CN105163506A - Composite surface treatment method for PCB - Google Patents
Composite surface treatment method for PCB Download PDFInfo
- Publication number
- CN105163506A CN105163506A CN201510469709.0A CN201510469709A CN105163506A CN 105163506 A CN105163506 A CN 105163506A CN 201510469709 A CN201510469709 A CN 201510469709A CN 105163506 A CN105163506 A CN 105163506A
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- CN
- China
- Prior art keywords
- screen printing
- pcb
- surface treatment
- treatment method
- composite surface
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/52—Polycarboxylic acids or polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Printing Methods (AREA)
Abstract
The invention discloses a composite surface treatment method for a PCB. The invention includes steps of A: preparing silk-screen printing films at the positions of golden fingers of the PCB, wherein the printing ink is strippable glue; B: performing baking for solidification after printing is completed; C: performing tin spraying after solidification is completed; D: removing the strippable glue. The method has beneficial effects that 1: production efficiency is improved substantially since single-process silk-screen printing can handle tens of golden finger positions at each PCB; 2: production cost is reduced and labor cost is reduced since large labor demand for gluing is lowered; 3: product quality and production capacity are enhanced, scratches in manual gluing process can be avoided effectively since manual gluing is replaced by silk-screen printing, and the distance between a tin spraying PAD and the golden fingers can be as short as 1 mm due to the high precision of silk-screen printing; 4: the golden fingers of different sizes can be covered together and demand for customization of glue paper of special sizes is eliminated.
Description
Technical field
The present invention relates to PCB field of surface treatment, particularly relate to a kind of PCB composite surface treatment method.
Background technology
At present, PCB adds man-hour carrying out compound base amount method, and work flow is as follows:
Sawing sheet-boring-electroless copper plating-whole plate plating-outer-layer circuit-graphic plating-etching--anti-welding-electric golden finger-spray tin-shaping-rear flow process; Aforesaid way, when carrying out this single operation of spray tin and making, needs through following sub-process:
Paste the red glue of high temperature (touching manual for the red glue of golden finger, tin on finger gold-plated when avoiding spraying tin)-baking-moulding (by the compacting while hot of red glue, when preventing from spraying tin, red glue a comes off) pre-treatment-spray tin-reprocessing-tear glue.
Visible, the compound base amount method of prior art, there is following shortcoming in it:
1, efficiency is low: need carry out manual rubberizing, and every sheet PCB is distributed with the gold-plated finger in tens of place, and everywhere all needs manual sticking, and because of finger width length inconsistent, the red glue of the high temperature of different in width need be selected;
, when golden finger is less than 2mm with the PAD spacing need spraying tin, there is rubberizing deviation, cause red sticker sprays tin PAD, make PAD not spray tin and reveal copper in 2, artificial rubberizing low precision;
3, owing to using manual operation, plate face scraping in rubberizing process is easily caused to be wounded;
4, cost is high: due to the manual rubberizing of needs, need at substantial manpower, bring cost to increase.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of PCB composite surface treatment method, be intended to solve that existing compound base amount method mode efficiency is low, low precision, easily scrape and wound and problem that cost is high.
Technical scheme of the present invention is as follows:
A kind of PCB composite surface treatment method, wherein, comprises step:
A, make the silk screen printing film at PCB golden finger position, peelable colloid selected by the ink of printing;
B, be completed for printing after carry out baking-curing;
C, solidified after carry out the process of spray tin;
D, glue process is torn to peelable colloid.
Described PCB composite surface treatment method, wherein, golden finger >=0.6mm that the monolateral ratio of lower oil level of silk screen printing need cover.
Described PCB composite surface treatment method, wherein, the lower oil level of silk screen printing is than the spacing >=0.4mm between the PAD that need spray tin.
Described PCB composite surface treatment method, wherein, silk screen printing adopts 60 order polyester silk screen printings.
Described PCB composite surface treatment method, wherein, the temperature of baking-curing is 150 DEG C.
Described PCB composite surface treatment method, wherein, the time of baking-curing is 30 minutes.
Beneficial effect: 1, greatly improve production efficiency, every sheet plate tens of places golden finger, adopts silk screen printing once to complete; 2, reduce production cost, do not need a large amount of manpower rubberizing, reduce human cost; 3, improve product quality and production capacity: owing to adopting silk screen printing to replace manual rubberizing, effectively prevent manual scraping of rubberizing process and wound, the precision of silk screen printing is simultaneously higher, within spray tin PAD and golden finger distance can accomplish 1mm; 4, the golden finger of different size size all can cover together, does not need the gummed paper customizing special size again.
Accompanying drawing explanation
Fig. 1 is the flow chart of a kind of PCB composite surface treatment method of the present invention preferred embodiment.
Fig. 2 is structural representation when adopting the inventive method process PCB surface.
Embodiment
The invention provides a kind of PCB composite surface treatment method, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is the flow chart of a kind of PCB composite surface treatment method of the present invention preferred embodiment, and as shown in the figure, it comprises step:
S1, make the silk screen printing film at PCB golden finger position, peelable colloid selected by the ink of printing;
S2, be completed for printing after carry out baking-curing;
S3, solidified after carry out the process of spray tin;
S4, glue process is torn to peelable colloid.
As shown in Figure 2, PCB100 is provided with PAD200, this PAD200 need spray tin, is anti-solder ink 300 between PAD200, and on PAD200, golden finger position makes the silk screen printing film, namely prints peelable colloid 400.Be cured after being completed for printing, then carry out spray tin, finally carry out tearing glue.Golden finger need not touch with red glue is manual by the present invention, also by a series of operations such as red glue compactings while hot, need not adopt silk screen printing, can disposablely complete, so substantially increase production efficiency.
Further, golden finger >=0.6mm that the monolateral ratio of lower oil level of silk screen printing need cover, the large 0.8mm of golden finger that the monolateral ratio of lower oil level of such as silk screen printing need cover.Further, the lower oil level of silk screen printing than the spacing >=0.4mm between the PAD that need spray tin, the lower oil level of such as silk screen printing 0.6mm larger than the spacing between the PAD that need spray tin.Above-mentioned distance can make the golden finger of different size size all can cover together, does not need the gummed paper customizing special size again.And improve silk screen printing precision, spray tin PAD and golden finger distance can accomplish the standard of 1mm.
Further, silk screen printing adopts 60 order polyester silk screen printings, and namely peelable colloid adopts polyester material.
Silk screen printing can adopt electronics aluminium frame, and the words of silk screen can select polyester net, in screen printing process, the method of net of stretching tight is as follows: load after chuck at silk screen, within the time of 5min, 70 ~ 80%(of the permission tension force of the silk screen that first stretches tight is as 75%), stop 10min, then move permission tension force to, then stop 10min, mend and move permission tension force to, stay on 10min, benefit moves permission tension force to, repeats 1.5 ~ 2h like this, such as 1.8h.
Polyester material can be prepared by under type:
Formula: dimethyl terephthalate (DMT): 80mol, BDO: 200mol, DMIP: 20mol, tetra-n-butyl titanate: 0.03mol, dimeric dibasic acid (binary acids containing 36 carbon atoms): 30mol, hydrogenation of liquid polybutadiene dihydroxylic alcohols: 15mol; Preparation: after dimethyl terephthalate (DMT), DMIP, dimeric dibasic acid and butanediol being mixed, add catalyst tetra-n-butyl titanate 0.01mol, carries out ester exchange in 200 DEG C of heating 1h under nitrogen protection.Then add hydrogenation of liquid polybutadiene dihydroxylic alcohols and tetra-n-butyl titanate 0.02mol, carry out polycondensation in 240 DEG C of heating 4h under vacuo.The polyester precursor copolymer obtained in 180 DEG C of hot pressing into about 75 μm of films.But this copolymer melting viscosity is too high, be difficult to coating, so the present invention adds butanediol 2%mol again, under nitrogen protection in 240 DEG C of depolymerization 1.5h.This polyester material has higher thermal endurance, good weather-proof, resistance to water and elasticity.
Further, the temperature of baking-curing is 150 DEG C, and the time of baking-curing is 30 minutes.
In sum, by present invention obtains following beneficial effect: 1, greatly improve production efficiency, every sheet plate tens of places golden finger, adopts silk screen printing once to complete; 2, reduce production cost, do not need a large amount of manpower rubberizing, reduce human cost; 3, improve product quality and production capacity: owing to adopting silk screen printing to replace manual rubberizing, effectively prevent manual scraping of rubberizing process and wound, the precision of silk screen printing is simultaneously higher, within spray tin PAD and golden finger distance can accomplish 1mm; 4, the golden finger of different size size all can cover together, does not need the gummed paper customizing special size again.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (6)
1. a PCB composite surface treatment method, is characterized in that, comprises step:
A, make the silk screen printing film at PCB golden finger position, peelable colloid selected by the ink of printing;
B, be completed for printing after carry out baking-curing;
C, solidified after carry out the process of spray tin;
D, glue process is torn to peelable colloid.
2. PCB composite surface treatment method according to claim 1, is characterized in that, golden finger >=0.6mm that the monolateral ratio of lower oil level of silk screen printing need cover.
3. PCB composite surface treatment method according to claim 1, is characterized in that, the lower oil level of silk screen printing is than the spacing >=0.4mm between the PAD that need spray tin.
4. PCB composite surface treatment method according to claim 1, is characterized in that, silk screen printing adopts 60 order polyester silk screen printings.
5. PCB composite surface treatment method according to claim 1, is characterized in that, the temperature of baking-curing is 150 DEG C.
6. PCB composite surface treatment method according to claim 1, is characterized in that, the time of baking-curing is 30 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510469709.0A CN105163506A (en) | 2015-08-04 | 2015-08-04 | Composite surface treatment method for PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510469709.0A CN105163506A (en) | 2015-08-04 | 2015-08-04 | Composite surface treatment method for PCB |
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| CN105163506A true CN105163506A (en) | 2015-12-16 |
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| CN201510469709.0A Pending CN105163506A (en) | 2015-08-04 | 2015-08-04 | Composite surface treatment method for PCB |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578780A (en) * | 2016-01-01 | 2016-05-11 | 广州兴森快捷电路科技有限公司 | Tin spraying method for gold finger plate |
| CN106686904A (en) * | 2017-02-15 | 2017-05-17 | 深圳市景旺电子股份有限公司 | Method for reducing ionic contaminants of PCB after tin deposition surface treatment |
| CN106686895A (en) * | 2016-12-30 | 2017-05-17 | 昆山元茂电子科技有限公司 | Surface treatment method for printed circuit board |
| CN108289383A (en) * | 2018-03-05 | 2018-07-17 | 东莞市龙谊电子科技有限公司 | The selective electroplating technique of printed circuit board |
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| CN101494955A (en) * | 2009-02-25 | 2009-07-29 | 深圳市华丰电器器件制造有限公司 | Method f or printing ripping blue glue on gold finger tin-spraying plate |
| CN103779242A (en) * | 2014-02-18 | 2014-05-07 | 无锡江南计算技术研究所 | Glue control method of step package substrate |
| CN104378925A (en) * | 2014-11-14 | 2015-02-25 | 中山市惠亚线路版有限公司 | Printed circuit board and mixed surface treatment process thereof |
| CN104470256A (en) * | 2014-11-28 | 2015-03-25 | 深圳市新宇腾跃电子有限公司 | Ink screen printing process for golden finger of flexible circuit board |
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2015
- 2015-08-04 CN CN201510469709.0A patent/CN105163506A/en active Pending
Patent Citations (4)
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| CN101494955A (en) * | 2009-02-25 | 2009-07-29 | 深圳市华丰电器器件制造有限公司 | Method f or printing ripping blue glue on gold finger tin-spraying plate |
| CN103779242A (en) * | 2014-02-18 | 2014-05-07 | 无锡江南计算技术研究所 | Glue control method of step package substrate |
| CN104378925A (en) * | 2014-11-14 | 2015-02-25 | 中山市惠亚线路版有限公司 | Printed circuit board and mixed surface treatment process thereof |
| CN104470256A (en) * | 2014-11-28 | 2015-03-25 | 深圳市新宇腾跃电子有限公司 | Ink screen printing process for golden finger of flexible circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578780A (en) * | 2016-01-01 | 2016-05-11 | 广州兴森快捷电路科技有限公司 | Tin spraying method for gold finger plate |
| CN106686895A (en) * | 2016-12-30 | 2017-05-17 | 昆山元茂电子科技有限公司 | Surface treatment method for printed circuit board |
| CN106686904A (en) * | 2017-02-15 | 2017-05-17 | 深圳市景旺电子股份有限公司 | Method for reducing ionic contaminants of PCB after tin deposition surface treatment |
| CN108289383A (en) * | 2018-03-05 | 2018-07-17 | 东莞市龙谊电子科技有限公司 | The selective electroplating technique of printed circuit board |
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Application publication date: 20151216 |