CN105163492A - Active tag module and manufacturing method thereof - Google Patents
Active tag module and manufacturing method thereof Download PDFInfo
- Publication number
- CN105163492A CN105163492A CN201510638272.9A CN201510638272A CN105163492A CN 105163492 A CN105163492 A CN 105163492A CN 201510638272 A CN201510638272 A CN 201510638272A CN 105163492 A CN105163492 A CN 105163492A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- housing
- hole
- wafer
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
The invention provides an active tag module and a manufacturing method thereof. The active tag module comprises a circuit board, an outer frame, electronic components and a black adhesive layer, wherein the outer frame is connected with the upper surface of the circuit board, a through hole is formed in the outer frame, the electronic components are arranged inside the through hole and welded on the circuit board, the black adhesive layer fills in the through hole and arranged above the electronic components, and a plurality of pins to be connected externally are formed on the circuit board. The active tag module can be used for packaging a chip and peripheral circuits of an active tag through the circuit board, the outer frame and the black adhesive layer, when in use, the user can connect the whole active tag module to an application circuit in a patching manner by utilizing the pins to be connected externally on the circuit board without caring about the specific internal structure of the active tag module, thereby the design of hardware circuits is greatly simplified, the reliability of circuits is improved, and the active tag module has the advantages of simple structure and low cost.
Description
Technical field
The present invention relates to field of circuit boards, particularly a kind of active label module and manufacture method thereof.
Background technology
In prior art, on the substrate of IC, wafer can only be made corresponding pin by the form of binding, like this, in design process of hardware, also need to carry out layout to peripheral circuit (such as electric capacity, resistance etc.) in the circuit board, bring very big inconvenience to hardware designs, reduce operating efficiency, meanwhile, also have impact on the reliability of circuit.
Summary of the invention
The invention provides that a kind of structure is simple, cost is low, integrated level is high, can increase work efficiency and the active label module of circuit reliability and manufacture method thereof.
For solving the problem, as one aspect of the present invention, provide a kind of active label module, comprise circuit board, housing, electronic component and black glue-line, wherein, housing is connected with the upper surface of circuit board, housing is formed with through hole, and electronic component is positioned at through hole, and welding electronic elements on circuit boards, black glue-line to be filled in through hole and to be positioned at the top of electronic component, circuit board is formed multiple for external pin.
Preferably, circuit board comprises the first ink layer, electric appliance circuits layers of copper, first medium layer, the second layers of copper, second dielectric layer, FR4 material layer, the 3rd dielectric layer, antenna layers of copper and the second ink layer that set gradually from top to bottom.
Preferably, housing comprises the first housing ink layer, the first housing layers of copper, housing FP4 substrate layer, the second housing layers of copper and the second housing ink layer that set gradually from top to bottom.
Preferably, electronic component comprises IC wafer and is used as the surface-mounted device of IC wafer periphery circuit, and by wire bonds on circuit boards, surface-mounted device is directly welded on the pad of circuit board IC wafer.
Preferably, be formed with groove in FR4 material layer, in groove, be provided with ferrite.
Present invention also offers a kind of manufacture method of active label module, comprising: peripheral components is welded on circuit board by the mode of attachment; IC wafer is tied on described circuit board; Housing is welded on described circuit board, and makes described peripheral components and IC wafer be positioned at the through hole of described housing; Fill and lead up in described through hole with black glue-line.
Preferably, described circuit board is formed multiple for external pin.
The chip of active label and peripheral circuit thereof can be encapsulated by circuit board, housing and black glue-line by the present invention, during use, user need not be concerned about its concrete internal structure, only need to utilize on circuit board for external pin, whole active label module can be connected in application circuit by the mode of paster and go, thus enormously simplify the design of hardware circuit, improve the reliability of circuit, have the advantages that structure is simple, cost is low.
Accompanying drawing explanation
Fig. 1 schematically shows structural representation of the present invention.
Reference numeral in figure: 1, circuit board; 2, housing; 3, black glue-line; 4, through hole; 5, the first ink layer; 6, electric appliance circuits layers of copper; 7, first medium layer; 8, the second layers of copper; 9, second dielectric layer; 10, FR4 material layer; 11, the 3rd dielectric layer; 12, antenna layers of copper; 13, the second ink layer; 14, the first housing ink layer; 15, the first housing layers of copper; 16, housing FP4 substrate layer; 17, the second housing layers of copper; 18, the second housing ink layer; 19, groove.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
Please refer to Fig. 1, the invention provides a kind of active label module, comprise circuit board 1, housing 2, electronic component and black glue-line 3, wherein, housing 2 is connected with the upper surface of circuit board 1, housing 2 is formed with through hole 4, electronic component is positioned at through hole 4, and welding electronic elements on the circuit card 1, black glue-line 3 to be filled in through hole 4 and to be positioned at the top of electronic component, circuit board 1 is formed multiple for external pin.
Owing to have employed technique scheme, the chip of active label and peripheral circuit (i.e. electronic component) thereof can be encapsulated by circuit board, housing and black glue-line by the present invention, during use, user need not be concerned about its concrete internal structure, only need to utilize on circuit board 1 for external pin, whole active label module can be connected in application circuit by the mode of paster and go, thus enormously simplify the design of hardware circuit, improve the reliability of circuit, have the advantages that structure is simple, cost is low.
The present invention is by increasing housing and filling and leading up the mode of device with black glue-line, the directivity of antenna can be realized outwardly, realize device criteria, mounted by the mode of paster (SMT), effectively improve follow-up production efficiency, and after the standardization of products, decrease the work of follow-up debugging antenna, realize product and transplant hardware simple.
Preferably, circuit board 1 comprises the first ink layer 5, electric appliance circuits layers of copper 6, first medium layer 7, second layers of copper 8, second dielectric layer 9, FR4 material layer 10, the 3rd dielectric layer 11, antenna layers of copper 12 and the second ink layer 13 that set gradually from top to bottom.Preferably, antenna layers of copper 12 is formed as snakelike coil antenna.Obviously, circuit board 1 also can adopt other forms of layer structure.
Preferably, housing 2 comprises the first housing ink layer 14, the first housing layers of copper 15, housing FP4 substrate layer 16, second housing layers of copper 17 and the second housing ink layer 18 that set gradually from top to bottom.Obviously, housing 2 also can adopt other forms of layer structure.
Preferably, the peripheral circuit that electronic component comprises IC wafer and coordinates with described IC wafer, by wire bonds on the circuit card 1, peripheral circuit is welded on described circuit board 1 by the mode of paster IC wafer.Peripheral circuit can be patch capacitor, Chip-R etc., these surface-mounted devices can be soldered directly on the pad of circuit board by the pad of himself, the form of what IC chip then adopted is IC wafer, therefore, is welded the pin of IC wafer with the respective pad on circuit board by wire.
Preferably, in FR4 material layer 10, be formed with groove 19, in groove 19, be provided with ferrite.Magnetic, such as ferrite etc. are inserted wherein, can increase the inductance value of antenna, and reduce the mutual interference between antenna and circuit, the inductance value increase of antenna can improve the performance of antenna.
Black glue-line in the present invention not only protects electronic component (comprising IC wafer and peripheral circuit thereof), also serves the effect of protective circuit plate and housing, and its rate of expanding with heat and contract with cold is low, and reliability is high, high temperature resistant, easily polishes.Further, by imbedding ferrite, adding the inductance value of antenna, being conducive to the raising of antenna performance, and ferrite effectively can isolate the electrical equipment interference of radiofrequency signal and electronic circuit.
Present invention also offers a kind of manufacture method of active label module, comprising: peripheral components is welded on circuit board 1 by the mode of attachment; IC wafer is tied on described circuit board 1; Housing 2 is welded on described circuit board 1, and makes described peripheral components and IC wafer be positioned at the through hole 4 of described housing 2; Fill and lead up in described through hole 4 with black glue-line 3.Wherein, binding refers to and directly connects the pin of IC wafer and the pin of circuit board or pad etc. by the mode of plain conductor.Preferably, described circuit board 1 is formed multiple for external pin.
Chip package of the prior art is the form of wafer by binding, be connected on substrate, and substrate is relatively simple, only has the function of conducting and carrier.But the mode that the present invention is encapsulated by wiring board, achieves the inaccessiable object of chip package, both can realize complicated electronic circuit cabling, circuit board function exploitation can have been realized again.
The present invention can reduce the work of debugging antenna, allow whole modularization standardization, can produce by practical function fast, and the present invention is compared to traditional label, it is little that it has area, respond well (the active active tag of Card Reader, traditional is passive passive label), there is SPI development interface (traditional does not have), can realize being connected with the standardization of product agent structure, carry out the exploitation of multiple utilization.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. an active label module, it is characterized in that, comprise circuit board (1), housing (2), electronic component and black glue-line (3), wherein, described housing (2) is connected with the upper surface of described circuit board (1), described housing (2) is formed with through hole (4), described electronic component is positioned at described through hole (4), and described welding electronic elements is on described circuit board (1), described black glue-line (3) to be filled in described through hole (4) and to be positioned at the top of described electronic component, described circuit board (1) is formed multiple for external pin.
2. active label module according to claim 1, it is characterized in that, described circuit board (1) comprises the first ink layer (5), electric appliance circuits layers of copper (6), first medium layer (7), the second layers of copper (8), second dielectric layer (9), FR4 material layer (10), the 3rd dielectric layer (11), antenna layers of copper (12) and the second ink layer (13) that set gradually from top to bottom.
3. active label module according to claim 1, it is characterized in that, described housing (2) comprises the first housing ink layer (14), the first housing layers of copper (15), housing FP4 substrate layer (16), the second housing layers of copper (17) and the second housing ink layer (18) that set gradually from top to bottom.
4. active label module according to claim 1, it is characterized in that, the peripheral circuit that described electronic component comprises IC wafer and coordinates with described IC wafer, described IC wafer is by wire bonds on described circuit board (1), and described peripheral circuit is welded on described circuit board (1) by the mode of paster.
5. the active label module according to claim 1 and 2, is characterized in that, be formed with groove (19) in described FR4 material layer (10), described groove is provided with ferrite in (19).
6. a manufacture method for active label module, is characterized in that, comprising:
Peripheral components is welded on circuit board (1) by the mode of attachment;
IC wafer is tied on described circuit board (1);
Housing (2) is welded on described circuit board (1), and makes described peripheral components and IC wafer be positioned at the through hole (4) of described housing (2);
Fill and lead up in described through hole (4) with black glue-line (3).
7. the manufacture method of active label module according to claim 6, is characterized in that, multiple for external pin in the upper formation of described circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510638272.9A CN105163492A (en) | 2015-09-29 | 2015-09-29 | Active tag module and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510638272.9A CN105163492A (en) | 2015-09-29 | 2015-09-29 | Active tag module and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105163492A true CN105163492A (en) | 2015-12-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510638272.9A Pending CN105163492A (en) | 2015-09-29 | 2015-09-29 | Active tag module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105163492A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2847387Y (en) * | 2005-09-15 | 2006-12-13 | 资重兴 | Structure improvement of storage card |
| CN101176109A (en) * | 2005-05-13 | 2008-05-07 | 3M创新有限公司 | Radio frequency identification tags for use on metal or other conductive objects |
| CN201364594Y (en) * | 2009-01-14 | 2009-12-16 | 中山达华智能科技股份有限公司 | Ultrathin-type RFID (radio frequency identification) electronic ticket card |
| CN101789263A (en) * | 2003-07-03 | 2010-07-28 | 株式会社瑞萨科技 | Multifunctional card device |
| CN102480850A (en) * | 2010-11-25 | 2012-05-30 | 软控股份有限公司 | Method for mounting RFID (radio frequency identification device) electronic label on printed circuit board |
| US20120139089A1 (en) * | 2010-12-03 | 2012-06-07 | Azurewave Technologies, Inc. | Module ic package structure and method for making the same |
| CN203218440U (en) * | 2013-04-01 | 2013-09-25 | 上海盛本通讯科技有限公司 | Intelligent communication terminal with front-mounting high frequency RFID antenna |
| CN204333221U (en) * | 2014-12-29 | 2015-05-13 | 蒋石正 | Initiatively noncontact induction antenna module |
| CN204362415U (en) * | 2015-01-29 | 2015-05-27 | 高德(苏州)电子有限公司 | Automobile audio half flex circuit application |
| CN204968241U (en) * | 2015-09-29 | 2016-01-13 | 蒋石正 | Active label module |
-
2015
- 2015-09-29 CN CN201510638272.9A patent/CN105163492A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101789263A (en) * | 2003-07-03 | 2010-07-28 | 株式会社瑞萨科技 | Multifunctional card device |
| CN101176109A (en) * | 2005-05-13 | 2008-05-07 | 3M创新有限公司 | Radio frequency identification tags for use on metal or other conductive objects |
| CN2847387Y (en) * | 2005-09-15 | 2006-12-13 | 资重兴 | Structure improvement of storage card |
| CN201364594Y (en) * | 2009-01-14 | 2009-12-16 | 中山达华智能科技股份有限公司 | Ultrathin-type RFID (radio frequency identification) electronic ticket card |
| CN102480850A (en) * | 2010-11-25 | 2012-05-30 | 软控股份有限公司 | Method for mounting RFID (radio frequency identification device) electronic label on printed circuit board |
| US20120139089A1 (en) * | 2010-12-03 | 2012-06-07 | Azurewave Technologies, Inc. | Module ic package structure and method for making the same |
| CN203218440U (en) * | 2013-04-01 | 2013-09-25 | 上海盛本通讯科技有限公司 | Intelligent communication terminal with front-mounting high frequency RFID antenna |
| CN204333221U (en) * | 2014-12-29 | 2015-05-13 | 蒋石正 | Initiatively noncontact induction antenna module |
| CN204362415U (en) * | 2015-01-29 | 2015-05-27 | 高德(苏州)电子有限公司 | Automobile audio half flex circuit application |
| CN204968241U (en) * | 2015-09-29 | 2016-01-13 | 蒋石正 | Active label module |
Non-Patent Citations (1)
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| 张戟等: "《现代汽车电磁兼容理论与设计基础》", 30 June 2009 * |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151216 |