CN105163491A - Packaging method for wearable electronic equipment - Google Patents
Packaging method for wearable electronic equipment Download PDFInfo
- Publication number
- CN105163491A CN105163491A CN201510595865.1A CN201510595865A CN105163491A CN 105163491 A CN105163491 A CN 105163491A CN 201510595865 A CN201510595865 A CN 201510595865A CN 105163491 A CN105163491 A CN 105163491A
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- flexible
- flexible substrates
- electronic component
- unit island
- electronic
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 title abstract 7
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 238000004891 communication Methods 0.000 claims abstract description 24
- 238000005538 encapsulation Methods 0.000 claims description 32
- 238000012856 packing Methods 0.000 claims description 19
- 238000005516 engineering process Methods 0.000 claims description 10
- 230000010354 integration Effects 0.000 claims description 4
- 230000006870 function Effects 0.000 abstract description 29
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 3
- 230000004308 accommodation Effects 0.000 abstract 2
- 230000008569 process Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004753 textile Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- NRTLIYOWLVMQBO-UHFFFAOYSA-N 5-chloro-1,3-dimethyl-N-(1,1,3-trimethyl-1,3-dihydro-2-benzofuran-4-yl)pyrazole-4-carboxamide Chemical compound C=12C(C)OC(C)(C)C2=CC=CC=1NC(=O)C=1C(C)=NN(C)C=1Cl NRTLIYOWLVMQBO-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Abstract
The invention discloses a packaging method for wearable electronic equipment. The packaging method comprises the following steps: carrying out classification on various electronic components in electronic equipment having user-required functions according to the functions and packaging dimensions of the electronic components and communication demand between the electronic components, the same kind of electronic components being classified into one unit island; and packaging a plurality of electronic equipment in the plurality of unit islands and an LED flexible display module on a flexible substrate in a manner of multilayer component stack packaging, the plurality of electronic components in each unit island being connected directly, and the plurality of unit islands being connected through a communication bus arranged on the flexible substrate. The packaging method for the wearable electronic equipment can overcome the defects of few function, large occupation space and inconvenient accommodation and the like in the prior art, and realizes the advantages of multiple functions, small occupation space and convenient accommodation.
Description
Technical field
The present invention relates to flexible circuit technology field, particularly, relate to a kind of wearable electronic and method for packing thereof.
Background technology
Existing wearable device development platform mainly contains Lilypad, and (namely ArduinoLilyPad is Arduino special version, develop for wearable device and electronic textile), (FLORA is a miniaturized development platform that Adafruit releases for wearable device to Flora, the flash memory of FLORA and SRAM are the twices of LilyPad, and FLORA is smaller and more exquisite than LilyPad).These platforms have small-sized system architecture, all to Arduino[Arduino be a convenient flexibly, facilitate the electronics Prototyping Platform of increasing income of left-hand seat, comprise hardware (the Arduino plate of various model) and software (ArduinoIDE)] circuit board compatibility, the equipment of specific function can be provided to research and develop.
But existing platform still cannot meet the demand of user to wearable device:
1) although can be sewn to clothes realizes wearable, but it is integrated owing to both have employed hard PCB, and volume is too fat to move, the naked version volume of not integrated any transducer has reached 44.5mm diameter, and being not suitable for making really can " wearing " equipment.
2) up-to-date flexibility (Limber) platform, can realize collapsible and can stretch, but having lacked wearable device critical function: not containing any wireless charging module, cannot change battery, therefore cannot be embedded in clothes; Can not waterproof, therefore cannot be integrated on clothing; The interpolation of sensor assembly is limited, and therefore platform development is limited.
Realizing in process of the present invention, inventor finds at least to exist in prior art the defects such as function is few, the large and storage of taking up room is inconvenient.
Summary of the invention
The object of the invention is to, for the problems referred to above, propose a kind of method for packing of wearable electronic, many with practical function, take up room little and receive advantage easily.
The second object of the present invention is, proposes a kind of package system of wearable electronic.
For achieving the above object, the technical solution used in the present invention is: a kind of method for packing of wearable electronic, comprising:
A, the communication requirement between function, package dimension and each electronic component according to electronic component, sorted out by each electronic component in the electronic equipment possessing user's required function, same class electronic component is categorized in a unit island;
B, by the multiple electronic equipment in multiple unit island and LED Flexible Displays module, encapsulate on flexible substrates in the mode of multi-layer part stacked package, directly connect between multiple electronic components in each unit island, connected by the communication bus arranged on flexible substrates between multiple unit island.
Further, each unit island, is specially: divide on flexible substrates and can hold one piece of region of same class electronic component, and/or, can one piece of pcb board of integrated same class electronic component.
Further, in step a, described each electronic component in the electronic equipment possessing user's required function is carried out the operation sorted out, specifically comprises:
Mark off multiple unit island on flexible substrates, by same class electronic component directly an integrated unit island on flexible substrates; And/or, by same class electronic component integration on a PCB unit island, then PCB unit island is interconnected by flexible substrate.
Further, in stepb, described by the multiple electronic equipment in multiple unit island and LED Flexible Displays module, encapsulate operation on flexible substrates in the mode of multi-layer part stacked package, specifically comprise:
Utilize COF flexible substrate encapsulation technology, by the bare chip of the multiple electronic equipments in multiple unit island, directly encapsulation on flexible substrates; And, by LED Flexible Displays module package on flexible substrates.
Further, described by the operation on flexible substrates of LED Flexible Displays module package, specifically comprise:
By LED array encapsulation on flexible substrates, encapsulation LED array on flexible substrates directly forms LED Flexible Displays module.
Further, described flexible substrate, is specially PI substrate; And/or described multiple electronic component, comprises at least one processor unit, sensor unit, bluetooth communication and power module.
Simultaneously, another technical scheme that the present invention adopts is: a kind of wearable electronic obtained based on the method for packing of above-described wearable electronic, comprise flexible substrate, encapsulate multiple unit island on flexible substrates and LED Flexible Displays module in the mode of multi-layer part stacked package, and to be integratedly arranged in described multiple unit island and multiple electronic components of the electronic equipment of user's required function can be formed;
Directly connect between multiple electronic components in each unit island, connected by the communication bus arranged on flexible substrates between multiple unit island;
Multiple electronic components in each unit island are same class electronic component, and function, the package dimension of same class electronic component are identical with communication requirement.
Further, each unit island, comprises division on flexible substrates and can hold one piece of region of same class electronic component, and/or, can one piece of pcb board of integrated same class electronic component.
Further, when being encapsulated on flexible substrates in the mode of multi-layer part stacked package in described multiple unit island and LED Flexible Displays module, the operation performed is needed to comprise:
Utilize COF flexible substrate encapsulation technology, by the bare chip of the multiple electronic equipments in multiple unit island, directly encapsulation on flexible substrates; And,
By LED array encapsulation on flexible substrates, encapsulation LED array on flexible substrates directly forms LED Flexible Displays module.
Further, described flexible substrate, is specially PI substrate; And/or described multiple electronic component, comprises at least one processor unit, sensor unit, bluetooth communication and power module.
The wearable electronic of various embodiments of the present invention and method for packing thereof, because this method for packing comprises: according to the communication requirement between the function of electronic component, package dimension and each electronic component, sorted out by each electronic component in the electronic equipment possessing user's required function, same class electronic component is categorized in a unit island; By the multiple electronic equipment in multiple unit island and LED Flexible Displays module, encapsulate on flexible substrates in the mode of multi-layer part stacked package, directly connect between multiple electronic components in each unit island, connected by the communication bus arranged on flexible substrates between multiple unit island; Can the electronic equipment with required function be integrated in wearable housing, under the prerequisite of not lost electrons functions of the equipments, in rational deployment electronic equipment each module line and the nude film of each module is directly encapsulated on flexible substrates; Thus can overcome that function in prior art is few, take up room large and that storage is inconvenient defect, many with practical function, take up room little and receive advantage easily.
Other features and advantages of the present invention will be set forth in the following description, and, partly become apparent from specification, or understand by implementing the present invention.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for specification, together with embodiments of the present invention for explaining the present invention, is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the structural representation of the package system of wearable electronic of the present invention;
Fig. 2 is the flow chart of the method for packing of the wearable electronic of wearable electronic of the present invention.
By reference to the accompanying drawings, in the embodiment of the present invention, Reference numeral is as follows:
1-PCB unit island (PCBisland); 2-IC bare chip group (ICBaredies); 3-minicell (MicroBattery); 4-flexible base, board (Flexiblesubstrate); 5-energy collecting device (EnergyHarvester); 6,7-LED is at the back displays array (LEDarrayDisplayonthebacksideoftheflexiblesubstrate) of flexible base, board.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein is only for instruction and explanation of the present invention, is not intended to limit the present invention.
For the function singleness in prior art existing for wearable electronic, too fat to move, the not folding shortcoming of volume, according to the embodiment of the present invention, as depicted in figs. 1 and 2, provide a kind of wearable electronic and method for packing thereof, be applicable to the flexible substrate encapsulation of wearable device integrated platform; That is: propose a kind of under the prerequisite of not sacrificial system function, based on flexible substrate, module each in system is optimized to the scheme of encapsulation.
embodiment of the method
The method for packing of the wearable electronic of the embodiment of the present invention, comprising:
A, the communication requirement between function, package dimension and each electronic component according to electronic component, sorted out by each electronic component in the electronic equipment possessing user's required function, same class electronic component is categorized in a unit island; Flexible substrate, is specially PI substrate, other similar polymeric material can also be used to make substrate, as PETG (PET) substrate and Merlon (PC) substrate etc.; And/or multiple electronic component, comprises at least one processor unit, sensor unit, bluetooth communication and power module;
Each unit island, is specially: divide on flexible substrates and can hold one piece of region of same class electronic component, and/or, can one piece of pcb board of integrated same class electronic component;
In step a, each electronic component in the electronic equipment possessing user's required function is carried out the operation sorted out, specifically comprises:
Mark off multiple unit island on flexible substrates, by same class electronic component directly an integrated unit island on flexible substrates; And/or, by same class electronic component integration on a PCB unit island, then PCB unit island is interconnected by flexible substrate;
B, by the multiple electronic equipment in multiple unit island and LED Flexible Displays module, encapsulate on flexible substrates in the mode of multi-layer part stacked package, directly connect between multiple electronic components in each unit island, connected by the communication bus arranged on flexible substrates between multiple unit island;
In stepb, by the multiple electronic equipment in multiple unit island and LED Flexible Displays module, encapsulate operation on flexible substrates in the mode of multi-layer part stacked package, specifically comprise:
Utilize COF flexible substrate encapsulation technology, by the bare chip of the multiple electronic equipments in multiple unit island, directly encapsulation on flexible substrates; And, by LED Flexible Displays module package on flexible substrates;
By the operation on flexible substrates of LED Flexible Displays module package, specifically comprise: by LED array encapsulation on flexible substrates, encapsulation LED array on flexible substrates directly forms LED Flexible Displays module.
Technical scheme of the present invention, by using flexible substrate, directly encapsulates nude film, thus make systemic-function complete, and possess the flexible characteristic of flexible substrate, and reduced volume, thus make system more be conducive to being worn, simultaneously also for the design of system brings more flexibility.
being described in detail as follows of technical solution of the present invention:
(1) electronic system will be integrated in wearable electronic, and therefore, the framework of system comprises: at least one processor unit, sensor unit, display module, bluetooth communication, battery etc.For different application, system also will suitably increase available module.
(2) according to different system element functions, package dimension and interelement communication requirement, each element is carried out classifying as different units, different unit is integrated in different unit islands, in island, each element directly communicates, and each unit is communicated by the bus in flexible substrate between island, thus it is more effective to make to communicate between system element, possesses again the flexible characteristic of flexible substrate, and makes system bulk reduce simultaneously.
The method that system classifies as unit island has:
A, be directly integrated on PI substrate;
B, to be integrated on PCB, then PCB unit is undertaken interconnected, see Fig. 1 by PI substrate;
The integration mode of each unit island (module) mainly contains two kinds: be directly encapsulated in PI substrate, and is connected on flexible base, board with the form on PCB unit island.
(3) Flexible Displays: be directly encapsulated on PI substrate by LED array, makes the display module volume of system reduce, possess flexible characteristic, and cost reduces greatly simultaneously.
(4), for integrated system increases watertight composition, the flexible characteristic of coupling system, makes system can be embedded in textile fabric, facilitates the wearable of electronic equipment.
wearable electronic embodiment
The wearable electronic obtained based on the method for packing of above-mentioned wearable electronic of the embodiment of the present invention, comprise flexible substrate (as flexible base, board 4), encapsulate multiple unit island on flexible substrates and LED Flexible Displays module (if LED is at the back displays array 6,7 of flexible base, board) in the mode of multi-layer part stacked package, and to be integratedly arranged in multiple unit island and multiple electronic components of the electronic equipment of user's required function can be formed; Directly connect between multiple electronic components in each unit island, connected by the communication bus arranged on flexible substrates between multiple unit island; Multiple electronic components in each unit island are same class electronic component, and function, the package dimension of same class electronic component are identical with communication requirement.
Here, each unit island, comprises division on flexible substrates and can hold one piece of region of same class electronic component, and/or, can one piece of pcb board (as PCB unit island 1) of integrated same class electronic component.Flexible substrate, is specially PI substrate; And/or multiple electronic component, comprises at least one processor unit, sensor unit (as energy collecting device 5), bluetooth communication and power module (as minicell 3).
In the above-described embodiments, when being encapsulated on flexible substrates in the mode of multi-layer part stacked package in multiple unit island and LED Flexible Displays module, the operation performed is needed to comprise:
Utilize COF flexible substrate encapsulation technology, by the bare chip (as IC bare chip group 2) of the multiple electronic equipments in multiple unit island, directly encapsulation on flexible substrates; And by LED array encapsulation on flexible substrates, encapsulation LED array on flexible substrates directly forms LED Flexible Displays module.
Technical scheme of the present invention, brilliant film (ChipOnFlex is covered in utilization, or ChipOnFilm, being called for short COF) IC (is fixed on crystal grain mantle structure packing technique in flexible circuit board by flexible substrate encapsulation technology, use soft additional circuit boards to make the technology that chip engages with flexible base plate circuit by packaged chip carrier), integrated each circuit module, display, battery, the necessary module such as bluetooth, under the prerequisite of not loss system performance, the line of each module of rational arrangement, the nude film of each module is directly encapsulated on flexible substrates, system bulk is reduced greatly, possesses complete function simultaneously, and foldable properties.
technical scheme of the present invention, specific implementation process is as follows:
(1) utilize polymer substrate polyimide resin (Polyimide, be called for short PI) foldable properties, and it is as the reliability of backing material, by each for system module package on PI substrate, while keeping system reliability, possess the folding characteristic that PI has, whole system is beneficial to wearable.
(2) encapsulation process is based on the stacked package of multi-layer part, comprising LED display unit, and each system element module (island) and PI substrate.
1. Flexible Displays module: LED array is on flexible substrates integrated, realizes Flexible Displays function and as the display module of wearable system, system bulk is reduced, possesses folding characteristic simultaneously.
Technical scheme of the present invention, by the encapsulation to LED array, directly forms display module (screen), and without the need to external display screen, effectively reduces system bulk and cost.Concrete array set-up mode is not key point of the present invention, can refer to the array set-up mode of conventional LED display.Fig. 1 just illustrates the mode that LED array shows.
2. directly being optimized the holonomic system of encapsulation by nude film: for making system bulk reduce, making again better to intercom mutually between system element simultaneously, adopting and nude film is directly integrated in system; Sorted out by different elements, be integrated in different unit, with the form on island, each unit is interconnected, thus when keeping system is complete, the volume of system is reduced greatly, internal structure obtains and optimizes simultaneously.The operation that nude film is directly integrated is that bare chip is directly encapsulated in flexible substrate, technically can be called without packaged type interconnect scheme (chiponboard is called for short CoB); Benefit reduces volume and reduces costs; Operating process comprises: the steps such as die bond, wire bonding and encapsulating, also can adopt conventional chip packages technique.
3. interconnected based on PI substrate between each unit island, ensures the flexibility of system.Due to flexibility and the reliability of material of PI substrate, and at the Mature property that encapsulation process middle punch goes between, it can be utilized to carry out interconnected based on PI substrate between unit island of having classified, ensure the flexible characteristic of system.
(3), for integrated system increases watertight composition, the flexible characteristic of coupling system, makes system can be embedded in textile fabric, facilitates the wearable of electronic equipment.Flexible package itself belongs to water-proof type encapsulation, and PI substrate plays the effect of isolation steam, makes inner integrated each element and module from the impact of steam in environment and pollution.
Last it is noted that the foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although with reference to previous embodiment to invention has been detailed description, for a person skilled in the art, it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a method for packing for wearable electronic, is characterized in that, comprising:
A, the communication requirement between function, package dimension and each electronic component according to electronic component, sorted out by each electronic component in the electronic equipment possessing user's required function, same class electronic component is categorized in a unit island;
B, by the multiple electronic equipment in multiple unit island and LED Flexible Displays module, encapsulate on flexible substrates in the mode of multi-layer part stacked package, directly connect between multiple electronic components in each unit island, connected by the communication bus arranged on flexible substrates between multiple unit island.
2. the method for packing of wearable electronic according to claim 1, it is characterized in that, each unit island, is specially: divide on flexible substrates and can hold one piece of region of same class electronic component, and/or, can one piece of pcb board of integrated same class electronic component.
3. the method for packing of wearable electronic according to claim 1 and 2, is characterized in that, in step a, described each electronic component in the electronic equipment possessing user's required function is carried out the operation sorted out, specifically comprises:
Mark off multiple unit island on flexible substrates, by same class electronic component directly an integrated unit island on flexible substrates; And/or, by same class electronic component integration on a PCB unit island, then PCB unit island is interconnected by flexible substrate.
4. the method for packing of wearable electronic according to claim 1 and 2, it is characterized in that, in stepb, described by the multiple electronic equipment in multiple unit island and LED Flexible Displays module, encapsulate operation on flexible substrates in the mode of multi-layer part stacked package, specifically comprise:
Utilize COF flexible substrate encapsulation technology, by the bare chip of the multiple electronic equipments in multiple unit island, directly encapsulation on flexible substrates; And, by LED Flexible Displays module package on flexible substrates.
5. the method for packing of wearable electronic according to claim 4, is characterized in that, described by the operation on flexible substrates of LED Flexible Displays module package, specifically comprises:
By LED array encapsulation on flexible substrates, encapsulation LED array on flexible substrates directly forms LED Flexible Displays module.
6. the method for packing of wearable electronic according to claim 1 and 2, is characterized in that, described flexible substrate, is specially PI substrate; And/or described multiple electronic component, comprises at least one processor unit, sensor unit, bluetooth communication and power module.
7. the wearable electronic obtained based on the method for packing of wearable electronic according to claim 1, it is characterized in that, comprise flexible substrate, encapsulate multiple unit island on flexible substrates and LED Flexible Displays module in the mode of multi-layer part stacked package, and to be integratedly arranged in described multiple unit island and multiple electronic components of the electronic equipment of user's required function can be formed;
Directly connect between multiple electronic components in each unit island, connected by the communication bus arranged on flexible substrates between multiple unit island;
Multiple electronic components in each unit island are same class electronic component, and function, the package dimension of same class electronic component are identical with communication requirement.
8. wearable electronic according to claim 7, is characterized in that, each unit island, comprises division on flexible substrates and can hold one piece of region of same class electronic component, and/or, can one piece of pcb board of integrated same class electronic component.
9. the wearable electronic according to claim 7 or 8, is characterized in that, when being encapsulated on flexible substrates in the mode of multi-layer part stacked package in described multiple unit island and LED Flexible Displays module, needs the operation performed to comprise:
Utilize COF flexible substrate encapsulation technology, by the bare chip of the multiple electronic equipments in multiple unit island, directly encapsulation on flexible substrates; And,
By LED array encapsulation on flexible substrates, encapsulation LED array on flexible substrates directly forms LED Flexible Displays module.
10. the wearable electronic according to claim 7 or 8, is characterized in that, described flexible substrate, is specially PI substrate; And/or described multiple electronic component, comprises at least one processor unit, sensor unit, bluetooth communication and power module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510595865.1A CN105163491B (en) | 2015-09-17 | 2015-09-17 | A kind of method for packing of wearable electronic |
| PCT/CN2016/098987 WO2017045604A1 (en) | 2015-09-17 | 2016-09-14 | Wearable electronic device and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510595865.1A CN105163491B (en) | 2015-09-17 | 2015-09-17 | A kind of method for packing of wearable electronic |
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| Publication Number | Publication Date |
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| CN105163491A true CN105163491A (en) | 2015-12-16 |
| CN105163491B CN105163491B (en) | 2018-03-06 |
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| CN201510595865.1A Active CN105163491B (en) | 2015-09-17 | 2015-09-17 | A kind of method for packing of wearable electronic |
Country Status (2)
| Country | Link |
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| CN (1) | CN105163491B (en) |
| WO (1) | WO2017045604A1 (en) |
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| WO2017045604A1 (en) * | 2015-09-17 | 2017-03-23 | 北京代尔夫特电子科技有限公司 | Wearable electronic device and packaging method thereof |
| CN110115114A (en) * | 2016-11-10 | 2019-08-09 | 波尓瑟兰尼提公司 | Textile electronic devices for intelligent clothing |
| CN113721329A (en) * | 2021-08-16 | 2021-11-30 | 深圳太辰光通信股份有限公司 | Optical module packaged by flexible board and packaging method thereof |
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| CN203840632U (en) * | 2014-03-25 | 2014-09-17 | 许振宇 | Modularized flexible circuit structure |
| JP2015079775A (en) * | 2013-09-12 | 2015-04-23 | 太陽誘電株式会社 | Circuit module and manufacturing method of the same |
| CN104752438A (en) * | 2013-12-26 | 2015-07-01 | 英特尔公司 | Method And Apparatus For Flexible Electronic Communicating Device |
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| US9019710B2 (en) * | 2012-10-11 | 2015-04-28 | Apple Inc. | Devices having flexible printed circuits with bent stiffeners |
| CN104146771B (en) * | 2014-07-18 | 2017-03-29 | 小米科技有限责任公司 | Wearable device and its manufacture method |
| CN104661473B (en) * | 2015-02-28 | 2018-01-09 | 京东方科技集团股份有限公司 | One kind assembling wearable device |
| CN105163491B (en) * | 2015-09-17 | 2018-03-06 | 北京代尔夫特电子科技有限公司 | A kind of method for packing of wearable electronic |
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2015
- 2015-09-17 CN CN201510595865.1A patent/CN105163491B/en active Active
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2016
- 2016-09-14 WO PCT/CN2016/098987 patent/WO2017045604A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2015079775A (en) * | 2013-09-12 | 2015-04-23 | 太陽誘電株式会社 | Circuit module and manufacturing method of the same |
| CN104752438A (en) * | 2013-12-26 | 2015-07-01 | 英特尔公司 | Method And Apparatus For Flexible Electronic Communicating Device |
| CN203840632U (en) * | 2014-03-25 | 2014-09-17 | 许振宇 | Modularized flexible circuit structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2017045604A1 (en) * | 2015-09-17 | 2017-03-23 | 北京代尔夫特电子科技有限公司 | Wearable electronic device and packaging method thereof |
| CN110115114A (en) * | 2016-11-10 | 2019-08-09 | 波尓瑟兰尼提公司 | Textile electronic devices for intelligent clothing |
| CN113721329A (en) * | 2021-08-16 | 2021-11-30 | 深圳太辰光通信股份有限公司 | Optical module packaged by flexible board and packaging method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017045604A1 (en) | 2017-03-23 |
| CN105163491B (en) | 2018-03-06 |
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