WO2017045604A1

WO2017045604A1 - Wearable electronic device and packaging method thereof

Info

Publication number: WO2017045604A1
Application number: PCT/CN2016/098987
Authority: WO
Inventors: 圣阿加塔·法比奥; 耶尔沃利诺·艾莉娜; 董明智; 张国旗
Original assignee: 北京代尔夫特电子科技有限公司
Priority date: 2015-09-17
Filing date: 2016-09-14
Publication date: 2017-03-23
Also published as: CN105163491B; CN105163491A

Abstract

A wearable electronic device and packaging method thereof. The packaging method comprises: sorting multiple electronic components of an electronic device into different types, and designating the electronic components of the same type to one single unit island; packaging, via multi-layer part stacking and packaging and on a flexible substrate, the multiple electronic components in multiple unit islands and a flexible light emitting diode (LED) display module, wherein the electronic components within each unit island are directly connected to each other, and the multiple unit islands are connected via a communication bus disposed on the flexible substrate.

Description

Wearable electronic device and packaging method thereof

Technical field

The present disclosure relates to the field of flexible circuit technology, for example, to a wearable electronic device and a method of packaging the same.

Background technique

Related wearable device development platforms are mainly Lilypad and Flora. Lilypad, the ArduinoLilyPad, is a special version of Arduino developed for wearables and electronic textiles. Flora is Adafruit's miniaturized development platform for wearable devices. Flora's flash and SRAM are twice as large as LilyPad, and Flora is smaller than LilyPad. These platforms have a small system architecture that is compatible with Arduino boards and provides device development for specific functions. Among them, Arduino is a convenient, flexible and easy to use open source electronic prototype platform, including hardware (various models of Arduino board) and software (Arduino IDE).

However, the platform in the related art still cannot meet the user's demand for wearable devices:

1) Although both can be sewn on clothes to achieve wearability, since both platforms use hard PCB integration and are bulky, the bare version without any sensor has reached a diameter of 44.5mm, which is not suitable for making real A device that can be "dressed."

2) The flexible (Limber) platform can be folded and stretchable, but lacks the important functions of the wearable device: the flexible platform does not contain any wireless charging module, cannot replace the battery, and therefore cannot be embedded in the clothes; Therefore, it cannot be integrated on clothing; the addition of sensor modules is limited, so platform development is limited.

In the process of implementing the technical solutions of the present disclosure, the inventors have found that the wearable device development platform in the related art has at least defects such as less functions, large occupied space, and inconvenient storage.

Summary of the invention

In view of the above problems, the present disclosure provides a packaging method of a wearable electronic device to realize the advantages of multiple functions, small space occupation, and convenient storage.

The present disclosure also proposes a packaging system for a wearable electronic device.

To achieve the above object, the technical solution adopted by the present disclosure is:

A method of packaging a wearable electronic device, comprising:

Classifying a plurality of electronic components in an electronic device, the same type of electronic components being classified in a unit island;

A plurality of electronic components and a Light Emitting Diode (LED) flexible display module in a plurality of unit islands are packaged on a flexible substrate in a multi-layer component package, and a plurality of electronic components in each unit island Directly connected between the plurality of unit islands is connected by a communication bus provided on the flexible substrate.

Optionally, one unit island is: an area divided on a flexible substrate and capable of accommodating the same type of electronic components, and/or a printed circuit board (PCB) capable of integrating the same type of electronic components;

Wherein, when the function of the electronic component, the package size, and the communication requirements between the plurality of electronic components are the same, it is determined that the plurality of electronic components are the same type of electronic components.

Optionally, the categorizing the plurality of electronic components in the electronic device includes:

Dividing a plurality of unit islands on the flexible substrate, directly integrating the same type of electronic components into a unit island on the flexible substrate; and/or,

The same type of electronic components are integrated on one PCB unit island, and then multiple PCB unit islands are interconnected through a flexible substrate.

Optionally, the plurality of electronic components and the LED flexible display module in the plurality of unit islands are packaged on the flexible substrate in a multi-layer component package, including:

Using a chip-on-film (Chip On Flex, or Chip On Film, COF) flexible substrate packaging technology, a bare chip of a plurality of electronic components in a plurality of unit islands is directly packaged on a flexible substrate;

The LED flexible display module is packaged on a flexible substrate.

Optionally, the packaging the LED flexible display module on the flexible substrate comprises:

The LED array is packaged on a flexible substrate, and the LED array packaged on the flexible substrate forms an LED flexible display module.

Optionally, the flexible substrate is a PI substrate.

Optionally, the plurality of electronic components include at least one processor unit, a sensor unit, a Bluetooth communication module, and a power module.

The present disclosure also employs a wearable electronic device, including:

a flexible substrate, a plurality of unit islands packaged on a flexible substrate in a multi-layer component package An LED flexible display module, and a plurality of electronic components integrated in the plurality of unit islands;

Direct connection between a plurality of electronic components in each unit island, and a plurality of unit islands are connected by a communication bus disposed on the flexible substrate;

The plurality of electronic components in each unit island are the same type of electronic components.

Optionally, a unit island comprising an area partitioned on a flexible substrate and capable of accommodating the same type of electronic components, and/or a PCB capable of integrating the same type of electronic components;

Among them, the same type of electronic components include: the function of the electronic component, the package size, and a plurality of electronic components having the same communication requirements between the plurality of electronic components.

Optionally, the flexible substrate is a PI substrate.

A wearable electronic device and a packaging method thereof according to an embodiment of the present disclosure, wherein the packaging method includes: classifying a plurality of electronic components in the electronic device, and classifying the same type of electronic components into one unit island; The plurality of electronic devices and the LED flexible display module are packaged on the flexible substrate in a multi-layer component stacking manner, and a plurality of electronic components in each unit island are directly connected, and a plurality of unit islands are disposed through each other. A communication bus connection on a flexible substrate. The electronic device having the required function can be integrated into the wearable casing, and the connection of each module in the electronic device can be reasonably arranged without directly losing the function of the electronic device, and the bare chip of the plurality of modules can be directly packaged in the flexible state. On the substrate, the defects in the related art, such as less function, large space occupation and inconvenient storage, can be overcome, so as to realize the advantages of multiple functions, small space occupation and convenient storage.

DRAWINGS

The accompanying drawings are used to provide a description of the disclosure, and are in the In the drawing:

1 is a schematic structural diagram of a package system of a wearable electronic device according to the present disclosure;

2 is a flow chart of a method of packaging a wearable electronic device of the present disclosure.

With reference to the accompanying drawings, the reference numerals in the embodiments of the present disclosure are as follows:

1-PCB unit island (PCB island);

2-IC bare chipset (IC Bare dies);

3-micro battery (Micro Battery);

4-Flexible substrate;

5-Energy Harvester (Energy Harvester);

6. The LED array is displayed on the backside of the flexible substrate.

Implementation

The exemplary embodiments of the present disclosure are described with reference to the accompanying drawings.

A wearable electronic device and a packaging method thereof are provided according to an embodiment of the present disclosure, as shown in FIG. 1 and FIG. 2, in accordance with an embodiment of the present disclosure. A flexible substrate package suitable for a wearable device integration platform; that is, a solution for optimally packaging multiple modules in a system based on a flexible substrate without sacrificing system functionality is proposed.

An embodiment of the present disclosure provides a method for packaging a wearable electronic device, including:

In 210, according to the function of the electronic component, the package size, and the communication requirement between the plurality of electronic components, the plurality of electronic components in the electronic device having the functions required by the user are classified, and the same type of electronic components are classified into one Within the unit island; the flexible substrate may be a polyimide (PI) substrate, and other similar polymer materials may be used as the substrate, such as polyethylene terephthalate (PET). a substrate and a polycarbonate (PC) substrate, etc.; and/or a plurality of electronic components including at least one processor unit, a sensor unit, a Bluetooth communication module, and a power module;

Wherein, the unit island may be selected as: an area divided on a flexible substrate and capable of accommodating the same type of electronic components, and/or a PCB board capable of integrating the same type of electronic components;

In 210, an operation of categorizing a plurality of electronic components in an electronic device having a function desired by a user may include:

Dividing a plurality of unit islands on a flexible substrate, directly integrating the same type of electronic components into a unit island on the flexible substrate; and/or integrating the same type of electronic components on a PCB unit island, and then Interconnecting PCB unit islands through a flexible substrate;

In 220, a plurality of electronic components and LED flexible display modules in a plurality of unit islands are packaged on a flexible substrate in a multi-layer component package, and a plurality of electronic components in each unit island are directly connected. a plurality of unit islands connected by a communication bus disposed on the flexible substrate;

In 220, the operation of packaging a plurality of electronic components and LED flexible display modules in a plurality of unit islands on a flexible substrate in a multi-layer component package, comprising:

Using a COF flexible substrate packaging technology, a bare chip of a plurality of electronic components in a plurality of unit islands is directly packaged on a flexible substrate; and an LED flexible display module is packaged on the flexible substrate;

The operation of packaging the LED flexible display module on the flexible substrate comprises: packaging the LED array on the flexible substrate, and the LED array packaged on the flexible substrate directly forms the LED flexible display module.

The technical solution of the present disclosure directly encapsulates the die by using a flexible substrate, thereby making the system function complete, and having the flexible characteristics of the flexible substrate, and reducing the volume, thereby making the system more favorable for being worn, and also for The design of the system brings more flexibility.

A related description of the technical solution of the present disclosure is as follows:

(1) The electronic system will be integrated in the wearable electronic device. Therefore, the architecture of the system includes: at least one processor unit, a sensor unit, a display module, a Bluetooth communication module, a battery, and the like. The system will also increase the available modules as appropriate for different applications.

(2) According to different system component functions, package size and communication requirements between electronic components, multiple components are classified into different units, different units are integrated in different unit islands, and multiple units in the same unit island Electronic components communicate directly, and multiple cells between multiple unit islands communicate through a bus on a flexible substrate, thereby making communication between system components more efficient, while at the same time providing flexibility of the flexible substrate and reducing system volume. .

Methods for classifying a system as a unit island can include:

a, directly integrated on the PI substrate;

b, integrated on the PCB, and then interconnect the PCB unit through the PI substrate, see Figure 1;

The integration of the plurality of unit islands (modules) may include: directly encapsulating in the PI substrate; or connecting to the flexible substrate in the form of a PCB unit island.

(3) Flexible display: The LED array is packaged on the PI substrate, so that the display module of the system is reduced in volume, and has flexible characteristics, and the cost is greatly reduced.

(4) Adding a waterproof layer to the integrated system, combined with the flexible characteristics of the system, enables the system to be embedded in the textile article to facilitate the wearability of the electronic device.

As shown in FIG. 1, an embodiment of the present disclosure provides a wearable electronic device including a flexible substrate (such as a flexible substrate 4), a plurality of unit islands encapsulated on a flexible substrate in a multi-layer component package. LED flexible display module (such as

LED display arrays

6, 7 on the back side of the flexible substrate), and a plurality of electronic components integrated with electronic devices disposed in a plurality of unit islands and capable of constituting a desired function of the user; The plurality of electronic components are directly connected, and the plurality of unit islands are connected by a communication bus disposed on the flexible substrate; the plurality of electronic components in each of the unit islands are the same type of electronic components, and the functions of the same type of electronic components The package size and communication requirements between multiple electronic components are the same.

Here, the unit island includes a region partitioned on a flexible substrate and capable of accommodating the same type of electronic components, and/or a PCB board (such as PCB unit island 1) capable of integrating the same type of electronic components. The flexible substrate can be a PI substrate; and/or the plurality of electronic components include at least one processor unit, a sensor unit (such as an energy harvester 5), a Bluetooth communication module, and a power module (such as a microbattery 3).

In the above embodiment, when the plurality of unit islands and the LED flexible display module are packaged on the flexible substrate in a multi-layer component package, the operations to be performed include:

Using a COF flexible substrate packaging technology, a bare chip of a plurality of electronic devices in a plurality of unit islands (such as an IC bare chip set 2) is directly packaged on a flexible substrate; and the LED array is packaged on a flexible substrate The LED array packaged on the flexible substrate directly forms the LED flexible display module.

The technical solution of the present disclosure utilizes a COF flexible substrate packaging technology (fixing an IC to a die-bonding technology on a flexible circuit board, using a soft additional circuit board as a package chip carrier to bond the chip to the flexible substrate circuit) Technology), integrate multiple circuit modules, displays, batteries, Bluetooth and other modules, without reasonable loss of system performance, reasonably arrange the connection of the multiple modules, directly package the die of multiple modules on the flexible substrate The system is greatly reduced in size, with full functionality and foldability. The technical solution of the present disclosure is implemented as follows:

(1) Using the foldable characteristics of the polymer substrate PI resin and its reliability as a substrate material, the module is packaged on the PI substrate to maintain the reliability of the system while having the PI The foldable features make the entire system easy to wear.

(2) The packaging process is based on a stacked package of multi-layer components, including LED display components, multiple systems Component module (island) and PI substrate.

1 Flexible display module: The LED array is integrated on a flexible substrate to realize a flexible display function and as a display module of the wearable system, the system is reduced in volume and has foldable characteristics.

The technical solution of the present disclosure directly forms a display module (screen) by encapsulating the LED array without an external display screen, thereby effectively reducing system volume and cost. Figure 1 is a diagram illustrating the LED array display.

2 The complete system is directly optimized by the bare chip: in order to reduce the system volume and at the same time make the system components better communicate with each other, the bare chip is directly integrated into the system; the different electronic components are classified and integrated. In a different unit, a plurality of units are connected to each other in the form of an island, so that the volume of the system is greatly reduced while the system is intact, and the internal structure is optimized. The direct integration operation of the bare chip is that the bare chip is directly packaged in the flexible substrate, which can be called a chip on board (CoB) in technology; the advantage is to reduce the volume and reduce the cost; the operation process includes: solid For the steps of crystal, wire bonding and encapsulation, a conventional chip packaging process can also be used.

3 The interconnection between each unit island is based on a PI substrate to ensure system flexibility. Due to the flexibility of the PI substrate and the material reliability, as well as the mature characteristics of the perforated leads during the packaging process, it can be used to interconnect the classified unit islands based on the PI substrate to ensure the flexible characteristics of the system.

(3) Adding a waterproof layer to the integrated system, combined with the flexible characteristics of the system, enables the system to be embedded in the textile article to facilitate the wearability of the electronic device. The flexible package itself is a waterproof package, and the PI substrate acts to isolate water vapor, so that the components and modules integrated inside are protected from moisture and pollution in the environment.

The above description is only an alternative embodiment of the present disclosure, and is not intended to limit the present disclosure. Although the present disclosure has been described with reference to the foregoing embodiments, it is still possible for those skilled in the art to The technical solutions described are modified, or some of the technical features are equivalently replaced.

Industrial applicability

The wearable electronic device and the packaging method thereof provided by the embodiments of the present disclosure can overcome the defects of the related technologies, such as less functions, large space occupation, and inconvenient storage, so as to achieve multiple functions, occupy small space, and accommodate Convenient advantages.

Claims

A method of packaging a wearable electronic device, comprising:

Classifying a plurality of electronic components in an electronic device, the same type of electronic components being classified in a unit island;

The plurality of electronic components and the LED flexible display module in the plurality of unit islands are packaged on the flexible substrate in a multi-layer component stacking manner, and the plurality of electronic components in each unit island are directly connected, and more The unit islands are connected by a communication bus provided on a flexible substrate.
The method according to claim 1, wherein one of the unit islands is: an area divided on a flexible substrate and capable of accommodating the same type of electronic components; and/or a printed circuit board PCB capable of integrating the same type of electronic components ;

Wherein, when the function of the electronic component, the package size, and the communication requirements between the plurality of electronic components are the same, it is determined that the plurality of electronic components are the same type of electronic components.
The method of claim 1 or 2, wherein the categorizing the plurality of electronic components in the electronic device comprises:

Dividing a plurality of unit islands on the flexible substrate, directly integrating the same type of electronic components into a unit island on the flexible substrate; and/or,

The same type of electronic components are integrated on one PCB unit island, and then multiple PCB unit islands are interconnected through a flexible substrate.
The method according to claim 1 or 2, wherein the encapsulating the plurality of electronic components and the LED flexible display module in the plurality of unit islands on the flexible substrate in a multi-layer component package manner comprises:

Using a flip chip COF flexible substrate packaging technology to directly package a bare chip of a plurality of electronic components in a plurality of unit islands on a flexible substrate;

The LED flexible display module is packaged on a flexible substrate.
The method of claim 4, wherein the encapsulating the LED flexible display module on the flexible substrate comprises:

The LED array is packaged on a flexible substrate, and the LED array packaged on the flexible substrate forms an LED flexible display module.
The method of claim 1 or 2, wherein the flexible substrate is a polyimide PI substrate.
The method according to claim 1 or 2, wherein

The plurality of electronic components include at least one processor unit, a sensor unit, and a Bluetooth communication module And power modules.
A wearable electronic device comprising:

a flexible substrate, a plurality of unit islands and a light emitting diode LED flexible display module packaged on the flexible substrate in a multilayer component package, and a plurality of electronic components integrated in the plurality of unit islands;

Direct connection between a plurality of electronic components in each unit island, and a plurality of unit islands are connected by a communication bus disposed on the flexible substrate;

The plurality of electronic components in each unit island are the same type of electronic components.
The wearable electronic device of claim 7, wherein one of the unit islands comprises a region partitioned on the flexible substrate and capable of accommodating the same type of electronic components, and/or a printed circuit capable of integrating the same type of electronic components Board PCB;

Among them, the same type of electronic components include: the function of the electronic component, the package size, and a plurality of electronic components having the same communication requirements between the plurality of electronic components.
The wearable electronic device of claim 7 or 8, wherein the flexible substrate is a PI substrate.
The wearable device according to claim 7 or 8, wherein the plurality of electronic components comprise at least one processor unit, a sensor unit, a Bluetooth communication module, and a power supply module.