CN105161973A - Packaging structure and packaging method for fiber coupled semiconductor laser - Google Patents
Packaging structure and packaging method for fiber coupled semiconductor laser Download PDFInfo
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- CN105161973A CN105161973A CN201510614095.0A CN201510614095A CN105161973A CN 105161973 A CN105161973 A CN 105161973A CN 201510614095 A CN201510614095 A CN 201510614095A CN 105161973 A CN105161973 A CN 105161973A
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Abstract
The invention belongs to the technical field of semiconductor lasers, and specifically discloses a packaging structure and a packaging method for a fiber coupled semiconductor laser. The packaging structure comprises a bottom plate, a tube cap, a window cover plate and a windowing structure, wherein the tube cap is buckled on the bottom plate, and the sealed interface between the tube cap and the bottom plate is sealed and connected by bonding; the windowing structure is arranged on the tube cap; the window cover plate is connected with the windowing structure by welding; and the bonding of the sealed interface between the tube cap and the bottom plate and the welding of the sealed interface between the window cover plate and the windowing structure are completed in the protective environment of inert gas. The packaging structure and the packaging method do not have too much limitation to the materials on the two sides of the sealed interfaces or strict requirements for the flatness and the cleanliness of the sealed planes, can be used for packaging special-shaped structures and large-sized sealed interfaces, and do not need complex packaging equipment and packaging clamps.
Description
Technical field
The invention belongs to the technical field of semiconductor laser, specifically a kind of encapsulating structure of fiber coupled laser diode and method for packing.
Background technology
Recent years, high-power semiconductor laser is produced, as direct material processed, optical-fiber laser and amplifier pumping, free-space method, printing and medical treatment etc. for many application more and more.These primarily give the credit to the development of laser structure design, semi-conducting material and reliable encapsulation technology.Particularly, the encapsulation of semiconductor laser makes Laser Devices can obtain high-wall and inserts efficiency, improves stability and saves the use cost of user.Although all progress that recent years obtain, encapsulation, test and reliability etc. still occupy the great amount of cost of the semiconductor laser that coupling fiber exports.
The encapsulation of semiconductor laser refers to that the measures such as and sealing fixing by electrical connection, optical coupling, temperature control, machinery make semiconductor laser become and have certain function and the assembled process of stable performance.
Usual chip of laser needs to work under nitrogen protection environment, and therefore which kind of packing forms all must consider air-tightness.For the module of some special purpose, its encapsulating package irregular structure, overall dimension is larger, and inside modules often has chip and the circuit of other function.
At present, the capping method of semiconductor laser adopts the fluid sealant encapsulation of parallel soldering and sealing or application high strength mostly.Above two kinds of capping methods, all extensive uses in the encapsulation of semiconductor laser.Wherein, it is fast that parallel soldering and sealing has package speed, high reliability.But because parallel soldering and sealing is to the solderability of welding material, evenness and the cleanliness factor of welding plane all have comparatively strict requirement.Sealing device is expensive simultaneously, can not carry out large area soldering and sealing, needs frock clamp be fixed welded part and can not carry out the factors such as soldering and sealing to polymorphic structure, limit parallel soldering and sealing and apply more widely in semiconductor laser encapsulation field in welding.The method for packing of another kind of application high-intensity sealing glue, effectively can overcome the shortcomings of parallel soldering and sealing.There is no too many limitation to by the material on both sides, seal interface, to the inundue requirement of the evenness of the plane of sealing, polymorphic structure and large scale encapsulation can be encapsulated, not need complicated sealed in unit and encapsulation fixture simultaneously.But the method is to sealing adhesive process, there is comparatively strict requirement.Due to glue in the curing process, there is mobility, the draught head of the temperature in solidification process and seal inside and outside can cause fluid sealant in the flowing at seal interface place, causes fluid sealant to depart from seal interface in the curing process, the air-tightness of the semiconductor laser after impact encapsulation.
High power semiconductor lasers has the advantages such as the little and high reliability of high efficiency, high-output power, volume, is widely used in the fields such as light-pumped solid state laser, direct material processing, printing.The working life of device is the key factor directly affecting its application, has multiple degradation mechanism relevant to it, can be divided into slow degeneration, fast degradation and sudden failure etc. by way of degeneration; Then divide for by the contamination of face, chamber, device damage, electrode degradation, fault in material, solder does not infiltrate, erection stress and face, chamber COD etc. cause degeneration by causes for Degradation.
The face, chamber of laser is exposed in air after cleavage, easily be subject to contamination, deliquescence and oxidation and form surface state, under the high optical power density of front facet and current density, these surface states are as light absorption and non-radiative recombination center, chamber surface temperature is raised, the deterioration velocity of device is accelerated, and COD even occurs and causes device sudden failure.For solving face, chamber problem, the approach that can take is the absorption reducing light and the distribution of charge carrier in face, chamber, reduce light near face, chamber, as adopted Large optical cavity structure, transparent window structure, electric current non-implanted window structure etc.Reduce surface state, remove light absorption and non-radiative recombination center, as vacuum cleavage and face, chamber ion beam milling, passivating technique.Except improving in the self structure of chip of laser, in the process of semiconductor laser encapsulation, in order to give semiconductor laser chip one stable operational environment, needing cleaning, a drying and having the confined space of protective gas.The reliability of the closed shell of laser is the key point of the stability determined after semiconductor laser encapsulation, and its packaging shell technique is also a difficult problem of industry.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of encapsulating structure and method for packing of fiber coupled laser diode.This encapsulating structure and method efficiently solve the problem existing for the encapsulation process at large scale and polymorphic structure interface.
To achieve these goals, the present invention is by the following technical solutions:
A kind of encapsulating structure of fiber coupled laser diode; comprise base plate, Guan Gai, window cover plate and fenestration; wherein pipe lid to be fastened on described base plate and seal interface between pipe lid and base plate is tightly connected by bonding way; described fenestration is arranged on described pipe lid or base plate; described window cover plate is connected with described fenestration by the mode of welding, and described pipe lid all completes with the welding process that is bonding and seal interface between described window cover plate and described fenestration of seal interface between base plate in inert gas shielding environment.
Described pipe lid is boxlike integrative-structure, and described pipe cover buckle is closed with on base plate, and the seal interface between described base plate and pipe lid is provided with the first concave-convex fit structure, and described first concave-convex fit structure passes through fluid sealant adhering and sealing in inert gas shielding environment.
Described pipe lid comprises ring frame and top cover; the bottom of described ring frame is connected with described base plate by the first concave-convex fit structure; the top of described ring frame is connected with described top cover by the second concave-convex fit structure, and described first concave-convex fit structure and described second concave-convex fit structure all pass through fluid sealant adhering and sealing in inert gas shielding environment.
Described top cover is connected with described ring frame further by screw.
Described fenestration comprises window groove, window package interface projection and window; wherein window groove is arranged at described pipe and covers and bottom is provided with the window with the encapsulation inner space of described encapsulating structure; the edge of described window is circumferentially provided with window package interface projection, and described window cover plate is welded by the mode of parallel soldering and sealing and described window package interface projection in inert gas shielding environment.
Described in the outer surface of described window cover plate and its place, the outer surface of pipe lid is coplanar.
A method for packing for fiber coupled laser diode, described method for packing is in inert gas shielding environment, carry out the encapsulation between base plate, pipe lid and window cover plate, and its encapsulation process comprises following step:
1) in inert gas shielding environment, pipe cover buckle with fenestration is combined on base plate, seal interface between described base plate and pipe lid is provided with the first concave-convex fit structure, described first concave-convex fit structure is by fluid sealant adhering and sealing, by fixture base plate and pipe lid fixed again and shift out inert gas shielding environment, carrying out the solidification of fluid sealant; Described fenestration is used for package cavity inside and outside pressure reduction in balanced seal adhesive curing process;
2) between described base plate and pipe lid the first concave-convex fit structure place sealing glue solidifying after, the assembly of described base plate and pipe lid is moved in inert gas shielding environment again, window cover plate is welded in fenestration that described pipe covers;
3) the assembling entirety of described base plate, pipe lid and window cover plate is shifted out inert gas shielding environment, complete overall package.
Described pipe lid is made up of ring frame and top cover; wherein between the bottom of ring frame and described base plate, seal interface is provided with described first concave-convex fit structure; between the top of described ring frame and top cover, seal interface is provided with the second concave-convex fit structure; in step 1) in complete the sealing of described first concave-convex fit structure after; carry out the adhesive seal of described second concave-convex fit structure; by fixture base plate, ring frame and top cover fixed again and shift out inert gas shielding environment, carrying out the solidification of fluid sealant.
In described step 1) in, be connected further by screw between described top cover with described ring frame.
Described fenestration comprises window groove and is arranged at the window of this window bottom portion of groove, and the edge of described window is circumferentially provided with window package interface projection.In described step 2) in, described window cover plate is welded with described window package interface projection by the mode of parallel soldering and sealing.
Advantage of the present invention and beneficial effect are: present invention incorporates parallel soldering and sealing and fluid sealant two aspect advantage; for large scale or special-shaped package interface application fluid sealant packing forms; simultaneously in order to prevent fluid sealant from producing flowing in solidification process under Buchholz protection environment; adopt special pipe lid fenestration, be used for seal inside and outside differential pressure in balanced seal adhesive curing process.The method efficiently solves the problem of fluid sealant existing for the encapsulation process at large scale and polymorphic structure interface, and the encapsulation for high-power semiconductor laser provides effective method for packing.
Accompanying drawing explanation
Fig. 1 is the structural representation of apparatus of the present invention;
Fig. 2 is the explosive view of the embodiment of the present invention one;
Fig. 3 is the assembling schematic diagram of the embodiment of the present invention one;
Fig. 4 is the explosive view of the embodiment of the present invention two.
Wherein: 1 is base plate, 11 is base plate package interface groove, and 2 is pipe lid, 21 is ring frame, and 211 is ring frame screwed hole, and 212 is that ring frame package interface is protruding, 22 is top cover, and 221 is top cover screwed hole, and 222 is top cover package interface groove, 3 is electrode outlet, and 4 is coupling light parts, and 5 is window cover plate, 6 is fenestration, 61 is window groove, and 62 is that window package interface is protruding, and 63 is window.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.
As shown in Figure 1, the encapsulating structure of a kind of fiber coupled laser diode provided by the invention, comprise base plate 1, pipe lid 2, window cover plate 5 and fenestration 6, wherein pipe lid 2 to be fastened on described base plate 1 and seal interface between pipe lid 2 and base plate 1 is tightly connected by fluid sealant bonding way, described fenestration 6 is arranged on described pipe lid 2 or base plate 1, for package cavity inside and outside pressure reduction in balanced seal adhesive curing process; Described window cover plate 5 is connected with described fenestration 6 by the mode of welding; described pipe lid 2 all completes with the welding process that is bonding and seal interface between described window cover plate 5 and described fenestration 6 of seal interface between base plate 1 in inert gas shielding environment, realizes clean, dry and has the confined space of protective gas.
Embodiment one
As shown in Figure 2; described pipe lid 2 comprises ring frame 21 and top cover 22; the bottom of described ring frame 21 is connected with described base plate 1 by the first concave-convex fit structure; the top of described ring frame 21 is connected with described top cover 22 by the second concave-convex fit structure, and described first concave-convex fit structure and described second concave-convex fit structure all pass through fluid sealant adhering and sealing in inert gas shielding environment.
As shown in Figure 3, described first concave-convex fit structure comprises the base plate package interface groove 11 being circumferentially arranged at described base plate 1 edge, after filling high-intensity sealing glue in described base plate package interface groove 11, the bottom margin of described ring ring frame 21 and the grafting of base plate package interface groove 11 coordinate.Described second concave-convex fit structure comprises the ring frame package interface protruding 212 being circumferentially arranged at described ring frame 21 top and the top cover package interface groove 222 being circumferentially arranged at described top cover 22 lower edge, after the plane of protruding 212 sides of described ring frame package interface smears high-intensity sealing glue, described top cover 22 is coordinated by protruding 212 grafting of described top cover package interface groove 222 and described ring frame package interface, and by fluid sealant adhering and sealing.Shift out inert gas shielding environment after described base plate 1, ring frame 21 and top cover 22 have encapsulated, leave standstill adhesive curing to be sealed.
In order to strengthen sealing effectiveness further, reciprocating hermetic structure can be adopted, namely multiple described first concave-convex fit structure is set between the bottom and described base plate 1 of described ring frame 21, multiple described second concave-convex fit structure is set between the top of described ring frame 21 and described top cover 22, in order to improve the intensity of sealing.
The corner of described top cover 22 is respectively equipped with four top cover screwed holes 221, the corner, top of described ring frame 21 is respectively equipped with four the ring frame screwed holes 211 corresponding with the top cover screwed hole 221 of four on top cover 22, after described top cover 22 is bonding with described ring frame 21, be connected with described ring frame 21 further by screw at four top cover screwed hole 221 places.The sidewall of described ring frame 21 is provided with the necessary structure such as electrode outlet 3, coupling light parts 4.
After sealing glue solidifying in described first concave-convex fit structure and described second concave-convex fit structure; again described base plate 1, ring frame 21 and top cover 22 packaging body are moved in inert gas shielding environment, carry out welding of seal interface between described window cover plate 5 with described fenestration 6.
As shown in Figure 2; described fenestration 6 is arranged on described top cover 22; comprise window groove 61, window package interface protruding 62 and window 63; wherein window groove 61 is arranged on described top cover 22 and bottom and is provided with the window 63 with the encapsulation inner space of described encapsulating structure; the edge of described window 63 is circumferentially provided with window package interface projection 62, and described window cover plate 5 is welded with described window package interface protruding 62 by the mode of parallel soldering and sealing in inert gas shielding environment.Described in the outer surface of described window cover plate 5 and its place, the outer surface of top cover 22 is coplanar.
Described fenestration 6 is not limited on described top cover 22, also can be arranged at the optional position on described base plate 1 or ring frame 21.In the present embodiment, described window 63 is square structure, also can be evolved into the structure that hole, hole array etc. can be used for balancing package cavity inside and outside pressure reduction.
Described encapsulating structure adopts metal material, and as copper, stainless steel etc., described encapsulating structure seal interface place adopts the sealing of high-intensity sealing glue.
A kind of method for packing of fiber coupled laser diode; described method for packing is that encapsulation process is carried out all the time in the inert gas shielding environment of negative pressure drying, and the encapsulation process between base plate 1, pipe lid 2 (comprising ring frame 21 and top cover 22) and window cover plate 5 comprises following step:
1) in inert gas shielding environment, in the base plate package interface groove 11 of base plate 1, evenly pour into high-intensity sealing glue, then ring frame 21 lower edge is sunk in the base plate package interface groove 11 after encapsulating, and make it tightly fasten the two alignment.Use fixture the ring frame 21 after fastening and base plate 1 to be fixed together, preventing the change causing the two relative position when carrying out follow-up assembling, affecting air-tightness.Then at the upper limb platform place uniform application high-intensity sealing glue of ring frame 21, the ring frame package interface projection 212 of top cover package interface groove 222 alignment ring frame 21 upper limb on top cover 22 is fallen, and with screw, top cover 22 and ring frame 21 is locked.With frock clamp, described base plate 1, ring frame 21 and the top cover 22 after fastening is fixed, prevent the displacement at rubber seal interface.After described base plate 1, ring frame 21 and top cover 22 have assembled, shifted out inert gas shielding environment, left standstill the sealing glue solidifying at part seal interface to be installed place.
If base plate 1, ring frame 21 and top cover 22 form closed structure described in this link, the pressure of protective gas during owing to being assembling at the gas pressure intensity of confined space, gas pressure intensity is much smaller than normal atmospheric pressure.Under the driving of inside and outside differential pressure, the fluid sealant at package interface place, flows generation, departs from interface, forms cavity, causes airtight failure.Top cover 22 described in the present invention offers fenestration 6; when assembly shifts out inert gas shielding environment; the space that assembly is closed and atmospheric environment can carry out air pressure balance by fenestration 6; eliminate pressure reduction; leave standstill in solidification process at assembly like this; fluid sealant can not produce flowing, avoids fluid sealant to depart from seal interface, affects air-tightness.
2) after the sealing glue solidifying at assembly seal interface place, assembly is moved to again in the inert gas shielding environment of negative pressure drying, carry out the soldering and sealing of window cover plate 5 and fenestration 6.By the justified margin of the window package interface projection 62 on the edge of window cover plate 5 and fenestration 6, parallel soldering and sealing is carried out to the edge of the two, completes overall package.This portion gives full play to the advantage of parallel soldering and sealing in small-sized package, and parallel soldering and sealing is simultaneously insensitive to inside and outside differential pressure, and packaging technology is simple.
3) the assembling entirety of described base plate 1, ring frame 21, top cover 22 and window cover plate 5 is shifted out inert gas shielding environment; complete overall package; thus achieve cleaning, drying and have the confined space of protective gas, for semiconductor laser chip provides a stable operational environment.
Embodiment two
As shown in Figure 4, described pipe lid 2 is boxlike integrative-structure, described pipe lid 2 is fastened on base plate 1, its encapsulation process and technique substantially identical with embodiment one, difference is exactly, because pipe lid 2 adopts integrative-structure, eliminate the encapsulation link of pipe lid 2 itself, save packaging time and simplify packaging technology.The sidewall of the pipe lid 2 of integral structure is integrated with the necessary structure such as electrode outlet 3 and coupling light parts 4.
In sum, the present invention does not have too many limitation to by the material on both sides, seal interface, the evenness of plane of sealing and cleanliness factor are not strict with, polymorphic structure and large scale seal interface can be encapsulated, and do not need complicated sealed in unit and encapsulation fixture, the invention solves a difficult problem for large scale and the encapsulation of special-shaped package interface.
Claims (10)
1. the encapsulating structure of a fiber coupled laser diode, it is characterized in that, comprise base plate (1), pipe lid (2), window cover plate (5) and fenestration (6), wherein pipe lid (2) is fastened on the upper and seal interface between pipe lid (2) and base plate (1) of described base plate (1) and is tightly connected by fluid sealant bonding way, described fenestration (6) is arranged on described pipe lid (2) or base plate (1), for package cavity inside and outside pressure reduction in balanced seal adhesive curing process; Described window cover plate (5) is connected with described fenestration (6) by the mode of welding, and described pipe lid (2) all completes with the welding process that is bonding and seal interface between described window cover plate (5) and described fenestration (6) of seal interface between base plate (1) in inert gas shielding environment.
2. by the encapsulating structure of fiber coupled laser diode according to claim 1; it is characterized in that; described pipe lid (2) is boxlike integrative-structure; described pipe lid (2) fastens with on base plate (1); seal interface between described base plate (1) and pipe lid (2) is provided with the first concave-convex fit structure, and described first concave-convex fit structure passes through fluid sealant adhering and sealing in inert gas shielding environment.
3. by the encapsulating structure of fiber coupled laser diode according to claim 1; it is characterized in that; described pipe lid (2) comprises ring frame (21) and top cover (22); the bottom of described ring frame (21) is connected with described base plate (1) by the first concave-convex fit structure; the top of described ring frame (21) is connected with described top cover (22) by the second concave-convex fit structure, and described first concave-convex fit structure and described second concave-convex fit structure all pass through fluid sealant adhering and sealing in inert gas shielding environment.
4., by the encapsulating structure of fiber coupled laser diode according to claim 3, it is characterized in that, described top cover (22) is connected with described ring frame (21) further by screw.
5. by the encapsulating structure of the fiber coupled laser diode described in any one of claim 1-4, it is characterized in that, described fenestration (6) comprises window groove (61), window package interface projection (62) and window (63), wherein window groove (61) is arranged on described pipe lid (2), and bottom is provided with the window (63) with the encapsulation inner space of described encapsulating structure, the edge of described window (63) is circumferentially provided with window package interface projection (62), described window cover plate (5) is welded with described window package interface projection (62) by the mode of parallel soldering and sealing in inert gas shielding environment.
6. by the encapsulating structure of fiber coupled laser diode according to claim 5, it is characterized in that, described in the outer surface of described window cover plate (5) and its place, the outer surface of pipe lid (2) is coplanar.
7. the method for packing of a fiber coupled laser diode; it is characterized in that; described method for packing is in inert gas shielding environment, carry out the encapsulation between base plate (1), pipe lid (2) and window cover plate (5), and its encapsulation process comprises following step:
1) in inert gas shielding environment, pipe lid (2) with fenestration (6) is fastened on base plate (1), seal interface between described base plate (1) and pipe lid (2) is provided with the first concave-convex fit structure, described first concave-convex fit structure is by fluid sealant adhering and sealing, by fixture, base plate (1) and pipe lid (2) fixed and shifted out inert gas shielding environment again, carrying out the solidification of fluid sealant; Described fenestration (6) is for package cavity inside and outside pressure reduction in balanced seal adhesive curing process;
2) between described base plate (1) and pipe lid (2) the first concave-convex fit structure place sealing glue solidifying after, the assembly of described base plate (1) and pipe lid (2) is moved in inert gas shielding environment again, window cover plate (5) is welded in the fenestration (6) on described pipe lid (2);
3) the assembling entirety of described base plate (1), pipe lid (2) and window cover plate (5) is shifted out inert gas shielding environment, complete overall package.
8. by method according to claim 7, it is characterized in that, described pipe lid (2) is made up of ring frame (21) and top cover (22), wherein between the bottom of ring frame (21) and described base plate (1), seal interface is provided with described first concave-convex fit structure, between the top of described ring frame (21) and top cover (22), seal interface is provided with the second concave-convex fit structure, in step 1) in complete the sealing of described first concave-convex fit structure after, carry out the adhering and sealing of described second concave-convex fit structure, again by fixture by base plate (1), ring frame (21) and top cover (22) are fixed, and shift out inert gas shielding environment, carry out the solidification of fluid sealant.
9., by method according to claim 8, it is characterized in that, described step 1) in, between described top cover (22) and described ring frame (21) after adhering and sealing, connect further by screw.
10. by method according to claim 7, it is characterized in that, described fenestration (6) comprises window groove (61) and is arranged at the window (63) of this window groove (61) bottom, the edge of described window (63) is circumferentially provided with window package interface projection (62), in described step 2) in, described window cover plate (5) is welded with described window package interface projection (62) by the mode of parallel soldering and sealing.
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| CN201510614095.0A CN105161973B (en) | 2015-09-23 | 2015-09-23 | The encapsulating structure and method for packing of a kind of fiber coupled laser diode |
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| CN201510614095.0A CN105161973B (en) | 2015-09-23 | 2015-09-23 | The encapsulating structure and method for packing of a kind of fiber coupled laser diode |
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| Publication number | Publication date |
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| CN105161973B (en) | 2018-01-16 |
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