CN102780144A - Packaging structure for laser head of solid laser - Google Patents
Packaging structure for laser head of solid laser Download PDFInfo
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- CN102780144A CN102780144A CN2011101214292A CN201110121429A CN102780144A CN 102780144 A CN102780144 A CN 102780144A CN 2011101214292 A CN2011101214292 A CN 2011101214292A CN 201110121429 A CN201110121429 A CN 201110121429A CN 102780144 A CN102780144 A CN 102780144A
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Abstract
The invention discloses a packaging structure for a laser head of a solid laser. The packaging structure is mainly formed by connecting of a base plate, a cover plate, a front side plate, a back side plate, a left side plate and a right side plate, and is characterized in that grooves are arranged at the mutual sealed joints of the base plate, the upper cover plate, the front side plate, the back side plate, the left side plate and the right side plate, and sealing material used for sealing connection are arranged in the grooves. The packaging structure for the laser head of the solid laser has the advantages that the packaging structure is simple, the requirement of laser head sealing performance is met, the cost is reduced, and economical requirements are met.
Description
Technical field
The present invention relates to a kind of encapsulating structure of solid state laser laser head.
Background technology
In recent years, along with the raising of china's overall national strength and whole industrial level, China's processing manufacturing industry just progressively makes the transition to recycling economy, high added value, high precision int from extensive style, high energy consumption, low value-added pattern.For realizing this target, eliminate the backward production facilities and to carry out industrial upgrading imperative.Using advanced process equipment and processing technology is to realize the important selection of economic transition.
Laser process equipment is the highly integrated product of laser, optics, machinery, electronics, software and industrial automation.The sector product variety is numerous, excellent performance, application are extensive, has become an important industry that develops rapidly.Laser is widely used in the commercial production, in particular for the aspects such as welding, cutting, punching, mark, rapid shaping and surface treatment of metal.The current the most widely used LASER Light Source of laser process equipment generally has two kinds.First kind is gas laser, i.e. carbon dioxide (CO
2) laser, its optical maser wavelength is 10.6 microns.Second kind is solid state laser, i.e. Nd:YAG (Nd:Y
3Al
5O
12, neodymium-doped yttrium-aluminum garnet) and laser, its optical maser wavelength is 1.064 microns.Solid state laser occupies quite great proportion owing to compact conformation, relative low price, processing effect excellence in laser process equipment.
As shown in Figure 3; Convenient disassembly when considering cost with maintenance; The laser head encapsulating structure that is applied to industrial solid state laser often adopts the non-tight structure, and package floor 31 adopts aluminium section bar, and encapsulation cover plate 32 then adopts easy U type sheet metal component; Use iron material, left plate 33 is generally aluminium section bar with 34 materials useds of right plate; Back side panel 35 is generally aluminium with 36 materials useds of front side board.In the time of encapsulation, left plate 33 and right plate 34 are installed on the base plate 31, then back side panel 35 and front side board 36 are installed on the base plate 31, and fully contact with left plate 33, right plate 34 as far as possible, cover encapsulation cover plate 32 at last with screw.The packaged type of Here it is general industry solid state laser laser head; Base plate 31, left plate 33, right plate 34, back side panel 35 and front side board 36 are the non-tight structure in the place that contacts with each other; Encapsulation cover plate 32 is to be made up of simple sheet metal component; The sheet metal component easy deformation at all can't the sealing solid laser.Relative solid state laser application requirements, the commercial production site condition is very severe often.Especially in the processing of laser cutting and laser welding, to supervene all that material splashes, material dust and toxic gas.Concerning the laser head of non-tight structure, these materials splash, material dust and toxic gas all are potential fatal risk to laser optical path and laser optics.They tend to get into the laser optical element in the laser head internal contamination laser head, thereby and then the beam quality that destroys laser beam reduce crudy greatly; Or be directly to destroy laser optical element, even do not go out laser in the time of serious.
Obviously, the laser head of non-tight structure is not to be suitable for the packaged high-power solid state laser, more is not suitable for being applied to industrial, thereby is necessary laser head is designed to hermetically-sealed construction.As shown in Figure 4; The solid state laser laser head overwhelming majority that scientific research is used is a hermetically-sealed construction; This laser head hermetically-sealed construction generally is made up of two parts; Comprise cavity 41 and upper cover plate 42, cavity 41 is designed to hermetically-sealed construction with the place that upper cover plate 42 contacts, thereby can satisfy the requirement of solid state laser sealing.But cavity 41 is cast out by mould often, and then processes, and this to cast out the Financial cost of the cavity 41 of reprocessing with mould bigger.Further, consider sealing requirements, water route and high-tension bus-bar are transferred outside laser head also should satisfy the requirement of sealing when advancing in the laser head.But, in the Traditional industrial solid state laser, often be on back side panel, directly to dig out the hole, let high-tension bus-bar and water route directly pass through, this obviously can not satisfy the requirement of laser head sealing.
Summary of the invention
Exist sealing wretched insufficiency and scientific research with the high problem of solid state laser laser head encapsulating structure cost to traditional industry solid state laser laser head encapsulating structure; The invention provides a kind of solid state laser laser head encapsulating structure, this laser head encapsulating structure has been taken into account the requirement of solid state laser encapsulating structure sealing and economy.
In order to address the above problem, the present invention is realized by following technical scheme.
A kind of solid state laser laser head encapsulating structure; Described encapsulating structure mainly connects to form by base plate, cover plate, front side board, back side panel, left plate and right plate are sealed to each other; It is characterized in that: said base plate, upper cover plate, front side board, back side panel, left plate and right plate are provided with groove in junction sealed to each other, are provided with encapsulant in the groove and are used to be tightly connected.
The groove of described left plate, right plate, back side panel, front side board and cover plate or base plate junction sealed to each other forms an annular groove, is provided with corresponding annular packing material in the annular groove and is used to be tightly connected.
The groove of described back side panel, front side board and left plate, right plate, base plate or cover plate junction sealed to each other forms a U font groove, is provided with corresponding U font encapsulant in the U font groove and is used to be tightly connected.
The groove of described left plate, right plate and base plate or cover plate junction sealed to each other is a straight-line groove, is provided with corresponding line seal material in the straight-line groove and is used to be tightly connected.
Described back side panel also is provided with the sealing adaptor plate that is used to connect cooling water and high-tension bus-bar.
Described sealing adaptor plate is provided with the hole of connecting the cooling water water route; Be tightly connected between hole and the water route; The sealing adaptor plate also is provided with the hole of connecting high-tension bus-bar, is tightly connected between hole and the high-tension bus-bar, is provided with sealing ring between sealing adaptor plate and the back side panel and is tightly connected.
Described front side board also is provided with laser output window.
Described laser output window is provided with laser output through hole; Laser output through hole is concentric with the laser output through hole of being located on the front side board; Laser output through hole on the front side board is provided with optical glass, between the output of the laser on optical glass and front side board through hole, is provided with sealing ring and is tightly connected.
Described encapsulant is the latex bar.
Beneficial effect of the present invention is that encapsulating structure is simple, has not only satisfied the requirement of solid state laser laser head sealing, and has reduced cost, satisfies requirement economically.
Description of drawings
Fig. 1 is the decomposition rough schematic view of solid state laser laser head encapsulating structure of the present invention
Fig. 2 is sketch map after the assembling of solid state laser laser head encapsulating structure of the present invention
Fig. 3 is existing industrial solid laser laser head encapsulating structure rough schematic view
Fig. 4 is the rough schematic view of existing scientific research with solid state laser laser head encapsulating structure
Fig. 5 does not attach the rough schematic view of laser output window for front side board of the present invention
Fig. 6 is the rough schematic view of right plate of the present invention
Fig. 7 is the rough schematic view of base plate of the present invention
Fig. 8 is the rough schematic view of cover plate of the present invention
Fig. 9 is the decomposition rough schematic view of the laser output window on the front side board of the present invention
Figure 10 is the decomposition rough schematic view of the sealing adaptor plate on the back side panel of the present invention
Embodiment
Do to describe in further detail below in conjunction with the accompanying drawing specific embodiments of the invention.
The decomposition rough schematic view of solid state laser laser head encapsulating structure as shown in Figure 1.This solid state laser laser head encapsulating structure comprises base plate 11, cover plate 12, left plate 13, right plate 14, back side panel 15, front side board 17, sealing adaptor plate 16 on the back side panel and the laser output window 18 on the front side board.The present invention also comprises base plate encapsulant 112, base plate encapsulant 113, back side panel encapsulant 152, front side board encapsulant 172 and cover plate for sealing material 122.As shown in Figure 7; Base plate 11 and arranged on left and right sides have straight-line groove 114,115; As shown in Figure 5, back side panel 15 is being provided with groove 174 with front side board 17 with base plate 11, left plate 13, right plate 14 junctions sealed to each other, and groove 174 connects together and forms a U font groove.Left plate 13, right plate 14, back side panel 15, front side board 17 are equipped with the straight line groove with cover plate 12 junctions sealed to each other, and four grooves connect together and form an annular groove.In the time of encapsulation; Base plate encapsulant 112 and base plate encapsulant 113 are contained in respectively base plate 11 left groove 114 and right groove 115 on; Counterbore with left plate 13 and right plate 14 bases aligns lock screw connection sealed to each other with the screwed hole of base plate 11 left and right sides then.Back side panel encapsulant 152 and front side board encapsulant 172 are contained in respectively on the groove 174 of back side panel 15 and front side board 17; Counterbore with back side panel 15 and front side board 17 aligns lock screw connection sealed to each other with the screwed hole of base plate 11, left plate 13, right plate 14 then.Cover plate for sealing material 122 is contained in the annular groove of being made up of left plate 13, right plate 14, back side panel 15, front side board 17; The screwed hole of counterbore on the cover plate 12 with left plate 13, right plate 14, back side panel 15, front side board 17 alignd lock screw connection sealed to each other.Sealing adaptor plate 16 on the back side panel 15 is installed on the back side panel 15, and cooling water and pass through high-tension bus-bar is used to transfer.Laser output window on the front side board 18 is installed on the front side board 17, is used to export laser.Fig. 2 is in the present embodiment, and the rough schematic view of solid state laser laser head encapsulating structure according to the step of above-mentioned encapsulation, is combined the plate of six separation, just forms complete laser head encapsulating structure as shown in Figure 2.
The employed material of encapsulant of the present invention may be selected to be the latex bar, is filled in the groove of six plate junctions sealed to each other.
Please combine Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, follow-up several rough schematic views shown in Figure 10,, but should not limit protection scope of the present invention with this with the structure that some plate in this encapsulating structure further is described.
The rough schematic view of laser head encapsulating structure front side board 17 does not attach laser output window 18 in the present embodiment as shown in Figure 5 in this sketch map, and this sketch map only is used for showing the sketch map of encapsulating structure, does not relate to other function of encapsulating structure.Because the packaged type of back side panel 15 and the packaged type of front side board 17 are identical, thereby Fig. 5 also is the sketch map of the encapsulating structure of front side board 15.The place that front side board 17 contacts with cover plate 12 has straight line groove 173, and the groove of one section bending is respectively arranged at the two ends of groove 173, and back side panel 15, front side board 17 also link together with groove on left plate 13 and the right plate 14, form the groove of an annular.Front side board 17 is provided with a U-shaped groove 174 with left plate 13, right plate 14 and base plate 11 junctions sealed to each other; In the time of encapsulation; Encapsulant 172 is installed in 174 li of U-shaped grooves, and straight-line groove 173 is not what link together with U-shaped groove 174, but 1～3 mm distance that staggers.
The rough schematic view of laser head encapsulating structure right plate 14 in the present embodiment as shown in Figure 6, this sketch map only is used for showing the sketch map of encapsulating structure, does not relate to other function of encapsulating structure.Because the packaged type of right plate 14 is identical in the packaged type of left plate 13, thereby Fig. 6 also is the sketch map of the encapsulating structure of left plate 13.The place that right plate 14 contacts with cover plate 12 has straight line groove 142, and the groove on right plate 14, left plate 13 and front side board 17 and the back side panel 15 links together, and forms the groove of an annular.
The rough schematic view of laser head encapsulating structure base plate 11 in the present embodiment as shown in Figure 7.The left side of base plate 11 has straight line groove 114, and the right side has straight line groove 115.In the time of encapsulation, encapsulant 112 and encapsulant 115 are respectively installed to straight- line groove 114 and 115 li of straight-line grooves.
The rough schematic view of laser head encapsulating structure cover plate 12 in the present embodiment as shown in Figure 8.After left plate 13, right plate 14, back side panel 15 and front side board 17 be installed to base plate 11; Encapsulant 122 is installed in the annular groove that is formed by left plate 13, right plate 14, back side panel 15 and front side board 17; Cover cover plate 12; Lock screw connection sealed to each other, promptly accomplish the encapsulation of laser head.
Though Fig. 5, Fig. 6, Fig. 7 have described the distribution mode of groove in the encapsulating structure of the present invention, the personnel with mechanical field knowledge still can change the distribution mode of groove easily, thereby obtain the effect of sealing.Such as; Left plate 13, right plate 14, back side panel 15, front side board 17 and base plate 11 junctions sealed to each other can be designed to the groove of an annular; Back side panel 15, front side board 17 are designed to straight-line groove with left plate 13, right plate 14 junctions sealed to each other, equally also can realize the object of the invention.
The decomposition rough schematic view of laser output window 18 on the laser head encapsulating structure front side board 17 in the present embodiment as shown in Figure 9.On front side board 17, have the diameter counterbore 177 bigger slightly than optical glass 182; In counterbore 177, have annular groove 176; Annular groove 176 its centers of circle are concentric with counterbore 177, and the thickness of groove 176 is smaller slightly than the diameter of O-ring seals 181, in counterbore 177, have a laser output through hole 175; The center of circle of laser output through hole 175 is concentric with counterbore 177, and laser is from this through hole output.Have four screwed holes on the front side board 17; Be used for fixing laser output window 18; Have four counterbores and diameter laser output through hole 183 slightly littler on the laser output window 18 than optical glass 182; Laser is from these laser output through hole 183 outputs, and the laser output through hole 183 on the laser output window 18 is concentric with the laser output through hole 175 on the front side board.In the time of encapsulation, O-ring seals 181 is installed to 176 li of annular grooves, puts into optical glass 182 then, four counterbores with laser output window 18 align with front side board 17 upper screwed holes at last, lock screw connection sealed to each other.
Described sealing adaptor plate is provided with the hole of connecting the cooling water water route; Be tightly connected between hole and the water route; The sealing adaptor plate also is provided with the hole of connecting high-tension bus-bar, is tightly connected between hole and the high-tension bus-bar, is provided with sealing ring between sealing adaptor plate and the back side panel and is tightly connected.
Keyset in the present embodiment shown in figure 10 on the laser head encapsulating structure back side panel decomposes rough schematic view.Have four counterbores on the sealing adaptor plate 16, be used for sealing adaptor plate 16 is fixed to back side panel 15.The boss of one circle is arranged on the keyset 16, and boss is concentric with sealing adaptor plate 16.Have two isodiametric tapped through holes 161 and 162, two tapped through holes 161 of two isodiametric through holes and two through holes 162 on the boss and be cross distribution.The two ends of tapped through hole 161 are used for spiral shell and establish the water nozzles 164 that two connection cooling water water routes are installed.The length of screwed hole 161 is the reach that doubles on the water nozzle 164.Through hole 162 is used for through high-tension bus-bar.The boss outside has an annular groove 163, is used to install O-ring seals 165, and the diameter of the depth ratio O-ring seals 165 of groove 163 is slightly little.When installing; Four water nozzles 164 are wrapped with raw material band or epoxide-resin glue; Be installed to form on the two ends of two tapped through holes 161 and be tightly connected; O-ring seals 165 is installed on the annular groove 163,16 4 counterbores of sealing adaptor plate are alignd with four screwed holes on the back side panel 15, lock screw and form and be tightly connected.High-tension bus-bar through behind the through hole 162, is tightly connected with the formation of glue rifle filling chink.
Claims (9)
1. solid state laser laser head encapsulating structure; Described encapsulating structure mainly connects to form by base plate, cover plate, front side board, back side panel, left plate and right plate are sealed to each other; It is characterized in that: said base plate, upper cover plate, front side board, back side panel, left plate and right plate are provided with groove in junction sealed to each other, are provided with encapsulant in the groove and are used to be tightly connected.
2. solid state laser laser head encapsulating structure according to claim 1; It is characterized in that: the groove of described left plate, right plate, back side panel, front side board and cover plate or base plate junction sealed to each other forms an annular groove, is provided with corresponding annular packing material in the annular groove and is used to be tightly connected.
3. solid state laser laser head encapsulating structure according to claim 1; It is characterized in that: the groove of described back side panel, front side board and left plate, right plate, base plate or cover plate junction sealed to each other forms a U font groove, is provided with corresponding U font encapsulant in the U font groove and is used to be tightly connected.
4. solid state laser laser head encapsulating structure according to claim 1; It is characterized in that: the groove of described left plate, right plate and base plate or cover plate junction sealed to each other is a straight-line groove, is provided with corresponding line seal material in the straight-line groove and is used to be tightly connected.
5. according to claim 1,2,3 or 4 described solid state laser laser head encapsulating structures, it is characterized in that: described back side panel also is provided with the sealing adaptor plate that is used to connect cooling water and high-tension bus-bar.
6. solid state laser laser head encapsulating structure according to claim 5; It is characterized in that: described sealing adaptor plate is provided with the hole of connecting the cooling water water route; Be tightly connected between hole and the water route; The sealing adaptor plate also is provided with the hole of connecting high-tension bus-bar, is tightly connected between hole and the high-tension bus-bar, is provided with sealing ring between sealing adaptor plate and the back side panel and is tightly connected.
7. according to claim 1,2,3 or 4 described solid state laser laser head encapsulating structures, it is characterized in that: described front side board also is provided with laser output window.
8. solid state laser laser head encapsulating structure according to claim 7; It is characterized in that: described laser output window is provided with laser output through hole; Laser output through hole is concentric with the laser output through hole of being located on the front side board; Laser output through hole on the front side board is provided with optical glass, between the output of the laser on optical glass and front side board through hole, is provided with sealing ring and is tightly connected.
9. according to claim 1,2,3 or 4 described solid state laser laser head encapsulating structures, it is characterized in that: described encapsulant is the latex bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101214292A CN102780144A (en) | 2011-05-09 | 2011-05-09 | Packaging structure for laser head of solid laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101214292A CN102780144A (en) | 2011-05-09 | 2011-05-09 | Packaging structure for laser head of solid laser |
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|---|---|
| CN102780144A true CN102780144A (en) | 2012-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101214292A Pending CN102780144A (en) | 2011-05-09 | 2011-05-09 | Packaging structure for laser head of solid laser |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015124093A1 (en) * | 2014-02-24 | 2015-08-27 | 马要武 | High air-tightness device |
| WO2020164251A1 (en) * | 2019-02-15 | 2020-08-20 | 深圳市星汉激光科技有限公司 | Sealing structure of laser |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5291504A (en) * | 1992-02-18 | 1994-03-01 | Fibertek, Inc. | Laser pump module |
| US5475702A (en) * | 1994-05-31 | 1995-12-12 | General Electric Company | Diode pumped slab module |
| CN1805227A (en) * | 2005-12-16 | 2006-07-19 | 中国科学院上海光学精密机械研究所 | Laser concentration cavity and laser head with the same |
| CN202034669U (en) * | 2011-05-09 | 2011-11-09 | 深圳市光大激光技术有限公司 | Laser head packaging structure of solid laser |
| CN302034669S (en) * | 2012-04-25 | 2012-08-15 | 罗美 | Packing box (Xilao millet spicy) |
-
2011
- 2011-05-09 CN CN2011101214292A patent/CN102780144A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5291504A (en) * | 1992-02-18 | 1994-03-01 | Fibertek, Inc. | Laser pump module |
| US5475702A (en) * | 1994-05-31 | 1995-12-12 | General Electric Company | Diode pumped slab module |
| CN1805227A (en) * | 2005-12-16 | 2006-07-19 | 中国科学院上海光学精密机械研究所 | Laser concentration cavity and laser head with the same |
| CN202034669U (en) * | 2011-05-09 | 2011-11-09 | 深圳市光大激光技术有限公司 | Laser head packaging structure of solid laser |
| CN302034669S (en) * | 2012-04-25 | 2012-08-15 | 罗美 | Packing box (Xilao millet spicy) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015124093A1 (en) * | 2014-02-24 | 2015-08-27 | 马要武 | High air-tightness device |
| WO2020164251A1 (en) * | 2019-02-15 | 2020-08-20 | 深圳市星汉激光科技有限公司 | Sealing structure of laser |
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Application publication date: 20121114 |