CN105161593A - 一种可将一种粉快速融合于基板之制造方法 - Google Patents
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Abstract
一种可将一种粉快速融合于基板之制造方法，至少具有一种粉及至少一覆盖于该粉上之黏性颗粒体或黏性膜体，其制造方法流程步骤如下:先将该粉置入一滚筒内使该粉能被均匀搅拌；再利用加热或其他方式将黏性颗粒体均匀附着于上述粉上；接着将上述之该粉与该黏性膜体融合后，经烘干或自然风干即形成一粉层。
Description
技术领域
本发明系有关于一种粉之制造方法，特别是指一种可将该粉快速融合于基板之制造方法。
背景技术
LED及Light-EmittingDiode的缩写，中文名为发光二极管，一般我们在生活上都只说LED，平常在生活中很多地方都可以看到利用LED发光的产品，例如日光灯、手电筒、路灯、显示器等，但LED到底是什么？
LED是一种能发光的半导体电子组件，于公元1962年开始出现，早期只能发出低亮度的红光，经过不断研发，至今LED发出的光已经遍及可见光、红外线及紫外线，亮度也不断提升，因此被应用在各种照明装置。
LED具有高亮度、省电、寿命长、体积小、耐震荡等优点，但相对的也有缺失，例如:
1.LED在高亮度下效能较低，在一般照明用途上仍比荧光灯耗电，有些甚至比省电灯泡耗电。
2.成本高，因此售价相对较高。
3.因为LED光源面积小、聚旋光性集中，做照明用途时容易刺眼，须利用光学设计分散光源，因此市面上才有防眩光产品。
许多LED有过蓝的问题，只要少量蓝光就可以让人有精神，白天使用是可以的，但是不适合夜间使用。
LED有闪烁问题，随着亮度降低，闪烁情况越明显，对眼睛容易造成伤害。
发明内容
有鉴于此，本发明提供了一种可将一种粉快速融合于基板之制造方法。
本发明提供一种可将一种粉快速融合于基板之制造方法，其至少具有一种粉及至少一覆盖于该粉上之黏性颗粒体或黏性膜体，其制造方法流程步骤如下:
步骤一:将该粉置入一滚筒内使该粉能被均匀搅拌；
步骤二之一:利用加热或其他方式将黏性颗粒体均匀附着于步骤一之粉上；或
步骤二之二:将步骤一之该粉与该黏性膜体融合后，经烘干或自然风干即形成一粉层。
下面将参照附图描述本发明的实施方式。
图1系本发明一种可将一种粉快速融合于基板之制造方法之示意图
图2系本发明一种可将一种粉快速融合于基板之制造方法之流程图
1---粉，2---黏性颗粒体，3---膜体，31---粉层。
具体实施方式
请参考图1、图2，图1系本发明一种可将一种粉快速融合于基板之制造方法方法之示意图，图2系本发明一种可将一种粉快速融合于基板之制造方法之流程图。本发明至少具有一种粉1及至少一覆盖于该粉1上之黏性颗粒体2或膜体3。
上述所述之该粉1可为奈米碳珠粉或散热粉或导热散热粉或陶瓷粉或发光粉或石墨粉。
上述所述之该黏性颗粒体2可为玻璃粉、石墨烯粉、二氧化硅粉、硅胶、硅胶、硅树脂或陶瓷粉任何一种或其之组合。
上述所述之膜体3可为干式膜体，其原料可为玻璃粉、石墨烯粉、二氧化硅粉、硅胶、硅胶、硅树脂或陶瓷粉任何一种或其之组合。
上述所述之膜体3可为液态膜体，其原料可为玻璃液、石墨烯液、二氧化硅液、硅胶、硅胶、硅树脂或陶瓷液任何一种或其之组合。
其制造方法流程步骤如下:
步骤一:将该粉1置入一滚筒内使该粉能被均匀搅拌；
步骤二之一:利用加热或其他方式将黏性颗粒体2均匀附着于步骤一之粉1上；
步骤二之二::将步骤一之该粉与该黏性膜体融合后，经烘干或自然风干即形成一粉层。
上述步骤步骤二之二中之烘干方式可藉由超音波照射或紫外线烤箱烘干。
以上所述者仅用为用以解释本发明之较佳实施例，并非企图据以对本发明作任何形式上之限制，凡有在相同之发明精神下所作有关本发明之任何修饰或变更，皆仍应包括在本发明保护之范围。
Claims (8)
1.一种可将一种粉快速融合于基板之制造方法，其至少具有一种粉及至少一覆盖于该粉上之黏性颗粒体或黏性膜体，其制造方法流程步骤如下:
步骤一:将该粉置入一滚筒内使该粉能被均匀搅拌；
步骤二之一:利用加热或其他方式将黏性颗粒体均匀附着于步骤一之粉上；
或
步骤二之二:将步骤一之该粉与该黏性膜体融合后，经烘干或自然风干即形成一粉层。
2.申请专利范围第1项所述之一种可将一种粉快速融合于基板之制造方法，其中该粉可为奈米碳珠粉或散热粉或导热散热粉或陶瓷粉或发光粉或石墨粉。
3.申请专利范围第1项所述之一种可将一种粉快速融合于基板之制造方法，其中该黏性颗粒体可为玻璃粉、石墨烯粉、二氧化硅粉、硅胶、硅胶、硅树脂或陶瓷粉任何一种或其之组合。
4.申请专利范围第1项所述之一种可将一种粉快速融合于基板之制造方法，其中该膜体可为干式。
5.申请专利范围第1项所述之一种可将一种粉快速融合于基板之制造方法，其中该膜体可为液态。
6.申请专利范围第4项所述之一种可将一种粉快速融合于基板之制造方法，其中该干式膜体原料可为玻璃粉、石墨烯粉、二氧化硅粉、硅胶、硅胶、硅树脂或陶瓷粉任何一种或其之组合。
7.申请专利范围第5项所述之一种可将一种粉快速融合于基板之制造方法，其中该液态膜体原料可为玻璃液、石墨烯液、二氧化硅液、硅胶、硅胶、硅树脂或陶瓷液任何一种或其之组合。
8.申请专利范围第1项所述之一种可将一种粉快速融合于基板之制造方法，其中步骤二之二中之烘干方式可藉由超音波照射或紫外线烤箱烘干。
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| WO2016206348A1 (zh) * | 2015-06-24 | 2016-12-29 | 林立宸 | 一种芯片级发光组件的制备方法 |
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