CN105157735A - Sensor chip, manufacturing method thereof, encapsulation method and sensor core - Google Patents
Sensor chip, manufacturing method thereof, encapsulation method and sensor core Download PDFInfo
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- CN105157735A CN105157735A CN201510512722.XA CN201510512722A CN105157735A CN 105157735 A CN105157735 A CN 105157735A CN 201510512722 A CN201510512722 A CN 201510512722A CN 105157735 A CN105157735 A CN 105157735A
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Abstract
The invention discloses a sensor chip, a manufacturing method and encapsulation method of the sensor chip as well as a sensor core and belongs to the sensor technical field. An insulating layer is bonded to the bottom surface of the substrate of the sensor chip. According to the sensor chip of the invention, the insulating layer is bonded to the bottom surface of the substrate of the sensor chip, so that the problem of electric leakage of the sensor chip can be solved; when the sensor chip is encapsulated to form the sensor core, an additional ceramic substrate is not needed to be adopted, and the sensor chip can be directly bonded to a base, and therefore, a step of ceramic substrate bonding can be omitted, and encapsulation difficulty can be reduced, and the consistency and reliability of the encapsulation of the sensor chip can be improved, and encapsulation stress can be reduced.
Description
Technical field
The present invention relates to sensor technical field, especially a kind of sensor chip, the manufacture method of sensor chip, the method for packing of sensor chip and sensor core.
Background technology
At present, MEMS (micro electro mechanical system) (MEMS) pressure transducer has two kinds of structures: the silicon-silicon structure of substrate to be the silicon-Bo structure of glass and substrate be silicon.Along with improving constantly of application demand, the pressure transducer of conventional silicon-Bo structure can not meet application requirement, and silicon-silicon structure pressure transducer relies on the features such as its high precision, high stability, high reliability, become the main flow of pressure transducer development.
The pressure sensor chip of silicon-silicon structure, when being packaged into pressure sensor core, because its substrate is single crystal silicon material, being easy to electric leakage, thus causing pressure sensor core to lose efficacy.Although some chip is after completing processing, can by the mode of plasma enhanced chemical vapor deposition (PECVD) in deposited on substrates layer of oxide layer, but due to the restriction of process conditions, the oxide layer deposited is very thin, and pressure sensor core still can exist leaky.
The method solving the problem of pressure sensor core electric leakage in prior art increases one deck ceramic substrate by manual operations between pressure sensor chip and pedestal, is equivalent under pressure sensor chip, increase a substrate again.Although solve the problem of chip electric leakage like this, the present inventor finds that this method at least has following shortcoming:
The one one bonding die technique that has been many, adds the difficulty of encapsulation;
Two is the decline that the manual mode increasing ceramic substrate can cause encapsulation consistance, reliability;
Three is can introduce very large encapsulation stress when boning ceramic substrate, reduces the performance of pressure sensor chip.
Similarly, also can there are the problems referred to above when encapsulating in the sensor chip of other silicon-silicon structures.
Summary of the invention
One of them technical matters to be solved by this invention is: propose a kind of sensor chip and manufacture method, method for packing and sensor core, to make the electrical leakage problems that can solve sensor chip, the encapsulation stress introduced in sensor chip can be reduced in again.
According to an aspect of the present invention, provide a kind of sensor chip, the bottom surface of the substrate of described sensor chip is bonded with insulation course.
In one embodiment, described insulation course by anode linkage technique together with described substrate bonding.
In one embodiment, the surface of described insulation course and described substrate bonding has stress relief structure.
In one embodiment, described stress relief structure is the depression of annular, square, cruciform or X-shaped.
In one embodiment, described substrate is silicon substrate; Or described insulation course is glassy layer.
In one embodiment, described sensor chip is MEMS pressure sensor chip; Described MEMS pressure sensor chip comprises: described substrate, and the top of described substrate has cavity; Sensitive membrane over the substrate; Sensitive element in described sensitive membrane; Passivation layer in described sensitive membrane and described sensitive element.
In one embodiment, described pressure sensor chip also comprises: the metal lead wire be connected with described sensitive element.
In one embodiment, described sensor chip is temperature sensor chip, humidity sensor chip, gyro sensor chip or microphone sensor chip.
According to a further aspect in the invention, provide a kind of sensor chip, the bottom surface of the substrate of described sensor chip has insulation course, and the surface of described insulation course and substrate contact has stress relief structure.
In one embodiment, described stress relief structure is the depression of annular, square, cruciform or X-shaped.
According to another aspect of the invention, a kind of manufacture method of sensor chip is provided, comprises: the initial sensor chip comprising substrate is provided; At the bottom surface bonding insulation course of described substrate, to form sensor chip.
In one embodiment, by the bottom surface bonding insulation course of anode linkage technique at described substrate.
In one embodiment, the surface of described insulation course and described substrate bonding has stress relief structure.
In one embodiment, described stress relief structure is annular, square, cruciform, X-shaped depression.
In one embodiment, described substrate is silicon substrate; Or described insulation course is glassy layer.
In one embodiment, described sensor chip is MEMS pressure sensor chip; Described MEMS pressure sensor chip comprises: described substrate, and the top of described substrate has cavity; Sensitive membrane over the substrate; Sensitive element in described sensitive membrane; Passivation layer in described sensitive membrane and described sensitive element.
In one embodiment, described MEMS pressure sensor chip also comprises: the metal lead wire be connected with described sensitive element.
In one embodiment, described sensor chip is temperature sensor chip, humidity sensor chip, gyro sensor chip or microphone sensor chip.
In accordance with a further aspect of the present invention, a kind of sensor core is provided, comprises: pedestal; Sensor chip, is bonded on described pedestal; Wherein, described sensor chip is the sensor chip described in any one embodiment above-mentioned.
In one embodiment, described sensor chip passes through a gel cementing be coated on described pedestal on described pedestal.
In one embodiment, described gel comprises 4 points, and 4 gels become 2 × 2 array distribution; Or described gel comprises 5 points, 4 gels wherein become 2 × 2 array distribution, and another gel is positioned at the center of the array of 2 × 2; Or described gel comprises 6 points, 6 gels become 2 × 3 array distribution; Or described gel is strip gel, comprise one or two gels, be positioned on pedestal corresponding to the edge of the insulation course of sensor chip.
According to also one side of the present invention, a kind of method for packing of sensor chip is provided, comprises: the sensor chip described in any one embodiment above-mentioned is provided; Described sensor chip is bonded on pedestal.
In one embodiment, by spot printing gel on described pedestal, so that described sensor chip is bonded on pedestal.
In one embodiment, described gel comprises 4 points, and 4 gels become 2 × 2 array distribution; Or described gel comprises 5 points, 4 gels wherein become 2 × 2 array distribution, and another gel is positioned at the center of the array of 2 × 2; Or described gel comprises 6 points, 6 gels become 2 × 3 array distribution; Or described gel is strip gel, comprise one or two gels, be positioned on pedestal corresponding to the edge of the bottom surface of sensor chip.
The embodiment of the present invention at least has following beneficial effect:
On the one hand, sensor chip owing to being bonded with a layer insulating in the bottom surface of substrate, therefore, the problem of sensor chip electric leakage can be solved, in addition, when sensor chip is encapsulated as sensor core, without the need to additionally increasing ceramic substrate, can directly sensor chip be bonded on pedestal, save the step of bonding ceramic substrate, reduce encapsulation difficulty, improve consistance and the reliability of sensor chip encapsulation, and reduce encapsulation stress, ensure that the performance of sensor.
On the other hand, insulation course is provided with stress relief structure, further reduces the stress introduced in sensor chip;
Again on the one hand, by low stress dotting glue method (such as 4 points, 5 points, or strip dotting glue method), sensor chip is bonded on pedestal at 6, the encapsulation stress introduced in sensor chip can be reduced further.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of the invention provides in order to example with for the purpose of describing, and is not exhaustively or limit the invention to disclosed form.Many modifications and variations are obvious for the ordinary skill in the art.Selecting and describing embodiment is in order to principle of the present invention and practical application are better described, and enables those of ordinary skill in the art understand the present invention thus design the various embodiments with various amendment being suitable for special-purpose.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of sensor chip according to an embodiment of the invention;
Fig. 2 is the structural representation of sensor chip according to another embodiment of the invention;
Fig. 3 is the structural representation of sensor core according to an embodiment of the invention;
Fig. 4 shows the schematic diagram of the adhesive method of sensor chip of the prior art and pedestal;
Fig. 5 is the schematic diagram of the adhesive method of sensor chip according to an embodiment of the invention and pedestal;
Fig. 6 is the schematic diagram of the adhesive method of sensor chip according to another embodiment of the invention and pedestal;
Fig. 7 is the schematic diagram of the adhesive method of sensor chip according to still another embodiment of the invention and pedestal;
Fig. 8 is the schematic diagram of the adhesive method of sensor chip according to still a further embodiment and pedestal;
Fig. 9 is the schematic diagram according to the sensor chip of another embodiment of the present invention and the adhesive method of pedestal;
Figure 10 is the schematic diagram of the manufacture method of sensor chip according to an embodiment of the invention;
Figure 11 is the schematic diagram of the method for packing of sensor chip according to an embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Unless specifically stated otherwise, otherwise positioned opposite, the numerical expression of the parts of setting forth in these embodiments and step and numerical value do not limit the scope of the invention.
Meanwhile, it should be understood that for convenience of description, the size of the various piece shown in accompanying drawing is not draw according to the proportionate relationship of reality.
May not discuss in detail for the known technology of person of ordinary skill in the relevant, method and apparatus, but in the appropriate case, described technology, method and apparatus should be regarded as a part of authorizing instructions.
In all examples with discussing shown here, any occurrence should be construed as merely exemplary, instead of as restriction.Therefore, other example of exemplary embodiment can have different values.
It should be noted that: represent similar terms in similar label and letter accompanying drawing below, therefore, once be defined in an a certain Xiang Yi accompanying drawing, then do not need to be further discussed it in accompanying drawing subsequently.
The sensor chip (bare chip) of existing silicon-silicon structure due to thickness less, must between chip and pedestal when sensor chip is encapsulated, increase a substrate again, such as usually adopt ceramic substrate, and this can increase the difficulty of encapsulation, cause encapsulation consistance, reliability decline, and bond ceramic substrate time can introduce very large encapsulation stress, reduce the performance of sensor chip.
The present invention proposes a kind of sensor chip of novelty, and this sensor chip comprises as the substrate of substructure and the superstructure on substrate, and wherein, the bottom surface of substrate is bonded with insulation course.Here, for different sensor chips, superstructure may be not identical yet, but be all bonded with insulation course in the bottom surface of substrate.Preferably, this insulation course by anode linkage technique together with substrate bonding.As a non-limiting example, anode linkage technique can be carried out in the following way: substrate is connect positive source, and insulation course connects power cathode, then substrate and insulation course is heated to 300-500 DEG C.Under the voltage effect of 500-1000V, the kation (such as sodium example) in insulation course will to negative electrode side to drift, and form depletion layer at the surface of insulating layer of next-door neighbour's substrate, depletion width is about several microns.Depletion layer is with negative charge, and backing tape positive charge, exists larger electrostatic attraction between substrate and insulation course, makes the two close contact.Under heating and pressurized conditions, can chemical reaction be there is in the kation in insulation course and substrate at the interface of close contact, form firmly chemical bond (such as, Si-O-Si chemical bond), thus define good sealing-in at the interface that substrate contacts with insulation course.
Anode linkage technique bonding temperature is low, bonded interface is firm, long-time stability good, and need not namely can make to rely on together with electrostatical binding between insulation course with substrate by any cementing agent, reduces the stress introduced in sensor chip.
Preferably, the substrate of sensor chip is silicon substrate; More preferably, be monocrystalline substrate.But the present invention is not limited to this, above-mentioned substrate also can be the substrate of other semiconductor materials.
Sensor chip of the present invention is owing to being bonded with a layer insulating in the bottom surface of substrate, therefore, the problem of sensor chip electric leakage can be solved, in addition, when sensor chip is encapsulated as sensor core, without the need to additionally increasing ceramic substrate, can directly sensor chip be bonded on pedestal, save the step of bonding ceramic substrate, reduce encapsulation difficulty, improve consistance and the reliability of sensor chip encapsulation, and reduce encapsulation stress.
It should be noted that, unless otherwise indicated, otherwise term mentioned in this article " chip " all represent the bare chip of un-encapsulated, " core body " represent by the structure after chip package.
As a preferred embodiment, can be borosilicate glass at the insulation course of the bottom surface bonding of substrate, such as Pyrex7740 glass, BF33 glass, GG-17 flint glass F, 95 flint glass Fs etc.; Or can be devitrified glass.When substrate is silicon substrate, because the material properties of above-mentioned glass and silicon substrate is close, especially the two similar thermal expansion coefficient, therefore will the two bonding time, larger stress can not be produced in silicon substrate and glass, thus the stress introduced in sensor chip can be reduced in further.In addition, the thickness of insulation course can adjust according to actual conditions.As a non-limiting example, the thickness range of insulation course can be about 200 μm to about 800 μm, such as 200 μm, 300 μm, 500 μm, 600 μm, 800 μm etc.
Sensor chip provided by the invention includes but not limited to pressure sensor chip, temperature sensor chip, humidity sensor chip, gyro sensor chip or microphone sensor chip.For pressure sensor chip, sensor chip of the present invention is described below.
Fig. 1 is the structural representation of sensor chip according to an embodiment of the invention, and the sensor chip in the present embodiment is MEMS (micro electro mechanical system) (MEMS) pressure sensor chip.As shown in Figure 1, MEMS pressure sensor chip comprises: substrate 101, and the top of substrate 101 has cavity 111, and the shape of this cavity 111 can be exemplarily trapezoidal; At the insulation course 102 of the bottom surface bonding of substrate 101, such as, it is glassy layer; Sensitive membrane 103 is on the substrate 101 such as monocrystalline silicon; Sensitive element 104 in sensitive membrane 103 is such as voltage dependent resistor (VDR); And the passivation layer 105 in sensitive membrane 103 and sensitive element 104, be such as the oxide layer of silicon, typically be silicon dioxide layer.
Here, substrate 101 is as the substructure of sensor chip, and sensitive membrane 103, sensitive element 104 and passivation layer 105 are as the superstructure of sensor chip.For MEMS pressure sensor chip, superstructure is not limited to shown here form, and such as superstructure can be omitted some element of shown here or also can comprise some other element.
Alternatively, as shown in Figure 1, MEMS pressure sensor chip can also comprise: the metal lead wire 106 be connected with sensitive element 104.
Fig. 2 is the structural representation of sensor chip according to another embodiment of the invention.As shown in Figure 2, the insulation course 102 in the present embodiment has stress relief structure 201 with the surface of substrate 101 bonding.This stress relief structure 201 the stress that can further reduce to introduce in sensor chip is set, to promote the performance of sensor chip.
As a non-limiting example, as shown in Figure 2, stress relief structure 201 can be the depression in the surface working at insulation course 102, and the existence of this depression reduces insulation course 102 and the contact area of substrate 101 on the one hand, reduces contact stress; On the other hand, the release of stress is also conducive to.Exemplarily, the shape of depression can be such as annular, square, cruciform or X-shaped.However, it should be understood that the shape of cited depression is not as limitation of the present invention here, the shape of depression also can be other shape.In addition, depression position on the insulating layer can set according to actual conditions, such as, the insulation course below the sensitizing range of chip can arrange depression.
Although it is pointed out that with MEMS pressure sensor chip to be illustrated stress relief structure and exemplary implementation thereof, should understand, stress relief structure is equally applicable to the sensor chip of other types, does not repeat them here.
In another embodiment of sensor chip of the present invention, the bottom surface of the substrate of sensor chip can have insulation course, and the surface of this insulation course and substrate contact has stress relief structure.With description above similarly, stress relief structure here can be stress relief structure 201 as shown in Figure 2.Further, stress relief structure can be the depression of annular, square, cruciform or X-shaped.
Sensor chip of the present invention can be packaged into sensor core, and in an embodiment of sensor core, sensor core can comprise pedestal and the sensor chip described in any one embodiment above-mentioned.Wherein, sensor chip is bonded on pedestal.
The sensor core of the present embodiment, the bottom surface due to the substrate of sensor chip is bonded with a layer insulating, solves the problem of sensor chip electric leakage, in addition, sensor chip is directly bonded on pedestal, and the not extra ceramic substrate increased, reduces encapsulation stress.
Fig. 3 is the structural representation of sensor core according to an embodiment of the invention, and the sensor core in this embodiment comprises MEMS pressure sensor chip 301 and pedestal 302.As shown in Figure 3, MEMS pressure sensor chip 301 is bonded on pedestal 302.
Particularly, pedestal 302 can be provided with cavity, and MEMS pressure sensor chip 301 can be bonded on the bottom surface of cavity.Be filled with silicone oil 303 in cavity, silicone oil 303 can be filled by the oil hole of pedestal.The top of cavity is provided with corrugated plate 304.Exemplarily, corrugated plate 304 can be stainless steel material.MEMS pressure sensor chip 301 can be gone between by spun gold and 305 306 to be connected with lead-in wire, and wherein, spun gold lead-in wire 305 connects the metal lead wire of MEMS pressure sensor chip 301 respectively and goes between 306.In addition, the surrounding of lead-in wire 306 can be provided with glass insulator 307, to play the effect of insulation protection; Ceramics seat 308 can be provided with, to play the effect of stable spun gold lead-in wire 305 around lead-in wire in cavity; Pedestal 302 can also be provided with O-ring seal 309.
Pressure sensor core operationally, impressed pressure conducts to silicone oil 303 by corrugated plate 304, then conduct to the sensitive membrane in MEMS pressure sensor chip 301, sensitive membrane generation deformation, cause sensitive element to export corresponding signal by spun gold lead-in wire 305 and lead-in wire 306.
In another embodiment of sensor core of the present invention, sensor chip can by the gel cementing in a part for the insulation course of sensor chip on pedestal.By reducing the bond area between insulation course and pedestal, the stress introduced in sensor chip can be reduced further.
Fig. 4 shows the schematic diagram of the adhesive method of sensor chip of the prior art and pedestal.As shown in Figure 4, large area coating gel on pedestal, the whole bottom surface of chip all bonds with pedestal, and this mode can introduce very large stress in sensor chip.
Fig. 5-Fig. 9 shows the schematic diagram of the adhesive method of sensor chip according to some embodiments of the invention and pedestal.Be introduced respectively below in conjunction with Fig. 5-Fig. 9.
As shown in Figure 5, by 4 dotting glue methods, sensor chip and pedestal can be bondd.In the present embodiment, the gel of applying can comprise 4 points, and 4 gels become 2 × 2 array distribution.Such as, on the pedestal that 4 gels position of laying respectively at four angles of the bottom surface of sensor chip is corresponding.
As shown in Figure 6, by 5 dotting glue methods, sensor chip and pedestal can be bondd.In the present embodiment, the gel of applying can comprise 5 points, and 4 gels wherein become 2 × 2 array distribution, and another gel is positioned at the center of the array of 2 × 2.
As shown in Figure 7, by 6 dotting glue methods, sensor chip and pedestal can be bondd.In the present embodiment, the gel of applying can comprise 6 points, and 6 gels become 2 × 3 array distribution.
As shown in Figure 8 and Figure 9, by strip dotting glue method, sensor chip and pedestal can be bondd.In these two embodiments, the gel applied is strip gel, can comprise a gel (as shown in Figure 8) or two gels (as shown in Figure 9), strip gel can be positioned on pedestal corresponding to the edge of the insulation course of sensor chip.
Those skilled in the art understand, above-mentioned 4 points, 5 points, 6 or strip dotting glue method are all exemplary, other forms of dotting glue method can be adopted sensor chip and pedestal to be bondd, as long as reduce bond area therebetween, the stress introduced in sensor chip can be reduced.
Corresponding with sensor chip and sensor core, present invention also offers a kind of manufacture method of sensor chip and a kind of method for packing of sensor chip, will be described respectively below.
Figure 10 is the schematic diagram of the manufacture method of sensor chip according to an embodiment of the invention.As shown in Figure 10, comprising:
Step 1002, provides the initial sensor chip comprising substrate.
Wherein, substrate is preferably silicon substrate; Be more preferably monocrystalline substrate.Initial sensor chip, except comprising substrate, also comprises the superstructure on substrate.
Step 1004, at the bottom surface bonding insulation course of substrate, to form sensor chip.
Preferably, by the bottom surface bonding insulation course of anode linkage technique at substrate.Insulation course is preferably glassy layer.Anode linkage technique with reference to description above, can not repeat them here.
According to another embodiment of the invention, the surface of insulation course and substrate bonding has stress relief structure.Stress relief structure can be such as annular, square, cruciform, X-shaped depression.
Pressure sensor chip, temperature sensor chip, humidity sensor chip, gyro sensor chip or microphone sensor chip is included but not limited to according to the sensor chip that said method is formed.
Figure 11 is the schematic diagram of the method for packing of sensor chip according to an embodiment of the invention.As shown in figure 11, comprising:
Step 1102, provides the sensor chip described in any one embodiment above-mentioned.
There is provided the method for sensor chip can be the manufacture method of the sensor chip described in any one embodiment above-mentioned.
Step 1104, is bonded in sensor chip on pedestal.
Preferably, by spot printing gel on pedestal, that is, on the region of pedestal placement sensor chip, apply gel, to be bonded on pedestal by sensor chip by dotting glue method.The mode of concrete applying gel can with reference to the description of Fig. 5-Fig. 9.
According to another embodiment of the invention, before execution step 1104, can clean pedestal.
According to still another embodiment of the invention, sensor chip is MEMS pressure sensor chip, the method for packing of sensor chip can also comprise: being connected with going between with MEMS pressure sensor chip by gold ball bonding technique by spun gold lead-in wire, drawing the electrode of pressure transducer; Corrugated plate is welded on pedestal; Vacuum filling silicone oil, finally, envelope oil hole.
In this instructions, each embodiment all adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiment, same or analogous part cross-reference between each embodiment.
One of ordinary skill in the art will appreciate that: all or part of step realizing said method embodiment can have been come by the hardware that programmed instruction is relevant, aforesaid program can be stored in a computer read/write memory medium, this program, when performing, performs the step comprising said method embodiment; And aforesaid storage medium comprises: ROM, RAM, magnetic disc or CD etc. various can be program code stored medium.
Claims (24)
1. a sensor chip, is characterized in that, the bottom surface of the substrate of described sensor chip is bonded with insulation course.
2. sensor chip according to claim 1, is characterized in that, described insulation course by anode linkage technique together with described substrate bonding.
3. sensor chip according to claim 1, is characterized in that, the surface of described insulation course and described substrate bonding has stress relief structure.
4. sensor chip according to claim 3, is characterized in that, described stress relief structure is the depression of annular, square, cruciform or X-shaped.
5. sensor chip according to claim 1, is characterized in that,
Described substrate is silicon substrate; Or
Described insulation course is glassy layer.
6. the sensor chip according to claim 1-5 any one, is characterized in that, described sensor chip is MEMS pressure sensor chip;
Described MEMS pressure sensor chip comprises:
Described substrate, the top of described substrate has cavity;
Sensitive membrane over the substrate;
Sensitive element in described sensitive membrane;
Passivation layer in described sensitive membrane and described sensitive element.
7. sensor chip according to claim 6, is characterized in that, described pressure sensor chip also comprises: the metal lead wire be connected with described sensitive element.
8. the sensor chip according to claim 1-5 any one, is characterized in that, described sensor chip is temperature sensor chip, humidity sensor chip, gyro sensor chip or microphone sensor chip.
9. a sensor chip, is characterized in that, the bottom surface of the substrate of described sensor chip has insulation course, and the surface of described insulation course and substrate contact has stress relief structure.
10. sensor chip according to claim 9, is characterized in that, described stress relief structure is the depression of annular, square, cruciform or X-shaped.
The manufacture method of 11. 1 kinds of sensor chips, is characterized in that, comprising:
The initial sensor chip comprising substrate is provided;
At the bottom surface bonding insulation course of described substrate, to form sensor chip.
12. manufacture methods according to claim 11, is characterized in that, by the bottom surface bonding insulation course of anode linkage technique at described substrate.
13. manufacture methods according to claim 11, is characterized in that, the surface of described insulation course and described substrate bonding has stress relief structure.
14. manufacture methods according to claim 13, is characterized in that, described stress relief structure is annular, square, cruciform, X-shaped depression.
15. manufacture methods according to claim 13, is characterized in that,
Described substrate is silicon substrate; Or
Described insulation course is glassy layer.
16. manufacture methods according to claim 11-15 any one, it is characterized in that, described sensor chip is MEMS pressure sensor chip;
Described MEMS pressure sensor chip comprises:
Described substrate, the top of described substrate has cavity;
Sensitive membrane over the substrate;
Sensitive element in described sensitive membrane;
Passivation layer in described sensitive membrane and described sensitive element.
17. sensor chips according to claim 16, is characterized in that, described MEMS pressure sensor chip also comprises: the metal lead wire be connected with described sensitive element.
18. manufacture methods according to claim 11-15 any one, it is characterized in that, described sensor chip is temperature sensor chip, humidity sensor chip, gyro sensor chip or microphone sensor chip.
19. 1 kinds of sensor cores, is characterized in that, comprising:
Pedestal;
Sensor chip, is bonded on described pedestal;
Wherein, described sensor chip is the sensor chip in claim 1-8,9 or 10 described in any one.
20. sensor cores according to claim 19, is characterized in that, described sensor chip passes through a gel cementing be coated on described pedestal on described pedestal.
21. sensor cores according to claim 20, is characterized in that,
Described gel comprises 4 points, and 4 gels become 2 × 2 array distribution; Or
Described gel comprises 5 points, and 4 gels wherein become 2 × 2 array distribution, and another gel is positioned at the center of the array of 2 × 2; Or
Described gel comprises 6 points, and 6 gels become 2 × 3 array distribution; Or
Described gel is strip gel, comprises one or two gels, is positioned on pedestal corresponding to the edge of the insulation course of sensor chip.
The method for packing of 22. 1 kinds of sensor chips, is characterized in that, comprising:
Sensor chip described in any one in claim 1-8,9 or 10 is provided;
Described sensor chip is bonded on pedestal.
23. method for packing according to claim 22, is characterized in that, by spot printing gel on described pedestal, to be bonded on pedestal by described sensor chip.
24. method for packing according to claim 23, is characterized in that,
Described gel comprises 4 points, and 4 gels become 2 × 2 array distribution; Or
Described gel comprises 5 points, and 4 gels wherein become 2 × 2 array distribution, and another gel is positioned at the center of the array of 2 × 2; Or
Described gel comprises 6 points, and 6 gels become 2 × 3 array distribution; Or
Described gel is strip gel, comprises one or two gels, is positioned on pedestal corresponding to the edge of the bottom surface of sensor chip.
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| CN116448713A (en) * | 2023-06-14 | 2023-07-18 | 有研工程技术研究院有限公司 | Terahertz biosensor based on Mie resonance effect and preparation method and application thereof |
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| CN102786027A (en) * | 2011-05-19 | 2012-11-21 | 通用电气公司 | Method and device for preventing corrosion on sensors |
| CN103105248A (en) * | 2013-01-16 | 2013-05-15 | 西安交通大学 | Silicon substrate double-paddle structure quartz beam resonant micro pressure sensor |
| CN203238029U (en) * | 2013-04-22 | 2013-10-16 | 安徽北方芯动联科微系统技术有限公司 | MEMS element provided with structure reducing packaging stress |
| CN103824758A (en) * | 2014-03-13 | 2014-05-28 | 华进半导体封装先导技术研发中心有限公司 | Method for reducing stress on peripheral region of silicon through hole |
| CN205066789U (en) * | 2015-08-20 | 2016-03-02 | 龙微科技无锡有限公司 | Sensor chip and sensor core |
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