CN105131898B - 用于水下led灯灌封胶的制备方法 - Google Patents
用于水下led灯灌封胶的制备方法 Download PDFInfo
- Publication number
- CN105131898B CN105131898B CN201510486983.9A CN201510486983A CN105131898B CN 105131898 B CN105131898 B CN 105131898B CN 201510486983 A CN201510486983 A CN 201510486983A CN 105131898 B CN105131898 B CN 105131898B
- Authority
- CN
- China
- Prior art keywords
- parts
- led lamp
- component
- casting glue
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003292 glue Substances 0.000 title claims abstract description 40
- 238000005266 casting Methods 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- -1 alkoxy silane Chemical compound 0.000 claims abstract description 46
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 22
- 125000003944 tolyl group Chemical group 0.000 claims abstract description 21
- 229910000077 silane Inorganic materials 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- 238000005292 vacuum distillation Methods 0.000 claims abstract description 13
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims abstract description 11
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims abstract description 9
- 238000006482 condensation reaction Methods 0.000 claims abstract description 9
- 230000006837 decompression Effects 0.000 claims abstract description 9
- 230000007062 hydrolysis Effects 0.000 claims abstract description 9
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 9
- 229940057874 phenyl trimethicone Drugs 0.000 claims abstract description 9
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims abstract description 9
- LINXHFKHZLOLEI-UHFFFAOYSA-N trimethyl-[phenyl-bis(trimethylsilyloxy)silyl]oxysilane Chemical compound C[Si](C)(C)O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)C1=CC=CC=C1 LINXHFKHZLOLEI-UHFFFAOYSA-N 0.000 claims abstract description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 24
- 229910008051 Si-OH Inorganic materials 0.000 claims description 20
- 229910006358 Si—OH Inorganic materials 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 238000010992 reflux Methods 0.000 claims description 16
- 239000003643 water by type Substances 0.000 claims description 15
- 239000004411 aluminium Substances 0.000 claims description 12
- 150000002924 oxiranes Chemical class 0.000 claims description 11
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 239000004156 Azodicarbonamide Substances 0.000 claims description 8
- 150000003863 ammonium salts Chemical class 0.000 claims description 8
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 claims description 8
- 235000019399 azodicarbonamide Nutrition 0.000 claims description 8
- 239000012044 organic layer Substances 0.000 claims description 8
- 239000012266 salt solution Substances 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 4
- KILURZWTCGSYRE-LNTINUHCSA-K (z)-4-bis[[(z)-4-oxopent-2-en-2-yl]oxy]alumanyloxypent-3-en-2-one Chemical compound CC(=O)\C=C(\C)O[Al](O\C(C)=C/C(C)=O)O\C(C)=C/C(C)=O KILURZWTCGSYRE-LNTINUHCSA-K 0.000 claims description 2
- DMLAVOWQYNRWNQ-UHFFFAOYSA-N azobenzene Chemical compound C1=CC=CC=C1N=NC1=CC=CC=C1 DMLAVOWQYNRWNQ-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- OKDJUBJTKGOTCQ-UHFFFAOYSA-N triethoxy(oxiran-2-ylmethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC1CO1 OKDJUBJTKGOTCQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- YCIVSJFIXXVSRH-UHFFFAOYSA-N amino-methyl-phenylsilicon Chemical compound C[Si](N)C1=CC=CC=C1 YCIVSJFIXXVSRH-UHFFFAOYSA-N 0.000 claims 1
- 238000011049 filling Methods 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 239000003054 catalyst Substances 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 abstract description 2
- 238000004078 waterproofing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004821 distillation Methods 0.000 description 4
- 229930195733 hydrocarbon Natural products 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229910002808 Si–O–Si Inorganic materials 0.000 description 2
- 230000006750 UV protection Effects 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 231100000572 poisoning Toxicity 0.000 description 2
- 230000000607 poisoning effect Effects 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001398 aluminium Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000000413 hydrolysate Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Silicon Polymers (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510486983.9A CN105131898B (zh) | 2015-08-10 | 2015-08-10 | 用于水下led灯灌封胶的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510486983.9A CN105131898B (zh) | 2015-08-10 | 2015-08-10 | 用于水下led灯灌封胶的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105131898A CN105131898A (zh) | 2015-12-09 |
CN105131898B true CN105131898B (zh) | 2017-10-20 |
Family
ID=54717484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510486983.9A Active CN105131898B (zh) | 2015-08-10 | 2015-08-10 | 用于水下led灯灌封胶的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105131898B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105969287A (zh) * | 2016-05-31 | 2016-09-28 | 苏州市奎克力电子科技有限公司 | 一种透明防水灌封材料 |
CN108034257B (zh) * | 2017-12-08 | 2022-05-31 | 华南师范大学 | 一种有机硅水下封装材料及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104745135A (zh) * | 2015-04-14 | 2015-07-01 | 广州惠利电子材料有限公司 | 紫光led灯封装胶水及其制备方法 |
CN104745142A (zh) * | 2013-12-27 | 2015-07-01 | 蓝星有机硅(上海)有限公司 | Led封装用的固化性硅橡胶组合物 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3948650B2 (ja) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
-
2015
- 2015-08-10 CN CN201510486983.9A patent/CN105131898B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104745142A (zh) * | 2013-12-27 | 2015-07-01 | 蓝星有机硅(上海)有限公司 | Led封装用的固化性硅橡胶组合物 |
CN104745135A (zh) * | 2015-04-14 | 2015-07-01 | 广州惠利电子材料有限公司 | 紫光led灯封装胶水及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105131898A (zh) | 2015-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104347530B (zh) | 带半导体密封用基体材料的密封材料、半导体装置及半导体装置的制造方法 | |
CN101638519B (zh) | 用于封装光学半导体元件的树脂组合物 | |
CN101186796A (zh) | 一种环氧树脂胶粘剂的制备方法 | |
CN104177837A (zh) | 增粘剂及其制备方法、加成型有机硅橡胶及其制备方法 | |
CN103102865B (zh) | 一种用于粘结加成型硅橡胶与皮革材料的底涂剂 | |
CN101717584A (zh) | 大功率led的有机硅凝胶封装料及其制备方法 | |
CN104903403B (zh) | 加成固化型硅酮组合物、光学元件密封材料及光学元件 | |
KR20080008286A (ko) | 실리콘 수지 조성물로 봉지된 반도체 장치 및 반도체 장치봉지용 실리콘 수지 타블렛 | |
CN103184031B (zh) | 一种led封装胶及其制备方法 | |
KR102082014B1 (ko) | 실리콘 수지 조성물, 및 이것을 이용한 실리콘 적층 기판과 그의 제조 방법 및 led 장치 | |
CN104327272B (zh) | 一种含梯形聚倍半硅氧烷的嵌段光学透明缩合型有机硅树脂的制备方法 | |
CN101475731A (zh) | 一种添加改性聚硅氧烷的环氧树脂复合材料及其制备方法 | |
CN105969287A (zh) | 一种透明防水灌封材料 | |
CN102634026B (zh) | 一种含三官能团链节的氢基硅树脂及其制备方法 | |
CN106244093A (zh) | 室温硫化加成型有机硅灌封胶组合物 | |
CN104232015B (zh) | 一种大功率型白光led用的单包装有机硅橡胶封装胶及制备方法 | |
CN102532900B (zh) | 功率型led封装用有机硅透镜材料 | |
CN105542705A (zh) | 一种单组份室温硫化硅橡胶密封剂及其制备方法 | |
Zhao et al. | Synthesis of an adhesion‐enhancing polysiloxane containing epoxy groups for addition‐cure silicone light emitting diodes encapsulant | |
CN105218825A (zh) | 一种有机硅无溶剂浸渍树脂及其合成方法 | |
TWI401270B (zh) | Epoxy. A polysiloxane mixed resin composition, and a light emitting semiconductor device | |
CN101638517B (zh) | 一种有机硅树脂组合物 | |
CN102516501A (zh) | 一种用于制作led透镜的光固化材料 | |
CN105131898B (zh) | 用于水下led灯灌封胶的制备方法 | |
CN101872832B (zh) | 一种应用于发光二极管的封装材料及其制备方法和使用方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191010 Address after: 314000 Building 2, No.288, development avenue, Wutong street, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: ZHEJIANG MAIZHI NETWORK TECHNOLOGY CO.,LTD. Address before: 215011 Jiangsu high tech Zone in Suzhou City, Tong An Zhen Hua Jin Road No. 225 -5 Patentee before: Suzhou Jinglei Photoelectric Lighting Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20191023 Address after: 314500 No. xd701-6, No. 1, Gongnong Road, Nanmen, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: JIAXING LONGLIE ELECTRONIC COMMERCE Co.,Ltd. Address before: 314000 Building 2, No.288, development avenue, Wutong street, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: ZHEJIANG MAIZHI NETWORK TECHNOLOGY CO.,LTD. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200429 Address after: 213000 No. 200 innovation two road, Xinbei District, Changzhou, Jiangsu Patentee after: GOLOHO TECH (CHANGZHOU) Co.,Ltd. Address before: 314500 No. xd701-6, No. 1, Gongnong Road, Nanmen, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: JIAXING LONGLIE ELECTRONIC COMMERCE Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 213000 No. 200, Chuangxin 2nd Road, Xinbei District, Changzhou City, Jiangsu Province Patentee after: Tianyongcheng Polymer Materials (Jiangsu) Co.,Ltd. Address before: 213000 No. 200, Chuangxin 2nd Road, Xinbei District, Changzhou City, Jiangsu Province Patentee before: GOLOHO TECH (CHANGZHOU) Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |