CN105097861A - Wafer-level packaging method for image sensor - Google Patents
Wafer-level packaging method for image sensor Download PDFInfo
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- CN105097861A CN105097861A CN201510486673.7A CN201510486673A CN105097861A CN 105097861 A CN105097861 A CN 105097861A CN 201510486673 A CN201510486673 A CN 201510486673A CN 105097861 A CN105097861 A CN 105097861A
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- cover plate
- wafer
- imageing sensor
- encapsulation cover
- support cofferdam
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Abstract
The invention discloses a wafer-level packaging method for an image sensor. In the process of packaging an image sensor chip at a wafer level, double-sided cutting is carried out on a packaged wafer packaging structure at first, a single image sensor is formed by separation with the help of a penetrating cutting slot, and a packaging cover plate of the single image sensor is enabled to reserve a small part of adhesion with a supporting cofferdam; and then the cover plate is separated by adopting a mode of external force applying, heating or laser irradiation. Therefore, the packaging cover plate of the single image sensor reserves a small part of adhesion with the supporting cofferdam, so that the bonding area of the packaging cover plate and the supporting cofferdam is effectively reduced, thereby being capable of weakening binding power between the packaging cover plate and the supporting cofferdam, being capable of separating the packaging cover plate and the image sensor very conveniently, and causing no damages for the image sensor.
Description
Technical field
The present invention relates to semiconductor packaging, particularly a kind of wafer-level packaging method of imageing sensor.
Background technology
Adopting Wafer level packaging when encapsulating imageing sensor, in order to protect the photosensitive area of imageing sensor injury-free and pollute in encapsulation process, usually needing to form an encapsulation cover plate in position, photosensitive area, to protect photosensitive area.At present, the wafer-level packaging method of imageing sensor is: first, the functional surfaces and band with the wafer of some image sensor chips is supported the encapsulation cover plate bonding in cofferdam; Then, expose the weld pad of each image sensor chip in wafer back part operation, then, form metal wiring layer, protective layer at wafer back part and make solder joint etc., weld pad electrically being guided to wafer rear; Finally, wafer is cut into the imageing sensor of single.But, even if encapsulation cover plate is transparent, still can affect the transmission of light, not benefit reception and the transmitting of image sensor chip photosensitive area light, thus affect the overall performance of image sensor chip.Therefore, packaging technology last, also needs wafer or single imageing sensor and encapsulation cover plate to be separated again.
And at present, when encapsulation cover plate and wafer or imageing sensor are separated, owing to being combined by adhesive glue between encapsulation cover plate with support cofferdam, encapsulation cover plate is larger with the bonding force supporting cofferdam, therefore, the damage of imageing sensor is easily caused when being separated, and then the reliability of effect diagram image-position sensor.
Summary of the invention
In order to solve the problems of the technologies described above, the present invention proposes a kind of wafer-level packaging method of imageing sensor, encapsulation cover plate and imageing sensor can be separated easily, and not cause damage to imageing sensor.
Technical scheme of the present invention is achieved in that
A wafer-level packaging method for imageing sensor, implement according to the following steps:
A, provide a wafer packaging structure, this wafer packaging structure comprises the wafer and an encapsulation cover plate with some imageing sensors, described encapsulation cover plate is bonded with the support cofferdam of the photosensitive area of corresponding each imageing sensor, described wafer is bonded together by described support cofferdam and described encapsulation cover plate; Have Cutting Road between adjacent two imageing sensors, the one side defining described encapsulation cover plate place is the first surface of described wafer packaging structure, and the another side relative with described first surface is the second surface of described wafer packaging structure;
B, employing one first cutter, along the Cutting Road between adjacent two imageing sensors, are cut into described support cofferdam by described first surface, are formed the first cutting groove, make described encapsulation cover plate and described support cofferdam part adhesive;
C, employing one second cutter are along the Cutting Road between adjacent two imageing sensors, cut into described support cofferdam by described second surface, form the second cutting groove, the bottom land of described second cutting groove and the bottom land of described first cutting groove through, form single imageing sensor;
D, by external condition, the described encapsulation cover plate of part adhesive in step C mono-imageing sensor and described support cofferdam to be separated.
As a further improvement on the present invention, first adopt the second cutter to be cut into described support cofferdam by described second surface, then adopt the first cutter to be cut into described support cofferdam by described first surface.
As a further improvement on the present invention, by the mode applying external force, encapsulation cover plate in step D and support cofferdam are separated, or pass through first to heat the mode applying external force again encapsulation cover plate in step D and support cofferdam are separated, or encapsulation cover plate in step D and support cofferdam are separated by the mode applying external force by first carrying out laser irradiation again.
As a further improvement on the present invention, in step D, described cover plate, in the module group assembling process of imageing sensor, is separated with described support cofferdam.
As a further improvement on the present invention, the material in described support cofferdam comprises photo anti-corrosion agent material, epoxy resin or polyimide resin.
As a further improvement on the present invention, in step B or step C cutting process, an adhesive tape is pasted in non-cutting face.
The invention has the beneficial effects as follows: the wafer-level packaging method that the invention provides a kind of imageing sensor, in the process that wafer size encapsulates image sensor chip, first, by carrying out two-sided cutting to the complete wafer packaging structure of encapsulation, by through cutting groove, be separated and form single imageing sensor, and make the encapsulation cover plate of single imageing sensor and support cofferdam and retain small part and bond; Then, the mode separation cover plate applying external force, heating or laser irradiation is used.Like this, encapsulation cover plate due to single imageing sensor remains small part with support cofferdam and bonds, effectively reduce encapsulation cover plate and the bonded area supporting cofferdam, therefore, bonding force between the two can be weakened, thus can encapsulation cover plate and imageing sensor be separated easily, and damage is not caused to imageing sensor.And imageing sensor and encapsulation cover plate to separate be after cutting into single chips, can avoid first encapsulation cover plate and wafer separate being opened chip when cutting again and fall into photosensitive area.
Accompanying drawing explanation
The wafer packaging structure schematic diagram of Figure 1A for providing in the embodiment of the present invention 1 steps A;
Figure 1B adopts the first cutter to cut into structural representation during support cofferdam in the embodiment of the present invention 1 step B;
Fig. 1 C is wafer packaging structure schematic diagram after the embodiment of the present invention 1 step B;
Fig. 1 D adopts the second cutter to cut into structural representation during support cofferdam in the embodiment of the present invention 1 step C;
Fig. 1 E is wafer packaging structure schematic diagram after the embodiment of the present invention 1 step C;
Fig. 1 F is wafer packaging structure schematic diagram after the embodiment of the present invention 1 step D;
Fig. 2 A adopts the second cutter to cut into structural representation during support cofferdam in the embodiment of the present invention 2 step B;
Fig. 2 B is wafer packaging structure schematic diagram after the embodiment of the present invention 2 step B;
Fig. 2 C adopts the first cutter to cut into structural representation during support cofferdam in the embodiment of the present invention 2 step C;
Fig. 2 D is wafer packaging structure schematic diagram after the embodiment of the present invention 2 step C;
Fig. 2 E is wafer packaging structure schematic diagram after the embodiment of the present invention 2 step D.
By reference to the accompanying drawings, make the following instructions:
1---encapsulation cover plate 2---supports cofferdam
3---image sensor chip 301---photosensitive area
302---weld pad 4---metal level
5---protective layer 6---solder joint
7---first cutter 8---second cutter
9---adhesive tape 101---first surface
102---second surface 11---first cutting groove
12---second cutting groove 13---Cutting Road
Embodiment
For enabling the present invention more understandable, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.For convenience of description, in the structure of embodiment accompanying drawing, each part does not press normal rates convergent-divergent, therefore does not represent the actual relative size of each structure in embodiment.Flow process shown in it is schematic diagram, and its structure may clipped intermediate layer, namely above said structure or face, comprises the middle situation also having other layers.Embodiment 1
A wafer-level packaging method for imageing sensor, implement according to the following steps:
A, as shown in Figure 1A, one wafer packaging structure is provided, this wafer packaging structure comprises the wafer and an encapsulation cover plate 1 with some imageing sensors, described encapsulation cover plate is bonded with the support cofferdam 2 of the photosensitive area of corresponding each imageing sensor, described wafer is bonded together by described support cofferdam and described encapsulation cover plate; Have Cutting Road 13 between adjacent two imageing sensors, the one side defining described encapsulation cover plate place is the first surface 101 of described wafer packaging structure, and the one side relative with described first surface is the second surface 102 of described wafer packaging structure; As a kind of preferred embodiment; this imageing sensor comprises image sensor chip 3; the functional surfaces of image sensor chip has photosensitive area 301 and is positioned at the weld pad 302 of photosensitive area periphery; electrical non-functional of being guided to image sensor chip by metal wiring layer 4 of this weld pad; metal wiring layer peripheral hardware has the protective layer 5 for preventing metal wiring layer to be oxidized or to corrode, and protective layer 5 is manufactured with some solder joints 6 for being electrically connected metal wiring layer and external devices.
B, as illustrated in figures ib and 1 c, adopts one first cutter 7 along the Cutting Road 13 between adjacent two imageing sensors, is cut into described support cofferdam 2, form the first cutting groove 11, make described encapsulation cover plate and described support cofferdam part adhesive by described first surface; Preferably, make encapsulation cover plate and support cofferdam small part and bond, namely encapsulation cover plate and the bond regions area supported between cofferdam be less than normally cut bond regions area between rear encapsulation cover plate and support cofferdam over half.Encapsulation cover plate and the cohesive force supported between cofferdam are less than the cohesive force between cofferdam and chip wafer.
C, as seen in figs.id and ie, adopt one second cutter 8 along the Cutting Road 13 between adjacent two imageing sensors, cut into described support cofferdam 2 by described second surface, form the second cutting groove 12, the bottom land of described second cutting groove and the bottom land of described first cutting groove through, form single imageing sensor; Like this, wafer separate can be become single imageing sensor by the second cutting groove through first cutting groove.
D, as shown in fig. 1f, by external condition, the described encapsulation cover plate of part adhesive in step C mono-imageing sensor and described support cofferdam to be separated.
Preferably, this external condition separate package cover plate with the method supporting cofferdam can be: encapsulation cover plate in step D and support cofferdam are separated by the mode applying external force, or pass through first to heat the mode applying external force again encapsulation cover plate in step D and support cofferdam are separated, or encapsulation cover plate in step D and support cofferdam are separated by the mode applying external force by first carrying out laser irradiation again.
Preferably, cover plate finally can carry out in module group assembling process at imageing sensor, separates with support cofferdam, to avoid introducing contaminating impurity again in the processes such as transport or transfer.
Preferably, the material in described support cofferdam comprises photo anti-corrosion agent material, epoxy resin or polyimide resin.These materials are convenient to photoetching or etching and are formed and support cofferdam structure, and have and cut characteristic preferably, be convenient to implement cutting, wafer cutting and separating is become single imageing sensor.
In step B or step C cutting process, paste an adhesive tape 9 in non-cutting face, for supporting, cushioning and reverse mould.Namely at employing first cutter 7 along the Cutting Road 13 between adjacent two imageing sensors, when being cut into support cofferdam by first surface, note one adhesive tape 9 is glued at second surface, at employing second cutter 8 along the Cutting Road 13 between adjacent two imageing sensors, when being cut into support cofferdam by second surface, glue note one adhesive tape 9 at first surface.
In above-mentioned cutting process, first, second cutter can be straight knife, oblique cutter etc., and corresponding formation straight trough or skewed slot, do not limit here.
Embodiment 2
A wafer-level packaging method for imageing sensor, implement according to the following steps:
A, as shown in Figure 1A, one wafer packaging structure is provided, this wafer packaging structure comprises the wafer and an encapsulation cover plate 1 with some imageing sensors, described encapsulation cover plate is bonded with the support cofferdam 2 of the photosensitive area of corresponding each imageing sensor, described wafer is bonded together by described support cofferdam and described encapsulation cover plate; Have Cutting Road 13 between adjacent two imageing sensors, the one side defining described encapsulation cover plate place is the first surface 101 of described wafer packaging structure, and the one side relative with described first surface is the second surface 102 of described wafer packaging structure; As a kind of preferred embodiment; this imageing sensor comprises image sensor chip 3; the functional surfaces of image sensor chip has photosensitive area 301 and is positioned at the weld pad 302 of photosensitive area periphery; electrical non-functional of being guided to image sensor chip by metal wiring layer 4 of this weld pad; metal wiring layer peripheral hardware has the protective layer 5 for preventing metal wiring layer to be oxidized or to corrode, and protective layer 5 is manufactured with some solder joints 6 for being electrically connected metal wiring layer and external devices.
B, as shown in Figure 2 A and 2 B, adopts one second cutter 8 along the Cutting Road 13 between adjacent two imageing sensors, is cut into described support cofferdam 2, form the second cutting groove 12 by described second surface;
C, as illustrated in figs. 2 c and 2d, adopt one first cutter 7 along the Cutting Road 13 between adjacent two imageing sensors, cut into described support cofferdam 2 by described first surface, form the first cutting groove 11, make described encapsulation cover plate and described support cofferdam part adhesive, and the bottom land of the bottom land of described second cutting groove and described first cutting groove is through, forms single imageing sensor; Like this, wafer separate can be become single imageing sensor by the second cutting groove through first cutting groove.Preferably, make encapsulation cover plate and support cofferdam small part and bond, namely encapsulation cover plate and the bond regions area supported between cofferdam be less than normally cut bond regions area between rear encapsulation cover plate and support cofferdam over half.
D, as shown in Figure 2 E, by external condition, the described encapsulation cover plate of part adhesive in step C mono-imageing sensor and described support cofferdam to be separated.
Preferably, this external condition separate package cover plate with the method supporting cofferdam can be: encapsulation cover plate in step D and support cofferdam are separated by the mode applying external force, or pass through first to heat the mode applying external force again encapsulation cover plate in step D and support cofferdam are separated, or encapsulation cover plate in step D and support cofferdam are separated by the mode applying external force by first carrying out laser irradiation again.
Preferably, cover plate finally can carry out in module group assembling process at imageing sensor, separates with support cofferdam, to avoid introducing contaminating impurity again in the processes such as transport or transfer.
Preferably, the material in described support cofferdam comprises photo anti-corrosion agent material, epoxy resin or polyimide resin.These materials are convenient to photoetching or etching and are formed and support cofferdam structure, and have and cut characteristic preferably, be convenient to implement cutting, wafer cutting and separating is become single imageing sensor.
In step B or step C cutting process, paste an adhesive tape 9 in non-cutting face, for supporting, cushioning and reverse mould.Namely at employing first cutter 7 along the Cutting Road 13 between adjacent two imageing sensors, when being cut into support cofferdam by first surface, note one adhesive tape 9 is glued at second surface, at employing second cutter 8 along the Cutting Road 13 between adjacent two imageing sensors, when being cut into support cofferdam by second surface, glue note one adhesive tape 9 at first surface.
In above-mentioned cutting process, first, second cutter can be straight knife, oblique cutter etc., and corresponding formation straight trough or skewed slot, do not limit here.
To sum up, the invention provides a kind of wafer-level packaging method of imageing sensor, in the process that wafer size encapsulates image sensor chip, first, by carrying out two-sided cutting to the complete wafer packaging structure of encapsulation, by through cutting groove, be separated and form single imageing sensor, and make the encapsulation cover plate of single imageing sensor and support cofferdam and retain small part and bond; Then, the mode separation cover plate applying external force, heating or laser irradiation is used.Like this, encapsulation cover plate due to single imageing sensor remains small part with support cofferdam and bonds, effectively reduce encapsulation cover plate and the bonded area supporting cofferdam, therefore, bonding force between the two can be weakened, thus can encapsulation cover plate and imageing sensor be separated easily, and damage is not caused to imageing sensor.And imageing sensor of the present invention and encapsulation cover plate to separate be after cutting into single chips, can avoid first encapsulation cover plate and wafer separate being opened chip when cutting again and fall into photosensitive area.
Above embodiment is with reference to accompanying drawing, to a preferred embodiment of the present invention will be described in detail.Those skilled in the art by carrying out amendment on various forms or change to above-described embodiment, but when not deviating from essence of the present invention, drops within protection scope of the present invention.
Claims (6)
1. a wafer-level packaging method for imageing sensor, is characterized in that: implement according to the following steps:
A, provide a wafer packaging structure, this wafer packaging structure comprises the wafer and an encapsulation cover plate (1) with some imageing sensors, described encapsulation cover plate is bonded with the support cofferdam (2) of the photosensitive area of corresponding each imageing sensor, described wafer is bonded together by described support cofferdam and described encapsulation cover plate; There is between adjacent two imageing sensors Cutting Road (13), the one side defining described encapsulation cover plate place is the first surface (101) of described wafer packaging structure, and the another side relative with described first surface is the second surface (102) of described wafer packaging structure;
B, employing one first cutter (7), along the Cutting Road between adjacent two imageing sensors, are cut into described support cofferdam by described first surface, are formed the first cutting groove (11), make described encapsulation cover plate and described support cofferdam part adhesive;
C, employing one second cutter (8) are along the Cutting Road between adjacent two imageing sensors, cut into described support cofferdam by described second surface, form the second cutting groove (12), the bottom land of described second cutting groove and the bottom land of described first cutting groove through, form single imageing sensor;
D, by external condition, the described encapsulation cover plate of part adhesive in step C mono-imageing sensor and described support cofferdam to be separated.
2. the wafer-level packaging method of imageing sensor according to claim 1, is characterized in that: first adopt the second cutter to be cut into described support cofferdam by described second surface, then adopts the first cutter to be cut into described support cofferdam by described first surface.
3. the wafer-level packaging method of imageing sensor according to claim 1, it is characterized in that: by the mode applying external force, encapsulation cover plate in step D and support cofferdam are separated, or pass through first to heat the mode applying external force again encapsulation cover plate in step D and support cofferdam are separated, or encapsulation cover plate in step D and support cofferdam are separated by the mode applying external force by first carrying out laser irradiation again.
4. the wafer-level packaging method of imageing sensor according to claim 1, is characterized in that, in step D, described cover plate, in the module group assembling process of imageing sensor, is separated with described support cofferdam.
5. the wafer-level packaging method of imageing sensor according to claim 1, is characterized in that: the material in described support cofferdam comprises photo anti-corrosion agent material, epoxy resin or polyimide resin.
6. the wafer-level packaging method of imageing sensor according to claim 1, is characterized in that: in step B or step C cutting process, pastes an adhesive tape (9) in non-cutting face.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510486673.7A CN105097861A (en) | 2015-08-11 | 2015-08-11 | Wafer-level packaging method for image sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510486673.7A CN105097861A (en) | 2015-08-11 | 2015-08-11 | Wafer-level packaging method for image sensor |
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| CN105097861A true CN105097861A (en) | 2015-11-25 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108010929A (en) * | 2017-11-29 | 2018-05-08 | 苏州晶方半导体科技股份有限公司 | A kind of method for packing of image sensing chip |
| CN108987293A (en) * | 2018-06-11 | 2018-12-11 | 华天科技（昆山）电子有限公司 | The wafer-level packaging method of the integrated chip with complex three-dimensional structure cover board |
| CN109192706A (en) * | 2018-09-07 | 2019-01-11 | 苏州晶方半导体科技股份有限公司 | A kind of chip-packaging structure and chip packaging method |
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| US20060040421A1 (en) * | 2004-08-19 | 2006-02-23 | Farnworth Warren M | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
| CN103426832A (en) * | 2012-05-21 | 2013-12-04 | 精材科技股份有限公司 | Chip package and method for forming the same |
| CN103928478A (en) * | 2013-01-10 | 2014-07-16 | 精材科技股份有限公司 | Image sensor chip package and fabricating method thereof |
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Patent Citations (3)
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| US20060040421A1 (en) * | 2004-08-19 | 2006-02-23 | Farnworth Warren M | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
| CN103426832A (en) * | 2012-05-21 | 2013-12-04 | 精材科技股份有限公司 | Chip package and method for forming the same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108010929A (en) * | 2017-11-29 | 2018-05-08 | 苏州晶方半导体科技股份有限公司 | A kind of method for packing of image sensing chip |
| CN108987293A (en) * | 2018-06-11 | 2018-12-11 | 华天科技（昆山）电子有限公司 | The wafer-level packaging method of the integrated chip with complex three-dimensional structure cover board |
| CN108987293B (en) * | 2018-06-11 | 2020-06-09 | 华天科技（昆山）电子有限公司 | Wafer-level packaging method for integrating chip with cover plate with complex three-dimensional structure |
| CN109192706A (en) * | 2018-09-07 | 2019-01-11 | 苏州晶方半导体科技股份有限公司 | A kind of chip-packaging structure and chip packaging method |
| CN109192706B (en) * | 2018-09-07 | 2024-04-12 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and chip packaging method |
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Application publication date: 20151125 |