CN105097421B - Method for the temperature correction of MASSON fast bench heat treaters - Google Patents
Method for the temperature correction of MASSON fast bench heat treaters Download PDFInfo
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- CN105097421B CN105097421B CN201410187492.XA CN201410187492A CN105097421B CN 105097421 B CN105097421 B CN 105097421B CN 201410187492 A CN201410187492 A CN 201410187492A CN 105097421 B CN105097421 B CN 105097421B
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Abstract
The present invention discloses a kind of method of the temperature correction for MASSON fast bench heat treaters.This method includes：Calibration chip is provided, the thermocouple of the temperature for measuring calibration chip is provided with the calibration chip；Calibration chip is placed in the support meanss in MASSON fast bench heat treaters；Analog heat-treating is carried out to calibration chip, while the pyrometer by being arranged on below support meanss and thermocouple gather the reading temperature curve and actual temperature curve of calibration chip respectively；Based on reading temperature curve and actual temperature curve generation school temperature curve；And upper heater and the power of lower heater in adjustment MASSON fast bench heat treaters, closed loop checking is carried out to school temperature curve, the actual temperature curve for reading temperature curve and thermocouple to pyrometer matches in the main operation stage of heat treatment.Methods described can realize the temperature correction of MASSON fast bench heat treaters, and cost is low.
Description
Technical field
The present invention relates to technical field of heat treatment, in particular it relates to a kind of temperature for MASSON fast bench heat treaters
Spend the method for calibration.
Background technology
MASSON fast bench heat treaters are a kind of conventional Equipments for Heating Processing.It is (big that high temperature can have both been carried out on the board
In 900 DEG C) Technology for Heating Processing, low temperature (being less than or equal to 900 DEG C) Technology for Heating Processing can also be carried out.In heat treatment process
In, in particularly thermally sensitive heat treatment process, the temperature correction of bench heat treater is extremely important.However, for
For MASSON bench heat treaters, the reading temperature of bench heat treater is provided by pyrometer.The pyrometer is located at the branch in board
The lower section of support arrangement, there is certain difference in its temperature measured and the temperature of actual heating substrates, before actual production,
Need to calibrate the temperature of MASSON fast bench heat treaters, so that the reading of the actual temperature of heating substrates and pyrometer
Going out temperature can match.
Therefore, it is necessary to the method for the temperature correction for MASSON fast bench heat treaters is proposed, to solve existing skill
Problem present in art.
The content of the invention
In order to solve problems of the prior art, the present invention provides a kind of for MASSON fast bench heat treaters
The method of temperature correction.Methods described includes：Calibration chip is provided, is provided with the calibration chip for measuring the calibration
The thermocouple of the temperature of substrate；The calibration chip is placed on the support meanss in the MASSON fast bench heat treaters
On；Analog heat-treating, while the pyrometer by being arranged on below the support meanss and described are carried out to the calibration chip
Thermocouple gathers the reading temperature curve and actual temperature curve of the calibration chip respectively；Based on it is described reading temperature curve and
The actual temperature curve generates school temperature curve；And upper heater in the adjustment MASSON fast bench heat treaters and
The power of lower heater, closed loop checking is carried out to the school temperature curve, to the reading temperature curve of the pyrometer and described
The actual temperature curve of thermocouple matches in the main operation stage of heat treatment.
Preferably, before the reading temperature curve and actual temperature curve of the calibration chip is gathered, methods described bag
The heating rate for adjusting the calibration chip is included, so that the school temperature curve of generation can monitor predetermined temperature range.
Preferably, the predetermined temperature range is 450 DEG C~800 DEG C.
Preferably, the initial temperature of the closed loop checking is 180 DEG C~250 DEG C.
Preferably, temperature hold stage is set in the temperature-rise period of closed loop checking, wherein being kept in the temperature
The measurement temperature of the pyrometer is constant during platform.
Preferably, the temperature of the temperature hold stage is lower 50 DEG C than the temperature of the main operation stage of the heat treatment
~100 DEG C.
Preferably, the retention time of the temperature hold stage is 10 seconds~20 seconds.
Preferably, the temperature of the main operation stage of the heat treatment is not higher than 900 DEG C.
Preferably, methods described also includes before the closed loop checking is carried out：Open loop is carried out to the temperature curve to test
Card, so that the maximum temperature difference of the actual temperature curve for reading temperature curve and the thermocouple of the pyrometer is less than in advance
Definite value.
Preferably, the predetermined value is 4 DEG C~8 DEG C.
In summary, thermoelectricity is passed through according to the method for the temperature correction for MASSON fast bench heat treaters of the present invention
The actual temperature of even measurement calibration chip and the generation calibration curve compared with the reading temperature of pyrometer, and adjust and heat
The power of device and lower heater, closed loop checking is carried out to the calibration curve, until the reading temperature curve and heat of pyrometer
The actual temperature curve of galvanic couple matches in the main operation stage of heat treatment.The calibration method is by simulating in actual production process
The Technology for Heating Processing of substrate, is matched to temperature section, and calibration result is good, and the repeatable utilization of calibration chip, cost are low.
A series of concept of reduced forms is introduced in Summary, this will enter in specific embodiment part
One step describes in detail.The Summary of the present invention is not meant to attempt to limit technical scheme claimed
Key feature and essential features, the protection domain for attempting to determine technical scheme claimed is not meant that more.
Below in conjunction with accompanying drawing, advantages and features of the invention are described in detail.
Brief description of the drawings
The drawings below of the present invention is used to understand the present invention in this as the part of the present invention.Shown in the drawings of this hair
Bright embodiment and its description, for explaining the principle of the present invention.In the accompanying drawings,
Fig. 1 is the side of the temperature correction according to an embodiment of the invention for MASSON fast bench heat treaters
Method；
Fig. 2 is that the method according to Fig. 1 flow chart carries out MASSON fast bench heat treaters during temperature correction
Internal structure schematic diagram；And
Fig. 3 is carried out in closed loop verification process, the calibration chip for reading temperature curve and thermocouple measurement of pyrometer
The schematic diagram of actual temperature curve, wherein, it is provided with temperature hold stage in the closed loop verification process.
Embodiment
Next, the present invention will be more fully described by with reference to accompanying drawing, shown in the drawings of embodiments of the invention.But
It is that the present invention can be implemented in different forms, and should not be construed as being limited to embodiments presented herein.On the contrary, provide
These embodiments will make disclosure thoroughly and complete, and will fully convey the scope of the invention to those skilled in the art.
In accompanying drawing, for clarity, the size and relative size in Ceng He areas may be exaggerated.Same reference numerals represent phase from beginning to end
Same element.
It should be understood that when element or layer be referred to as " ... on ", " with ... it is adjacent ", " being connected to " or " being coupled to " it is other
When element or layer, its can directly on other elements or layer, it is adjacent thereto, be connected or coupled to other elements or layer, or
Person may have element or layer between two parties.On the contrary, when element is referred to as " on directly existing ... ", " with ... direct neighbor ", " directly
It is connected to " or when " being directly coupled to " other elements or layer, then element or layer between two parties is not present.
The present invention provides a kind of method of temperature correction for MASSON fast bench heat treaters, (hereinafter referred to as " temperature
The method of calibration ").Fig. 1 shows the flow chart of the method for temperature correction according to an embodiment of the invention, and Fig. 2 is shown
Internal structure when carrying out temperature correction to MASSON fast bench heat treaters according to the method that Fig. 1 flow illustrates is illustrated
Figure.
The present invention is described in detail below according to the internal structure schematic diagram shown in the flow chart and Fig. 2 shown in Fig. 1.
Step S110：Calibration chip is provided, the thermocouple of the temperature for measuring calibration chip is provided with calibration chip.
As shown in Figure 2, there is provided calibration chip 210.The calibration chip 210 can be the semi-conducting materials such as silicon chip, sheet glass,
It can also be the metal materials such as iron plate, copper sheet, can also be that other any can carry out heat with MASSON fast bench heat treaters
The material of processing.Thermocouple 220 is provided with calibration chip 210.Thermocouple 220 is used for the actual temperature for measuring calibration chip 210
Degree.Preferably, calibration chip 210 is made with the substrate for it is expected to be heat-treated of same or analogous material, to reduce bar
Difference caused by part change.
Step S120：Calibration chip is placed in the support meanss in MASSON fast bench heat treaters.
Calibration chip 210 is placed in the support meanss 230 in MASSON fast bench heat treaters, support meanss 230
Lower section is provided with pyrometer 240.It is simple in order to illustrate, the support in MASSON fast bench heat treaters is merely illustrated in the present invention
Device 230 and pyrometer 240, and in the board miscellaneous part (such as hereinafter it will be mentioned that upper heater and it is lower plus
Thermal and miscellaneous part) do not show that.Support meanss 230 can be any form, such as carrying tablet.Support meanss 230
Can have excellent heat conductivity rate material be made so that the temperature in support meanss 230 as much as possible with the calibration chip 210
Temperature reach unanimity.Pyrometer 240 can be any pyrometer that can measure object temperature, such as leucoscope, ratio
Colour pyrometer and radiant-energy thermometer.The measurement temperature scope of pyrometer 240 should correspond to actual needs.
Step S130：Analog heat-treating, while the pyrometer by being arranged on below support meanss are carried out to calibration chip
Gather the reading temperature curve and actual temperature curve of calibration chip respectively with thermocouple.
Analog heat-treating is carried out in MASSON fast bench heat treaters to calibration chip 210.In order that after calibration
MASSON fast bench heat treaters are applicable in actual production process, and the Analog heat-treating in calibration process should try one's best and reality
It is consistent in the production process of border.During Analog heat-treating, because pyrometer 240 is arranged on the lower section of support meanss 230, therefore
The temperature of temperature shown in pyrometer 240 closer to support meanss 230.And in fact, temperature on calibration chip 210 may be with
Temperature in support meanss 230 differs, therefore the temperature shown in pyrometer 240 might not be with the reality of calibration chip 210
Temperature is identical.Due to being provided with thermocouple 220 on calibration chip 210, therefore calibration chip can be measured by thermocouple 220
210 actual temperature.It should be noted that in actual production process, the substrate in support meanss 230 is not provided with heat
Galvanic couple, the registration of the actual upper pyrometer 240 of the registration read on MASSON fast bench heat treaters.Therefore, in this application,
Registration on pyrometer 240 is defined as to read temperature, the registration on thermocouple 220 is defined as actual temperature.Correspondingly, lead to
It is reading temperature curve to cross the temperature curve that pyrometer 240 collects, and the temperature curve collected by thermocouple 220 is real
Border temperature curve.
Step S140：Based on reading temperature curve and actual temperature curve generation school temperature curve.
In step s 130, the actual temperature curve of calibration chip 210 has been collected by thermocouple 220, and it is logical
Cross pyrometer 240 and collect reading temperature curve.Hereinbefore it has been noted that there may be difference between both, therefore, need
The reading temperature curve that the actual temperature curve and pyrometer 240 to be collected based on thermocouple 220 are collected, given birth to by being fitted
The school temperature curve mapped one by one with actual temperature into reading temperature.Specifically, can in the MASSON bench heat treaters of the present invention
To run LOWCAL.1 schools temperature menu, school temperature curve is generated by the fit procedure in LOWCAL.1 menus.
Above-mentioned fit procedure is that the reading temperature value of the actual temperature value and pyrometer 240 measured based on thermocouple 220 is entered
Capable, if the actual temperature value heating rate that thermocouple 220 measures is too fast or excessively slow, it is likely to cause what is ultimately generated
School temperature curve is not within the scope of expected temperature.Therefore, the reading temperature curve on collection calibration chip 210 and actual temperature
Write music before line, the heating rate of calibration chip 210 can also be adjusted according to actual conditions, so that the school temperature curve ultimately generated
Predetermined temperature range can be monitored.
Because the MASSON fast bench heat treaters in the present invention are at high temperature (such as 900 DEG C~1100 DEG C), pyrometer
The actual temperature for the substrate that 240 reading temperature can more truly reflect in support meanss 230, therefore general calibration
It is that lower temperature (such as 500 DEG C~800 DEG C) is calibrated.It is therefore preferred that according to one embodiment of present invention
In, the predetermined temperature range that above-mentioned school temperature curve can monitor is 450 DEG C~800 DEG C.
S150：The power of the upper heater and lower heater in MASSON fast bench heat treaters is adjusted, and to school
Warm curve carries out closed loop checking, to pyrometer the actual temperature curve for reading temperature curve and thermocouple heat treatment main work
Skill stage match.
High-ranking officers' temperature curve is called in main process menu.Such as according to one embodiment of present invention, Technology for Heating Processing
Temperature is 500 DEG C, and time of heat treatment is 30 seconds, and main process menu is 500RT30, then can high-ranking officers' temperature curve to call in MASSON fast
Closed loop checking is carried out in 500RT30 menus on fast bench heat treater.It should be noted that in practice, in (900 DEG C of high temperature
More than) in technical process, support meanss 230 and the temperature difference on calibration chip 210 are little, therefore the reading of pyrometer 240
The temperature that temperature can more truly reflect on calibration chip 210 substantially, therefore in elevated temperature processes, it may not be necessary to it is logical
Cross method of the present invention and carry out temperature correction.It is therefore preferred that the main operation stage of heat treatment mentioned herein
Temperature can be less than or equal to 900 DEG C.
Progress closed loop verification process in the main process menu on MASSON fast bench heat treaters is called in high-ranking officers' temperature curve
In, if the reading Temperature Matching of actual temperature and the pyrometer 240 for the calibration chip 210 that thermocouple 220 measures, i.e., the two
When difference is in the range of tolerance, then it is assumed that this is calibrated successfully.If the calibration chip 210 that thermocouple 220 measures
When the reading temperature of actual temperature and pyrometer 240 mismatches, i.e., the two difference it is larger, during more than tolerance scope,
Upper heater (such as upper fluorescent tube) on MASSON fast bench heat treaters and lower heater (such as time lamp can be adjusted
Pipe) power so that the actual temperature curve of thermocouple 220 and pyrometer 240 read main work of the temperature curve in heat treatment
Skill stage match.For example, according to one embodiment of present invention, when the reality of the calibration chip 210 of the measurement of thermocouple 220
When border temperature is more than the reading temperature of pyrometer 230, the power of upper fluorescent tube or the power of the upper fluorescent tube of increase can be reduced, so that hot
The actual temperature curve of galvanic couple 220 matches with the reading temperature curve of pyrometer 240 in the main operation stage of heat treatment.
As described above, can when calibration curve directly being called in into main process menu (such as 500RT30) progress closed loop checking
Actual temperature and the reading temperature difference of pyrometer 240 of the calibration chip 210 of the measurement of thermocouple 220 can be caused very big, though
So can by adjust the upper heater on MASSON fast bench heat treaters (such as upper fluorescent tube) and lower heater (such as
Lower fluorescent tube) power so that the reading temperature curve of the actual temperature curve of thermocouple 220 and pyrometer 240 is in heat treatment
Main operation stage matching, but the actual temperature of the calibration chip 210 measured in thermocouple 220 and the reading temperature of pyrometer 240
In the case that degree differs greatly, the workload of this adjustment is very big and effect is bad.Therefore, in a reality according to the present invention
Apply in example, open loop checking can be carried out to the school temperature curve generated in step S140 before closed loop checking is carried out.Carry out open loop
During checking, the school temperature curve generated in step S140 is called in the temperature menu of school, and run school temperature menu, calibration chip 210
Freely heated.Compare the actual temperature curve and height for the calibration chip 210 that the thermocouple 220 in open loop verification process measures
The difference read between temperature curve of temperature meter 240.If the difference of the two is less than predetermined value, the school temperature curve can be adjusted
Become owner of progress closed loop checking in process menu.On the contrary, if the difference of the two is more than predetermined value, can pass through in the temperature menu of school
Adjustment offset (such as increaseing or decreasing offset) is adjusted to school temperature curve, and in the temperature menu of school after combustion adjustment
School temperature curve, so circulation, until thermocouple measurement the actual temperature of calibration chip 210 and the reading temperature of pyrometer
Timing, the school temperature curve after last adjustment is called in main process menu and carries out above-mentioned closed loop checking.Above-mentioned predetermined value can
It is determined with the actual conditions according to board and the actual requirement of Technology for Heating Processing.As an example, according to the present invention's
In one embodiment, above-mentioned predetermined value can be 4 DEG C~8 DEG C.
In addition, applicant is had found by substantial amounts of practical studies, and during temperature correction, MASSON rapid thermal treatment machines
Initial temperature in platform inner chamber body produces certain influence on calibration result.Initial temperature can not be too low, due to the reading of thermocouple 220
Temperature has certain hysteresis quality, therefore too low initial temperature easily causes the reading temperature of thermocouple 220 not catch up with actual temperature.
Initial temperature can not be too high, and too high reading temperature will make it that the temperature range that final PID can be controlled is smaller.For example, work as main work
The temperature in skill stage be 500 DEG C, and initial temperature be 300 DEG C when, the temperature range that such PID can be controlled only has 200 DEG C.And
In the process, the fuel factor accumulation of thermocouple, easily causes to overheat in main operation stage.Therefore, in one according to the present invention
In individual preferred embodiment, it is 180 DEG C~250 DEG C, more preferably 200 DEG C -230 to carry out the initial temperature in closed loop verification process
DEG C, referring to table one.It has been found that initial temperature within the range when, calibration effect is most preferable, and repeatability is high.Show in table one
Gone out initial temperature for 200 DEG C -230 DEG C when, height that the repeatability checking of the main operation stage of heat treatment when different is drawn
Actual temperature and the two comparison of the reading temperature of temperature meter 240 with the calibration chip 210 of the measurement of thermocouple 220.From table
As can be seen that calibration result is reproducible.
Table one：
In addition, above it was mentioned that the invention that the reading of thermocouple 220 has hysteresis quality, therefore, when calibration chip 210 is certain
Initial temperature (such as 200 DEG C) when starting heated, in the preliminary stage of main technique, the not up to reading of thermocouple 220 and school
The actual temperature of quasi- substrate 210.Therefore, according to a preferred embodiment of the present invention, closed loop checking can carried out
Temperature hold stage is set in temperature-rise period.In the temperature hold stage, the actual temperature and pyrometer of calibration chip 210
240 reading temperature does not change, and the reading of thermocouple 220 is gradually increasing, and final truly reflection calibration chip 210
True temperature.
Applicants have found that the temperature of temperature hold stage can select the temperature of the main operation stage than heat treatment low
50 DEG C~100 DEG C.For example, according to one embodiment of present invention, the temperature of the main operation stage of heat treatment is 500 DEG C,
The temperature of temperature hold stage can be 400 DEG C~450 DEG C, such as 430 DEG C.Show and carried out in closed loop verification process in Fig. 3,
Actual temperature curve (the curve for the calibration chip 210 that the reading temperature curve (curve 1) of pyrometer 240 measures with thermocouple 220
2) schematic diagram, wherein, abscissa represents the time, and ordinate represents temperature.As shown in figure 3, before temperature hold stage, high temperature
The reading temperature (curve 1) of meter 240 is higher than the reading temperature (curve 2) of thermocouple 220, keeps flat when setting up temperature at 430 DEG C
During platform, stablize always at 430 DEG C or so in the reading temperature of temperature hold stage section pyrometer 240, and the reading of thermocouple 220
430 DEG C are increased to from 320 DEG C.At the end of temperature hold stage, thermocouple 220 can truly reflect calibration chip 210 substantially
True temperature.
The retention time of temperature hold stage can be determined according to actual conditions.As an example, according to the present invention
One embodiment in, retention time of temperature hold stage can be 10 seconds~20 seconds, such as 15 seconds.It is it has been found that warm
Degree is kept for the retention time of platform within the above range, and can avoid can not be truly anti-because thermocouple 220 reads temperature hysteresis
The phenomenon of the actual temperature of calibration chip 210 is reflected, calibration result can be made more preferable, repeatability is more preferable.
In summary, thermoelectricity is passed through according to the method for the temperature correction for MASSON fast bench heat treaters of the present invention
Even 220 measure the actual temperature of calibration chip 210 and the generation calibration curve compared with the reading temperature of pyrometer 240, and
The power of heater and lower heater in adjustment, closed loop checking is carried out to the calibration curve, until the reading of pyrometer 240
The actual temperature curve of temperature curve and thermocouple 220 matches in the main operation stage of heat treatment.The calibration method passes through simulation
The Technology for Heating Processing of substrate in actual production process, is matched to temperature section, and calibration result is good, and calibration chip 210 can
Recycling, cost are low.
The present invention is illustrated by above-described embodiment, but it is to be understood that, above-described embodiment is only intended to
Citing and the purpose of explanation, and be not intended to limit the invention in described scope of embodiments.In addition people in the art
Member can also make more kinds of it is understood that the invention is not limited in above-described embodiment according to the teachings of the present invention
Variants and modifications, these variants and modifications are all fallen within scope of the present invention.Protection scope of the present invention by
The appended claims and its equivalent scope are defined.
Claims (9)
1. a kind of method of temperature correction for MASSON fast bench heat treaters, it is characterised in that methods described includes：
Calibration chip is provided, the thermocouple of the temperature for measuring the calibration chip is provided with the calibration chip；
The calibration chip is placed in the support meanss in the MASSON fast bench heat treaters；
Analog heat-treating, while the pyrometer by being arranged on below the support meanss and described are carried out to the calibration chip
Thermocouple gathers the reading temperature curve and actual temperature curve of the calibration chip respectively；
Based on the reading temperature curve and actual temperature curve generation school temperature curve；
Open loop checking is carried out to the school temperature curve, so that the reality for reading temperature curve and the thermocouple of the pyrometer
The maximum temperature difference of temperature curve is less than predetermined value；And
The power of the upper heater and lower heater in the MASSON fast bench heat treaters is adjusted, to the school Wen Qu
Line carries out closed loop checking, to the reading temperature curve of the pyrometer and the actual temperature curve of the thermocouple in heat treatment
Main operation stage matching.
2. the method as described in claim 1, it is characterised in that gathering the reading temperature curve and reality of the calibration chip
Before temperature curve, methods described includes adjusting the heating rate of the calibration chip, so that the school temperature curve energy of generation
Enough monitor predetermined temperature range.
3. method as claimed in claim 2, it is characterised in that the predetermined temperature range is 450 DEG C~800 DEG C.
4. the method as described in claim 1, it is characterised in that the initial temperature of the closed loop checking is 180 DEG C~250 DEG C.
5. the method as described in claim 1, it is characterised in that set temperature to keep in the temperature-rise period of closed loop checking
Platform, wherein the measurement temperature of the pyrometer is constant during the temperature hold stage.
6. method as claimed in claim 5, it is characterised in that institute of the temperature of the temperature hold stage than the heat treatment
The temperature for stating main operation stage is low 50 DEG C~100 DEG C.
7. method as claimed in claim 5, it is characterised in that the retention time of the temperature hold stage is 10 seconds~20
Second.
8. the method as described in claim 1, it is characterised in that the temperature of the main operation stage of the heat treatment is not higher than
900℃。
9. the method as described in claim 1, it is characterised in that the predetermined value is 4 DEG C~8 DEG C.
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| CN106706379B (en) * | 2016-08-31 | 2023-09-08 | 厦门通灵生物医药科技有限公司 | Device and method for processing slide specimen |
| US11545375B2 (en) * | 2019-06-17 | 2023-01-03 | Applied Materials, Inc. | Hybrid control system for workpiece heating |
| CN111256857A (en) * | 2020-02-25 | 2020-06-09 | 上海华力集成电路制造有限公司 | Method for monitoring temperature of chuck of probe station by testing voltage of BJT emission junction |
| CN113494968B (en) | 2020-03-19 | 2022-11-25 | 长鑫存储技术有限公司 | Temperature measurement and temperature calibration method and temperature measurement system |
| CN113432737A (en) | 2020-03-19 | 2021-09-24 | 长鑫存储技术有限公司 | Method for measuring and calibrating temperature of wafer chuck and temperature measuring system |
| CN113496910B (en) * | 2020-03-19 | 2024-02-06 | 长鑫存储技术有限公司 | Temperature correcting sheet and application method thereof |
| CN113496911A (en) * | 2020-03-19 | 2021-10-12 | 长鑫存储技术有限公司 | Temperature calibration method for semiconductor machine |
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| CN101727118A (en) * | 2008-10-22 | 2010-06-09 | 北京中科信电子装备有限公司 | Rapid heat-treatment temperature measuring and controlling system and measuring and controlling method |
| CN103426794A (en) * | 2012-05-15 | 2013-12-04 | 台湾积体电路制造股份有限公司 | Real-time calibration for wafer processing chamber lamp modules |
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| US7112763B2 (en) * | 2004-10-26 | 2006-09-26 | Applied Materials, Inc. | Method and apparatus for low temperature pyrometry useful for thermally processing silicon wafers |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101727118A (en) * | 2008-10-22 | 2010-06-09 | 北京中科信电子装备有限公司 | Rapid heat-treatment temperature measuring and controlling system and measuring and controlling method |
| CN103426794A (en) * | 2012-05-15 | 2013-12-04 | 台湾积体电路制造股份有限公司 | Real-time calibration for wafer processing chamber lamp modules |
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