CN105086898A - 用于装配led软灯条的抗紫外透明灌封胶 - Google Patents
用于装配led软灯条的抗紫外透明灌封胶 Download PDFInfo
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- CN105086898A CN105086898A CN201510486342.3A CN201510486342A CN105086898A CN 105086898 A CN105086898 A CN 105086898A CN 201510486342 A CN201510486342 A CN 201510486342A CN 105086898 A CN105086898 A CN 105086898A
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- Prior art keywords
- assembling
- led lamp
- lamp bar
- flexible led
- casting glue
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- 239000000565 sealant Substances 0.000 title abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- 150000004982 aromatic amines Chemical class 0.000 claims abstract description 16
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims abstract description 14
- -1 glycidyl ester Chemical class 0.000 claims abstract description 10
- 239000004593 Epoxy Substances 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 150000007524 organic acids Chemical class 0.000 claims abstract description 6
- 238000005266 casting Methods 0.000 claims description 17
- 239000003292 glue Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 13
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 6
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 4
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 claims description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- QZVCTJOXCFMACW-UHFFFAOYSA-N Phenoxybenzamine Chemical compound C=1C=CC=CC=1CN(CCCl)C(C)COC1=CC=CC=C1 QZVCTJOXCFMACW-UHFFFAOYSA-N 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 229960003418 phenoxybenzamine Drugs 0.000 claims description 3
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 2
- HPILSDOMLLYBQF-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COC(CCC)OCC1CO1 HPILSDOMLLYBQF-UHFFFAOYSA-N 0.000 claims description 2
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 claims description 2
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 claims description 2
- 238000000498 ball milling Methods 0.000 claims description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 claims description 2
- CUBCNYWQJHBXIY-UHFFFAOYSA-N benzoic acid;2-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1O CUBCNYWQJHBXIY-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 claims description 2
- 229960001826 dimethylphthalate Drugs 0.000 claims description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 235000006408 oxalic acid Nutrition 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 2
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 abstract description 7
- 235000019445 benzyl alcohol Nutrition 0.000 abstract description 5
- 230000002195 synergetic effect Effects 0.000 abstract description 4
- 230000003712 anti-aging effect Effects 0.000 abstract 1
- 238000005457 optimization Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 7
- 230000008646 thermal stress Effects 0.000 description 6
- 230000032683 aging Effects 0.000 description 4
- 229960004217 benzyl alcohol Drugs 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 125000003368 amide group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 150000008431 aliphatic amides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000007278 cyanoethylation reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 235000019633 pungent taste Nutrition 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Epoxy Resins (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | |
缩水甘油酯环氧树脂 | 100 | 100 | 100 | 120 | 140 | 100 |
双苄胺基醚 | 0 | 70 | 30 | 50 | 60 | 30 |
异佛尔酮二胺 | 70 | 0 | 40 | 60 | 70 | 40 |
辛基二缩水甘油醚 | 10 | 10 | 10 | 15 | 20 | 10 |
邻苯二甲酸二乙酯 | 2 | 2 | 2 | 6 | 8 | 2 |
苯甲醇 | 50 | 50 | 50 | 75 | 80 | 50 |
苯甲酸 | 20 | 20 | 20 | 35 | 50 | 20 |
ZrW2O8/SiO2烧结物 | 0 | 0 | 0 | 0 | 0 | 5 |
Claims (7)
Priority Applications (1)
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CN201510486342.3A CN105086898B (zh) | 2015-08-10 | 2015-08-10 | 用于装配led软灯条的抗紫外透明灌封胶 |
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CN201510486342.3A CN105086898B (zh) | 2015-08-10 | 2015-08-10 | 用于装配led软灯条的抗紫外透明灌封胶 |
Publications (2)
Publication Number | Publication Date |
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CN105086898A true CN105086898A (zh) | 2015-11-25 |
CN105086898B CN105086898B (zh) | 2018-01-09 |
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CN201510486342.3A Expired - Fee Related CN105086898B (zh) | 2015-08-10 | 2015-08-10 | 用于装配led软灯条的抗紫外透明灌封胶 |
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CN (1) | CN105086898B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105694373A (zh) * | 2016-04-19 | 2016-06-22 | 安徽一路明光电科技有限公司 | 一种led灯防静电外壳材料及其生产工艺 |
CN105860920A (zh) * | 2016-05-31 | 2016-08-17 | 苏州市奎克力电子科技有限公司 | 用于封装led灯带的耐黄变灌封胶 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102504744A (zh) * | 2011-11-08 | 2012-06-20 | 扬州文达胶业有限公司 | 一种临时粘接用胶粘剂及其制备方法 |
WO2014042944A2 (en) * | 2012-09-12 | 2014-03-20 | Momentive Performance Materials Inc. | Siloxane organic hybrid materials providing flexibility to epoxy-based coating compositons |
CN104496183A (zh) * | 2014-12-26 | 2015-04-08 | 上海天马有机发光显示技术有限公司 | 一种低温封接玻璃料及复合填料的制备方法 |
-
2015
- 2015-08-10 CN CN201510486342.3A patent/CN105086898B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102504744A (zh) * | 2011-11-08 | 2012-06-20 | 扬州文达胶业有限公司 | 一种临时粘接用胶粘剂及其制备方法 |
WO2014042944A2 (en) * | 2012-09-12 | 2014-03-20 | Momentive Performance Materials Inc. | Siloxane organic hybrid materials providing flexibility to epoxy-based coating compositons |
CN104496183A (zh) * | 2014-12-26 | 2015-04-08 | 上海天马有机发光显示技术有限公司 | 一种低温封接玻璃料及复合填料的制备方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105694373A (zh) * | 2016-04-19 | 2016-06-22 | 安徽一路明光电科技有限公司 | 一种led灯防静电外壳材料及其生产工艺 |
CN105860920A (zh) * | 2016-05-31 | 2016-08-17 | 苏州市奎克力电子科技有限公司 | 用于封装led灯带的耐黄变灌封胶 |
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Effective date of registration: 20191011 Address after: 314000 Building 2, No.288, development avenue, Wutong street, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: ZHEJIANG MAIZHI NETWORK TECHNOLOGY CO.,LTD. Address before: 215011 Jiangsu high tech Zone in Suzhou City, Tong An Zhen Hua Jin Road No. 225 -5 Patentee before: Suzhou Jinglei Photoelectric Lighting Technology Co.,Ltd. |
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Effective date of registration: 20191023 Address after: 314500 No. xd701-6, No. 1, Gongnong Road, Nanmen, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: JIAXING LONGLIE ELECTRONIC COMMERCE Co.,Ltd. Address before: 314000 Building 2, No.288, development avenue, Wutong street, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: ZHEJIANG MAIZHI NETWORK TECHNOLOGY CO.,LTD. |
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Effective date of registration: 20200827 Address after: 201499, No. 155, Lane 5, East Ring Road, South Bridge Town, Shanghai, Fengxian District Patentee after: SHANGHAI BEGINOR POLYMER MATERIALS Co.,Ltd. Address before: 314500 No. xd701-6, No. 1, Gongnong Road, Nanmen, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: JIAXING LONGLIE ELECTRONIC COMMERCE Co.,Ltd. |
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Granted publication date: 20180109 |
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