CN105082555B - The manufacture device of electronic equipment waterproof case and the technique using the device - Google Patents
The manufacture device of electronic equipment waterproof case and the technique using the device Download PDFInfo
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- CN105082555B CN105082555B CN201410176289.2A CN201410176289A CN105082555B CN 105082555 B CN105082555 B CN 105082555B CN 201410176289 A CN201410176289 A CN 201410176289A CN 105082555 B CN105082555 B CN 105082555B
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- cope plate
- supporting plate
- encapsulant
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- lower template
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Abstract
The invention discloses the manufacture device of a kind of electronic equipment waterproof case, including the cope plate and lower template being oppositely arranged；Supporting plate, the top of lower template is arranged on, cope plate is arranged at the top of supporting plate, suitable for being interlocked with the supporting plate；Under buckling state, the chip spaces for being suitable to laying base material are formed between the cope plate and supporting plate, while is formed between the cope plate and chip spaces and is suitable to inject chamber in the encapsulant of substrate surface injection and forming seal material；Injection channel, one end are connected with the inside of encapsulant injection chamber, and the other end extends to the outside of manufacture device；During cope plate and lower template are pressed against, encapsulant injection chamber is suitable to encapsulant is fixed-type on substrate surface.The invention also discloses the technique using device manufacture waterproof case.The device can use electronic equipment waterproof case of the one set of die one-shot forming manufacture with sealing ring, and process costs are low, production efficiency is high.
Description
Technical field
The present invention relates to the manufacture device of a kind of electronic equipment waterproof case, and the work using device manufacture shell
Skill, belong to electronic equipment waterproof case technical field.
Background technology
When notebook, tablet personal computer, mobile phone and other types of electronic equipment are in wet environment, its internal electronics member
Device is easily damaged, therefore electronic device exterior is typically equipped with waterproof case.For the material of waterproof case, due to
Metal material is oxidizable, electrochemical corrosion easily occurs, so current waterproof case uses plastic substrate more, and in order to ensure
The sealing of waterproof case, also further in the marginal adhesion rubber mass encapsulant of waterproof case, with completely cut off external environment and
Component body in electronic equipment；The factors such as firmness and electronic equipment usage time in view of bonding, these all can
Directly affect the sealing water resistance of plastics matter waterproof case.
In order to improve sealing of the rubber mass encapsulant to plastics matter waterproof case, prior art use is more advanced
Dijection forming technique is processed to shell, as Chinese patent literature CN101636048A discloses a kind of manufacture of electronic installation
Method, a upper shell and a lower house are first molded, and the upper shell is molded to form a rubber with least one party in lower house through dijection
Glue-line, upper shell and lower house are then assembled into electronic installation, and rubber layer as housing composition surface with it is corresponding another
Housing is inconsistent, the good water-proof effect of gained housing.Dijection shaping therein refers to divide in two expects pipes of dijection forming machine
Not Cun Fang plastics and rubber raw material, then coordinate two molds, be finally made by shaping twice forming rubber layer successively
Upper shell or lower house.
Electronic equipment casing water resistance and favorable sealing property manufactured by above-mentioned dijection forming machine, but above-mentioned dijection
Forming machine includes two molds, need to can just produce shell through being molded twice, the process costs height of the manufacture device, production efficiency
It is low.
The content of the invention
The technical problems to be solved by the invention are that the dijection forming machine of prior art includes two molds, need to through twice into
Type just obtains electronic equipment casing, and process costs are high, efficiency is low；And then propose that a kind of one set of die is integrally formed manufacture electronics and set
The manufacture device of standby waterproof case.
In order to solve the above technical problems, the invention provides the manufacture device of a kind of electronic equipment waterproof case, including
The cope plate and lower template being oppositely arranged；
Supporting plate, it is arranged on the top of the lower template；
The cope plate is arranged at the top of the supporting plate, and the cope plate is suitable to be interlocked with the supporting plate；
Under buckling state, the chip spaces for being suitable to laying base material are formed between the cope plate and supporting plate, at the same it is described
Formed between cope plate and chip spaces and be suitable to inject chamber in the encapsulant of substrate surface injection and forming seal material；
Injection channel, one end are connected with the inside of encapsulant injection chamber, and the other end extends to the manufacture dress
The outside put；
During the cope plate and lower template are pressed against, the encapsulant injection chamber is suitable to fix encapsulant
Shaping is on substrate surface.
The supporting plate is detachably arranged at the top of the lower template.
Edge of the encapsulant injection chamber along the chip spaces is set.
Also include outer rim block and central stopper, the encapsulant injects chamber by the outer rim block and central stopper structure
Into.
The outer rim block and central stopper are extended downwardly integrally formed by the lower end of the cope plate.
Also include being mutually adapted the cutting edge and groove for cutting base material, the groove opens up along the supporting plate, described
Cutting edge extends downwardly setting by the outer rim block.
The injection channel is set through the cope plate.
The chip spaces are cylinder, and the encapsulant injection chamber is cylinder ring.
The edge of the vertical plane of the chip spaces is curved, correspondingly, the vertical plane of the encapsulant injection chamber
Edge is also curved.
Also include being used for the limited block for limiting base material thickness, be arranged in the supporting plate；The supporting plate passes through described
Limited block is interlocked with cope plate.
Also include being mutually adapted the emptiness avoiding hole and prepreg cloth locating dowel for fixing substrate；The emptiness avoiding hole is opened in described
On cope plate, the prepreg cloth locating dowel is arranged in the supporting plate；Also include die plate locating holes and the template being mutually adapted
Locating dowel, the die plate locating holes are opened in the cope plate or lower template, and accordingly, the Template Location post is arranged on
In the lower template or cope plate, and run through the supporting plate.
Using the technique of manufacture device manufacture electronic equipment waterproof case, including,
（1）Base material is placed in chip spaces, and base material and supporting plate are preheated to more than the fusing point of base material jointly；
（2）The temperature of cope plate and lower template is maintained at below the solidification temperature of encapsulant, will be placed with base material after preheating
Supporting plate be placed in lower template and fasten cope plate, by injection channel by liquid sealing material injecting sealing material inject chamber
It is interior, die sinking taking-up product after encapsulant cooling and solidifying.
220-280 DEG C is preheated to, preheating time 20-30s；The temperature of cope plate and lower template is maintained at 100-120 DEG C；
The time of cooling and solidifying is 2-5min.
The base material is continuity fiber-reinforced thermoplastic resin composite, and the encapsulant is silicon rubber；Also wrap
Include when fastening cope plate, cutting edge is punched the base material with fit depressions in the case where being punched pressure；Fasten cope plate speed be
300-600mm/s, the punching pressure being carried between cope plate and lower template are 100-200Kgf/cm2；In step（1）Before, first
The base material is cut.
" supporting plate is arranged on the top of the lower template " refers to that supporting plate is located on lower template in the application, and props up
The lower surface of fagging is in contact with the upper surface of lower template.
" cope plate is arranged at the top of the supporting plate " refers to that cope plate is located on supporting plate in the application, and
And form space between the lower surface of cope plate and the upper surface of supporting plate.
Using the technique of manufacture device manufacture electronic equipment waterproof case, including,
（1）Base material is placed in chip spaces, and base material and supporting plate are preheated to more than the fusing point of base material jointly；
（2）The temperature of cope plate and lower template is maintained at below the solidification temperature of encapsulant, will be placed with base material after preheating
Supporting plate be placed in lower template and fasten cope plate, by injection channel by liquid sealing material injecting sealing material inject chamber
It is interior, die sinking taking-up product after encapsulant cooling and solidifying.
The base material is continuity fiber-reinforced thermoplastic resin composite, and the encapsulant is silicon rubber.
220-280 DEG C is preheated to, preheating time 20-30s.
The temperature of cope plate and lower template is maintained at 100-120 DEG C.
The time of cooling and solidifying is 2-5min.
When being additionally included in fastening cope plate, cutting edge is punched the base material with fit depressions in the case where being punched pressure；On fastening
The speed of template is 300-600mm/s, and the punching pressure being carried between cope plate and lower template is 100-200Kgf/cm2。
In step（1）Before, first the base material is cut.
The present invention has the advantages that compared with prior art：
（1）The manufacture device of electronic equipment waterproof case of the present invention includes, the cope plate and lower template being oppositely arranged；
Supporting plate, the top of the lower template is arranged on, the cope plate is suitable to be interlocked with the supporting plate；Under buckling state, institute
State the chip spaces for being formed between cope plate and supporting plate and being suitable to laying base material, while shape between the cope plate and chip spaces
Into suitable for injecting chamber in the encapsulant of substrate surface injection and forming seal material；Injection channel, one end and the sealing material
The inside of material injection chamber is connected, and the other end extends to the outside of the manufacture device；The cope plate and the relative pressure of lower template
During tight, the encapsulant injection chamber is suitable to encapsulant is fixed-type on substrate surface.By in chip spaces
Base material fastens the cope plate of low temperature with being put in after supporting plate preheating in lower template, to encapsulant injection intracavitary injection sealing
Material, die sinking is to obtain the shell that base material is firmly connected with encapsulant after cooling and solidifying, and the device only needs one set of die i.e.
Can one-shot forming obtain waterproof case, process costs are low, production efficiency is high, avoid in the prior art dijection forming machine include two
Mold, need to be through being molded the problem of just obtaining waterproof case twice.
（2）The manufacture device of electronic equipment waterproof case of the present invention, the encapsulant inject chamber accordingly edge
The edge of the chip spaces is set, and edge of the encapsulant along base material can so be set to a circle, to improve the close of shell
Seal water proofing property.Also include outer rim block and central stopper, the encapsulant injects chamber by the outer rim block and central stopper
Form, outer rim block and central stopper can avoid the leakage of liquid sealing material, improve electronic shell performance and
Outer rim block and central stopper, can be fabricated to single part by aesthetic measure, fit together during use, are dismantled after use
Fall；Further, the outer rim block and central stopper can also be extended downwardly by the lower end of the cope plate integrally formed.
（3）The manufacture device of electronic equipment waterproof case of the present invention, in addition to the cutting edge and groove being mutually adapted,
The groove opens up along the supporting plate, and the cutting edge extends downwardly setting by the outer rim block, for cutting base material.Due to
Size can be expanded after base material preheating, and material edge can not be accurately solidificated in by easily causing encapsulant, pass through cutting edge and groove
Coordinating can reduce by the base material rim charge unnecessary because of expansion, so as to ensure the cure site of encapsulant.
（4）The manufacture device of electronic equipment waterproof case of the present invention, chip spaces and the encapsulant injection
The shape of chamber can be configured as needed, to meet electronic product casing needs of different shapes.
（5）The manufacture device of electronic equipment waterproof case of the present invention, in addition to limited block, are arranged at the support
On plate, the supporting plate is pressed into contact with by the limited block with cope plate, in order that product can meet unified standard,
The thickness of base material is limited by limited block, while the shape of chamber limitation encapsulant is injected by encapsulant, chi can be obtained
Very little homogeneous waterproof case product.Also include emptiness avoiding hole and the prepreg cloth locating dowel being mutually adapted, the Template Location being mutually adapted
Hole and Template Location post, base material can so be fixed on the supporting plate by prepreg cloth locating dowel, and keep cope plate, branch
Fagging and the stability of lower template assembling, so as to improve the stability of shell product quality.
（6）The present invention manufactures the technique of electronic equipment waterproof case using manufacture device, and base material is placed in chip spaces, will
Base material and supporting plate are preheated to more than the fusing point of base material jointly；The temperature of cope plate and lower template is maintained at the solidification of encapsulant
Below temperature, the supporting plate that base material is placed with after preheating is placed in lower template and covers cope plate, by injection channel that liquid is close
Closure material injecting sealing material injects intracavitary, is molded after encapsulant cooling and solidifying and takes out product.The device only needs a set of
Mould can one-shot forming obtain waterproof case, process costs are low, production efficiency is high.
Brief description of the drawings
In order that present disclosure is more easily understood, the present invention combines the drawings and specific embodiments to the present invention's
Content is further detailed；
Fig. 1 is that the disassembled form for the electronic equipment waterproof case manufacture device that chip spaces of the present invention are cylinder is shown
It is intended to；
Fig. 2 is that the use state for the electronic equipment waterproof case manufacture device that chip spaces of the present invention are cylinder is shown
It is intended to；
Fig. 3 is bowing for the supporting plate for the electronic equipment waterproof case manufacture device that chip spaces of the present invention are cylinder
View；
Fig. 4 is the disassembled form of the curved electronic equipment waterproof case manufacture device in chip spaces edge of the present invention
Schematic diagram；
Fig. 5 is the use state of the curved electronic equipment waterproof case manufacture device in chip spaces edge of the present invention
Schematic diagram；
Fig. 6 is the supporting plate of the curved electronic equipment waterproof case manufacture device in chip spaces edge of the present invention
Top view；
Fig. 7 is the casing structure signal that manufacture electronic equipment waterproof case technique described in the embodiment of the present invention 2 obtains
Figure；
Fig. 8 is the casing structure signal that manufacture electronic equipment waterproof case technique described in the embodiment of the present invention 3 obtains
Figure；
Wherein reference is：1- cope plates, 2- lower templates, 3- supporting plates, 4- chip spaces, the injection of 5- encapsulants
Chamber, 6- injection channels, 7- outer rim blocks, 8- central stoppers, 9- cutting edges, 10- grooves, 11- limited blocks, 12- emptiness avoiding holes, 13- are pre-
Soak cloth locating dowel, 14- die plate locating holes, 15- Template Location posts, 16- drain pans, 17- silicone rubber O-rings.
Embodiment
The manufacture device of electronic equipment waterproof case of the present invention, including the cope plate 1 and lower template being oppositely arranged
2, the shape and size of the cope plate 1 and lower template 2 can be selected as needed, in the present embodiment, the cope plate 1
Cross section with lower template 2 is rectangle, and cope plate 1 is identical with the size of lower template 2；Supporting plate 3, the supporting plate 3 are set
Put at the top of the lower template 2, be detachably connected with the lower template 2, the cope plate 1 is detachably arranged at the support
The top of plate 3, the cope plate 1 are suitable to be interlocked with the supporting plate 3, and the shape and size of the supporting plate 3 can be according to need
Selected, in the present embodiment, the supporting plate 3 is identical with the shape of cope plate 1 and lower template 2, size.
Under buckling state, the chip spaces 4 for being suitable to laying base material, while institute are formed between the cope plate 1 and supporting plate 3
State to be formed between cope plate 1 and chip spaces 4 and be suitable to inject chamber in the encapsulant of substrate surface injection and forming seal material
5；The shape and set location of chip spaces 4 and encapsulant the injection chamber 5 can be selected according to the needs of shell mechanism,
In the present embodiment, in order to improve the sealing water proofing property of shell edge, the encapsulant injects chamber 5 accordingly along the base material
The edge in space 4 is set, and the preferably described chip spaces 4 of the present embodiment are cylinder, and the encapsulant injection chamber 5 is cylinder
Ring.Injection channel 6, one end are connected with the inside of encapsulant injection chamber 5, and the other end extends to the manufacture device
Outside, in the present embodiment, the injection channel 6 are set through the cope plate 1.The cope plate 1 and the relative pressure of lower template 2
During tight, the encapsulant injection chamber 5 is suitable to encapsulant is fixed-type on substrate surface.
On the basis of above-mentioned embodiment, as the embodiment of change, electronic equipment waterproof case of the present invention
Manufacture device also include outer rim block 7 and central stopper 8, the encapsulant injects chamber 5 by the outer rim block 7 and center
Block 8 is formed, and in the present embodiment, the outer rim block 7 is the circumferentially disposed closed circle band of column along chip spaces 4, described
Central stopper 8 is to be arranged at the cylinder that encapsulant injects the inner side of chamber 5, and the thickness of the outer rim block 7 and central stopper 8
Spend identical.
On the basis of the above, in order to improve the integraty of equipment, as interchangeable embodiment, the outer rim block 7
Extended downwardly and be integrally formed by the lower end of the cope plate 1 with central stopper 8.
On the basis of the above, as Figure 1-3, the manufacture device of electronic equipment waterproof case of the present invention also includes phase
The cutting edge 9 and groove 10 being mutually adapted to, the groove 10 open up along the supporting plate 3, the cutting edge 9 from the outer rim block 7 to
It is lower to be extended, for cutting base material.Also include limited block 11, be arranged in the supporting plate 3, for limiting the thickness of base material
Degree；The supporting plate 3 is fastened by the limited block 11 and cope plate 1 and compressed, in the present embodiment, the chip spaces 4
Cross section is rectangle, and the limited block 11 is four, is set respectively close to four sides of the cross section of chip spaces 4.Also include
The emptiness avoiding hole 12 and prepreg cloth locating dowel 13 being mutually adapted, the emptiness avoiding hole 12 are opened on the cope plate 1, the prepreg cloth
Locating dowel 13 is arranged in the supporting plate 3, and in the present embodiment, the emptiness avoiding hole 12 and prepreg cloth locating dowel 13 are two pairs,
The both ends of the cross section diagonal of chip spaces 4 are separately positioned on, the fixation of base material can be realized by prepreg cloth locating dowel 13, simultaneously
Cope plate 1 and supporting plate 3 can be fastened by emptiness avoiding hole 12；Also include the die plate locating holes 14 and Template Location post being mutually adapted
15, the die plate locating holes 14 are opened in the cope plate 1 or lower template 2, and accordingly, the Template Location post 15 is set
In the lower template 2 or cope plate 1, and run through the supporting plate 3, in the present embodiment, the die plate locating holes 14 open up
On the cope plate 1, the Template Location post 15 is arranged in the lower template 2, and the die plate locating holes 14 and template are determined
Position post 15 is four pairs, is separately positioned on four angles of device.
On this basis, as Figure 4-Figure 6, the chip spaces of the manufacture device of electronic equipment waterproof case of the present invention
The edge of 4 vertical plane can also be curved, and correspondingly, the edge of the vertical plane of the encapsulant injection chamber 5 is also curved.
It is as follows using the technique of above-mentioned manufacture device manufacture electronic equipment waterproof case：
（1）First continuity fibre reinforced thermoplastic resin prepreg cloth is cut, the prepreg cloth laying after cutting out
Fixed in chip spaces 4 and with prepreg cloth locating dowel 13, cloth base material will be presoaked and supporting plate 3 is preheated to the molten of prepreg cloth jointly
More than point, this technique will presoak cloth base material and supporting plate 3 is preheated to 250-280 DEG C jointly, preheating time 10-20s；
（2）The temperature of cope plate 1 and lower template 2 is maintained at below the solidification temperature of encapsulant, and this technique is by cope plate 1
90-110 DEG C is maintained at the temperature of lower template 2, the supporting plate 3 that prepreg cloth is placed with after preheating is placed in lower template 2 and covered
Cope plate 1, when covering cope plate 1, prepreg cloth locating dowel 13 is embedded in emptiness avoiding hole 12, the embedded template positioning hole of Template Location post 15
In 14, cutting edge 9 is engaged punching prepreg cloth with groove 10, and the speed for covering cope plate 1 is 400-600mm/s, is carried in and covers
Punching pressure between rear cope plate 1 and lower template 2 is 100-200 Kgf/cm2；Fluid silicone rubber is injected by injection channel 6
In encapsulant injection chamber 5, die sinking taking-up product, gained casing structure are shown in figure after silicon rubber cooling and solidifying 3-5min
7, it includes drain pan 16 and the silicone rubber O-ring 17 on top.
On the basis of the above, the edge using the curved chip spaces 4 in the edge of vertical plane and vertical plane is curved
The casing structure that encapsulant injection chamber 5 makes is as shown in Figure 8.
Although the present invention has carried out detailed elaboration to it by above-mentioned specific embodiment, this specialty is common
Technical staff should be understood that the change for any form and details without departing from claims made on this basis
Change, belong to invention which is intended to be protected.
Claims (11)
1. the manufacture device of a kind of electronic equipment waterproof case, it is characterised in that including
The cope plate (1) and lower template (2) being oppositely arranged；
Supporting plate (3), on the lower template (2), and the lower surface of supporting plate is in contact with the upper surface of lower template；
The cope plate (1) is arranged at the top of the supporting plate (3), and the cope plate (1) is suitable to and the supporting plate (3) phase
Fasten；
Under buckling state, the chip spaces (4) for being suitable to laying base material are formed between the cope plate (1) and supporting plate (3), simultaneously
The encapsulant being suitable in substrate surface injection and forming seal material is formed between the cope plate (1) and chip spaces (4)
Chamber (5) is injected, edge of the encapsulant injection chamber (5) along the chip spaces (4) is set；
Injection channel (6), one end are connected with the inside of encapsulant injection chamber (5), and the other end extends to the manufacture
The outside of device；
During the cope plate (1) and lower template (2) are pressed against, the encapsulant injection chamber (5) is suitable to sealing material
Expect it is fixed-type on substrate surface；
Also include outer rim block (7) and central stopper (8), the encapsulant injection chamber (5) by the outer rim block (7) and in
Heart block (8) is formed；
Also include being mutually adapted cutting edge (9) and groove (10) for cutting base material, the groove (10) is along the supporting plate (3)
Open up, the cutting edge (9) extends downwardly setting by the outer rim block (7).
2. manufacture device according to claim 1, it is characterised in that the supporting plate (3) be detachably arranged at it is described under
The top of template (2).
3. manufacture device according to claim 2, it is characterised in that the outer rim block (7) and central stopper (8) are by institute
State cope plate (1) lower end extend downwardly it is integrally formed.
4. manufacture device according to claim 3, it is characterised in that the injection channel (6) runs through the cope plate (1)
Set.
5. according to any described manufacture devices of claim 1-4, it is characterised in that the chip spaces (4) are cylinder, institute
It is cylinder ring to state encapsulant injection chamber (5).
6. manufacture device according to claim 5, it is characterised in that the edge of the vertical plane of the chip spaces (4) is in
Arc, correspondingly, the edge of the vertical plane of the encapsulant injection chamber (5) are also curved.
7. according to the manufacture device described in claim 1,2,3,4 or 6, it is characterised in that also include being used to limit base material thickness
Limited block (11), be arranged in the supporting plate (3)；The supporting plate (3) passes through the limited block (11) and cope plate (1)
It is interlocked.
8. manufacture device according to claim 7, it is characterised in that also include being mutually adapted the empty avoiding for fixing substrate
Hole (12) and prepreg cloth locating dowel (13)；The emptiness avoiding hole (12) is opened on the cope plate (1), the prepreg cloth locating dowel
(13) it is arranged in the supporting plate (3)；Also include the die plate locating holes (14) and Template Location post (15) being mutually adapted, it is described
Die plate locating holes (14) are opened in the cope plate (1) or lower template (2), and accordingly, the Template Location post (15) sets
Put in the lower template (2) or cope plate (1), and run through the supporting plate (3).
9. usage right requires the technique of any manufacture device manufacture electronic equipment waterproof cases of 1-8, including,
(1) base material is placed in chip spaces (4), and base material and supporting plate (3) are preheated to more than the fusing point of base material jointly；
(2) cope plate (1) and the temperature of lower template (2) are maintained at below the solidification temperature of encapsulant, will be placed with base after preheating
The supporting plate (3) of material is placed in lower template (2) and fastens cope plate (1), it is close to be injected liquid sealing material by injection channel (6)
In closure material injection chamber (5), die sinking taking-up product after encapsulant cooling and solidifying.
10. technique according to claim 9, it is characterised in that be preheated to 220-280 DEG C, preheating time 20-30s；On
The temperature of template (1) and lower template (2) is maintained at 100-120 DEG C；The time of cooling and solidifying is 2-5min.
11. the technique according to claim 9 or 10, it is characterised in that the base material is continuity fiber reinforced thermolplastic
Resin composite materials, the encapsulant are silicon rubber；When being additionally included in fastening cope plate (1), cutting edge (9) and groove (10) phase
Cooperation is punched the base material in the case where being punched pressure；The speed for fastening cope plate (1) is 300-600mm/s, is carried in cope plate (1)
Punching pressure between lower template (2) is 100-200Kgf/cm2；Before step (1), first the base material is cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410176289.2A CN105082555B (en) | 2014-04-29 | 2014-04-29 | The manufacture device of electronic equipment waterproof case and the technique using the device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410176289.2A CN105082555B (en) | 2014-04-29 | 2014-04-29 | The manufacture device of electronic equipment waterproof case and the technique using the device |
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| Publication Number | Publication Date |
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| CN105082555A CN105082555A (en) | 2015-11-25 |
| CN105082555B true CN105082555B (en) | 2018-01-23 |
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| CN111152389A (en) * | 2020-01-17 | 2020-05-15 | 浙江普兴电子科技有限公司 | Tool and method for preparing composite material mixed layer at one time by using vulcanizing machine |
| CN112873744B (en) * | 2021-02-01 | 2023-01-24 | 杭州纳网信息科技有限公司 | Lightweight car door plant injection mold |
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