CN105082555A - Manufacturing apparatus for electronic-equipment waterproof housing - Google Patents
Manufacturing apparatus for electronic-equipment waterproof housing Download PDFInfo
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- CN105082555A CN105082555A CN201410176289.2A CN201410176289A CN105082555A CN 105082555 A CN105082555 A CN 105082555A CN 201410176289 A CN201410176289 A CN 201410176289A CN 105082555 A CN105082555 A CN 105082555A
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- cope match
- plate pattern
- gripper shoe
- encapsulant
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Abstract
The invention discloses a manufacturing apparatus for an electronic-equipment waterproof housing. The manufacturing apparatus comprises an upper die plate and a lower die plate which are arranged in an opposite way, a supporting plate and an injection channel; the supporting plate is arranged at the top of the lower die plate, the upper die plate is arranged above the supporting plate and is suitable for being buckled with the supporting plate; under the buckling state, the space between the upper die plate and the supporting plate forms a base-material space suitable for laying a base material, and also the space between the upper die plate and the base-material space forms a sealing-material injection chamber suitable for injecting a sealing material on the base material surface for molding; one end of the injection channel is communicated with the interior of the sealing-material injection chamber, and the other end of the injection channel extends outside of the manufacturing apparatus; in the relative compacting process of the upper die plate and the lower die plate, the sealing-material injection chamber is suitable for enabling the sealing material to be fixed and molded on the base material surface. The invention also discloses a technology of using the apparatus to manufacture the waterproof housing. The apparatus is capable of manufacturing an electronic-equipment waterproof housing with a sealing ring in a one shot forming manner by employing a set of die, technological cost is low and production efficiency is high.
Description
Technical field
The present invention relates to a kind of manufacturing installation of electronic equipment waterproof case, and use this device to manufacture the technique of shell, belong to electronic equipment waterproof case technical field.
Background technology
When the electronic equipment of notebook, panel computer, mobile phone and other type is in wet environment, the electronic devices and components of its inside are easily damaged, and therefore electronic device exterior is generally all configured with waterproof case.From the material of waterproof case, because metal material is oxidizable, easily electrochemical corrosion occurs, so current waterproof case many employings plastic substrate, and in order to ensure the sealing of waterproof case, also further at the marginal adhesion rubber mass encapsulant of waterproof case, with the component body in isolated external environment and electronic equipment; Consider the factors such as bonding firmness and electronic equipment service time, these all directly can affect the water-tight performance of plastics matter waterproof case.
In order to improve the sealing of rubber mass encapsulant to plastics matter waterproof case, prior art adopts more advanced dijection forming technique to process shell, as Chinese patent literature CN101636048A discloses a kind of manufacture method of electronic installation, a first shaping upper shell and a lower house, and in this upper shell and lower house at least one party through dijection shaping formation one rubber layer, then upper shell and lower house are assembled into electronic installation, and rubber layer as the composition surface of housing and another corresponding housing inconsistent, the good water-proof effect of gained housing.Dijection is wherein shaping refers to the raw material depositing plastics and rubber in two material pipes of dijection forming machine respectively, then coordinates two molds, shapingly finally makes the upper shell or lower house that form rubber layer successively through twice.
Electronic equipment casing water resistance manufactured by above-mentioned dijection forming machine and favorable sealing property, but above-mentioned dijection forming machine comprises two molds, and shapingly just need can produce shell through twice, the process costs of this manufacturing installation is high, production efficiency is low.
Summary of the invention
Technical problem to be solved by this invention is that the dijection forming machine of prior art comprises two molds, and shapingly just need obtain electronic equipment casing through twice, process costs is high, efficiency is low; And then the manufacturing installation of a kind of one set of die one-body molded manufacture electronic equipment waterproof case is proposed.
For solving the problems of the technologies described above, the invention provides a kind of manufacturing installation of electronic equipment waterproof case, comprising
The cope match-plate pattern be oppositely arranged and lower bolster;
Gripper shoe, is arranged on the top of described lower bolster;
Described cope match-plate pattern is arranged at the top of described gripper shoe, and described cope match-plate pattern is suitable for being interlocked with described gripper shoe;
Under buckling state, between described cope match-plate pattern and gripper shoe, form the chip spaces being suitable for laying base material, formed between described cope match-plate pattern and chip spaces simultaneously and be suitable for injecting and the encapsulant of forming seal material injection chamber at substrate surface;
Injection channel, the inside that chamber is injected with described encapsulant in one end is connected, and the other end extends to the outside of described manufacturing installation;
In described cope match-plate pattern compaction process relative to lower bolster, described encapsulant injects chamber and is suitable for encapsulant on substrate surface fixed-type.
Described gripper shoe is detachably arranged at the top of described lower bolster.
Described encapsulant injection chamber is arranged along the edge of described chip spaces.
Also comprise outer rim block and central stopper, described encapsulant injects chamber and is made up of described outer rim block and central stopper.
Described outer rim block and central stopper are integrally formed to downward-extension by the lower end of described cope match-plate pattern.
Also comprise the adaptive cutting edge for cutting base material and groove mutually, described groove is offered along described gripper shoe, and described cutting edge is extended downwards by described outer rim block.
Described injection channel is run through described cope match-plate pattern and is arranged.
Described chip spaces is cylinder, and it is cylinder ring that described encapsulant injects chamber.
The edge of the vertical plane of described chip spaces is curved, and correspondingly, the edge that described encapsulant injects the vertical plane in chamber is also curved.
Also comprising the limited block for limiting base material thickness, being arranged in described gripper shoe; Described gripper shoe is interlocked by described limited block and cope match-plate pattern.
Also comprise the adaptive emptiness avoiding hole for fixing substrate and prepreg cloth locating dowel mutually; Described emptiness avoiding hole is opened on described cope match-plate pattern, and described prepreg cloth locating dowel is arranged in described gripper shoe; Also comprise mutually adaptive die plate locating holes and Template Location post, described die plate locating holes is opened on described cope match-plate pattern or lower bolster, and accordingly, described Template Location post is arranged on described lower bolster or cope match-plate pattern, and runs through described gripper shoe.
Use described manufacturing installation to manufacture the technique of electronic equipment waterproof case, comprise,
(1) base material is placed in chip spaces, and base material and gripper shoe are preheated to more than the fusing point of base material jointly;
(2) temperature of cope match-plate pattern and lower bolster remains on below the solidification temperature of encapsulant, the gripper shoe being placed with base material after preheating being placed on lower bolster and fastening cope match-plate pattern, inject in chamber by injection channel by liquid sealing material injecting sealing material, after encapsulant cooling curing, product is taken out in die sinking.
Be preheated to 220-280 DEG C, preheating time is 20-30s; The temperature of cope match-plate pattern and lower bolster remains on 100-120 DEG C; The time of cooling curing is 2-5min.
Described base material is continuity fiber-reinforced thermoplastic resin composite, and described encapsulant is silicon rubber; Also be included in when fastening cope match-plate pattern, cutting edge and recess are combined in base material described in stamping-out under stamping-out pressure; The speed fastening cope match-plate pattern is 300-600mm/s, and the stamping-out pressure be carried between cope match-plate pattern and lower bolster is 100-200Kgf/cm
2; Before step (1), first described base material is carried out cutting.
In the application, " gripper shoe is arranged on the top of described lower bolster " refers to that gripper shoe is positioned on lower bolster, and the lower surface of gripper shoe contacts with the upper surface of lower bolster.
In the application, " described cope match-plate pattern is arranged at the top of described gripper shoe " refers to that cope match-plate pattern is positioned on gripper shoe, and forms space between the lower surface of cope match-plate pattern and the upper surface of gripper shoe.
Use described manufacturing installation to manufacture the technique of electronic equipment waterproof case, comprise,
(1) base material is placed in chip spaces, and base material and gripper shoe are preheated to more than the fusing point of base material jointly;
(2) temperature of cope match-plate pattern and lower bolster remains on below the solidification temperature of encapsulant, the gripper shoe being placed with base material after preheating being placed on lower bolster and fastening cope match-plate pattern, inject in chamber by injection channel by liquid sealing material injecting sealing material, after encapsulant cooling curing, product is taken out in die sinking.
Described base material is continuity fiber-reinforced thermoplastic resin composite, and described encapsulant is silicon rubber.
Be preheated to 220-280 DEG C, preheating time is 20-30s.
The temperature of cope match-plate pattern and lower bolster remains on 100-120 DEG C.
The time of cooling curing is 2-5min.
Also be included in when fastening cope match-plate pattern, cutting edge and recess are combined in base material described in stamping-out under stamping-out pressure; The speed fastening cope match-plate pattern is 300-600mm/s, and the stamping-out pressure be carried between cope match-plate pattern and lower bolster is 100-200Kgf/cm
2.
Before step (1), first described base material is carried out cutting.
The present invention has following beneficial effect compared with prior art:
(1) manufacturing installation of electronic equipment waterproof case of the present invention comprises, the cope match-plate pattern be oppositely arranged and lower bolster; Gripper shoe, is arranged on the top of described lower bolster, described cope match-plate pattern is suitable for being interlocked with described gripper shoe; Under buckling state, between described cope match-plate pattern and gripper shoe, form the chip spaces being suitable for laying base material, formed between described cope match-plate pattern and chip spaces simultaneously and be suitable for injecting and the encapsulant of forming seal material injection chamber at substrate surface; Injection channel, the inside that chamber is injected with described encapsulant in one end is connected, and the other end extends to the outside of described manufacturing installation; In described cope match-plate pattern compaction process relative to lower bolster, described encapsulant injects chamber and is suitable for encapsulant on substrate surface fixed-type.To be put on lower bolster after the base material in chip spaces and gripper shoe preheating, and fasten the cope match-plate pattern of low temperature, injecting sealing material in chamber is injected to encapsulant, after cooling curing, namely die sinking obtains the shell that base material is firmly connected with encapsulant, this device only needs one set of die one-shot forming can obtain waterproof case, process costs is low, production efficiency is high, avoids dijection forming machine in prior art and comprises two molds, need through twice shaping problem just obtaining waterproof case.
(2) manufacturing installation of electronic equipment waterproof case of the present invention, described encapsulant injects chamber and arranges along the edge of described chip spaces accordingly, encapsulant can be arranged a circle, to improve the water-tight of shell along the edge of base material like this.Also comprise outer rim block and central stopper, described encapsulant injects chamber and is made up of described outer rim block and central stopper, outer rim block and central stopper can avoid leaking outside of liquid sealing material, improve serviceability and the aesthetic measure of electronic shell, outer rim block and central stopper can be made into independent parts, fit together during use, disassemble after using; Further, also described outer rim block and central stopper can be integrally formed to downward-extension by the lower end of described cope match-plate pattern.
(3) manufacturing installation of electronic equipment waterproof case of the present invention, also comprise mutually adaptive cutting edge and groove, described groove is offered along described gripper shoe, and described cutting edge is extended downwards by described outer rim block, for cutting base material.Because after base material preheating, size can expand, easily cause encapsulant cannot accurately be solidificated in base material edge, the base material rim charge unnecessary because of expansion can be reduced by the cooperation of cutting edge and groove, thus ensure the cure site of encapsulant.
(4) manufacturing installation of electronic equipment waterproof case of the present invention, the shape that described chip spaces and encapsulant inject chamber can be arranged, as required to meet the difform needs of electronic product casing.
(5) manufacturing installation of electronic equipment waterproof case of the present invention, also comprise limited block, be arranged in described gripper shoe, described gripper shoe is compressed with cope match-plate pattern by described limited block and contacts, unified standard can both be met to make product, by the thickness of limited block restriction base material, injected the shape of chamber restriction encapsulant simultaneously by encapsulant, the waterproof case product of size uniformity can be obtained.Also comprise mutually adaptive emptiness avoiding hole and prepreg cloth locating dowel, the die plate locating holes of mutual adaptation and Template Location post, like this can be fixing on the supporting plate by prepreg cloth locating dowel by base material, and keep the stability that cope match-plate pattern, gripper shoe and lower bolster are assembled, thus improve the stability of shell product quality.
(6) the present invention uses manufacturing installation to manufacture the technique of electronic equipment waterproof case, and base material is placed in chip spaces, and base material and gripper shoe are preheated to more than the fusing point of base material jointly; The temperature of cope match-plate pattern and lower bolster remains on below the solidification temperature of encapsulant, the gripper shoe being placed with base material after preheating being placed on lower bolster and covering cope match-plate pattern, inject in chamber by injection channel by liquid sealing material injecting sealing material, after encapsulant cooling curing, product is taken out in die sinking.This device only needs one set of die one-shot forming can obtain waterproof case, and process costs is low, production efficiency is high.
Accompanying drawing explanation
In order to make content of the present invention more easily be understood, the present invention is further detailed content of the present invention with detailed description of the invention by reference to the accompanying drawings;
The disassembled form schematic diagram of Fig. 1 to be chip spaces of the present invention be columniform electronic equipment waterproof case manufacturing installation;
The using state schematic diagram of Fig. 2 to be chip spaces of the present invention be columniform electronic equipment waterproof case manufacturing installation;
The top view of Fig. 3 to be chip spaces of the present invention be gripper shoe of columniform electronic equipment waterproof case manufacturing installation;
Fig. 4 is the disassembled form schematic diagram of the curved electronic equipment waterproof case manufacturing installation in chip spaces edge of the present invention;
Fig. 5 is the using state schematic diagram of the curved electronic equipment waterproof case manufacturing installation in chip spaces edge of the present invention;
Fig. 6 is the top view of the gripper shoe of the curved electronic equipment waterproof case manufacturing installation in chip spaces edge of the present invention;
The casing structure schematic diagram that Fig. 7 obtains for manufacturing electronic equipment waterproof case technique described in the embodiment of the present invention 2;
The casing structure schematic diagram that Fig. 8 obtains for manufacturing electronic equipment waterproof case technique described in the embodiment of the present invention 3;
Wherein Reference numeral is: 1-cope match-plate pattern, 2-lower bolster, 3-gripper shoe, 4-chip spaces, 5-encapsulant injects chamber, 6-injection channel, 7-outer rim block, 8-central stopper, 9-cutting edge, 10-groove, 11-limited block, 12-emptiness avoiding hole, 13-prepreg cloth locating dowel, 14-die plate locating holes, 15-Template Location post, 16-drain pan, 17-silicone rubber O-ring.
Detailed description of the invention
The manufacturing installation of electronic equipment waterproof case of the present invention, comprise the cope match-plate pattern 1 and lower bolster 2 that are oppositely arranged, the shape and size of described cope match-plate pattern 1 and lower bolster 2 can be selected as required, in the present embodiment, the cross section of described cope match-plate pattern 1 and lower bolster 2 is rectangle, and cope match-plate pattern 1 and lower bolster 2 is measure-alike; Gripper shoe 3, described gripper shoe 3 is arranged on the top of described lower bolster 2, removably connect with described lower bolster 2, described cope match-plate pattern 1 is detachably arranged at the top of described gripper shoe 3, described cope match-plate pattern 1 is suitable for being interlocked with described gripper shoe 3, the shape and size of described gripper shoe 3 can be selected as required, in the present embodiment, the shape of described gripper shoe 3 and cope match-plate pattern 1 and lower bolster 2, measure-alike.
Under buckling state, between described cope match-plate pattern 1 and gripper shoe 3, form the chip spaces 4 being suitable for laying base material, formed between described cope match-plate pattern 1 and chip spaces 4 simultaneously and be suitable for injecting and the encapsulant of forming seal material injection chamber 5 at substrate surface; Shape and the setting position in described chip spaces 4 and encapsulant injection chamber 5 can be selected according to the needs of shell mechanism, in the present embodiment, in order to improve the water-tight of shell edge, described encapsulant injects chamber 5 and arranges along the edge of described chip spaces 4 accordingly, the preferred described chip spaces 4 of the present embodiment is cylinder, and it is cylinder ring that described encapsulant injects chamber 5.Injection channel 6, the inside that chamber 5 is injected with described encapsulant in one end is connected, and the other end extends to the outside of described manufacturing installation, and in the present embodiment, described injection channel 6 is run through described cope match-plate pattern 1 and arranged.In described cope match-plate pattern 1 compaction process relative to lower bolster 2, described encapsulant injects chamber 5 and is suitable for encapsulant on substrate surface fixed-type.
On the basis of above-mentioned embodiment, as the embodiment of change, the manufacturing installation of electronic equipment waterproof case of the present invention also comprises outer rim block 7 and central stopper 8, described encapsulant injects chamber 5 and is made up of described outer rim block 7 and central stopper 8, in the present embodiment, described outer rim block 7 is the closed circle band of column arranged along the circumference of chip spaces 4, described central stopper 8 is for being arranged at the cylinder inside encapsulant injection chamber 5, and described outer rim block 7 is identical with the thickness of central stopper 8.
On the basis of the above, in order to improve the integraty of equipment, as interchangeable embodiment, described outer rim block 7 and central stopper 8 one-body molded to downward-extension by the lower end of described cope match-plate pattern 1.
On the basis of the above, as Figure 1-3, the manufacturing installation of electronic equipment waterproof case of the present invention also comprises mutually adaptive cutting edge 9 and groove 10, and described groove 10 is offered along described gripper shoe 3, described cutting edge 9 is extended downwards by described outer rim block 7, for cutting base material.Also comprising limited block 11, being arranged in described gripper shoe 3, for limiting the thickness of base material; Described gripper shoe 3 is fastened by described limited block 11 and cope match-plate pattern 1 and compresses, and in the present embodiment, the cross section of described chip spaces 4 is rectangle, and described limited block 11 is four, and four sides respectively near chip spaces 4 cross section are arranged.Also comprise mutually adaptive emptiness avoiding hole 12 and prepreg cloth locating dowel 13, described emptiness avoiding hole 12 is opened on described cope match-plate pattern 1, described prepreg cloth locating dowel 13 is arranged in described gripper shoe 3, in the present embodiment, described emptiness avoiding hole 12 and prepreg cloth locating dowel 13 are two right, be separately positioned on the two ends of chip spaces 4 cross section diagonal, the fixing of base material can be realized by prepreg cloth locating dowel 13, cope match-plate pattern 1 and gripper shoe 3 can be fastened by emptiness avoiding hole 12 simultaneously; Also comprise mutually adaptive die plate locating holes 14 and Template Location post 15, described die plate locating holes 14 is opened on described cope match-plate pattern 1 or lower bolster 2, accordingly, described Template Location post 15 is arranged on described lower bolster 2 or cope match-plate pattern 1, and run through described gripper shoe 3, in the present embodiment, described die plate locating holes 14 is opened on described cope match-plate pattern 1, described Template Location post 15 is arranged on described lower bolster 2, described die plate locating holes 14 and Template Location post 15 are four right, are separately positioned on four angles of device.
On this basis, as Figure 4-Figure 6, the edge of the vertical plane of the chip spaces 4 of the manufacturing installation of electronic equipment waterproof case of the present invention also can be curved, and correspondingly, the edge that described encapsulant injects the vertical plane in chamber 5 is also curved.
above-mentioned manufacturing installation is adopted to manufacture the technique of electronic equipment waterproof case, as follows:
(1) first continuity fibre reinforced thermoplastic resin prepreg cloth is carried out cutting, prepreg cloth after cutting out to be layed in chip spaces 4 and to fix by prepreg cloth locating dowel 13, prepreg cloth base material and gripper shoe 3 are preheated to more than the fusing point of prepreg cloth jointly, prepreg cloth base material and gripper shoe 3 are preheated to 250-280 DEG C by this technique jointly, and preheating time is 10-20s;
(2) cope match-plate pattern 1 remains on below the solidification temperature of encapsulant with the temperature of lower bolster 2, cope match-plate pattern 1 and the temperature of lower bolster 2 are remained on 90-110 DEG C by this technique, the gripper shoe 3 being placed with prepreg cloth after preheating to be placed on lower bolster 2 and to cover cope match-plate pattern 1, when covering cope match-plate pattern 1, prepreg cloth locating dowel 13 embeds in emptiness avoiding hole 12, in Template Location post 15 embedded template locating hole 14, cutting edge 9 matches with groove 10 stamping-out prepreg cloth, the speed covering cope match-plate pattern 1 is 400-600mm/s, the stamping-out pressure be carried between the cope match-plate pattern after covering 1 and lower bolster 2 is 100-200Kgf/cm
2, inject in chamber 5 by injection channel 6 by fluid silicone rubber injecting sealing material, after silicon rubber cooling curing 3-5min, product is taken out in die sinking, and gained casing structure is shown in Fig. 7, and it comprises the silicone rubber O-ring 17 on drain pan 16 and top.
On the basis of the above, the curved encapsulant of the chip spaces 4 adopting the edge of vertical plane curved and the edge of vertical plane injects casing structure that chamber 5 makes as shown in Figure 8.
Although the present invention has carried out detailed elaboration by above-mentioned specific embodiment to it; but; those skilled in the art should be understood that and made on this basis not exceed any form of claims and the change of details, all belong to invention which is intended to be protected.
Claims (14)
1. a manufacturing installation for electronic equipment waterproof case, is characterized in that, comprises
The cope match-plate pattern (1) be oppositely arranged and lower bolster (2);
Gripper shoe (3), is arranged on the top of described lower bolster (2);
Described cope match-plate pattern (1) is arranged at the top of described gripper shoe (3), and described cope match-plate pattern (1) is suitable for being interlocked with described gripper shoe (3);
Under buckling state, form the chip spaces (4) being suitable for laying base material between described cope match-plate pattern (1) and gripper shoe (3), formed between described cope match-plate pattern (1) and chip spaces (4) simultaneously and be suitable for injecting and the encapsulant of forming seal material injection chamber (5) at substrate surface;
Injection channel (6), the inside that one end and described encapsulant inject chamber (5) is connected, and the other end extends to the outside of described manufacturing installation;
Described cope match-plate pattern (1) is with in lower bolster (2) relative compaction process, and described encapsulant injects chamber (5) and is suitable for encapsulant on substrate surface fixed-type.
2. manufacturing installation according to claim 1, is characterized in that, described gripper shoe (3) is detachably arranged at the top of described lower bolster (2).
3. manufacturing installation according to claim 1 and 2, is characterized in that, described encapsulant injection chamber (5) is arranged along the edge of described chip spaces (4).
4. manufacturing installation according to claim 3, is characterized in that, also comprises outer rim block (7) and central stopper (8), and described encapsulant injects chamber (5) and is made up of described outer rim block (7) and central stopper (8).
5. manufacturing installation according to claim 4, is characterized in that, described outer rim block (7) and central stopper (8) are integrally formed to downward-extension by the lower end of described cope match-plate pattern (1).
6. the manufacturing installation according to claim 4 or 5, it is characterized in that, also comprise the adaptive cutting edge (9) for cutting base material and groove (10) mutually, described groove (10) is offered along described gripper shoe (3), and described cutting edge (9) is extended downwards by described outer rim block (7).
7. according to the arbitrary described manufacturing installation of claim 4-6, it is characterized in that, described injection channel (6) are run through described cope match-plate pattern (1) and are arranged.
8., according to the arbitrary described manufacturing installation of claim 3-7, it is characterized in that, described chip spaces (4) is cylinder, and it is cylinder ring that described encapsulant injects chamber (5).
9. manufacturing installation according to claim 8, is characterized in that, the edge of the vertical plane of described chip spaces (4) is curved, and correspondingly, the edge that described encapsulant injects the vertical plane in chamber (5) is also curved.
10., according to the arbitrary described manufacturing installation of claim 1-9, it is characterized in that, also comprising the limited block (11) for limiting base material thickness, be arranged in described gripper shoe (3); Described gripper shoe (3) is interlocked by described limited block (11) and cope match-plate pattern (1).
11., according to the arbitrary described manufacturing installation of claim 1-10, is characterized in that, also comprise the adaptive emptiness avoiding hole (12) for fixing substrate and prepreg cloth locating dowel (13) mutually; Described emptiness avoiding hole (12) is opened on described cope match-plate pattern (1), and described prepreg cloth locating dowel (13) is arranged in described gripper shoe (3); Also comprise mutually adaptive die plate locating holes (14) and Template Location post (15), described die plate locating holes (14) is opened on described cope match-plate pattern (1) or lower bolster (2), accordingly, described Template Location post (15) is arranged on described lower bolster (2) or cope match-plate pattern (1), and runs through described gripper shoe (3).
12. use the arbitrary described manufacturing installation of claim 1-11 to manufacture the technique of electronic equipment waterproof case, comprise,
(1) base material is placed in chip spaces (4), and base material and gripper shoe (3) are preheated to more than the fusing point of base material jointly;
(2) cope match-plate pattern (1) remains on below the solidification temperature of encapsulant with the temperature of lower bolster (2), the gripper shoe (3) being placed with base material after preheating is placed in lower bolster (2) go up and fasten cope match-plate pattern (1), inject in chamber (5) by injection channel (6) by liquid sealing material injecting sealing material, after encapsulant cooling curing, product is taken out in die sinking.
13. techniques according to claim 12, is characterized in that, be preheated to 220-280 DEG C, and preheating time is 20-30s; Cope match-plate pattern (1) remains on 100-120 DEG C with the temperature of lower bolster (2); The time of cooling curing is 2-5min.
14. techniques according to claim 12 or 13, it is characterized in that, described base material is continuity fiber-reinforced thermoplastic resin composite, and described encapsulant is silicon rubber; Also be included in when fastening cope match-plate pattern (1), cutting edge (9) matches with groove (10) base material described in stamping-out under stamping-out pressure; The speed fastening cope match-plate pattern (1) is 300-600mm/s, and the stamping-out pressure be carried between cope match-plate pattern (1) and lower bolster (2) is 100-200Kgf/cm
2; Before step (1), first described base material is carried out cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410176289.2A CN105082555B (en) | 2014-04-29 | 2014-04-29 | The manufacture device of electronic equipment waterproof case and the technique using the device |
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|---|---|---|---|
| CN201410176289.2A CN105082555B (en) | 2014-04-29 | 2014-04-29 | The manufacture device of electronic equipment waterproof case and the technique using the device |
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| CN105082555A true CN105082555A (en) | 2015-11-25 |
| CN105082555B CN105082555B (en) | 2018-01-23 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111152389A (en) * | 2020-01-17 | 2020-05-15 | 浙江普兴电子科技有限公司 | Tool and method for preparing composite material mixed layer at one time by using vulcanizing machine |
| CN112873744A (en) * | 2021-02-01 | 2021-06-01 | 台州市黄岩新豪检具有限公司 | Lightweight car door plant injection mold |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101774252A (en) * | 2009-12-30 | 2010-07-14 | 范迪雷 | Imprint injection molding process for switch socket panel and composite injection mold |
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2014
- 2014-04-29 CN CN201410176289.2A patent/CN105082555B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101774252A (en) * | 2009-12-30 | 2010-07-14 | 范迪雷 | Imprint injection molding process for switch socket panel and composite injection mold |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111152389A (en) * | 2020-01-17 | 2020-05-15 | 浙江普兴电子科技有限公司 | Tool and method for preparing composite material mixed layer at one time by using vulcanizing machine |
| CN112873744A (en) * | 2021-02-01 | 2021-06-01 | 台州市黄岩新豪检具有限公司 | Lightweight car door plant injection mold |
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|---|---|
| CN105082555B (en) | 2018-01-23 |
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