CN105057163A - Spin coating device and method utilizing airflow for controlling thickness of photoresist film - Google Patents
Spin coating device and method utilizing airflow for controlling thickness of photoresist film Download PDFInfo
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- CN105057163A CN105057163A CN201510415328.4A CN201510415328A CN105057163A CN 105057163 A CN105057163 A CN 105057163A CN 201510415328 A CN201510415328 A CN 201510415328A CN 105057163 A CN105057163 A CN 105057163A
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Abstract
The invention discloses a spin coating device and method utilizing airflow for controlling the thickness of a photoresist film and relates to the field of holographic grating manufacturing. By the adoption of the spin coating device and method utilizing airflow for controlling the thickness of the photoresist film, the problems that according to existing spin coating methods, a long time is consumed, cost is high, the reliability of manufactured photoresist films is poor, the photoresist films are nonuniform, and it is difficult to manufacture thick photoresist films are solved. The spin coating device comprises a motor, a base vacuum chuck, a second vacuum pump regulating switch, a photoresist dropper, an air shower back plate, an air shower cavity, an air pump set, a display screen, a jerk button, a touch screen control panel, a vacuum pump, a residual liquor groove, a wind speed regulating switch, a first vacuum pump regulating switch, a bearing supporting structure, a control panel, a photoresist spraying head, a yellow fluorescent light source and a residual liquor collecting device. A base of a holographic grating is fixed to the center of the base vacuum chuck by means of the vacuum absorption force of the vacuum pump, and the spin coating process is completed by means of compressed air of the air pump set. According to the spin coating device and method utilizing airflow for controlling the thickness of the photoresist film, the thickness of the photoresist film is controlled by controlling the evaporation rate of photoresist through airflow; the reliability is high, a short time is consumed, and cost is low.
Description
Technical field
The present invention relates to holographic grating making technical field, be specifically related to a kind ofly utilize the even adhesive dispenser of gas flow optimized photoresist film thickness and even gluing method.
Background technology
Photic etching method, as a kind of important fine processing technique, has a wide range of applications in fields such as light storage, microelectronics, micro photo-electro-mechanical and holographic gratings.First processing step implementing photic etching is exactly the coating of photo-induced etching agent (abbreviation photoresist), and also claim spin processes, he is related to the success or failure of whole technological process, therefore enjoys the attention of various equivalent modifications.Spin processes most critical to control the thickness of photoresist film and uniformity thereof well.Make holographic grating mask if be used in, the thickness of photoresist film directly affects final obtained grating diffration efficiency; If be used as ion beam etching mask, then directly impact finally obtains the blaze angle of grating.
At present, conventional even gluing method is centrifugal cladding process (abbreviation spin-coating method), and spin-coating method is more difficult for the photoresist film that preparation is thicker.Current spin-coating method prepares comparatively thick photoresist film by two means: one is reduce even glue speed, reduce centrifugal force and improve photoresist film thickness, by reduce prepared by even glue speed compared with thick photoresist film because centrifugal force in even glue process is too small, cause photoresist film uneven, surface existing defects, cannot apply in holographic grating making field, even glue speed can not infinitely reduce in addition.Two is adopt sol-gal process repeatedly to drip glue to improve photoresist film thickness, by repeatedly dripping glue, repeatedly the mode of sol-gel improves photoresist film thickness, dripping glue process need uses the instruments such as glue head dropper draw a little photoresist and ooze a little on grating substrate, drip glue process and seem simple, actual needs certain experiences, and drip glue thousands of times compared with needing the at substantial time to carry out hundreds of during thick photoresist film in enormous quantities in preparation, and the method is strict to dripping glue status requirement, at substantial artificial and time, and repeatedly drip glue, repeatedly gel can cause photoresist film in uneven thickness.In addition, the method length consuming time, makes grating substrate expose for a long time in atmosphere, greatly reduces the cleanliness factor preparing photoresist film.
Summary of the invention
In order to solve length consuming time that existing even gluing method exists, cost high, prepare photoresist film poor reliability, photoresist film uneven, be difficult to prepare the problem compared with thick photoresist film, the invention provides and a kind ofly utilize the even adhesive dispenser of gas flow optimized photoresist film thickness and even gluing method.The present invention can prepare thicker even photoresist film by changing air-flow velocity control photoresist film thickness in the short period of time.
The technical scheme that the present invention adopts for technical solution problem is as follows:
The even adhesive dispenser utilizing gas flow optimized photoresist film thickness of the present invention, comprising:
Wind drenches chamber;
Be fixed on the control panel that wind drenches exterior thereto;
To be built in control panel and the computer of even glue program is installed;
The fixing touch screen control panel be electrically connected on the control panel and with computer;
The motor be electrically connected with computer, the output shaft of described motor is hollow, and the output shaft of described motor is stretched into wind and drenches chamber interior and fixed by bearing support structure, is controlled the running of motor by touch screen control panel;
The substrate vacuum cup be connected with the output shaft upper end of motor, described substrate vacuum cup, for placing holographic grating substrate, is rotated by driven by motor substrate vacuum cup;
Be connected and the vavuum pump be electrically connected with computer with the output shaft of motor by pipeline, controlled the running of vavuum pump by touch screen control panel;
Be arranged on the first vavuum pump by-pass cock on the pipeline between the output shaft of motor and vavuum pump, open the first vavuum pump by-pass cock, the vacuum adsorption force utilizing vavuum pump to provide makes holographic grating substrate be fixed on substrate vacuum cup center;
Be arranged on the wind pouring backboard that wind drenches chamber interior;
Drench backboard by pipeline and wind to be connected and the air pump group be electrically connected with computer, controlled the running of air pump group by touch screen control panel;
Stretch into wind drench the photoresist dropper of chamber interior and be arranged on the light-sensitive lacquer sprayer of photoresist dropper lower end;
Be arranged on wind and drench chamber interior and the raffinate groove being fixed on substrate vacuum cup lower end, described raffinate groove is connected by pipeline with vavuum pump, for collecting photoresist raffinate;
Be arranged on the raffinate gathering-device on the pipeline between raffinate groove and vavuum pump and the second vavuum pump by-pass cock, open the second vavuum pump by-pass cock, the photoresist raffinate in described raffinate groove is collected into raffinate gathering-device under the vacuum adsorption force effect of vavuum pump.
Further, also comprising: be arranged on the yellow fluorescence light source that wind drenches chamber interior upper end, for providing light source for wind drenches chamber, not making photoresist produce photochemical reaction simultaneously.
Further, the junction that described wind drenches between backboard and air pump group is provided with airstrainer, preventing pollution.
Further, also comprise: the fixing display screen be electrically connected on the control panel and with computer, for showing the rotating speed of motor, the wind speed of air pump group and the vacuum adsorption force of vavuum pump.
Further, also comprising: the fixing scram button be electrically connected on the control panel and with computer, for cutting off the power supply of motor, avoiding having an accident.
Further, described wind drenches on the pipeline between backboard and air pump group and is provided with wind speed by-pass cock, exports for the wind speed controlling air pump group.
The even gluing method utilizing gas flow optimized photoresist film thickness of the present invention, comprises the following steps:
Step one, pretreated holographic grating substrate is placed on substrate vacuum cup center, vavuum pump is opened by touch screen control panel, open the first vavuum pump by-pass cock, close the second vavuum pump by-pass cock, vavuum pump provides vacuum adsorption force to make substrate vacuum cup hold holographic grating substrate;
Step 2, by photoresist dropper by photoresist via light-sensitive lacquer sprayer drip at the holographic grating substrate surface being adsorbed on substrate vacuum cup center, open motor by touch screen control panel simultaneously, the rotating speed of substrate vacuum cup with 500/rpm ~ 1000/rpm under driven by motor at the uniform velocity rotates, and makes photoresist be covered with whole holographic grating substrate surface;
Step 3, open wind speed by-pass cock, air pump group is opened by touch screen control panel, the compressed air that air pump group is exported drenches backboard by wind and airstrainer acts on substrate vacuum cup and holographic grating substrate, the wind speed of air pump group is 0.2m/s ~ 0.6m/s, the vacuum cup of substrate simultaneously starts to accelerate to 1000/rpm ~ 3500/rpm and keeps this rotating speed at the uniform velocity to rotate under driven by motor, completes spin processes;
Decelerating through motor is controlled to stopping by touch screen control panel after step 4, spin processes complete, holographic grating substrate is taken out after closing the first vavuum pump by-pass cock, open the second vavuum pump by-pass cock, photoresist raffinate in raffinate groove is collected into raffinate gathering-device under the vacuum adsorption force effect of vavuum pump, and holographic grating substrate encapsulates for subsequent use after carrying out drying and processing.
Further, the wind speed of described air pump group is preferably 0.4m/s and 0.6m/s.
Further, need, by the even glue program controlled in touch screen control panel setting computer, namely to set the rotating speed of motor, the wind speed of air pump group, the vacuum adsorption force of vavuum pump, complete spin processes according to technique.
The invention has the beneficial effects as follows: the present invention controls photoresist film thickness by gas flow optimized photoresist evaporation rate, enhanced water evaporation mechanism in even glue process, photoresist concentration is changed, with the generation effect jointly of centrifugal mechanism, make photoresist film thickness uniform flat, and being easy to make comparatively thick photoresist film, obtained photoresist film reliability is high; Make to be in malleation in wind pouring chamber because wind drenches simultaneously always, be easy to keep wind to drench chamber clean degree.The inventive method is consuming time short, and cost is low, simplifies manual steps, has important using value.
Accompanying drawing explanation
Fig. 1 is the structural representation utilizing the even adhesive dispenser of gas flow optimized photoresist film thickness of the present invention.
Fig. 2 is the process chart utilizing the even gluing method of gas flow optimized photoresist film thickness of the present invention.
Fig. 3 is even glue rotating speed in the present invention under three kinds of different wind speed and the curved line relation schematic diagram between photoresist thickness.
In figure: 1, motor, 2, output shaft, 3, substrate vacuum cup, 4, the second vavuum pump by-pass cock, 5, photoresist dropper, 6, wind drench backboard, 7, wind drench chamber, 8, air pump group, 9, display screen, 10, scram button, 11, touch screen control panel, 12, vavuum pump, 13, raffinate groove, 14, wind speed by-pass cock, the 15, first vavuum pump by-pass cock, 16, bearing support structure, 17, control panel, 18, light-sensitive lacquer sprayer, 19, holographic grating substrate, 20, yellow fluorescence light source, 21, raffinate gathering-device.
Detailed description of the invention
As shown in Figure 1, a kind of even adhesive dispenser utilizing gas flow optimized photoresist film thickness of the present invention, mainly comprises motor 1, substrate vacuum cup 3, second vavuum pump by-pass cock 4, photoresist dropper 5, wind drenches backboard 6, wind drenches chamber 7, air pump group 8, display screen 9, scram button 10, touch screen control panel 11, vavuum pump 12, raffinate groove 13, wind speed by-pass cock 14, first vavuum pump by-pass cock 15, bearing support structure 16, control panel 17, light-sensitive lacquer sprayer 18, yellow fluorescence light source 20, raffinate gathering-device 21.
Display screen 9, scram button 10 and touch screen control panel 11 are successively set on control panel 17 from top to bottom, control panel 17 is built-in with computer (not having display in the drawings), even glue program is installed in computer, display screen 9, scram button 10 and touch screen control panel 11 are all electrically connected with computer, display screen 9 is for showing rotating speed, the wind speed of air pump group 8, the vacuum adsorption force of vavuum pump 12 of motor 1, scram button 10 uses under emergency, press the power supply that scram button 10 can cut off motor 1, motor 1 is shut down, avoids having an accident.Needing according to technique can even glue program in setting computer by controlling touch screen control panel 11, completes spin processes.Control panel 17 integral installation drenches chamber 7 outer front end at wind, handled easily.Said even glue program refers to the numerical value such as rotating speed, the wind speed of air pump group 8, the vacuum adsorption force of vavuum pump 12 of setting motor 1, to complete follow-up spin processes.
Bearing support structure 16 is arranged on wind and drenches chamber 7 inner bottom, and first end of the output shaft 2 of motor 1 stretches into wind, and to drench chamber 7 inner, and the mid portion of the output shaft 2 of motor 1 drenches chamber 7 inner bottom by bearing support structure 16 and wind is fixedly linked; Substrate vacuum cup 3 is positioned at wind and drenches chamber 7 interior lower end, and substrate vacuum cup 3 is fixedly linked with the upper end of the output shaft 2 of motor 1, and holographic grating substrate 19 is positioned over the center of substrate vacuum cup 3.Motor 1 is electrically connected with computer built-in in control panel 17, by the opening and closing of the even glue program controlled motor 1 in touch screen control panel 11 computer for controlling, regulate the rotating speed size of motor 1 simultaneously, substrate vacuum cup 3 can be driven to rotate by motor 1.
The output shaft 2 of motor 1 is hollow, vavuum pump 12 is connected with the output shaft 2 of motor 1 by pipeline, vavuum pump 12 can directly act on substrate vacuum cup 3 by the output shaft 2 of pipeline and motor 1, pipeline between the output shaft 2 of vavuum pump 12 and motor 1 is also provided with the first vavuum pump by-pass cock 15, vavuum pump 12 is electrically connected with computer built-in in control panel 17, by the opening and closing of the even glue programme-control vavuum pump 12 in touch screen control panel 11 computer for controlling, regulate the vacuum adsorption force size that vavuum pump 12 provides simultaneously.Open the first vavuum pump by-pass cock 15, vacuumized by vavuum pump 12 pairs of substrate vacuum cups 3, the vacuum adsorption force utilizing vavuum pump 12 to provide makes holographic grating substrate 19 be fixed on substrate vacuum cup 3 center.
Wind drenches chamber 7 inside and is provided with wind pouring backboard 6, wind is drenched backboard 6 and is connected by pipeline with air pump group 8, the junction that wind drenches between backboard 6 and air pump group 8 is provided with airstrainer, wind drenches on the pipeline between backboard 6 and air pump group 8 and is provided with wind speed by-pass cock 14, air pump group 8 is electrically connected with computer built-in in control panel 17, by the opening and closing of the even glue programme-control air pump group 8 in touch screen control panel 11 computer for controlling, regulate the wind speed size of air pump group 8 simultaneously.Air pump group 8 and wind drench between backboard 6 has installed airstrainer, and drench under backboard 6 and vavuum pump 12 act on because substrate vacuum cup in even glue process 3 and holographic grating substrate 19 are in wind, wind drenches in chamber 7 and keeps barotropic state, and from external contaminants is drenched in chamber 7 as dust is difficult to enter wind.
Wind drenches in chamber 7 and is provided with photoresist dropper 5, light-sensitive lacquer sprayer 18 and raffinate groove 13, light-sensitive lacquer sprayer 18 is arranged on photoresist dropper 5 lower end and close holographic grating substrate 19, photoresist dropper 5 is for storing photoresist, light-sensitive lacquer sprayer 18 is for dripping photoresist to holographic grating substrate 19, raffinate groove 13 is arranged on substrate vacuum cup 3 lower end, and raffinate groove 13 is for collecting the photoresist raffinate of splashing.Raffinate groove 13 is connected by pipeline with vavuum pump 12, pipeline between raffinate groove 13 and vavuum pump 12 there is also mounted raffinate gathering-device 21 and the second vavuum pump by-pass cock 4, open the second vavuum pump by-pass cock 4, the photoresist raffinate in raffinate groove 13 is collected into raffinate gathering-device 21 under the vacuum adsorption force effect of vavuum pump 12.
Wind drenches chamber 7 inner upper end has installed yellow fluorescence light source 20, while providing light source for wind pouring chamber 7, do not make photoresist produce photochemical reaction.
As depicted in figs. 1 and 2, the even gluing method utilizing gas flow optimized photoresist film thickness of the present invention, is realize based on above-mentioned even adhesive dispenser, specifically comprises the following steps:
(1) wind drenches chamber 7 inner upper end installation yellow fluorescence light source 20, while providing light source for wind pouring chamber 7, do not make photoresist produce photochemical reaction, holographic grating substrate 19 after pretreatment (cleaning treatment and front baking process) is placed on substrate vacuum cup 3 center in wind pouring chamber 7, the vavuum pump 12 be connected with substrate vacuum cup 3 is opened by the touch screen control panel 11 in control panel 17, then the first vavuum pump by-pass cock 15 is opened, close the second vavuum pump by-pass cock 4, vavuum pump 12 provides vacuum adsorption force, and (vacuum adsorption force size is arranged according to the needs of spin processes, general warranty holographic grating substrate 19 can not be fallen down from substrate vacuum cup 3) make substrate vacuum cup 3 hold holographic grating substrate 19, then even glue program is set by touch screen control panel 11, even glue program is arranged in computer built-in in control panel 17.
(2) by photoresist dropper 5, photoresist is dripped on holographic grating substrate 19 surface being adsorbed on substrate vacuum cup 3 center via light-sensitive lacquer sprayer 18, open motor 1 by the touch screen control panel 11 in control panel 17 simultaneously, substrate vacuum cup 3 at the uniform velocity rotates with the rotating speed of 500/rpm ~ 1000/rpm under motor 1 drives, and makes photoresist be covered with whole holographic grating substrate 19 surface.
(3) after coating technique completes, even glue program according to above-mentioned setting carries out spin processes, first wind speed by-pass cock 14 is opened, air pump group 8 is opened by the touch screen control panel 11 in control panel 17, the compressed air that air pump group 8 is exported drenches backboard 6 by wind and airstrainer acts on substrate vacuum cup 3 and holographic grating substrate 19, the wind speed of air pump group 8 is 0.2m/s ~ 0.6m/s, the vacuum cup of substrate simultaneously 3 starts to accelerate to 1000/rpm ~ 3500/rpm and keeps this rotating speed at the uniform velocity to rotate under motor 1 drives, and completes spin processes.
(4) spin processes controls motor 1 by the touch screen control panel 11 in control panel 17 after completing and slows down until stop, holographic grating substrate 19 is taken out after closing the first vavuum pump by-pass cock 15, open the second vavuum pump by-pass cock 4, photoresist raffinate in raffinate groove 13 is collected into raffinate gathering-device 21 under the vacuum adsorption force effect of vavuum pump 12, drying and processing is carried out in holographic grating substrate 19, can carry out next step techniques such as exposure after completing oven dry.
As shown in Figure 3, the even glue rotating speed in the present invention under three kinds of different wind speed and the curved line relation between photoresist thickness, along with the increase of motor 1 rotating speed, photoresist thickness reduces gradually, therefore, can reach a conclusion, the rotating speed of motor 1 is larger, and the thickness of photoresist is thicker.
In the present invention, air pump group 8 and wind drench between backboard 6 has installed airstrainer; And drenches under backboard 6 and vavuum pump 12 act on because substrate vacuum cup in even glue process 3 and holographic grating substrate 19 are in wind, wind drenches maintenance barotropic state in chamber 7, and from external contaminants such as dust is difficult to enter in wind pouring chamber 7; The effect that photoresist solvent drenches due to wind in even glue process has in addition carried out solvent volatilization in advance, eliminate the solvent volatilization process after normal even glue, avoid holographic grating substrate 19 surface contamination of taking out in holographic grating substrate 19 and drying course, and save the time.
Claims (10)
1. utilize the even adhesive dispenser of gas flow optimized photoresist film thickness, it is characterized in that, comprising:
Wind drenches chamber (7);
Be fixed on wind and drench the outside control panel (17) of chamber (7);
To be built in control panel (17) and the computer of even glue program is installed;
Be fixed on control panel (17) to go up and the touch screen control panel (11) be electrically connected with computer;
The motor (1) be electrically connected with computer, the output shaft (2) of described motor (1) is hollow, the output shaft (2) of described motor (1) is stretched into wind and drenches chamber (7) inside and fixed by bearing support structure (16), is controlled the running of motor (1) by touch screen control panel (11);
The substrate vacuum cup (3) be connected with output shaft (2) upper end of motor (1), described substrate vacuum cup (3), for placing holographic grating substrate (19), drives substrate vacuum cup (3) to rotate by motor (1);
Be connected and the vavuum pump (12) be electrically connected with computer with the output shaft (2) of motor (1) by pipeline, controlled the running of vavuum pump (12) by touch screen control panel (11);
Be arranged on the first vavuum pump by-pass cock (15) on the pipeline between the output shaft (2) of motor (1) and vavuum pump (12), open the first vavuum pump by-pass cock (15), the vacuum adsorption force utilizing vavuum pump (12) to provide makes holographic grating substrate (19) be fixed on substrate vacuum cup (3) center;
Be arranged on wind and drench inner wind pouring backboard (6) of chamber (7);
Drench backboard (6) by pipeline and wind to be connected and the air pump group (8) be electrically connected with computer, controlled the running of air pump group (8) by touch screen control panel (11);
Stretch into the light-sensitive lacquer sprayer (18) that wind drenches the inner photoresist dropper (5) of chamber (7) and is arranged on photoresist dropper (5) lower end;
Be arranged on wind and drench chamber (7) inside and the raffinate groove (13) being fixed on substrate vacuum cup (3) lower end, described raffinate groove (13) is connected by pipeline with vavuum pump (12), for collecting photoresist raffinate;
Be arranged on the raffinate gathering-device (21) on the pipeline between raffinate groove (13) and vavuum pump (12) and the second vavuum pump by-pass cock (4), open the second vavuum pump by-pass cock (4), the photoresist raffinate in described raffinate groove (13) is collected into raffinate gathering-device (21) under the vacuum adsorption force effect of vavuum pump (12).
2. even adhesive dispenser according to claim 1, it is characterized in that, also comprising: be arranged on the yellow fluorescence light source (20) that wind drenches chamber (7) inner upper end, for providing light source for wind drenches chamber (7), not making photoresist produce photochemical reaction simultaneously.
3. even adhesive dispenser according to claim 1, is characterized in that, the junction that described wind drenches between backboard (6) and air pump group (8) is provided with airstrainer, preventing pollution.
4. even adhesive dispenser according to claim 1, it is characterized in that, also comprise: be fixed on control panel (17) and go up and the display screen (9) be electrically connected with computer, for showing the vacuum adsorption force of the rotating speed of motor (1), the wind speed of air pump group (8) and vavuum pump (12).
5. even adhesive dispenser according to claim 1, it is characterized in that, also comprise: being fixed on control panel (17) and going up and the scram button (10) be electrically connected with computer, for cutting off the power supply of motor (1), avoiding having an accident.
6. even adhesive dispenser according to claim 1, it is characterized in that, described wind drenches on the pipeline between backboard (6) and air pump group (8) and is provided with wind speed by-pass cock (14), exports for the wind speed controlling air pump group (8).
7. utilize the even gluing method of the even adhesive dispenser of gas flow optimized photoresist film thickness as claimed in claim 1, it is characterized in that, comprise the following steps:
Step one, pretreated holographic grating substrate (19) is placed on substrate vacuum cup (3) center, vavuum pump (12) is opened by touch screen control panel (11), open the first vavuum pump by-pass cock (15), close the second vavuum pump by-pass cock (4), vavuum pump (12) provides vacuum adsorption force to make substrate vacuum cup (3) hold holographic grating substrate (19);
Step 2, by photoresist dropper (5) by photoresist via light-sensitive lacquer sprayer (18) drip be adsorbed on substrate vacuum cup (3) center holographic grating substrate (19) surface, open motor (1) by touch screen control panel (11) simultaneously, substrate vacuum cup (3) at the uniform velocity rotates with the rotating speed of 500/rpm ~ 1000/rpm under motor (1) drives, and makes photoresist be covered with whole holographic grating substrate (19) surface;
Step 3, open wind speed by-pass cock (14), air pump group (8) is opened by touch screen control panel (11), the compressed air that air pump group (8) is exported drenches backboard (6) by wind and airstrainer acts on substrate vacuum cup (3) and holographic grating substrate (19), the wind speed of air pump group (8) is 0.2m/s ~ 0.6m/s, substrate vacuum cup simultaneously (3) starts to accelerate to 1000/rpm ~ 3500/rpm and keeps this rotating speed at the uniform velocity to rotate under motor (1) drives, and completes spin processes;
Control motor (1) by touch screen control panel (11) after step 4, spin processes complete and be decelerated to stopping, close the first vavuum pump by-pass cock (15) and take out holographic grating substrate (19) afterwards, open the second vavuum pump by-pass cock (4), photoresist raffinate in raffinate groove (13) is collected into raffinate gathering-device (21) under the vacuum adsorption force effect of vavuum pump (12), encapsulates for subsequent use after drying and processing is carried out in holographic grating substrate (19).
8. even gluing method according to claim 7, is characterized in that, in step 3, the wind speed of described air pump group (8) is 0.4m/s.
9. even gluing method according to claim 7, is characterized in that, in step 3, the wind speed of described air pump group (8) is 0.6m/s.
10. even gluing method according to claim 7, it is characterized in that, the even glue program by controlling in touch screen control panel (11) setting computer is needed according to technique, namely set the rotating speed of motor (1), the wind speed of air pump group (8), the vacuum adsorption force of vavuum pump (12), complete spin processes.
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| CN201510415328.4A CN105057163A (en) | 2015-07-15 | 2015-07-15 | Spin coating device and method utilizing airflow for controlling thickness of photoresist film |
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| CN201510415328.4A CN105057163A (en) | 2015-07-15 | 2015-07-15 | Spin coating device and method utilizing airflow for controlling thickness of photoresist film |
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| CN107837983A (en) * | 2017-11-02 | 2018-03-27 | 南通大学 | It is a kind of that there is the electromagnetic levitation type glue spreader for quantitatively dripping glue |
| CN108682613A (en) * | 2018-03-29 | 2018-10-19 | 广东先导先进材料股份有限公司 | The processing method of semiconductor wafer |
| CN111842016A (en) * | 2020-06-22 | 2020-10-30 | 上海工程技术大学 | Rotary film coating device capable of recycling precursor solution |
| CN113289855A (en) * | 2021-06-21 | 2021-08-24 | 南通捷晶半导体技术有限公司 | Glue dispensing and homogenizing device |
| CN114682437A (en) * | 2020-12-31 | 2022-07-01 | 苏州卓兆点胶股份有限公司 | Multifunctional vacuum adhesive dispensing device |
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| CN108682613B (en) * | 2018-03-29 | 2021-02-26 | 广东先导先进材料股份有限公司 | Method for processing semiconductor wafer |
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Application publication date: 20151118 |