CN207254682U - A kind of sol evenning machine - Google Patents
A kind of sol evenning machine Download PDFInfo
- Publication number
- CN207254682U CN207254682U CN201721132855.5U CN201721132855U CN207254682U CN 207254682 U CN207254682 U CN 207254682U CN 201721132855 U CN201721132855 U CN 201721132855U CN 207254682 U CN207254682 U CN 207254682U
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- CN
- China
- Prior art keywords
- spin coating
- coating cavity
- housing
- sol evenning
- evenning machine
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of sol evenning machine, including housing（1）, the housing（1）Inside it is provided with spin coating chamber component（20）, the spin coating chamber combination（20）Including spin coating cavity（21）, spin coating cavity lid（23）And connecting rod（22）And cylinder, the spin coating cavity（21）It is fixed in housing, the spin coating cavity lid（23）With connecting rod（22）Connection, the connecting rod（22）It is connected with cylinder, spin coating cavity lid（23）Spin coating cavity is sealed under the driving of cylinder（21）Top or from spin coating cavity（21）Remove on top.Using the utility model, thyristor chip spin coating quality and efficiency are improved.
Description
Technical field
The present invention relates to a kind of sol evenning machine, particularly a kind of sol evenning machine of thyristor chip.
Background technology
Complex procedures of the photoetching process in whole semiconductor processes so that the stability of photoetching technique, reliable
Property and process yield are to the quality of product, yield rate and cost important.And the performance of sol evenning machine directly affects
The quality of subsequent handling and final graphics
At present, the spin coating process of sol evenning machine carries out in open space, after glue is dropped on thyristor chip, core
Piece starts to rotate, and glue is constantly come in chip vertical spread.During chip high speed rotation carries out spin coating, glue flies everywhere
To splash, often splash substantial amounts of glue point and collodion silk for the back side of chip, and the glue of these chip backs can influence follow-up photoetching process,
So as to be impacted to thyristor chip quality.
Utility model content
The purpose of this utility model provides a kind of sol evenning machine, makes thyristor chip spin coating more uniform, improves product matter
Amount.
Existing in the prior art to solve the problems, such as, the utility model provides a kind of sol evenning machine, which includes：Housing,
Be provided with spin coating chamber component in the housing, the spin coating chamber combination include spin coating cavity, spin coating cavity lid and connecting rod and
Cylinder, the spin coating cavity are fixed in housing, and the spin coating cavity lid is connected with connecting rod, and the connecting rod is connected with cylinder, even
Glue chamer body, which is covered, to be sealed spin coating cavity top under the driving of cylinder or is removed from spin coating cavity top.
The technical program seals spin coating cavity by spin coating cavity lid, and glue is splashed on spin coating cavity wall, rather than core
The back side of piece, improves the quality of chip.
In addition, the housing upper is provided with exhaust outlet, the exhaust outlet makes enclosure interior be connected with hull outside.Promote
Into the circulation of air, effectively with improving the effect of spin coating.
In addition, further including, glue component is dripped, the drop glue component includes drop sebific duct, plastic container is connected with drop sebific duct, with Sheng
The Pneumatic glue pump of glue container connection, the relay being connected with Pneumatic glue pump, the PLC controller being connected with relay, controls with PLC
The human-computer interaction interface that device is connected.Realize the process of automatic glue-dropping.
In addition, further including chip rotating mechanism, the chip rotating mechanism includes spin coating sucker, is connected with spin coating sucker
Connecting shaft, the driving motor with being connected axis connection.The high speed rotation of chip rotating mechanism is realized, improves spin coating quality.
The spin coating chamber component of the utility model is provided with spin coating cavity lid.Therefore during spin coating, spin coating cavity lid
Spin coating cavity top can be sealed.So the process of spin coating just carries out in the closed space in top, when turntable carries out high speed rotation
During rotating into row spin coating, glue can be splashed on spin coating cavity wall, will not be splashed to the back side of chip, be improved chip
Spin coating quality.
Brief description of the drawings
Fig. 1 is a kind of a kind of schematic diagram of embodiment of sol evenning machine of the utility model；
Fig. 2 is a kind of a kind of schematic diagram of embodiment of the drop glue component of sol evenning machine of the utility model.
In figure：
1. housing, 2. manual operation casees, 3. human-computer interaction interfaces, 4. power switches, 5. exhaust outlets, 10. drop glue groups
Part, 11. drop sebific ducts, 12. plastic containers, 13. Pneumatic glues pump, 14. relays, 15.PLC controllers, 20. spin coating chamber components, 21.
Spin coating cavity, 22. connecting rods, 23. spin coating cavity lids, 30. chip rotating mechanisms, 31. driving motors, 32. connecting shafts, 33. is even
Glue sucker, 34. vacuum interfaces, 35. thyristor chips.
Embodiment
The utility model is described in detail below in conjunction with the accompanying drawings.
With reference to figure 1, which is a kind of a kind of schematic diagram of embodiment of sol evenning machine of the utility model, which includes：
Housing 1, drop glue component 10, spin coating chamber component 20 and chip rotating mechanism 30, wherein rotating mechanism 30 are provided with housing 1 and is used
In adsorbing and thyristor chip is rotated at a high speed, rotating mechanism is stretched into spin coating chamber component, makes the process of whole spin coating in spin coating
Carried out in chamber.
As shown in Fig. 2, drop glue component 10, including drop sebific duct 11, plastic container 12 is connected with drop sebific duct, with plastic container 12
The Pneumatic glue pump 13 of connection, the relay 14 being connected with Pneumatic glue pump 13, the PLC controller 15 being connected with relay 14, and
The human-computer interaction interface 3 being connected with PLC controller.User can set drop glue amount and rotation parameter by human-computer interaction interface,
So as to fulfill the control of diagonal film thickness.The stroke that glue can be controlled to pump by PLC control unit, and then control the given of glue
Amount, and require the different glue given amounts of setting according to different chips.
Spin coating chamber component 20, including spin coating cavity 21, spin coating cavity lid 23 and connecting rod 22 and cylinder（Not shown in figure）.
Wherein spin coating cavity lid is connected with connecting rod, and connecting rod is connected with cylinder, and under the driving of cylinder, connecting rod drives spin coating cavity lid to move
It is dynamic, so that spin coating cavity lid seals spin coating cavity top or spin coating cavity lid is removed from spin coating cavity top.
Chip rotating mechanism 30, including driving motor 31, connecting shaft 32, spin coating sucker 33, wherein spin coating sucker 33 are used for
Thyristor chip 35 is adsorbed, spin coating sucker 33 is connected with connecting shaft 32, and connecting shaft 32 is connected with driving motor 31.Spin coating sucker 33
It can be vacuum spin coating sucker, further include the vacuum interface 34 being connected with connecting shaft at this time, vacuum interface 34 is with vacuum pump (in figure
It is not shown) connection.The rotating speed of the driving motor of the rotating mechanism, user can manually control box 2 be set, can also
Set in man-machine interface.The functions such as start button, motor speed setting button can be set to press in manual operation case 2
Key.
In addition, housing can also set total power switch 4 and exhaust outlet 5.It can be powered on by power switch 4.
Exhaust outlet makes the contact air outside air and sol evenning machine in sol evenning machine, so as to play the role of ventilation and heat, improves even
Glue effect.
During specific implementation, chip is placed on spin coating sucker with Simple clamp, it is quantitative to send signal control glue pump by PLC
To glue.During glue is dripped, spin coating cavity top is in open state, i.e., spin coating cavity drowning has sealing spin coating cavity top.
After the completion of dripping glue, spin coating cavity lid sealing spin coating cavity, suction piece sucker high speed rotation allows on glue uniform fold chip, by setting
Drip glue amount and spin speed profile control film thickness.Drip glue amount number and spin speed profile, user can be by man-machine
Interactive interface is defined.PLC control unit is controlled the process of spin coating according to the parameter of setting.
The spin coating system and the contrast of conventional open spin coating system employ closing spin coating cavity, change and rotate at a high speed
Chip circumference air draught to the direction of extrusion of glued membrane, substantially improve chip back and splash glue problem, improve chip face
On glued membrane uniformity.
The utility model is capped spin coating lid to seal spin coating cavity, while interior plus exhaust outlet during spin coating, improves
Film thickness uniformity and glued membrane quality.
The above is the preferred embodiment of the utility model, it is noted that for the ordinary skill of the art
For personnel, on the premise of the utility model principle is not departed from, some improvements and modifications can also be made, these are improved and profit
Decorations are also considered as the scope of protection of the utility model.
Claims (5)
1. a kind of sol evenning machine, including housing（1）, it is characterised in that the housing（1）Inside it is provided with spin coating chamber component（20）, institute
State spin coating chamber combination（20）Including spin coating cavity（21）, spin coating cavity lid（23）And connecting rod（22）And cylinder, the spin coating
Cavity（21）It is fixed in housing, the spin coating cavity lid（23）With connecting rod（22）Connection, the connecting rod（22）It is connected with cylinder,
Spin coating cavity lid（23）Spin coating cavity is sealed under the driving of cylinder（21）Top or from spin coating cavity（21）Remove on top.
2. sol evenning machine according to claim 1, it is characterised in that the housing（1）Top is provided with exhaust outlet（5）, institute
State exhaust outlet（5）Enclosure interior is set to be connected with hull outside.
3. sol evenning machine according to claim 1, it is characterised in that further include, drip glue component（10）, the drop Jiao Zujianbao
Include drop sebific duct（11）, with dripping sebific duct（11）Connect plastic container（12）, with plastic container（12）The Pneumatic glue pump of connection（13）, with
Pneumatic glue pumps（13）Connected relay（14）, with relay（14）Connected PLC controller（15）, with PLC controller（15）
Connected human-computer interaction interface（3）.
4. sol evenning machine according to claim 1, it is characterised in that further include chip rotating mechanism（30）, the chip rotation
Rotation mechanism（30）Including spin coating sucker（33）, with spin coating sucker（33）The connecting shaft of connection（32）, with connecting shaft（32）Connection
Drive motor.
5. sol evenning machine according to claim 1, it is characterised in that be additionally provided with start button on the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721132855.5U CN207254682U (en) | 2017-09-05 | 2017-09-05 | A kind of sol evenning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721132855.5U CN207254682U (en) | 2017-09-05 | 2017-09-05 | A kind of sol evenning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207254682U true CN207254682U (en) | 2018-04-20 |
Family
ID=61923644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721132855.5U Active CN207254682U (en) | 2017-09-05 | 2017-09-05 | A kind of sol evenning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207254682U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109604100A (en) * | 2018-08-17 | 2019-04-12 | 丹玥光学(上海)有限公司 | One kind is in resin lens surface uniform coating and cured device and working method |
| CN110385238A (en) * | 2019-08-16 | 2019-10-29 | 吉林华微电子股份有限公司 | Sol evenning machine remodeling method |
| CN113426637A (en) * | 2021-08-30 | 2021-09-24 | 江苏晟驰微电子有限公司 | Constant-temperature spin coater for manufacturing power chips |
-
2017
- 2017-09-05 CN CN201721132855.5U patent/CN207254682U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109604100A (en) * | 2018-08-17 | 2019-04-12 | 丹玥光学(上海)有限公司 | One kind is in resin lens surface uniform coating and cured device and working method |
| CN110385238A (en) * | 2019-08-16 | 2019-10-29 | 吉林华微电子股份有限公司 | Sol evenning machine remodeling method |
| CN113426637A (en) * | 2021-08-30 | 2021-09-24 | 江苏晟驰微电子有限公司 | Constant-temperature spin coater for manufacturing power chips |
| CN113426637B (en) * | 2021-08-30 | 2021-11-12 | 江苏晟驰微电子有限公司 | Constant-temperature spin coater for manufacturing power chips |
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