CN105045455A - Metal grid transparent conducting film, preparation method thereof and capacitive touch screen - Google Patents
Metal grid transparent conducting film, preparation method thereof and capacitive touch screen Download PDFInfo
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Abstract
The invention provides a metal grid transparent conducting film, a preparation method thereof and a capacitive touch screen. The preparation method of the metal grid transparent conducting film includes the steps that S1, insulating layers are formed on the surface of a transparent base material layer; S2, the insulating layers are etched, so that grooves are formed; S3, conducting layers are arranged in the grooves, and accordingly the metal grid transparent conducting film is formed. The metal grid transparent conducting film prepared through the method is even in line width, and the micron grade and even hundreds-of-nanometer grade can be achieved. The preparation method is suitable for mass production of metal grid transparent conducting films, and the yield of the metal grid transparent conducting films can be increased.
Description
Technical field
The application relates to technical field nesa coating field, in particular to a kind of metal grill nesa coating, its preparation method and capacitive touch screen.
Background technology
As the alternative improved products of ITO (IndiumTinOxide, tin-doped indium oxide) film, the exploitation that metal grill electrically conducting transparent is thin is risen gradually.
In prior art, the preparation method of metal grill nesa coating has two kinds: the first utilizes silver, metal material or the oxides etc. such as copper are easy to obtain and the raw material of cheap conductive layer, the plastic films such as PET are suppressed the metal grill pattern of formation, then the raw material of conductive layer is filled in metal grill pattern, forms metal grill nesa coating; The second prepares conductive layer, and then etching conductive layer (usually adopting gold-tinted etching or laser ablation), forms wire netting form transparent conductive film.
The width that two kinds of above-mentioned preparation technologies are difficult to make metal wire has several microns, the metal grill nesa coating of even hundreds of Nano grade, the width of the metal wire of the metal grill nesa coating made is general wider, more than 30 μm, what have even reaches 100 μm, and the width of metal wire is uneven, the width of metal wire is less, and non-uniform phenomenon is more serious.
The reason of the above results is caused to have a lot, such as in the second preparation method, reason is: conductive layer principal ingredient is opaque metal and oxide thereof mostly, or transparent metal and the particle of oxide thereof, fiber, or organic conductive macromolecule etc. formed, if etching adopts gold-tinted etching, can because the reflection of composition and at random in conductive layer, or the impact of the factors such as etching agent concentration and etching extent control, cause the width of the rear metal wire of etching uneven, be less than in the product of below 50 μm of microns at the width of metal wire, this phenomenon is especially serious.When keeping higher yield, the width of metal wire is in micron number magnitude, and product has high visual realizing with this target of rate of good quality rate is very difficult in traditional gold-tinted etch process.
If what etching adopted is laser-induced thermal etching processing procedure, then because of the influence factor such as at random, absorption, heat transfer, the width of metal wire can be caused to be less than the uneven of the width of the metal wire of the product of less than 50 μm, to affect the touch-control performance of final products.And the efficiency of laser-induced thermal etching is not high, improve the preparation cost of product.
If all in micron level, individual cases are issued to Nano grade to the width of metal wire (thinner, visuality is better), then can the visuality of significantly improving product.But metal wire is thinner, make Product processing become more difficult, often there will be the short circuit between broken string or metal wire occurred because the printing processing of metallic circuit is bad and cause product touch-control bad, reduce the yield of product.
Summary of the invention
The application aims to provide a kind of metal grill nesa coating, its preparation method and capacitive touch screen, volume production can not obtain live width in micron order, number nanoscale and the problem of the more uniform metal grill nesa coating of live width to solve in prior art.
To achieve these goals, according to an aspect of the application, provide a kind of metal grill nesa coating, the preparation method of this metal grill nesa coating comprises: step S1, forms insulation course on the surface of transparent substrate layer; Step S2, etches above-mentioned insulation course, forms groove; And step S3, conductive layer is set in above-mentioned groove, forms metal grill nesa coating.
Further, above-mentioned steps S1 comprises: step S11, arranges insulation photoresists water layer on the surface of transparent substrate layer; And step S12, above-mentioned insulation photoresists water layer is exposed, forms above-mentioned insulation course.
Further, above-mentioned steps S11 comprises: step S111, arranges the shadow shield with predetermined pattern on the surface of above-mentioned insulation photoresists water layer; And step S112, the above-mentioned insulation photoresists water layer being provided with above-mentioned shadow shield is exposed, forms above-mentioned insulation course.
Further, above-mentioned shadow shield is the hollow out shadow shield with above-mentioned predetermined pattern.
Further, in above-mentioned hollow out shadow shield, the live width of non-openwork part is between 0.1 ~ 100 μm, preferably between 1 ~ 50 μm; The live width of openwork part at 2 ~ 5000 μm, preferably between 20 ~ 3000 μm.
Further, above-mentioned steps S3 comprises: step S31, in above-mentioned groove, arrange conductive layer, and above-mentioned conductive layer extends to the surface of above-mentioned insulation course simultaneously; Step S32, carries out surface planarisation to above-mentioned conductive layer, forms metal grill nesa coating.
Further, before above-mentioned steps S1, above-mentioned preparation method also comprises: carry out heat-resisting lower shrinkage process to above-mentioned transparent substrate layer.
Further, the wavelength for the light wave implementing above-mentioned exposure is less than 380nm, and the thickness of above-mentioned insulation course is between 1 ~ 100 μm, preferably between 5 ~ 30 μm.
Further, above-mentioned conductive layer is transparent organic conductive macromolecule compound layer, inorganic metal oxide, opaque organic conductive compound layer, metal level or metal oxide layer.
Further, above-mentioned transparent substrate layer comprises the former film of transparent base, and the full light transmission rate of the former film of above-mentioned transparent base is greater than 85%, the thickness of the former film of above-mentioned transparent base between 10 ~ 500 μm, preferably between 20 ~ 200 μm.
Further, in above-mentioned metal grill nesa coating the thickness of conductive layer between 1 ~ 120 μm.
To achieve these goals, according to another aspect of the application, provide a kind of metal grill nesa coating, preparation method's formation that this employing is above-mentioned.
To achieve these goals, according to another aspect of the application, provide a kind of capacitive touch screen, above-mentioned capacitive touch screen comprises metal grill nesa coating, and above-mentioned metal grill nesa coating adopts above-mentioned preparation method to be formed.
The preparation method of application the application, first insulation course is set on the surface of transparent substrate layer, then it is etched, form groove, the material of insulation course is generally photosensitive glue, trickle structure is more easily formed, so the live width of groove formed insulation course etching is at micron order, even can arrive hundreds of Nano grade compared to the material of conductive layer.Further, because the impact of material on etching of insulation course is less, do not exist at random with reflection etc. phenomenon, etch the live width of the groove obtained comparatively evenly, and then obtain the more uniform metal grill nesa coating of live width.The visuality of the metal grill nesa coating adopting the method to prepare is better, can be applied in touch-screen better, and the method can be applied in the volume production of touch-control product, and then promotes the application of metal grill nesa coating better.
Accompanying drawing explanation
The Figure of description forming a application's part is used to provide further understanding of the present application, and the schematic description and description of the application, for explaining the application, does not form the improper restriction to the application.In the accompanying drawings:
Fig. 1 shows the schematic flow sheet of the preparation method of the metal grill nesa coating that a kind of exemplary embodiment of the application proposes;
The surface in transparent substrate layer that Fig. 2 shows a kind of preferred embodiment to be provided forms the cross-sectional view after insulation course;
Fig. 3 shows the diagrammatic cross-section of the structure insulation course shown in Fig. 2 being etched to rear formation;
The diagrammatic cross-section of the structure that Fig. 4 a is formed after showing and arrange conductive layer in the groove shown in Fig. 3;
Fig. 4 b shows the structural profile schematic diagram of the metal grill nesa coating provided in a kind of embodiment;
The diagrammatic cross-section of the structure that Fig. 5 is formed after showing and arrange shadow shield on the surface of insulation photoresists water layer;
Fig. 6 shows the cross-sectional view of the transparency conducting layer that a kind of embodiment provides; And
Fig. 7 shows the cross-sectional view of the transparency conducting layer that another kind of embodiment provides.
Embodiment
It is noted that following detailed description is all exemplary, be intended to provide further instruction to the application.Unless otherwise, all technology used herein and scientific terminology have the identical meanings usually understood with the application person of an ordinary skill in the technical field.
It should be noted that used term is only to describe embodiment here, and be not intended to the illustrative embodiments of restricted root according to the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative is also intended to comprise plural form, in addition, it is to be further understood that, " comprise " when using term in this manual and/or " comprising " time, it indicates existing characteristics, step, operation, device, assembly and/or their combination.
Introduce as background technology, the method preparing metal grill nesa coating of the prior art is difficult to prepare metal line-width at micron and other metal grill nesa coating of hundred nano-scale, and the homogeneity preparing the metal wire of metal grill nesa coating is poor, in order to solve technical matters as above, present applicant proposes a kind of preparation method of metal grill nesa coating.
In a kind of typical embodiment of the application, as shown in Figure 1, propose a kind of preparation method of metal grill nesa coating, the method comprises: step S1, forms insulation course 30, as shown in Figure 2 on the surface of transparent substrate layer 10; Step S2, etches the insulation course 30 in Fig. 2, forms groove 31, as shown in Figure 3; And step S3, conductive layer 50 is set in above-mentioned groove 31, forms the metal grill nesa coating shown in Fig. 4 b.
In the method, first insulation course 30 is set on the surface of transparent substrate layer 10, then it is etched, form groove 31, the material of insulation course 30 is generally photosensitive glue, trickle structure is more easily formed, so etch the live width of groove 31 that formed at micron order, even hundreds of Nano grade can be arrived to insulation course 30 compared to the material of conductive layer 50.Further, because the impact of material on etching of insulation course 30 is less, do not exist at random with reflection etc. phenomenon, etch the live width of the groove 31 obtained comparatively evenly, and then obtain the more uniform metal grill nesa coating of live width.The visuality of the metal grill nesa coating adopting the method to prepare is better, can be applied in touch-screen better, and the method can be applied in the volume production of touch-control product, and then promotes the application of metal grill nesa coating better.
In order to reduce the impact of the material of insulation course 30 on etching own further, and then obtain the narrower and uniform metal grill nesa coating of live width of live width, the preferred above-mentioned steps S1 of the application comprises: step S11, arranges insulation photoresists water layer 20 on the surface of transparent substrate layer 10; And step S12, above-mentioned insulation photoresists water layer 20 is exposed, insulation photoresists water layer 20 is hardened, forms insulation course 30.
In another preferred embodiment of the application, above-mentioned steps S11 comprises: step S111, arranges the shadow shield 40 with predetermined pattern, as shown in Figure 5 on the surface of above-mentioned insulation photoresists water layer 20; And step S112, the above-mentioned insulation photoresists water layer 20 being provided with above-mentioned shadow shield 40 is exposed, be blocked the part that plate 40 blocks in insulation photoresists water layer 20 can not harden, and be not blocked the part that plate 40 blocks and harden, forming section sclerosis, the insulation course 30 that do not harden of part, and in follow-up etching process, not have the part of sclerosis to be etched removal, and the part of sclerosis can not be etched removals, the part of etching removal defines the groove 31 shown in Fig. 3.
In order to make the insulation photoresists water layer 20 partly fully sclerosis further that is not blocked, and then in subsequent etching process, further guarantee its be not removed, and then guarantee further to form predetermined groove 31, the preferred shadow shield of the application 40 is for having the hollow out shadow shield of above-mentioned predetermined pattern.
In the application in another kind of preferred embodiment, in above-mentioned hollow out shadow shield, the live width of non-openwork part 41 is between 0.1 ~ 100 μm, preferably between 1 ~ 50 μm; The live width of openwork part is at 2 ~ 5000 μm, preferably between 20 ~ 3000 μm, the live width of the corresponding metal grill of live width of non-openwork part 41, that is, adopt such shadow shield 40 can guarantee further to form live width at 0.1 ~ 100 μm, or even the metal grill nesa coating between 1 ~ 50 μm.The live width of non-openwork part 41, between 0.1 ~ 100 μm, can ensure the realizability of technique further, and ensures to have lower impedance at metal grill nesa coating, also assures that metal grill nesa coating has good visuality simultaneously.
In order to ensure to fill up conductive material in groove 31 further, in the preferred above-mentioned steps S3 of the application, first conductive layer 50 is set in the groove 31 shown in Fig. 3, and makes above-mentioned conductive layer 50 extend to the surface of above-mentioned insulation course 30 simultaneously, as shown in fig. 4 a; Then, surface planarisation is carried out to above-mentioned conductive layer 50, remove the conductive material on insulation course 30 surface, form the metal grill nesa coating shown in Fig. 4 b.
In one embodiment, during planarization, after removing the conductive material on insulation course 30 surface, planarization can be continued and removes insulation course 30 and conductive layer 50 simultaneously.The thickness of such as insulation course 30 is 10 μm, and the thickness of conductive layer 50 is 12 μm, when planarization, grinds off the conductive layer 50 of 3 μm and the insulation course 30 of 12 μm, and the final like this thickness that obtains is all the insulation course 30 of 9 μm and conductive layer 50.The insulation course 30 grinding off 1 μm can ensure the function of insulation course 30 further, and then ensures that conductive layer 50 can not produce electrical connection in groove 31 other parts outer further.
In order to make transparent substrate layer 10, there is low-shrinkage, and then prevent further in aftertreatment technology because etching lines shrinks the generation of the excessive etched pattern position mismatch problem caused, the preferred above-mentioned preparation method of the application also comprises: carry out heat-resisting lower shrinkage process to above-mentioned transparent substrate layer 10, percent thermal shrinkage after general process is TD (TransverseDirection, longitudinally) <0.1%, MD (MechineDirection, laterally) <0.5%.
In another preferred embodiment of the application, wavelength for the light wave implementing above-mentioned exposure is less than 380nm, containing unsatisfied chemical bond in insulation photoresists water layer 20, the light-wave energy being less than 380nm at wavelength is larger, there is good polyreaction in the photosensitive glue that can make to insulate, and then further ensures the formation of predetermined pattern.
In the another kind of preferred embodiment of the application, the thickness of above-mentioned insulation course 30 between 1 ~ 100 μm, preferably between 5 ~ 30 μm.Insulation course 30 is excessively thin, can cause the conducting resinl hypovolia of recess, causes impedance comparatively large, meanwhile, can not ensure the hardness of cured section well, and then can not ensure that follow-up technique is carried out smoothly better.Insulation course 30 is too thick, then insulation photosensitive glue filling process can be made longer, and production efficiency reduces, and, add firm time and the sclerosis difficulty of the photosensitive glue that insulate, cause production cost significantly to rise.
In the another kind of embodiment of the application, above-mentioned conductive layer 50 is transparent organic conductive macromolecule compound layer, inorganic metal oxide, opaque organic conductive compound layer, metal level or metal oxide layer.Those skilled in the art can select suitable conductive layer 50 as the case may be.
In another embodiment of the application, above-mentioned transparent substrate layer 10 comprises the former film of transparent base, and the full light transmission rate of the former film of above-mentioned transparent base is greater than 85%, the thickness of the former film of above-mentioned transparent base between 10 ~ 500 μm, preferably between 20 ~ 200 μm.
The former film of transparent base, refers to transparent plastic film that each manufacturer produces, such as PET, TAC, COP, PMMA or PC etc.Be not limited only to above-mentioned citing.The full light transmission rate of the former film of transparent base is greater than 85%, can ensure that product has good light transmittance further, and then guarantee the demand meeting client further.
The thickness of the former film of transparent base is greater than 10 μm, and existing production technology is easier to prepare, and thickness is less than 500 μm, this film rolling is easier to, and cost is lower.In order to ensure that the cost of this film is lower, rolling is easier to further, can availability higher, the thickness of the former film of preferably clear base material is between 20 ~ 200 μm.
In the another kind of embodiment of the application, above-mentioned transparent substrate layer 10 also comprises transparent sclerosis protective seam, as shown in Figure 6, sclerosis protective seam can be set in the upper and lower surface of transparent base former film 11 simultaneously, be respectively the first sclerosis protective seam 13 and second and to harden protective seam 15; Sclerosis protective seam also only can be set on a surface, as shown in Figure 7, only the second sclerosis protective seam 15 be set at the upper surface of the former film 11 of transparent base.
For the balance to product cost, the pencil hardness of sclerosis protective seam, between 3B ~ 4H, preferably between B ~ 3H, meanwhile, within the scope of this pencil hardness, can ensure to form good predetermined pattern further.The thickness of sclerosis protective seam is at 0.3 μm ~ 10 μm, and preferably between 0.5 μm ~ 3 μm, the thickness of sclerosis protective seam, within the scope of this, can ensure its hardness further, also can ensure that it has lower cost further.
In another embodiment of the application, in above-mentioned metal grill nesa coating, the thickness of conductive layer 50 is between 1 ~ 120 μm.The thickness of this conductive layer 50 is identical with the thickness of insulation course 30 (if when the conductive layer 50 arranged extends to the situation on the surface of above-mentioned insulation course 30, then the thickness of the conductive layer 50 of planarization should be identical with the thickness of insulation course 30), during by the THICKNESS CONTROL of conductive layer 50 within the scope of this, the realizability of technique can be ensured further, the cost of metal grill nesa coating is lower, and impedance is lower.
In the typical embodiment of another kind of the application, provide a kind of metal grill nesa coating, this metal grill nesa coating adopts above-mentioned preparation method to obtain.
The live width of the metal grill of this metal grill nesa coating is less, and homogeneity is better, makes it better visual.
In the typical embodiment of another kind of the application, provide a kind of capacitive touch screen, this capacitive touch screen comprises metal grill nesa coating, and this metal grill nesa coating adopts above-mentioned preparation method to obtain.
Metal grill nesa coating in this capacitive touch screen adopts above-mentioned preparation method to obtain, and makes the live width of metal grill less, and homogeneity is better, makes the visuality of touch-screen better
In order to the technical scheme making those skilled in the art can understand the application better, be described in detail below with reference to embodiment and comparative example.
Embodiment 1
First, at the PCZ001 glue that the thickness shown in Fig. 7 is DIC company of wet coating Japan on 1.5 μm of second sclerosis protective seam 15, obtain the insulation photoresists water layer that build is 10 μm, after the high-pressure mercury-vapor lamp adopting surface to add hollow out shadow shield exposes it, wherein, the width 5 μm of non-openwork part in hollow out shadow shield, the width of openwork part is 100 μm, exposure is 800mJ/cm2, be not blocked the part that plate blocks in such insulation photoresists water layer to harden, and be blocked the part that plate blocks and harden, and then formation insulation course, the thickness of cured section is 10 μm.
Then, adopt solvent MIBK (MethylIsobutylKetone, the methylisobutylketone) structure to insulation course to carry out wet etching, remove the insulation photoresists water layer not occurring to harden, form groove and dry.
Finally, silver coating slurry on the surface of structure of removing unhardened glue, after the heat hardening of silver slurry, obtain conductive layer, its thickness is 12 μm.Then this conductive layer is carried out physical grinding, after grinding off 3 μm, obtain metal grill nesa coating.
Embodiment 2
First; be the PCZ001 glue 1.5 μm of second sclerosis protective seam 15 being arranged Japanese DIC company at the thickness shown in Fig. 7; obtain the insulation photoresists water layer that build is 10 μm; after the high-pressure mercury-vapor lamp adopting surface to add hollow out shadow shield exposes it; wherein; the width 5 μm of non-openwork part in hollow out shadow shield, the width of openwork part is 100 μm, and exposure is 800mJ/cm
2, be not blocked the partially hardened that plate covers in the photoresists water layer of making to insulate, the part of blocking is unhardened, and then forms insulation course, and the thickness of cured section is 10 μm.
Then, adopt the structure of solvent MIBK to above-mentioned formation insulation course to carry out wet etching, remove unhardened glue, form groove and dry.
Finally, the surface of structure of removing unhardened glue is coated with copper slurry, after the heat hardening of copper slurry, obtain conductive layer, its thickness is 12 μm.Then this conductive layer is carried out chemical grinding, after grinding off 3 μm, obtain transparent conductive film.
Embodiment 3
First; be the PCZ001 glue 1.5 μm of second sclerosis protective seam 15 being arranged Japanese DIC company at the thickness shown in Fig. 7; obtain the insulation photoresists water layer that build is 10 μm; after the high-pressure mercury-vapor lamp adopting surface to add hollow out shadow shield exposes it; wherein; the width 5 μm of non-openwork part in hollow out shadow shield, the width of openwork part is 100 μm, and exposure is 800mJ/cm
2, the photoresists water layer of making to insulate is not blocked the partially hardened that plate covers, and the part of blocking is unhardened, and then forms insulation course, and the thickness of cured section is 10 μm.
Then, adopt the structure of solvent MIBK to above-mentioned formation insulation course to carry out wet etching, remove above-mentioned unhardened glue, form groove and dry.
Finally, the surface of structure of removing unhardened glue is coated with transparent nano silver fibre coating, and after heat hardening, obtain conductive layer, its thickness is 12 μm.Then this conductive layer is carried out physical grinding, after grinding off 3 μm, obtain transparent conductive film.
Comparative example 1
First, be 1.5 μm second at the thickness shown in Fig. 7 and harden on protective seam 15, utilize magnetron sputtering technique to carry out plated film, (material is Nb to film forming height diopter layer successively
2o
5, refractive index nD=2.20, thickness is 50nm), (material is SiO to low diopter layer
2, refractive index nD=1.45, thickness is 80nm) and crystallinity ITO layer (Sn content is 5%, and thickness is 21nm).
Etch above-mentioned ITO layer by gold-tinted processing procedure, then through 150 DEG C, after 60min baking, obtain nesa coating.
Comparative example 2
First; being 1.5 μm second at the thickness shown in Fig. 7 hardens on protective seam 15; utilize the method for wet coating obtain thickness be 10 μm silver slurry conductive layer; the high-pressure mercury-vapor lamp adopting surface to add hollow out shadow shield exposes it; wherein; the width 5 μm of openwork part in hollow out shadow shield, the width of non-openwork part is 100 μm, and exposure is 1500mJ/cm
2, there is not the change of character in silver slurry conductive layer is blocked part that plate covers, the change of the part generation character of not blocking.
Then, adopt the structure of solvent MIBK to above-mentioned formation conductive layer to carry out wet etching, remove above-mentioned conductive layer character not occurring and changes, form groove and dry.
Finally, be coated with the PCZ001 glue of Japanese DIC company, heating, (exposure is 400mJ/cm to UV
2) after sclerosis, its thickness is 18 μm, obtains transparent conductive film.
Comparative example 3
First, the thickness shown in Fig. 7 be 1.5 μm second sclerosis protective seam 15 on, utilize the method for wet coating obtain thickness be 10 μm silver slurry conductive layer, by after high-pressure mercury-vapor lamp exposure curing, (exposure is 1500mJ/cm
2), utilize gold-tinted processing procedure to etch current-carrying part live width 5 μm, after the pattern that non-conducting portion live width is 100 μm
Finally, then be coated with the PCZ001 of Japanese DIC company, heating, (exposure is 400mJ/cm to UV
2) after sclerosis, its thickness is 18 μm, obtains transparent conductive film.
Employing standard 4 pin method of testing tests the impedance of the nesa coating in above-described embodiment and comparative example.
Sample in each embodiment is cut into 15cm (MD direction) × 5cm (TD direction), outwardly, elongatedness direction, by paint film bending test device (model: QYT-32 for film forming face; Producer: Tianjin Jingke) carry out bending test, visually under major light determine whether be full of cracks, and draw the minimum line rod diameter not chapping and occur.
The surface of the sample in each embodiment and the generation of section with or without broken string, line, deformation and the size of incidence (comprising broken string, line, deformation) is observed with SEM, incidence is expressed as A between 0 ~ 5%, incidence is B between 5 ~ 20%, and incidence is C more than 20%.
The full light transmission rate of each embodiment is measured with Japan's electric look NDH-2000 analyzer.
The sample observing each embodiment under adopting three wavelength light carries out visuality test, and visual range is about 50cm, and different angles observe the sample in each embodiment, and the sample that substantially can't see layout is zero; Indistinctly see that the sample of layout is.Visual range is about 1m, and different angles observe sample, can see that the sample of layout is △.Test result is in table 1.Test result is in table 1.
Table 1
As can be seen from Table 1, the impedance that employing the application prepares metal grill nesa coating is lower, better visual, full light transmission rate is higher, and the photoresists water layer in each embodiment is based on organic gel water constituent, make the bendable folding endurance of sample better, be less than or equal to 20mm around curved bar diameter, and after etching, the integrality of pattern is better.
As can be seen from the above description, the application's the above embodiments achieve following technique effect:
1) in the preparation method of, the application, first insulation course is set on the surface of transparent substrate layer, then it is etched, form groove, the material of insulation course is generally photosensitive glue, trickle structure is more easily formed, so the live width of groove formed insulation course etching is at micron order, even can arrive hundreds of Nano grade compared to the material of conductive layer.Further, because the impact of material on etching of insulation course is less, do not exist at random with reflection etc. phenomenon, etch the live width of the groove obtained comparatively evenly, and then obtain the more uniform metal grill nesa coating of live width.The visuality of metal grill nesa coating adopting the method to prepare is better, can be applied in touch-screen better, and, to this method solve in prior art and volume production can not obtain the less and problem of more uniform metal grill transparent conductive body of live width.
2) live width of the metal grill of the metal grill nesa coating, in the application is less, and homogeneity is better, makes it better visual.
3) the metal grill nesa coating in the capacitive touch screen, in the application adopts above-mentioned preparation method to obtain, and makes the live width of metal grill less, and homogeneity is better, makes the visuality of touch-screen better.
The foregoing is only the preferred embodiment of the application, be not limited to the application, for a person skilled in the art, the application can have various modifications and variations.Within all spirit in the application and principle, any amendment done, equivalent replacement, improvement etc., within the protection domain that all should be included in the application.
Claims (13)
1. a preparation method for metal grill nesa coating, is characterized in that, described preparation method comprises:
Step S1, forms insulation course on the surface of transparent substrate layer;
Step S2, etches described insulation course, forms groove; And
Step S3, arranges conductive layer in described groove, forms metal grill nesa coating.
2. preparation method according to claim 1, is characterized in that, described step S1 comprises:
Step S11, arranges insulation photoresists water layer on the surface of transparent substrate layer; And
Step S12, exposes described insulation photoresists water layer, forms described insulation course.
3. preparation method according to claim 2, is characterized in that, described step S11 comprises:
Step S111, arranges the shadow shield with predetermined pattern on the surface of described insulation photoresists water layer; And
Step S112, exposes the described insulation photoresists water layer being provided with described shadow shield, forms described insulation course.
4. preparation method according to claim 3, is characterized in that, described shadow shield is the hollow out shadow shield with described predetermined pattern.
5. preparation method according to claim 4, is characterized in that, in described hollow out shadow shield, the live width of non-openwork part is between 0.1 ~ 100 μm, preferably between 1 ~ 50 μm; The live width of openwork part at 2 ~ 5000 μm, preferably between 20 ~ 3000 μm.
6. preparation method according to any one of claim 1 to 5, is characterized in that, described step S3 comprises:
Step S31, arranges conductive layer in described groove, and described conductive layer extends to the surface of described insulation course simultaneously; And
Step S32, carries out surface planarisation to described conductive layer, forms metal grill nesa coating.
7. preparation method according to claim 1, is characterized in that, before described step S1, described preparation method also comprises: carry out heat-resisting lower shrinkage process to described transparent substrate layer.
8. the preparation method according to any one of claim 2 to 5, is characterized in that, the wavelength for the light wave implementing described exposure is less than 380nm, and the thickness of described insulation course is between 1 ~ 100 μm, preferably between 5 ~ 30 μm.
9. preparation method according to any one of claim 1 to 5, is characterized in that, described conductive layer is transparent organic conductive macromolecule compound layer, inorganic metal oxide, opaque organic conductive compound layer, metal level or metal oxide layer.
10. preparation method according to any one of claim 1 to 5, it is characterized in that, described transparent substrate layer comprises the former film of transparent base, the full light transmission rate of the former film of described transparent base is greater than 85%, the thickness of the former film of described transparent base between 10 ~ 500 μm, preferably between 20 ~ 200 μm.
11. preparation methods according to any one of claim 1 to 5, is characterized in that, in described metal grill nesa coating, the thickness of conductive layer is between 1 ~ 120 μm.
12. 1 kinds of metal grill nesa coatings, is characterized in that, described metal grill nesa coating adopts the preparation method according to any one of claim 1 ~ 11 to be formed.
13. 1 kinds of capacitive touch screens, described capacitive touch screen comprises metal grill nesa coating, it is characterized in that, described metal grill nesa coating adopts the preparation method according to any one of claim 1 ~ 11 to be formed.
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| CN109065757A (en) * | 2018-08-07 | 2018-12-21 | 中国乐凯集团有限公司 | Substrate and illuminating device for OLED illuminating device |
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