Summary of the invention
The invention provides a kind of conducting film and touch-screen, solve the technical matters that electric conductivity caused by existing break line treatment is poor.
The invention provides a kind of conducting film, comprising:
Transparency carrier, be located at the conductive layer on described transparency carrier, described conductive layer forms by organizing conductive pattern more, often organize the conductive grid that conductive pattern comprises multiple series connection mutually in a first direction, and have at least in interconnective many group conductive patterns the conductive grid of series connection mutually described in one group of conductive pattern and the conductive grid of mutually connecting described in adjacent sets in a second direction mutual dislocation be separated, make two groups of adjacent conductive pattern mutually insulateds, described first direction is mutually vertical with described second direction.
Conducting film as above, preferably, also comprises:
Impression glue-line, described impression glue-line is arranged on described transparency carrier, and described conductive layer embeds in described impression glue-line and the thickness of described conductive layer is not more than described impression glue-line for embedding the degree of depth of the groove of described impression glue-line.
Conducting film as above, preferably, described impression film surface impression has latticed groove, and be filled with conductive material in described groove and form conductive thread, the mutual cross connection of described conductive thread forms described conductive grid.
Conducting film as above, preferably, the width of described conductive thread is 0.2 μm-10 μm, and the thickness of described conductive thread is 0.1 μm-10 μm.
Conducting film as above, preferably, the distance in described conductive grid between adjacent node is 10 μm-800 μm.
Conducting film as above, preferably, described conductive material comprises:
There is at least one in the potpourri of the gold, silver of electricity connection function, copper, aluminium or zinc and organic binder bond or following material: gold, silver, copper, aluminum and zinc.
Conducting film as above, preferably, described transparent base comprises any one in following base material: glass, polymetylmethacrylate, polyethylene terephtalate, cyclic olefin polymer COP, cycloolefin analog copolymer COC.
Conducting film as above, preferably, the thickness of described transparent base is 0.02mm-2.5mm.
Conducting film as above, preferably, described impression glue-line is heat-setting polymkeric substance or ultraviolet (UV) cure polymer, and the thickness of described impression glue-line is 1 μm-30 μm, and the thickness of described impression glue-line is greater than the thickness of described groove.
The invention provides a kind of touch-screen, at least comprise above-mentioned arbitrary described conducting film.
The invention provides conducting film and touch-screen, by arranging conductive layer on described transparency carrier, described conductive layer forms by organizing conductive pattern more, often organize the conductive grid that conductive pattern comprises multiple series connection mutually in a first direction, and have at least in interconnective many group conductive patterns the conductive grid of series connection mutually described in one group of conductive pattern and the conductive grid of mutually connecting described in adjacent sets in a second direction mutual dislocation be separated, make two groups of adjacent conductive pattern mutually insulateds, achieve and obtain separate conductive electrode with the complete conductive grid structure of mutual dislocation, add effective nodes of conductive electrode, improve the electric conductivity of conductive electrode.
Embodiment
The conducting film that the present embodiment provides can be applied in touch-screen, can also be applied in some electronic equipments, Fig. 2 is the structural representation of conducting film of the present invention, the schematic diagram that Fig. 3 is the conductive grid of conductive layer in Fig. 2 when being rhombus, as Figure 2-3, conducting film comprises:
Transparency carrier 1, be located at the conductive layer 3 on transparency carrier 1, wherein, in the present embodiment, transparency carrier 1 can be glass, also can be polymethylmethacrylate (PolymethylMethacrylate, be called for short: PMMA), can also be polyethylene terephthalate (polyethylene terephthalate, be called for short: PET), can also be cyclic olefin polymer (Cyclo Olefin Polymers, COP) or cycloolefin analog copolymer (Cyclo Olefin Copoly-mers be called for short:, be called for short: COC), transparency carrier 1 is specifically according to selecting corresponding material in practical application, do not limited in the present embodiment.
In the present embodiment, conductive layer 3 forms by organizing conductive pattern more, often organize the conductive grid that conductive pattern comprises multiple series connection mutually in a first direction, have at least in interconnective many group conductive patterns the conductive grid of series connection mutually in one group of conductive pattern and the conductive grid of mutually connecting in adjacent sets in a second direction mutual dislocation be separated, make two groups of adjacent conductive pattern mutually insulateds, for example, in the present embodiment, organize conductive pattern in conductive layer more, and organize in conductive pattern more and mutual conductive grid of connecting in the conductive grid of series connection mutually and adjacent sets (can be a group in adjacent sets or two groups) can be had in one group of conductive pattern to misplace be separated, be still by grid interconnective between the conductive pattern of all the other groups, be separated when the conductive grid of mutually series connection in one group of conductive pattern misplaces with adjacent conductive grid of wherein mutually connecting in a group, then conductive layer 3 is just divided into independently two pieces of conductive layers, be separated when the conductive grid of mutually series connection in one group of conductive pattern all misplaces with the conductive grid of mutually connecting in adjacent two groups of conductive patterns, then conductive layer 3 is just divided into independently three pieces of conductive layers, mutual conductive grid of connecting in the conductive grid of series connection mutually and adjacent sets (can be a group in adjacent sets or two groups) can also to be had in two groups or more conductive pattern in many groups conductive pattern to misplace be separated, like this, conductive layer 3 can be divided into polylith independently conductive layer, therefore, in the present embodiment, be separated if the conductive pattern of individual group and the conductive grid in the conductive pattern of adjacent sets specifically can be selected according to the actual requirements to misplace thus reach the demand dividing separate conductive layer.
In the present embodiment, the shape of conductive grid can be regular polygon, as square, rhombus, regular hexagon, can also be some random conductive grid shapes, in Fig. 3, be that rhombus is next illustrational with conductive grid, in the present embodiment, first direction and second direction are orthogonal, wherein first direction can be vertical or horizontal, first direction can also be vergence direction, corresponding, second direction can be horizontal or longitudinal, can also be the vergence direction vertical with first direction, for example, as shown in Figure 3, in conductive layer 3, conductive grid W1 and conductive grid W2 can be first group of conductive pattern, conductive grid W3 and conductive grid W4 is the second group conductive pattern adjacent with first group of conductive pattern, the conductive grid W1 be mutually connected in series on first direction D1 (longitudinal direction) and conductive grid W2 is included in first group of group conductive pattern, second group of conductive pattern comprises the conductive grid W3 and conductive grid W4 that are mutually connected in series in the first direction dl, and the conductive grid W1 of series connection mutually in first group of conductive pattern and conductive grid W2 and the conductive grid W3 mutually connected in second group of conductive pattern and conductive grid W4) be separated (the round dotted line as in Fig. 3) in the upper mutual dislocation of second direction D2 (transverse direction), specifically as shown in Figure 3, conductive grid W1 in a second direction d 2 and be separated near the node G1 of conductive grid W3 side and conductive grid W3 mutual dislocation in a second direction d 2 and between the node G2 of conductive grid W1 side, node G1 and node G2 individualism, do not link together, therefore, by conductive grid W1 and conductive grid W3, and conductive grid W2 misplaces in a second direction d 2 with conductive grid W4 and is separated, first group of conductive pattern and second group of conductive pattern define two pieces of separate conductive electrodes, it should be noted that, in Fig. 3, merely illustrate two groups of conductive patterns, in practical application, have and organize conductive pattern more, may be separated with second group of conductive pattern mutual dislocation by first group of conductive pattern, and second group of conductive pattern and the 3rd group of conductive pattern can be interconnective by conductive grid, also can be separated by conductive grid mutual dislocation, the application is compared with prior art (as shown in Figure 1), in the present embodiment, after by the node (as G1 and G2) of conductive grid W1 and conductive grid W3 (conductive grid W2 and conductive grid W4), mutual dislocation is separated in a second direction d 2, when forming separate conductive electrode, conductive grid W1, conductive grid W3, conductive grid W2 and conductive grid W4 is complete conductive grid structure, compared with prior art break line treatment, be separated the effective nodes added in conductive layer by dislocation in the application, make conducting film performance more stable.
The present embodiment provides conducting film, by conductive layer is arranged on the transparent substrate, conductive layer forms by organizing conductive pattern more, often organize the conductive grid that conductive pattern comprises multiple series connection mutually in a first direction, and have at least in interconnective many group conductive patterns the conductive grid of series connection mutually described in one group of conductive pattern and the conductive grid of mutually connecting in adjacent sets in a second direction mutual dislocation be separated, achieve and carry out obtained separate conductive electrode with complete conductive grid structure, add effective nodes of conductive electrode, improve the electric conductivity of conductive electrode, reduce the open circuit risk caused because of break line treatment when obtaining independently conductive electrode with break line treatment in prior art simultaneously.
Fig. 4 is the another structural representation of conducting film of the present invention, on the basis of above-described embodiment, in the present embodiment, as shown in Figure 4, conducting film also comprises: impression glue-line 2, impression glue-line 2 is arranged on transparency carrier 1, conductive layer 3 is embedded in impression glue-line 2 and the thickness of conductive layer 3 is not more than on impression glue-line 2 for embedding the degree of depth of the groove of conductive layer 3, in the present embodiment, the material of impression glue-line 2 can be heat-setting polymkeric substance, can also be ultraviolet (UltraViolet, be called for short: UV) cure polymer, simultaneously, in the present embodiment, conductive layer 3 embeds in impression glue-line 2 and is specially, on impression glue-line 2, impression has latticed groove, be filled with conductive material in groove and form conductive thread, conductive thread mutual cross connection composition conductive grid, conductive layer 3 forms by organizing conductive pattern more, often organize the conductive grid that conductive pattern comprises multiple series connection mutually in a first direction, have at least in interconnective many group conductive patterns the conductive grid of series connection mutually in one group of conductive pattern and the conductive grid of mutually connecting in adjacent sets in a second direction mutual dislocation be separated, make two groups of adjacent conductive pattern mutually insulateds, in the present embodiment, conductive material can be gold, silver, copper, the alloy of a kind of in aluminum and zinc or at least two kinds, it can also be the gold with electricity connection function, silver, copper, the potpourri of aluminium or zinc and organic binder bond, in the present embodiment, conductive material is mainly silver, it should be noted that, when conductive layer 3 is set directly on transparency carrier 1, conductive layer 3 can by prior art as plating rete etches formation again, in the present embodiment, conductive layer 3 is by arranging groove on impression glue-line 2, impress conductive material in a groove formed.
Further, in the present embodiment, because conductive thread is light tight, in order to increase the glazed area of conducting film, need reduce the width of conductive thread and increase the size of conductive grid, Fig. 5 is the close-up schematic view of conductive grid in conductive layer, as shown in Figure 5, in the present embodiment, for conductive grid shape for square, the width d of the conductive thread of conductive layer 3 is 0.2 μm-10 μm, such as, the width d of conductive thread can be 0.2 μm, 1 μm or 5 μm, in actual applications, the width d of conductive thread is preferably 0.5 μm-2 μm, further, in the present embodiment, as shown in Figure 5, distance in conductive grid between adjacent node is 10 μm-800 μm, namely, spacing W between conductive grid interior joint E and adjacent node F is 10 μm-800 μm, such as W can be 10 μm, 200 μm or 800 μm.
Further, in the present embodiment, the thickness of transparency carrier 1 is 0.02mm-2.5mm, and in actual applications, transparency carrier 1 thickness is preferably 0.05mm-0.5mm, such as, can be 0.1mm or 0.4mm.
Further, Fig. 6 is conductive layer and the close-up schematic view impressing glue-line in Fig. 4, as shown in Figure 6, the thickness of impression glue-line 2 is 1 μm-30 μm, in actual applications, the thickness of impression glue-line 2 is preferably 2 μm-11 μm, the thickness h of the conductive material of filling in groove is 0.1 μm-10 μm, namely the thickness of conductive thread (conductive layer 3) is 0.1 μm-10 μm, in actual applications, the thickness of conductive thread is preferably 0.5 μm-5 μm, it should be noted that, in the present embodiment, the thickness h of the conductive material of filling in groove is not more than the degree of depth of impression glue-line 2 upper groove, simultaneously, the thickness of selected impression glue-line 2 must be greater than the degree of depth of groove, namely, if the thickness h of conductive thread is 5 μm, then the degree of depth of groove is greater than and equals 5 μm, the thickness then impressing glue-line 2 need be greater than 5 μm, therefore impress glue-line 2 to be less than in the scope of 30 μm and to choose being greater than 5 μm.
The present embodiment provides conducting film, arrange on the transparent substrate by glue-line will be impressed, it is interior and concordant with the surface of impression glue-line that conductive layer is embedded in impression glue-line, conductive layer forms by organizing conductive pattern more, often organize the conductive grid that conductive pattern comprises multiple series connection mutually in a first direction, and have at least in interconnective many group conductive patterns the conductive grid of series connection mutually described in one group of conductive pattern and the conductive grid of mutually connecting in adjacent sets in a second direction mutual dislocation be separated, achieve and carry out obtained separate conductive electrode with complete conductive grid structure, add effective nodes of conductive electrode, improve the electric conductivity of conductive electrode, simultaneously, reduce the open circuit risk caused because of break line treatment when obtaining independently conductive electrode with break line treatment in prior art, and, by conductive layer to be embedded in impression glue-line and the thickness of conductive layer is not more than on impression glue-line and is used for embedding the degree of depth of the groove of conductive layer, avoid the scratch of conductive layer.
Further, the present embodiment provides a kind of touch-screen, at least comprises the conducting film that above-mentioned any embodiment provides in touch-screen, and wherein, the structure of conducting film specifically with reference to the content recorded in above-described embodiment, can repeat no more in the present embodiment.
The touch-screen that the present embodiment provides, by at least comprising by transparency carrier, the conducting film of conductive layer composition, conductive layer forms by organizing conductive pattern more, often organize the conductive grid that conductive pattern comprises multiple series connection mutually in a first direction, and have at least in interconnective many group conductive patterns the conductive grid of series connection mutually in one group of conductive pattern and the conductive grid of mutually connecting in adjacent sets in a second direction mutual dislocation be separated, make the conducting film stable performance formed, touch-screen touch-control better effects if.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.