CN103425349A - Transparent electric conductor and manufacturing method - Google Patents
Transparent electric conductor and manufacturing method Download PDFInfo
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- CN103425349A CN103425349A CN2013103490474A CN201310349047A CN103425349A CN 103425349 A CN103425349 A CN 103425349A CN 2013103490474 A CN2013103490474 A CN 2013103490474A CN 201310349047 A CN201310349047 A CN 201310349047A CN 103425349 A CN103425349 A CN 103425349A
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Abstract
The invention provides a transparent electric conductor and a manufacturing method. The transparent electric conductor comprises a transparent base material and a touch sensing conducting layer arranged on the surface of the transparent base material, the touch sensing conducting layer comprises at least two electric conducting units which are in latticed patterns formed by electric conducting materials, and a preset clearance is formed between two adjacent electric conducting units. According to the transparent electric conductor, the latticed touch sensing conducting layer formed by the electric conducting materials is arranged on the transparent base material and replaces an ITO conducting film in the prior art, the electrical resistivity of the conducting layer can be effectively lowered, the electric conducting performance of the electric conductor is improved, and the transparent electric conductor is suitable for being used in a large-size touch screen. In addition, the manufacturing method of the transparent electric conductor is simple in manufacturing technology, and large-scale production can be achieved.
Description
Technical field
The present invention relates to touch technology, relate in particular to a kind of transparent conductive body and preparation method.
Background technology
Touch-screen is a kind of inductive arrangement that touches input signal that receives.Existing touch-screen is divided into resistive touch screen and capacitive touch screen substantially.The transparent conductive body of existing resistive touch screen and capacitive touch screen all adopts nano indium tin metal oxide (Indium Tin Oxides is called for short ITO) nesa coating.
Existing transparent conductive body is generally to plate one deck ITO conducting film on transparent base by vacuum ion sputtering technique.ITO is a kind of semiconductor material, resistivity is larger, therefore cause the poorly conductive of ITO conducting film, having limited the ITO conducting film is applied in larger-size touch-screen, palm PC (PAD) for example, in all-in-one (All in one is called for short AIO) or the upper touch-screen used of notebook computer (NoteBook).
Summary of the invention
Given this, the invention provides a kind of transparent conductive body and preparation method, to improve electric conductivity, be applicable to the large scale touch-screen.
First aspect of the present invention provides a kind of transparent conductive body, transparent base and be arranged at the touch sensible conductive layer on described transparent base surface, described touch sensible conductive layer comprises at least two conductive units, described conductive unit is the waffle-like pattern that conductive material forms, and between two adjacent conductive units, has prepsetting gap.
In embodiment, described conductive material is mixed ink therein, and described mixed ink comprises: conductive particle or conductor wire, and photosensitive resin.
Therein in embodiment, described conductive particle or conductor wire are a kind of in gold, silver, copper, aluminium, manganese, molybdenum, zinc and carbon or conductive particle or conductor wire that any multiple combination forms;
Described photosensitive resin comprises: film-forming resin, emulsion, solvent, stabilizing agent, levelling agent and defoamer.
Therein in embodiment, in described photosensitive resin, the number percent that each component accounts for general assembly (TW) is respectively: 30～50% film-forming resin, 1～10% emulsion, 10～40% solvent, 0.1～5% stabilizing agent, 0.1～5% levelling agent and 0.1～5% defoamer.
In embodiment, the thickness of described transparent base is 0.02mm～1.2mm therein, and the thickness of described touch sensible conductive layer is 0.5 μ m～10 μ m.
In embodiment, the mesh lines width of the conductive unit of described waffle-like pattern is 0.2 μ m～5 μ m therein, and the distance in the conductive unit of described waffle-like pattern between two adjacent grid intersection points is 50 μ m～500 μ m.
Therein in embodiment, described transparent conductive body also comprises optical adjustment layer, described optical adjustment layer is arranged at the side that described transparent base is provided with the touch sensible conductive layer, described optical adjustment layer covers the mesh lines of waffle-like pattern of described touch sensible conductive layer and the zone that described transparent base surface is not covered by described mesh lines, for reducing the difference in reflectivity in described the transparent conductive body zone covered by described mesh lines and the zone do not covered by described mesh lines.
In embodiment, the refractive index of described optical adjustment layer is 1.6～2.8 therein, and thickness is 20nm～2000nm.
In embodiment, on described touch sensible conductive layer, also be provided with insulating protective layer therein.
In embodiment, the upper surface of described insulating protective layer is 0.5 μ m～5 μ m to the distance between the upper surface of described touch sensible conductive layer therein.
Second aspect of the present invention provides a kind of preparation method of transparent conductive body, comprising:
Apply layer of conductive material on transparent base, form conductive material layer;
Described conductive material layer is carried out to etching, form the pattern of touch sensible conductive layer, wherein, described touch sensible conductive layer comprises at least two conductive units, described conductive unit is the waffle-like pattern that conductive material forms, and between two adjacent conductive units, has prepsetting gap.
In embodiment, described conductive material comprises photosensitive material, described conductive material layer is carried out to etching therein, and the pattern that forms the touch sensible conductive layer comprises:
Adopt uviol lamp to carry out exposure-processed to described conductive material layer;
Described conductive material layer after exposure-processed is carried out to development treatment.
In embodiment, the wavelength of described uviol lamp is 300～400nm therein, and power is 800～1200W, and exposure energy is 50～1000mj/cm
2.
In embodiment, described conductive material is mixed ink therein, and described mixed ink comprises: conductive particle or conductor wire, and photosensitive resin;
Correspondingly, described employing uviol lamp also comprises before described conductive material layer is carried out to exposure-processed:
The transparent base that is coated with described conductive material layer is carried out to the prebake conditions processing;
Described described conductive material layer after exposure-processed is carried out to development treatment after, also comprise:
Described conductive material layer after development treatment is fixed to baking to be processed.
In embodiment, the temperature that described prebake conditions is processed is 60～120 ℃ therein; The temperature that described fixedly baking is processed is 100～150 ℃.
Therein in embodiment, described described conductive material layer is carried out to etching, after forming the pattern of touch sensible conductive layer, also comprises:
Apply one deck resin on described touch sensible conductive layer, and be cured, form optical adjustment layer, the refractive index of described resin is 1.6～2.8.
Therein in embodiment, described described conductive material layer is carried out to etching, after forming the pattern of touch sensible conductive layer, also comprises:
Apply one deck heat reactive resin or UV cured resin on described touch sensible conductive layer, and be cured, form insulating protective layer.
As shown from the above technical solution, the embodiment of the present invention by arranging the latticed touch sensible conductive layer formed by conductive material on transparent base, replace ITO conducting film of the prior art, can effectively reduce the resistivity of touch sensible conductive layer, improve the wire-conducting performance of transparent conductive body, be suitable for using in the large scale touch-screen.In addition, the preparation method of the transparent conductive body that the embodiment of the present invention provides, its preparation technology is simple, can realize producing in enormous quantities.
The accompanying drawing explanation
The schematic cross-section of the transparent conductive body that Fig. 1 provides for the embodiment of the present invention one;
Fig. 2 measures figure for the axle of the transparent conductive body that the embodiment of the present invention one provides;
In the transparent conductive body that Fig. 3 provides for the embodiment of the present invention one, the grid of the waffle-like pattern of conductive unit is foursquare schematic diagram;
The schematic diagram that in the transparent conductive body that Fig. 4 provides for the embodiment of the present invention one, the grid of the waffle-like pattern of conductive unit is rhombus;
In the transparent conductive body that Fig. 5 provides for the embodiment of the present invention one, the grid of the waffle-like pattern of conductive unit is orthohexagonal schematic diagram;
The schematic diagram that in the transparent conductive body that Fig. 6 provides for the embodiment of the present invention one, the grid of the waffle-like pattern of conductive unit is random arbitrary polygon;
The mesh lines width d of the waffle-like pattern of conductive unit and the schematic diagram apart from w between adjacent two grid intersection points in the transparent conductive body that Fig. 7 provides for the embodiment of the present invention one;
The structural representation a kind of in the cards of the transparent conductive body that Fig. 8 provides for the embodiment of the present invention two;
The another kind structural representation in the cards of the transparent conductive body that Fig. 9 provides for the embodiment of the present invention two;
The structural representation of the transparent conductive body that Figure 10 provides for the embodiment of the present invention three;
The preparation method's of the transparent conductive body that Figure 11 provides for the embodiment of the present invention four process flow diagram;
The preparation method's of the transparent conductive body that Figure 12 provides for the embodiment of the present invention five process flow diagram;
The preparation method's of the transparent conductive body that Figure 13 provides for the embodiment of the present invention six process flow diagram.
Embodiment
The structural representation of the transparent conductive body that as depicted in figs. 1 and 2, the embodiment of the present invention one provides.As shown in Figure 1, the described transparent conductive body of the present embodiment one comprises: transparent base 1 and be arranged at the touch sensible conductive layer 2 on described transparent base 1 surface.As shown in Figure 2, described touch sensible conductive layer 2 comprises at least two conductive units 21.Described conductive unit 21, for the waffle-like pattern that conductive material forms, has prepsetting gap between two adjacent conductive units 21.
The present embodiment by arranging the latticed touch sensible conductive layer formed by conductive material on transparent base, replace ITO conducting film of the prior art, can effectively reduce the resistivity of touch sensible conductive layer, improve the wire-conducting performance of transparent conductive body, be suitable for using in the large scale touch-screen.
Particularly, in the described transparent conductive body of the present embodiment one, the material of transparent base can be the optically transparent materials such as glass, polymethylmethacrylate (PMMA) or polyethylene terephthalate (PET).The thickness of transparent base is chosen as 0.02mm-1.2mm, is preferably 0.05mm-0.5mm.
The thickness of touch sensible conductive layer is chosen as 0.5 μ m～10 μ m, is preferably 2 μ m～5 μ m.The touch sensible conductive layer is solidified and is formed by a kind of mixed ink.The viscosity of described mixed ink is chosen as 1000cps～50000cps.Described mixed ink comprises: conductive particle or conductor wire, and photosensitive resin.Particularly, described conductive particle or conductor wire are conductive particle or the conductor wire that a kind of or combination in any in gold, silver, copper, aluminium, manganese, molybdenum, zinc and carbon forms.When being conductive particle, the outline full-size of this conductive particle can be 100nm～1000nm; When being conductor wire, the diameter of this conductor wire can be 20nm-200nm, and length can be 100nm-10um.Described photosensitive resin comprises: film-forming resin, emulsion, solvent, stabilizing agent, levelling agent and defoamer, wherein, the number percent that each component accounts for general assembly (TW) is respectively: 30～50% film-forming resin, 1～10% emulsion, 10～40% solvent, 0.1～5% stabilizing agent, 0.1～5% levelling agent and 0.1～5% defoamer.Wherein, described film-forming resin is a kind of or multiple combination arbitrarily in polymethylmethacrylate, linear phenolic resin photosensitive resin, epoxy resin photosensitive resin, crotonic acid, acrylate, vinyl ether and M Cr.Described emulsion is a kind of or any multiple combination in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, fragrant salt compounded of iodine and ferrocene salt.Described solvent is tetrahydrofuran, methyl ethyl ketone, cyclohexanone, propylene glycol, N, dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1, a kind of or multiple combination arbitrarily in 6-hexanediol methoxyl mono acrylic ester, ethoxylation neopentyl glycol methoxyl mono acrylic ester.Described stabilizing agent is a kind of or multiple combination arbitrarily in p-dihydroxy-benzene, p methoxy phenol, 1,4-benzoquinone, 2,6 one di-t-butyl cresols, phenothiazine and anthraquinone.Described levelling agent is a kind of or multiple combination arbitrarily in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral.Described defoamer is a kind of or multiple combination arbitrarily in phosphate, fatty acid ester and organosilicon.Described mixed ink has the function of conducting function and photoresist concurrently.
The grid of the waffle-like pattern of described conductive unit can be regular polygon, for example, the square shown in Fig. 3, the rhombus shown in Fig. 4, the regular hexagon shown in Fig. 5, can also be random arbitrary polygon as shown in Figure 6.The gap arranged between two adjacent conductive units, for the two adjacent conductive units that insulate, Touch Zone is divided into to a plurality of zones.
Because the mesh lines of a kind of touch sensible conductive layer of above-described embodiment is light tight, therefore reduce mesh lines width d and increase can increase glazed area apart from w between adjacent two grid intersection points, can improve the transmittance of transparent conductive body, particularly, as shown in Figure 7, visual transparent in order to meet, the mesh lines width d of the conductive unit of described waffle-like pattern is 0.2 μ m～5 μ m, is preferably 0.5um～2um.Distance W in the conductive unit of described waffle-like pattern between two adjacent grid intersection points is 50 μ m～500 μ m.
The structural representation of the transparent conductive body that as shown in Figure 8, the embodiment of the present invention two provides.As shown in Figure 8, the described transparent conductive body of the present embodiment two, based on above-described embodiment one, a side that further at transparent base 1, is provided with touch-control sensing conductive layer 2 on the basis of above-described embodiment one arranges optical adjustment layer 3.The mesh lines of the waffle-like pattern of the described touch-control sensing conductive layer 2 of described regulating course 3 covering and the zone that transparent base 1 surface is not covered by described mesh lines.Described optical adjustment layer 3 is for the difference in reflectivity in the zone that reduces described transparent conductive body and covered by described mesh lines and the zone do not covered by described mesh lines.
Wherein, the material of described optical adjustment layer is high refractive index transparent insulation material, can be specifically titania (TiO
2), niobium pentaoxide (Nb
2O
5) etc. inorganics, can be also 1,3,5-triazines-2,4, the organic materials such as 6-tri-aminated compoundss.The refractive index of described optical adjustment layer is chosen as 1.6～2.8, and thickness is 20nm～2000nm.
Because touch sensible conductive layer in above-described embodiment one is the waffle-like pattern that lighttight conductive material forms, it is conductive material zone, cover part only on transparent base, when the refractive index difference of the reflectivity of conductive material and transparent base is larger, the optical effect that light is radiated at the light that conductive material surface and transparent base surface reflection return can produce larger difference, makes the people easily see the grid of conductive layer; Therefore, region division one deck optical adjustment layer that the present embodiment two is not covered by mesh lines by the mesh lines at the touch sensible conductive layer and transparent base surface, to reduce the difference in reflectivity in the mesh lines zone covered and the zone do not covered by mesh lines, and then reduce the visibility of the grid of touch sensible conductive layer.
Further; for prevent conductive layer and optical adjustment layer produce and use procedure in scratch and dropping, as shown in Figure 9, an insulating protective layer 4 can be set on described optical adjustment layer 3; particularly, the material of this insulating protective layer can be heat reactive resin or UV cured resin.The upper surface of described insulating protective layer is 0.5 μ m～5 μ m to the distance between the upper surface of described conductive layer.
The structural representation of the transparent conductive body that as shown in figure 10, the embodiment of the present invention three provides.As shown in the figure, the described transparent conductive body of the present embodiment three, based on above-described embodiment one, on the basis of embodiment mono-, also be provided with insulating protective layer 4 on described touch sensible conductive layer 2.The mesh lines of the waffle-like pattern of the described touch-control sensing conductive layer 2 of described insulating protective layer 4 covering and the zone that transparent base 1 surface is not covered by described mesh lines.On described touch sensible conductive layer 2, arrange insulating protective layer 4 can prevent touch sensible conductive layer 2 produce and use procedure in scratch and dropping.Particularly, the material of described insulating protective layer can be heat reactive resin or UV cured resin.The upper surface of described insulating protective layer is 0.5 μ m～5 μ m to the distance between the upper surface of described conductive layer.
The preparation method's of the transparent conductive body that as shown in figure 11, the embodiment of the present invention four provides process flow diagram.As shown in figure 11, the described preparation method of the present embodiment comprises:
Particularly, if described conductive material comprises photosensitive material, this step, carry out etching to described conductive material layer, forms the pattern of touch sensible conductive layer, can adopt following steps to realize:
At first, adopt uviol lamp to carry out exposure-processed to described conductive material layer.
Particularly, can adopt predominant wavelength is 300～400nm, and the uviol lamp that power is 800～1200W carries out exposure-processed to described conductive material layer.Exposure energy can be for being 50～1000mj/cm
2.In practical operation, can adopt predominant wavelength is that the uviol lamp that 365nm, power are 1000W carries out exposure-processed to described conductive material layer, and exposure energy can be 200mj/cm
2.
Then, the described conductive material layer after exposure-processed is carried out to development treatment.
Wherein, developer solution can be weak base salt solution, as: sodium carbonate, sal tartari, sodium bicarbonate, saleratus, sodium phosphate, phosphoric acid hydrogen is received etc., and the mass concentration of the solution of described weak base salt is 0.1% – 3%.
If described conductive material is mixed ink, described mixed ink has conducting function and photoresist function concurrently.Be that described mixed ink is the mixed ink described in above-described embodiment one, this step, carry out etching to described conductive material layer, forms the pattern of touch sensible conductive layer, can adopt following steps to realize:
At first, the transparent base that is coated with described conductive material layer is carried out to the prebake conditions processing.
Particularly, can at the preliminary drying temperature of 60～120 ℃, to the transparent base that is coated with described conductive material layer, carry out the prebake conditions processing, baking time can be 10～60min.In practical operation, can be chosen at the preliminary drying temperature of 80 ℃, the transparent base that is coated with described conductive material layer is carried out to the prebake conditions processing, preliminary drying 10min.
Then, adopt uviol lamp to carry out exposure-processed to described conductive material layer.
Particularly, can adopt predominant wavelength is 300～400nm, and the uviol lamp that power is 800～1200W carries out exposure-processed to described conductive material layer.Exposure energy can be for being 50～1000mj/cm
2.In practical operation, can adopt predominant wavelength is that the uviol lamp that 365nm, power are 1000W carries out exposure-processed to described conductive material layer, and exposure energy can be 200mj/cm
2.
Subsequently, the described conductive material layer after exposure-processed is carried out to development treatment.
Wherein, developer solution can be weak base salt solution, as: sodium carbonate, sal tartari, sodium bicarbonate, saleratus, sodium phosphate, phosphoric acid hydrogen is received etc., and the mass concentration of the solution of described weak base salt is 0.1% – 3%.
Finally, the described conductive material layer after development treatment being fixed to baking processes.
Particularly, under the environment of 100～150 ℃, the described conductive material layer after development treatment is fixed to baking and processes, baking time can be 10～60min.In practical operation, can be chosen under the environment of 130 ℃, the described conductive material layer after development treatment is fixed to baking and processes, baking time can be 30min.
The preparation method of the transparent conductive body that the embodiment of the present invention provides above-described embodiment one to provide, its preparation technology is simple, can realize producing in enormous quantities.
The preparation method's of the transparent conductive body that as shown in figure 12, the embodiment of the present invention five provides process flow diagram.As shown in figure 12, the preparation method of the present embodiment five, based on above-described embodiment four, except comprising the described step 101 of above-described embodiment four and 102, after described step 102, also comprises:
Wherein, the refractive index of described resin is 1.6～2.8, and thickness is 20nm～2000nm.This resin can be titania (TiO
2), niobium pentaoxide (Nb
2O
5) etc. inorganics, can be also 1,3,5-triazines-2,4, the organic materials such as 6-tri-aminated compoundss
Further, describedly apply one deck resin on described touch sensible conductive layer, and be cured, after forming optical adjustment layer, also comprise:
Apply one deck heat reactive resin or UV cured resin on described optical adjustment layer, and be cured, form insulating protective layer.
The preparation method's of the transparent conductive body that as shown in figure 13, the embodiment of the present invention six provides process flow diagram.As shown in figure 13, the preparation method of the present embodiment six, based on above-described embodiment four, except comprising the described step 101 of above-described embodiment four and 102, after described step 102, also comprises:
Particularly, the upper surface of described insulating protective layer is 0.5 μ m～5 μ m to the distance between the upper surface of described touch sensible conductive layer.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, there is no the part described in detail in certain embodiment, can be referring to the associated description of other embodiment.
Finally it should be noted that: above each embodiment, only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to aforementioned each embodiment, the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: its technical scheme that still can put down in writing aforementioned each embodiment is modified, or some or all of technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of various embodiments of the present invention technical scheme.
Claims (17)
1. a transparent conductive body, it is characterized in that, comprise: transparent base and be arranged at the touch sensible conductive layer on described transparent base surface, described touch sensible conductive layer comprises at least two conductive units, described conductive unit is the waffle-like pattern that conductive material forms, and between two adjacent conductive units, has prepsetting gap.
2. transparent conductive body according to claim 1, is characterized in that, described conductive material is mixed ink, and described mixed ink comprises: conductive particle or conductor wire, and photosensitive resin.
3. transparent conductive body according to claim 2, is characterized in that, conductive particle or conductor wire that described conductive particle or conductor wire are a kind of or any multiple combination formation in gold, silver, copper, aluminium, manganese, molybdenum, zinc and carbon;
Described photosensitive resin comprises: film-forming resin, emulsion, solvent, stabilizing agent, levelling agent and defoamer.
4. transparent conductive body according to claim 3, it is characterized in that, in described photosensitive resin, the number percent that each component accounts for general assembly (TW) is respectively: 30～50% film-forming resin, 1～10% emulsion, 10～40% solvent, 0.1～5% stabilizing agent, 0.1～5% levelling agent and 0.1～5% defoamer.
5. transparent conductive body according to claim 1, is characterized in that, the thickness of described transparent base is 0.02mm～1.2mm, and the thickness of described touch sensible conductive layer is 0.5 μ m～10 μ m.
6. transparent conductive body according to claim 1, it is characterized in that, the mesh lines width of the conductive unit of described waffle-like pattern is 0.2 μ m～5 μ m, and the distance in the conductive unit of described waffle-like pattern between two adjacent grid intersection points is 50 μ m～500 μ m.
7. transparent conductive body according to claim 1, it is characterized in that, described transparent conductive body also comprises optical adjustment layer, described optical adjustment layer is arranged at the side that described transparent base is provided with the touch sensible conductive layer, described optical adjustment layer covers the mesh lines of waffle-like pattern of described touch sensible conductive layer and the zone that described transparent base surface is not covered by described mesh lines, for reducing the difference in reflectivity in described the transparent conductive body zone covered by described mesh lines and the zone do not covered by described mesh lines.
8. transparent conductive body according to claim 7, is characterized in that, the refractive index of described optical adjustment layer is 1.6～2.8, and thickness is 20nm～2000nm.
9. according to the described transparent conductive body of claim 1 or 7, it is characterized in that, on described touch sensible conductive layer, also be provided with insulating protective layer.
10. transparent conductive body according to claim 9, is characterized in that, the upper surface of described insulating protective layer is 0.5 μ m～5 μ m to the distance between the upper surface of described touch sensible conductive layer.
11. the preparation method of a transparent conductive body, is characterized in that, comprising:
Apply layer of conductive material on transparent base, form conductive material layer;
Described conductive material layer is carried out to etching, form the pattern of touch sensible conductive layer, wherein, described touch sensible conductive layer comprises at least two conductive units, described conductive unit is the waffle-like pattern that conductive material forms, and between two adjacent conductive units, has prepsetting gap.
12. preparation method according to claim 11, is characterized in that, described conductive material comprises photosensitive material, described conductive material layer is carried out to etching, and the pattern that forms the touch sensible conductive layer comprises:
Adopt uviol lamp to carry out exposure-processed to described conductive material layer;
Described conductive material layer after exposure-processed is carried out to development treatment.
13. preparation method according to claim 12, is characterized in that, the wavelength of described uviol lamp is 300～400nm, and power is 800～1200W, and exposure energy is 50～1000mj/cm
2.
14. preparation method according to claim 12, is characterized in that, described conductive material is mixed ink, and described mixed ink comprises: conductive particle or conductor wire, and photosensitive resin;
Correspondingly, described employing uviol lamp also comprises before described conductive material layer is carried out to exposure-processed:
The transparent base that is coated with described conductive material layer is carried out to the prebake conditions processing;
Described described conductive material layer after exposure-processed is carried out to development treatment after, also comprise:
Described conductive material layer after development treatment is fixed to baking to be processed.
15. preparation method according to claim 14 is characterized in that:
The temperature that described prebake conditions is processed is 60～120 ℃;
The temperature that described fixedly baking is processed is 100～150 ℃.
16. preparation method according to claim 12, is characterized in that, described described conductive material layer carried out to etching, after forming the pattern of touch sensible conductive layer, also comprises:
Apply one deck resin on described touch sensible conductive layer, and be cured, form optical adjustment layer, the refractive index of described resin is 1.6～2.8.
17., according to the described preparation method of claim 11 or 16, it is characterized in that, described described conductive material layer is carried out to etching, after forming the pattern of touch sensible conductive layer, also comprise:
Apply one deck heat reactive resin or UV cured resin on described touch sensible conductive layer, and be cured, form insulating protective layer.
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| CN106598316A (en) * | 2015-10-19 | 2017-04-26 | 上海蓝沛信泰光电科技有限公司 | Thin film integrating touch handwriting sensor and near field communication antenna and preparation method thereof |
| CN109659095A (en) * | 2018-12-13 | 2019-04-19 | 江西蓝沛泰和新材料有限公司 | A kind of preparation method of transparent conductive film |
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