CN103744571A - Ultrathin touch sensor and manufacturing method thereof - Google Patents
Ultrathin touch sensor and manufacturing method thereof Download PDFInfo
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- CN103744571A CN103744571A CN201410037667.9A CN201410037667A CN103744571A CN 103744571 A CN103744571 A CN 103744571A CN 201410037667 A CN201410037667 A CN 201410037667A CN 103744571 A CN103744571 A CN 103744571A
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Abstract
The invention discloses an ultrathin touch sensor and a manufacturing method thereof. The ultrathin touch sensor comprises a base material layer, a receiving circuit layer, a transmitting circuit layer and a protection layer which are stacked in sequence, wherein the receiving circuit layer and the transmitting circuit layer are arranged on the same side of the base material layer; each of the transmitting circuit layer and the receiving circuit layer comprises a plurality of conductive grids and an imprinting layer, the conductive grids are embedded into the imprinting layer, each conductive grid comprises at least three grid lines connected in sequence, the width of each grid line is not less than 1 micron, and the height-width ratio of the grid line is (1:0.5)-(1:2). According to the ultrathin touch sensor, the receiving circuit layer and the transmitting circuit layer are arranged on the same side of the base material layer and made of metal conductive materials, and the thickness of the ultrathin touch sensor is reduced. The ultrathin touch sensor has the advantages of environmental friendliness, low cost and high sensitivity.
Description
Technical field
The present invention relates to a kind of touch sensing, be specifically related to a kind of ultra-thin touch sensing and preparation method thereof.
Background technology
Along with scientific and technological development, touch-screen as one simply, man-machine interaction mode easily, be widely used in the every field of our daily life, such as mobile phone, media player, navigational system, digital camera, photo frame, PDA, game station, display, electrical equipment control, Medical Devices etc.Touch technology has been opened up the new model of the interpersonal interactive operation of mobile terminal, and large scale, ultrathin flexible, low cost have become the inevitable development trend of touch-screen industry.
Touch screen technology is mainly divided into resistance-type, condenser type, infrared type and surface acoustic wave mode, and wherein capacitive touch screen is divided into again surface capacitance type and inductance capacitance formula.Inductance capacitance formula touch-screen have realize true multiple point touching, transparency is good, durability is good, resolution advantages of higher, it has become the mainstream technology of the consumer electronics products such as mobile phone, panel computer.
In capacitive touch screen, touch sensing (Touch Sensor) is the element of most critical in touch-screen, and its cost accounts for 40% of whole touch-screen.Really can realizing in the capacitive touch screen of multi-point touch, the conductive material in business-like product is tin indium oxide (ITO) substantially, and the primary structure of touch sensing is one side ITO structure and two-sided ITO structure.Wherein, one side ITO structure is that induction electrode layer and drive electrode layer are positioned in same layer ITO structure, adopts bridging technique; Two-sided ITO structure is that induction electrode layer and drive electrode layer lay respectively in two-layer ITO structure.Two-sided ITO structure can be same base material, is combined to form GF2(Glass-Film Ditto) touch screen structure; Or double-deck base material, ITO structure is upper in double-layer films inductor (Film Sensor), thereby then by optical lens gelatin, double-layer films is fitted and is combined to form GFF(Glass-Film-Film) structure.For above-mentioned ITO sensor, no matter be single-sided structure or bilateral structure, the method for making of its electrode pattern is mainly: first at substrate surface sputtering ITO material, then form telegraph circuit by gold-tinted, etch process.
But there is following problem in touch sensing of traditional use ITO and preparation method thereof: on base material, the raising of the thickness evenness control difficulty of sputter, yield reduce; In order to meet the requirement of low square resistance, must need to increase the thickness of ITO film forming simultaneously, but the problem of so but bringing transmitance to reduce.In addition, owing to needing to form circuit by gold-tinted and etch process in ITO making, thereby also there is the problem of environmental protection in traditional technique.And, the resource-constrained of ITO material own, along with the expansion of touch-screen market application, the problem that certainly will rise with the cost of the touch sensing of use ITO material.Meanwhile, the ultrathin of touch sensing is also inexorable trend from now on, and the thickness that how to reduce touch sensing also will become the major fields of scientific research from now on.
Summary of the invention
In view of this, the invention provides a kind of ultra-thin touch sensing, and preparation method thereof.
One of to achieve these goals, the ultra-thin touch sensing of one of the present invention, it comprises:
Stack gradually substrate layer, receiving circuit layer, radiating circuit layer and the protective seam of arranging, described receiving circuit layer and radiating circuit layer are positioned at the homonymy of described substrate layer;
Described radiating circuit layer and receiving circuit layer comprise: multiple conductive grids and embossed layer, described multiple conductive grid is embedded in described embossed layer, described conductive grid comprises at least three mesh lines that connect in turn, the width of described mesh lines is more than or equal to 1 μ m, and the scope of the depth-width ratio of described mesh lines is 1:0.5～1:2.
As a further improvement on the present invention, the shape of cross section of described conductive grid is polygon.
As a further improvement on the present invention, described mesh lines comprises some the first mesh lines and some the second mesh lines, described some the first mesh lines are arranged mutually parallel along first direction, described some the second mesh lines are arranged between described the first mesh lines and perpendicular to described the first mesh lines, and the second mesh lines of described arbitrary the first mesh lines both sides is dislocatedly distributed.
As a further improvement on the present invention, the material of described conductive grid is nano level metal conductive material or organic conductive material.
As a further improvement on the present invention, described protective seam comprises optics glue-line.
As a further improvement on the present invention, described radiating circuit layer, receiving circuit layer separate and arrange, and between described radiating circuit layer and receiving circuit layer, described insulation course are set.
For realizing above-mentioned another goal of the invention, the invention provides a kind of method for making of preparing ultra-thin touch sensing as above, it comprises the steps:
S1, by the mode of nano impression, nanostructured pattern is impressed on impression materials, on described impression materials, form the micro-nano structure groove corresponding with nanostructured pattern;
S2, the coating of nanometer conductive material is carried out in the described surface with micro-nano structure groove, described nanometer conductive material is inserted in micro-nano structure groove, carry out sintering, form receiving circuit layer;
S3, at the insulating material of described receiving layer circuit layer surface-coated or printing layer of transparent, at described insulating material surface-coated impression materials, and nano impression forms micro-nano structure groove on impression materials;
S4, the micro-nano structure groove surfaces coating nanometer conductive material obtaining at nano impression, remove the nanometer conductive material beyond groove by polishing mode, carries out sintering, the complete formation radiating circuit of sintering layer;
S5, outside the FPC binding region on radiating circuit layer surface, be coated with protective seam.
As a further improvement on the present invention, when described coating or printing insulating material, by the mode of half tone or hollow out mask protection, avoid the pin field of receiving circuit layer to be insulated material covering; In described step S1 and S3, during nano impression, by the mode of mask protection, avoid the FPC binding region of receiving circuit layer and the FPC binding region of radiating circuit layer to be stamped material and cover.
For realizing above-mentioned another goal of the invention, the present invention also provides a kind of method for making of preparing ultra-thin touch sensing as above, and it comprises the steps:
S1, by the mode of nano impression, nanostructured pattern is impressed on impression materials, on described impression materials, form the micro-nano structure groove corresponding with nanostructured pattern;
S2, the coating of nanometer conductive material is carried out in the described surface with micro-nano structure groove, described nanometer conductive material is inserted in micro-nano structure groove, carry out sintering, form receiving circuit layer;
S3, at described receiving layer circuit layer surface-coated impression materials, and on impression materials nano impression micro-nano structure groove;
S4, the micro-nano structure groove surfaces coating nanometer conductive material obtaining at nano impression, remove the nanometer conductive material beyond groove by polishing mode, carries out sintering, the complete formation radiating circuit of sintering layer;
S5, outside the FPC binding region on radiating circuit layer surface, be coated with protective seam.
As a further improvement on the present invention, in described step S1 and S3, during nano impression, by the mode of mask protection, avoid the FPC binding region of receiving circuit layer and the FPC binding region of radiating circuit layer to be stamped material and cover.
Compared with prior art, the invention has the beneficial effects as follows: the radiating circuit layer of ultra-thin touch sensing of the present invention and receiving circuit layer are arranged at the homonymy of substrate layer, and radiating circuit layer and receiving circuit layer are all made by metallic conduction material, reduce the thickness of ultra-thin touch sensing, there is environmental protection, low cost, highly sensitive advantage.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, the accompanying drawing the following describes is only some embodiment that record in the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the cut-open view of ultra-thin touch sensing of the present invention;
Fig. 2 is radiating circuit layer under a kind of embodiment of the present invention or the part-structure schematic diagram of receiving circuit layer;
Fig. 3 is radiating circuit layer under another embodiment of the present invention or the part-structure schematic diagram of receiving circuit layer;
Fig. 4 is the enlarged diagram of circle A in Fig. 2;
Fig. 5 is the method flow schematic diagram of an embodiment of the method for making of ultra-thin touch sensing of the present invention.
Embodiment
In order to make those skilled in the art person understand better the technical scheme in the present invention, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, should belong to the scope of protection of the invention.
As shown in Figure 1, ultra-thin touch sensing 100 of the present invention comprises and stacks gradually as follows substrate layer 1, receiving circuit layer 2, radiating circuit layer 4 and the protective seam 5 of arranging.Wherein, described radiating circuit layer 2, receiving circuit layer 4 separate and arrange, and the two is positioned at the homonymy of described substrate layer 1.The insulation course 3 that plays insulating effect is set between described radiating circuit layer 2 and receiving circuit layer 4, and preferably, the material of this insulation course 3 is resin.
In addition, described substrate layer 1 can be poly-carbonic acid junket (Polycarbonate, PC), Polyvinylchloride (Polyvinyl Chloride, PVC), polyester (Polyethylene terephthalate, PET), PEN (Polyethylene naphthalate, PEN), the material such as polycarbonate (Polycarbanate, PC).Described protective seam 5 also comprises optics glue-line, and preferably, this optical cement comprises liquid ultraviolet optical cement.
As shown in Figure 2 and Figure 3, further, described radiating circuit layer 2 and receiving circuit layer 4 comprise: multiple conductive grids 21 and embossed layer 22, described multiple conductive grids 21 are embedded in described embossed layer 22.In addition, described multiple conductive grid 21 surroundings are also provided with frame 23.Particularly, described multiple conductive grid 21 is interconnected to form an entirety, described frame 23 forms the framed structure of a closure, and the entirety that described multiple conductive grids 21 form is arranged in the space that described frame 23 surrounds, and the conductive grid 21 outside being positioned at contacts with frame 23.
Ultra-thin touch sensing of the present invention is by described conductive grid and embossed layer; the radiating circuit layer or the receiving circuit layer that by multiple grids, are formed have been formed; its thickness minimum value only has 5～10 μ m; add the thickness 20 μ m～200 μ m of substrate layer 1; the thickness 10 μ m～100 μ m of insulation course 3, and the thickness of protective seam 5, the gross thickness of ultra-thin touch sensing of the present invention can reach 40um for the thinnest; compare traditional touch sensing, there is very large advantage.
In addition, described conductive grid 21 comprises at least three mesh lines 211 that connect in turn, is provided with a cross section, and it parallels with conductive grid 211, and this cross section is simultaneously by each mesh lines 211 of conductive grid 21, thereby conductive grid 211 is a polygon by shape that cross section is cut.Exemplarily, this polygon can be rectangle or square or pentagon or hexagon.Further, the width of described mesh lines 211 is more than or equal to 1 μ m, and the scope of the depth-width ratio of described mesh lines 211 is 1:0.5～1:2.
Cooperation is with reference to shown in Fig. 4, as one preferred embodiment, described mesh lines 211 comprises some the first mesh lines 2111 and some the second mesh lines 2112, described some the first mesh lines 2111 are arranged mutually parallel along first direction, described some the second mesh lines 2112 are arranged between described the first mesh lines 2111 and perpendicular to described the first mesh lines 2111, and the second mesh lines 2112 of described arbitrary the first mesh lines 2111 both sides is dislocatedly distributed.Thereby described some the first mesh lines 2111 and some the second mesh lines 2112 intersect to form described multiple conductive grid 21 mutually.In present embodiment, the cross sectional shape of the conductive grid 21 forming can be rectangle or square, and between two conductive grids of arbitrary neighborhood or shared same the second mesh lines, or common sparing the first mesh lines, multiple conductive grid rules as above are arranged.
In addition, the material of described conductive grid 21 is nano level metal conductive material or organic conductive material, and particularly, nano level metal conductive material can be: Nano Silver, Nanometer Copper etc., and when nano level metal conductive material is Nano Silver, the particle diameter of Nano Silver is less than 1000nm.
As shown in Figure 5, the present invention also provides a kind of method for making of ultra-thin touch sensing, and this method for making can be used for preparing ultra-thin touch sensing as above, and described method for making comprises the steps:
S1, by the mode of nano impression, nanostructured pattern is impressed on impression materials, on described impression materials, form the micro-nano structure groove corresponding with nanostructured pattern.
Described nanostructured pattern can be set to various shape according to the actual requirements.Wherein, the width of described micro-nano structure groove is more than or equal to 1 μ m, and the degree of depth of described micro-nano structure groove and the ratio range of width are 1:0.5～1:2.
S2, the coating of nanometer conductive material is carried out in the described surface with micro-nano structure groove, described nanometer conductive material is inserted in micro-nano structure groove, carry out sintering, form the receiving circuit layer of capacitive transducer.
Described nanometer conductive material is in described micro-nano structure groove after moulding, form the shape matching with micro-nano structure groove, for example, when micro-nano structure groove specifically comprises the chase unit of multiple mesh shapes, the nanometer conductive material of moulding also comprises multiple conductive grids.Wherein, described nanometer conductive material can be nano level metal conductive material or organic conductive material, described nano level metal conductive material comprises Nano Silver, Nanometer Copper etc., and when nano level metal conductive material is Nano Silver, the particle diameter of described Nano Silver is less than 1000nm.
S3, at the insulating material of described receiving layer circuit layer surface-coated or printing layer of transparent, at described insulating material surface-coated impression materials, and nano impression forms micro-nano structure groove on impression materials.
Wherein, when described coating or printing insulating material, by the mode of half tone or hollow out mask protection, avoid the pin region of receiving circuit layer to be insulated material covering.In addition, in described step S1 and S3, during nano impression, by the mode of mask protection, avoid the FPC binding region of receiving circuit layer and the FPC binding region of radiating circuit layer to be stamped material and cover.Preferably, described mask can be the film, now, and the light transmission part of the corresponding film in FPC binding region, and the black shading light part of the corresponding film of part of covering impression materials; Thereby making FPC binding district not be stamped material covers.
S4, the micro-nano structure groove surfaces coating nanometer conductive material obtaining at nano impression, remove the nanometer conductive material beyond groove by polishing mode, carries out sintering, the complete formation radiating circuit of sintering layer.
S5, outside the FPC binding region on radiating circuit layer surface, be coated with protective seam.
In addition the opposite side that, this method for making is also included in radiating circuit layer arranges a substrate layer.
For ultra-thin touch sensing as above, the present invention also provides a kind of method for making of ultra-thin touch sensing, this method for making is with method for making difference as above, in step S3, during coating impression materials, the directly surface with described receiving layer circuit layer by impression materials coating, and on impression materials nano impression micro-nano structure groove.Now, impression materials both, as the carrier of nano impression, also played insulating effect as insulating material simultaneously.
In this method for making, similarly, when nano impression, by the mode of mask protection, avoid the FPC binding region of receiving circuit layer and the FPC binding region of radiating circuit layer to be stamped material and cover.
Compared with prior art, the radiating circuit layer of ultra-thin touch sensing of the present invention and receiving circuit layer are arranged at the homonymy of substrate layer, and radiating circuit layer and receiving circuit layer are all made by metallic conduction material, reduce the thickness of ultra-thin touch sensing, there is environmental protection, low cost, highly sensitive advantage.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned example embodiment, and in the situation that not deviating from spirit of the present invention or essential characteristic, can realize the present invention with other concrete form.Therefore, no matter from which point, all should regard embodiment as exemplary, and be nonrestrictive, scope of the present invention is limited by claims rather than above-mentioned explanation, is therefore intended to all changes that drop in the implication and the scope that are equal to important document of claim to include in the present invention.Any Reference numeral in claim should be considered as limiting related claim.
In addition, be to be understood that, although this instructions is described according to embodiment, but be not that each embodiment only comprises an independently technical scheme, this narrating mode of instructions is only for clarity sake, those skilled in the art should make instructions as a whole, and the technical scheme in each embodiment also can, through suitably closing, form other embodiments that it will be appreciated by those skilled in the art that.
Claims (10)
1. a ultra-thin touch sensing, is characterized in that, described ultra-thin touch sensing comprises:
Stack gradually substrate layer, receiving circuit layer, radiating circuit layer and the protective seam of arranging, described receiving circuit layer and radiating circuit layer are positioned at the homonymy of described substrate layer;
Described radiating circuit layer and receiving circuit layer comprise: multiple conductive grids and embossed layer, described multiple conductive grid is embedded in described embossed layer, described conductive grid comprises at least three mesh lines that connect in turn, the width of described mesh lines is more than or equal to 1 μ m, and the scope of the depth-width ratio of described mesh lines is 1:0.5～1:2.
2. ultra-thin touch sensing as claimed in claim 1, is characterized in that, the shape of cross section of described conductive grid is polygon.
3. ultra-thin touch sensing as claimed in claim 1, it is characterized in that, described mesh lines comprises some the first mesh lines and some the second mesh lines, described some the first mesh lines are arranged mutually parallel along first direction, described some the second mesh lines are arranged between described the first mesh lines and perpendicular to described the first mesh lines, and the second mesh lines of described arbitrary the first mesh lines both sides is dislocatedly distributed.
4. ultra-thin touch sensing as claimed in claim 1, is characterized in that, the material of described conductive grid is nano level metal conductive material or organic conductive material.
5. ultra-thin touch sensing as claimed in claim 1, is characterized in that, described protective seam comprises optics glue-line.
6. ultra-thin touch sensing as claimed in claim 1, is characterized in that, described radiating circuit layer, receiving circuit layer separate and arrange, and between described radiating circuit layer and receiving circuit layer, described insulation course are set.
7. a method for making of preparing the ultra-thin touch sensing as described in claim 1-6 any one, is characterized in that, described method for making comprises the steps:
S1, by the mode of nano impression, nanostructured pattern is impressed on impression materials, on described impression materials, form the micro-nano structure groove corresponding with nanostructured pattern;
S2, the coating of nanometer conductive material is carried out in the described surface with micro-nano structure groove, described nanometer conductive material is inserted in micro-nano structure groove, carry out sintering, form receiving circuit layer;
S3, at the insulating material of described receiving layer circuit layer surface-coated or printing layer of transparent, at described insulating material surface-coated impression materials, and nano impression forms micro-nano structure groove on impression materials;
S4, the micro-nano structure groove surfaces coating nanometer conductive material obtaining at nano impression, remove the nanometer conductive material beyond groove by polishing mode, carries out sintering, the complete formation radiating circuit of sintering layer;
S5, outside the FPC binding region on radiating circuit layer surface, be coated with protective seam.
8. the method for making of ultra-thin touch sensing as claimed in claim 7, is characterized in that, when described coating or printing insulating material, by the mode of half tone or hollow out mask protection, avoids the pin field of receiving circuit layer to be insulated material covering; In described step S1 and S3, during nano impression, by the mode of mask protection, avoid the FPC binding region of receiving circuit layer and the FPC binding region of radiating circuit layer to be stamped material and cover.
9. a method for making of preparing the ultra-thin touch sensing as described in claim 1-5 any one, is characterized in that, described method for making comprises the steps:
S1, by the mode of nano impression, nanostructured pattern is impressed on impression materials, on described impression materials, form the micro-nano structure groove corresponding with nanostructured pattern;
S2, the coating of nanometer conductive material is carried out in the described surface with micro-nano structure groove, described nanometer conductive material is inserted in micro-nano structure groove, carry out sintering, form receiving circuit layer;
S3, at described receiving layer circuit layer surface-coated impression materials, and on impression materials nano impression micro-nano structure groove;
S4, the micro-nano structure groove surfaces coating nanometer conductive material obtaining at nano impression, remove the nanometer conductive material beyond groove by polishing mode, carries out sintering, the complete formation radiating circuit of sintering layer;
S5, outside the FPC binding region on radiating circuit layer surface, be coated with protective seam.
10. the method for making of ultra-thin touch sensing as claimed in claim 9; it is characterized in that; in described step S1 and S3, during nano impression, by the mode of mask protection, avoid the FPC binding region of receiving circuit layer and the FPC binding region of radiating circuit layer to be stamped material and cover.
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