CN104050484B - Fingerprint Identification sensor, integrated package and electronic device - Google Patents
Fingerprint Identification sensor, integrated package and electronic device Download PDFInfo
- Publication number
- CN104050484B CN104050484B CN201410313038.4A CN201410313038A CN104050484B CN 104050484 B CN104050484 B CN 104050484B CN 201410313038 A CN201410313038 A CN 201410313038A CN 104050484 B CN104050484 B CN 104050484B
- Authority
- CN
- China
- Prior art keywords
- driving electrodes
- electrode
- induction electrode
- fingerprint
- detection element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001514 detection method Methods 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 230000006698 induction Effects 0.000 claims description 84
- 239000010410 layer Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 2
- 239000013528 metallic particle Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 239000002322 conducting polymer Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- -1 graphite Alkene Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005057 finger movement Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
This application involves fingerprint Identification sensor, integrated package and electronic devices.The integrated package of a kind of touch sensor and fingerprint sensor includes：First flexible and transparent substrate；First embossed layer is formed in the first flexible and transparent substrate, and the first coining layer surface is provided with multiple first grooves and multiple second grooves；First electrode layer is arranged in the multiple first groove；Fingerprint detection element and a plurality of leads being connect with the fingerprint detection element are arranged in the multiple second groove；Second flexible and transparent substrate is arranged on the part of first embossed layer；Second embossed layer is formed in the second flexible and transparent substrate, and the second coining layer surface is provided with multiple third grooves；The second electrode lay is arranged in the multiple third groove, and the first electrode layer and the second electrode lay are for constituting touch sensor.
Description
Technical field
This disclosure relates to which fingerprint Identification sensor, senses in particular to a kind of swiping formula (swipe) fingerprint recognition
Device, touch sensor and fingerprint sensor integrated package and including the electronics of the fingerprint Identification sensor or the integrated package fill
It sets.
Background technology
The certain biological characteristics of human body (such as finger print/palm print) are the unique features of human body, and their complexity energy
Enough enough feature quantities provided for discriminating.
The identification technologies such as finger print/palm print fingerprint are current most ripe and cheap biometrics identification technologies.Fingerprint
Identification technology is widely used.We are not only it can be seen that the figure of fingerprint identification technology, city in gate inhibition, attendance checking system
There is the application of more fingerprint recognitions on field：As laptop, mobile phone, automobile, bank paying all can employing fingerprint identify
Technology.In particular with the continuous development of smart mobile phone, will occur largely such as utilizing fingerprint with the relevant demand of fingerprint recognition
Identification unlock mobile phone, protection privacy information, guarantee transaction security etc..
Sensor for fingerprint recognition includes resistance sensor, optical sensor and capacitance type sensor etc..
Capacitance type fingerprint identification sensor is typically formed on monocrystalline silicon substrate, therefore is existed when finger force presses
Splintering problem occurs.In order to solve the problems, such as silicon chip receive user press many times or it is improper press and it is flimsy, now determine
The general silicon substrate using the higher sapphire protection fingerprint sensor of hardness.But sapphire cost is higher, causes entirely to refer to
Line identifying system cost is higher.It is generally formed by cmos semiconductor technique using the fingerprint sensor of silicon substrate, this method work
Skill is complicated, causes the capacitance type fingerprint identification sensor production cost based on silicon substrate expensive.
Fingerprint Identification sensor is manufactured to need to form certain amount sensing unit on base material such as silicon substrate.If induction is single
The lazy weight of member, then the resolution ratio of fingerprint recognition is low, this will lead to not accurately carry out fingerprint recognition or need user more
Secondary input fingerprint and keep user experience poor.In addition, the base material area of fingerprint Identification sensor is relatively limited.In limited areal
The fingerprint sensor for forming high-resolution is also a technological challenge.
Some fingerprinting schemes, for example, Apple Inc. a scheme, also need increase a drive ring.This drive ring
On the one hand it for providing electric field to user's finger, is on the other hand used to be electromagnetically shielded to prevent external electromagnetic field from producing fingerprint recognition
Raw interference.This causes entire fingerprint recognition component complicated, increases cost.
It needs a kind of to form sufficient amount sensing unit on limited areal base material or further increase fingerprint recognition
The scheme of resolution ratio.
Above- mentioned information is only used for reinforcing the understanding to the background of the disclosure, therefore it disclosed in the background technology part
May include the information not constituted to the prior art known to persons of ordinary skill in the art.
Invention content
The application discloses a kind of fingerprint Identification sensor and the electronic device including the fingerprint Identification sensor, can reduce
Cost, and sufficient amount driving electrodes can be formed on limited areal base material to improve fingerprint recognition resolution ratio.
Other characteristics and advantages of the disclosure will be apparent from by the following detailed description, or partially by the disclosure
Practice and acquistion.
According to one aspect of the disclosure, a kind of integrated package of touch sensor and fingerprint sensor is provided, including：The
One flexible and transparent substrate；First embossed layer is formed in the first flexible and transparent substrate, the first coining layer surface setting
There are multiple first grooves and multiple second grooves；First electrode layer is arranged in the multiple first groove；Fingerprint detection element
And a plurality of leads being connect with the fingerprint detection element, it is arranged in the multiple second groove；Second flexible and transparent substrate,
It is arranged on the part of first embossed layer；Second embossed layer is formed in the second flexible and transparent substrate, described second
Coining layer surface is provided with multiple third grooves；The second electrode lay is arranged in the multiple third groove, the first electrode
Layer and the second electrode lay are for constituting touch sensor, wherein the fingerprint detection element includes：First induction electrode；It is more
The first driving electrodes of item, a plurality of first driving electrodes are arranged in parallel and are separated from each other, a plurality of first driving electrodes
It is opposite to define multiple first detector gaps at interval with first induction electrode respectively；Second induction electrode, and it is described
First induction electrode is parallelly oppositely arranged and positioned at the opposite with a plurality of first driving electrodes of first induction electrode
Side；A plurality of second driving electrodes, a plurality of second driving electrodes are arranged in parallel and are separated from each other, and described a plurality of second
Driving electrodes are opposite to define multiple second detector gaps at interval with second induction electrode respectively, and described a plurality of second
Driving electrodes are arranged in correspondence with a plurality of first driving electrodes in the second electrode and the first induction electrode phase
Anti- side.
According to some embodiments, the pitch between pitch and adjacent second driving electrodes between adjacent first driving electrodes
Be equal to each other and in 50-60 μ ms, the width of the width of the first driving electrodes and the second driving electrodes be equal to each other and
In 20-45 μ ms, the size of the first detector gap and the second detector gap is equal to each other and in 20-40 μ m.
According to some embodiments, the first flexible and transparent substrate and the second flexible and transparent substrate are PET film.
According to some embodiments, first embossed layer and second embossed layer are ultraviolet-curing resin, hot-setting adhesive, light
Solid glue or from dry glue.
According to some embodiments, the first electrode layer, the second electrode lay and/or the fingerprint detection element include
Conductive grid.
According to another aspect of the present disclosure, a kind of electronic device is provided, including such as aforementioned any one of them integrated package.
According to some embodiments, electronic device further includes transparent cover plate, and the transparent cover plate has top surface, opposite with top surface
Bottom surface and connect top and bottom side, the transparent cover plate includes viewing area and non-display area, the integrated package
The bottom surface is fitted in by OCA, and bends and fitted in by OCA the non-display area of the side and the top surface,
The wherein described fingerprint detection element is located on the top surface, and a plurality of leads extends to the bottom surface from the top surface.
According to some embodiments, the first flexible and transparent substrate than the second flexible and transparent substrate closer to or it is farther
From the transparent cover plate.
According to some embodiments, electronic device further includes the protective layer for covering the fingerprint detection element.
According to another aspect of the present disclosure, a kind of fingerprint Identification sensor is provided, including：Substrate；It is formed in substrate
Embossed layer, the coining layer surface are provided with multiple grooves；And fingerprint detection element, it is placed in the multiple groove；Wherein
The fingerprint detection element includes：First induction electrode；A plurality of first driving electrodes, the parallel cloth of a plurality of first driving electrodes
It sets and is separated from each other, a plurality of first driving electrodes are opposite more to define at interval with first induction electrode respectively
A first detector gap；Second induction electrode is parallelly oppositely arranged with first induction electrode and feels positioned at described first
Answer the side opposite with a plurality of first driving electrodes of electrode；A plurality of second driving electrodes, a plurality of second driving electricity
Pole is arranged side by side and is separated from each other, and a plurality of second driving electrodes are opposite at interval with second induction electrode respectively
To define multiple second detector gaps, a plurality of second driving electrodes are arranged in correspondence with a plurality of first driving electrodes
The side opposite with first induction electrode of the second electrode.
According to some embodiments, the pitch between pitch and adjacent second driving electrodes between adjacent first driving electrodes
Be equal to each other and in 50-60 μ ms, the width of the width of the first driving electrodes and the second driving electrodes be equal to each other and
In 20-45 μ ms, the size of the first detector gap and the second detector gap is equal to each other and in 20-40 μ m.
According to some embodiments, the fingerprint detection element further includes the first reference electrode and the second reference electrode and a plurality of
First illusory driving electrodes and a plurality of second illusory driving electrodes, first reference electrode are parallel with first induction electrode
Ground is oppositely arranged and is located at the side opposite with a plurality of first driving electrodes of first induction electrode, second ginseng
Electrode is examined parallelly to be oppositely arranged with second induction electrode and positioned at second induction electrode and described a plurality of second
The opposite side of driving electrodes, a plurality of first illusory driving electrodes are arranged in parallel and are electrically connected to each other, and described a plurality of first
Illusory driving electrodes are arranged in correspondence with a plurality of first driving electrodes in first reference electrode and first sense
The side that electrode is opposite, a plurality of second illusory driving electrodes is answered to be arranged in parallel and be electrically connected to each other, described a plurality of second is empty
If driving electrodes are arranged in correspondence with a plurality of second driving electrodes in second reference electrode and second induction
The opposite side of electrode.
According to some embodiments, the fingerprint detection element includes metallic particles, graphene, carbon nanotube or conductive polymer
Sub- material.
According to some embodiments, the fingerprint detection element includes conductive grid.
According to another aspect of the present disclosure, a kind of electronic device is provided, including such as aforementioned any one of them fingerprint recognition
Sensor.
According to some embodiments of the disclosure, electrode and lead are formed on non-silicon-based bottom by using embossed layer, it can
To improve the reliability of sensor, and the fingerprint sensor of high-resolution can be formed in limited areal at lower cost.Root
According to some embodiment of the disclosure, a kind of integrated package of touch sensor and fingerprint sensor is provided, cost can be reduced,
Component wear caused by when avoiding forming improves yield rate.
Description of the drawings
Its example embodiment is described in detail by referring to accompanying drawing, the above and other feature and advantage of the disclosure will become
It is more obvious.
Fig. 1 schematically shows the fundamental diagram of capacitance type fingerprint detecting element；
Fig. 2 schematically shows the structure chart of the swiping formula fingerprint Identification sensor according to one example embodiment of the disclosure；
Fig. 3 schematically shows the sectional view obtained along the AA ' lines of Fig. 1；
Fig. 4 schematically shows the sectional view obtained along the BB ' lines of Fig. 1；
Fig. 5 schematically shows the conductive grid that can be used for fingerprint detection element；
Fig. 6 schematically shows the structure chart of the swiping formula fingerprint Identification sensor according to one example embodiment of the disclosure；
Fig. 7 shows a plurality of linear fingerprint image obtained when swiping moves above fingerprint Identification sensor when finger；
Fig. 8 shows the complete finger print image that a plurality of linear fingerprint pattern pieces together；
Fig. 9 schematically shows the structural schematic diagram of the fingerprint detection element according to one example embodiment of the disclosure；
Figure 10 schematically shows the structural schematic diagram of the fingerprint detection element according to one example embodiment of the disclosure；
Figure 11 schematically shows the electronic device according to one example embodiment of the disclosure；
Figure 12 is schematically shown according to the collection of the touch sensor of disclosure example embodiment and fingerprint sensor in groups
Part；And
Figure 13 schematically shows the electronic device according to disclosure example embodiment, is integrated including shown in Figure 12
Component.
Specific implementation mode
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, thesing embodiments are provided so that the disclosure will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.In the figure in order to clear
It is clear, exaggerate the thickness of region and layer.Identical reference numeral indicates same or similar part in figure, thus will omit it
Detailed description.
In addition, described feature, structure or characteristic can be incorporated in one or more implementations in any suitable manner
In example.In the following description, many details are provided to fully understand embodiment of the disclosure to provide.However,
It will be appreciated by persons skilled in the art that can be with technical solution of the disclosure without one in the specific detail or more
It is more, or other methods, constituent element, material may be used etc..In other cases, be not shown in detail or describe known features,
Material or operation are to avoid fuzzy all aspects of this disclosure.
The disclosure provides a kind of fingerprint Identification sensor and the electronic device including the fingerprint Identification sensor, can reduce
Cost, and sufficient amount driving electrodes can be formed on limited areal base material to improve fingerprint recognition resolution ratio.
Fig. 1 schematically shows the fundamental diagram of capacitance type fingerprint detecting element.
As shown in Figure 1, capacitance type fingerprint detecting element includes fingerprint identification unit, and cover with protective layer 117.Fingerprint is known
Other unit may include induction electrode 101 and driving electrodes 103, have a detector gap 107 therebetween.Fingerprint identification unit is
It is multiple, and uniline or multirow can be arranged, a fingerprint identification unit is only shown in figure.The induction electrode 101 of fingerprint identification unit
A basic capacitor is may make up with driving electrodes 103.
When finger 190 presses above fingerprint identification unit or when swiping, between induction electrode 101 and driving electrodes 103
Capacitive coupling can have different changes above detector gap 107 according to fingerprint ridge 192 or fingerprint valley 194.This be because
Dielectric constant for fingerprint ridge is typically 10 to 20 times of air (fingerprint valley).Therefore, fingerprint identification unit compares under fingerprint ridge
There is bigger equivalent capacity under fingerprint valley.By detecting the capacitance variations (or voltage change thereon) of fingerprint identification unit,
It can be determined that above the unit be fingerprint ridge or fingerprint valley, to obtain fingerprint image.
Fig. 2 schematically shows the structure chart of the swiping formula fingerprint Identification sensor according to one example embodiment of the disclosure.
Fig. 3 shows the sectional view that the AA ' lines along Fig. 2 obtain.Fig. 4 shows the sectional view that the BB ' lines along Fig. 2 obtain.
As in Figure 2-4, fingerprint Identification sensor 100 include substrate 111, the embossed layer 113 that is formed in substrate 111 with
And it is formed in the fingerprint detection element 110 in embossed layer 113.113 surface of embossed layer is provided with multiple grooves 115, fingerprint detection
Element 110 is placed in groove 115.According to example embodiment, fingerprint detection element 110 can be filled up completely groove 115, that is, refer to
The upper surface of line detecting element 110 is concordant with the upper surface of embossed layer 113, and but the present disclosure is not limited thereto.
As shown in Fig. 2, fingerprint detection element 110 includes induction electrode 101 and a plurality of driving opposite with induction electrode 101
Electrode 103.A plurality of driving electrodes 103 can be arranged in parallel and be separated from each other.Induction electrode 101 can be with a plurality of driving electrodes 103
It is substantially vertical.A plurality of driving electrodes 103 are spaced apart to define multiple detector gaps 107 respectively with induction electrode 101.Every drive
Moving electrode 103 may make up a fingerprint identification unit with induction electrode 101, to induction electrode 101 and 103 structure of a plurality of driving electrodes
At multiple fingerprint identification units.
Pitch d between adjacent driven electrode 103 can be equal to each other.The width w1 of driving electrodes 103 can be equal to each other.Sense
Answer the width w2 of electrode 101 that can be equal to each other with the width w1 of driving electrodes 103.The size of detector gap 107 can be equal to each other.
But the disclosure is not limited.
As shown in Figures 3 and 4, the pitch d between adjacent driven electrode 103 for example can be in 40-60 μ ms.Driving electrodes
103 width w1 for example can be in 20-45 μ ms.The width g of detector gap 107 for example can be in 20-40 μ ms.Detection
The width g in gap 107 can be equal to each other.The depth of groove 115 for example can be in 20nm-10 μ ms.The width of induction electrode 101
Spending w2 for example can be in 50-60 μ m.
According to an embodiment, the pitch d between adjacent driven electrode 103 is 50 μm, and the identification for realizing 508PPI is differentiated
Rate.
Substrate 111 can be strengthened glass, tempered glass, ceramics, sapphire or PET, PMMA, PC etc..Substrate 111
May be flexible printed circuit board (FPC) substrate, such as BT, FR4, FR5.
Embossed layer 113 may be, for example, as ultraviolet-curing resin, hot-setting adhesive, light binding or from dry glue.
The material of induction electrode 101 and driving electrodes 103 may be the same or different.It forms induction electrode 101 and drives
The material of moving electrode 103 can be selected from the one or two of ITO (tin indium oxide) or metal simple-substance particle such as gold, silver, copper, zinc, aluminium
Above, metal alloy conductive material, graphene, carbon nano-tube material, nanometer conductive material such as nano silver etc., but the disclosure is unlimited
In this.
According to an example embodiment, induction electrode 101 and driving electrodes 103 may include conductive grid 105, such as Fig. 5 institutes
Show.At this moment, groove 115 has structure corresponding with conductive grid 105.Using conductive grid, cost is reduced, but still can reach
The good result of fingerprint recognition.
Fingerprint Identification sensor 100 may also include lead (not shown), be connect with fingerprint detection element 110, for that will refer to
Line detecting element 110 is connected to external circuit, such as fingerprint recognition circuit 109.Lead can be also placed in groove, and can be had
Material identical with induction electrode 101 and driving electrodes 103.Lead may also comprise conductive grid.
Fingerprint recognition circuit 109 can sequentially provide drive signal to driving electrodes 103, and can be examined by induction electrode 101
Inductive signal is surveyed, to identify fingerprint.But the present disclosure is not limited thereto.
According to the fingerprint Identification sensor of disclosure embodiment, electrode is formed on non-silicon-based bottom by using embossed layer
And lead, the reliability of sensor can be improved, and the fingerprint of high-resolution can be formed in limited areal at lower cost
Sensor.
When finger pressing is above the fingerprint Identification sensor with structure as shown in Figure 2, know from the multiple fingerprint
Other unit can get the linear fingerprint image of reflection a fingerprint ridge and fingerprint valley.When finger is sliding above fingerprint Identification sensor
When wiping mobile, a plurality of linear fingerprint image is can get, as shown in Figure 6.The a plurality of linear fingerprint pattern capable assembling is complete at one
Whole fingerprint image, as shown in Figure 7.
The manufacturing method of fingerprint Identification sensor according to disclosure embodiment is described below.
First, prepare substrate 111, such as PET base.Then, embossed layer 113 can be formed in substrate 111.Embossed layer
113 can be ultraviolet-curing resin, hot-setting adhesive, light binding or from dry glue etc..Then, in table of the embossed layer 113 far from substrate 111
Groove 115 is formed by imprint process on face.Groove 115 can be for example latticed according to actual needs.
Then, doctor blade technique can be used to fill such as silver ink in groove 115, and under the conditions of about 150 DEG C
Baking sintering, makes the silver-colored simple substance in silver ink sinter conducting electrode patterns into, to form induction electrode 101 and driving electricity
Pole 103, and lead is formed as needed.According to an embodiment, silver ink water solid content about 35%, solvent volatilizees in sintering.
Fig. 8 schematically shows the structural schematic diagram of the fingerprint detection element according to another example embodiment of the disclosure.
As shown in figure 8, fingerprint detection element 210 according to the present embodiment and fingerprint detection element 110 shown in Fig. 2
Further include reference electrode 101 ' and illusory driving electrodes 103 ' difference lies in fingerprint detection element 210.
Reference electrode 101 ' can be parallelly oppositely arranged with induction electrode 101, and positioned at induction electrode 101 and a plurality of drive
The opposite side of moving electrode 103.
Reference electrode 101 ' is enough to provide noise at least partly to eliminate common-mode noise and post at a distance from driving electrodes 103
Raw coupling reference.In some embodiments, reference electrode 101 ' and induction electrode 101 can have equal length and width,
And it can be arranged in parallel.Reference electrode 101 ' can be similar to induction electrode 101 and sense fingerprint ridge/fingerprint valley signal like that, but
Its substantial remitted its fury.Reference electrode 101 ' is closely spaced with induction electrode 101 and has similar size, two electricity
Pole can generate roughly equal noise and parasitic signal.The noise and parasitic signal of equal coupling can be for example by subtracting two
Signal on electrode and be eliminated.
According to some embodiments, induction electrode 101 and reference electrode 101 ' can be coupled to difference by difference filter 123
Amplifier 125.
A plurality of illusory driving electrodes 103 ' parallel arrangement and can be electrically connected to each other, a plurality of illusory driving electrodes 103 ' with
A plurality of driving electrodes 103 are arranged in correspondence in the other side of reference electrode 101 ', i.e. the side opposite with induction electrode 101.
Illusory driving electrodes 103 ' are spaced apart with reference electrode 101 ' with gap 107 '.It gap 107 ' can be with 107 phase of gap
Together.Illusory driving electrodes 103 ' can be connected to reference potential during fingerprint image senses, such as be grounded.In fingerprint image sense
Any instant of time surveyed, one in driving electrodes 103 can be encouraged by drive signal, and remaining driving electrodes 103
It can be coupled to reference potential, such as be grounded.Using the arrangement, noise is coupled substantially equally to induction electrode 101 and reference
Electrode 101 ', so as to be eliminated for example, by difference amplifier 125.The circuit arrangement eliminated or reduce noise jamming can root
Various modes, the disclosure are taken to be limited not to this according to actual demand.
According to the embodiment, the accuracy of fingerprint recognition can be improved, eliminate the coupling of the fingerprint ridge outside detector gap
Close interference.
Fig. 9 schematically shows the structural schematic diagram of the fingerprint detection element according to another example embodiment of the disclosure.
As shown in figure 9, fingerprint detection element 310 according to the present embodiment and fingerprint detection element 110 shown in Fig. 2
Further include the second induction electrode 101 " and a plurality of second driving electrodes 103 " difference lies in fingerprint detection element 310.Second induction
Electrode 101 " can be electrically connected with induction electrode 101.
Second induction electrode 101 " is parallel with induction electrode 101 and is set up in parallel, and positioned at induction electrode 101 with it is a plurality of
The opposite side of driving electrodes 103.
A plurality of second driving electrodes 103 " are arranged in parallel and are separated from each other.A plurality of second driving electrodes 103 " are respectively with
Two induction electrodes 101 " are opposite to define multiple second detector gaps 107 " at interval.A plurality of second driving electrodes 103 " with it is more
The first driving electrodes of item 103 are arranged in correspondence with the side opposite with induction electrode 101 of the second induction electrode 101 ".
In the present embodiment, pass through driving electrodes 103, induction electrode 101 and the second driving electrodes 103 ", the second induction
Electrode 101 " constitutes a pair of line imaging device, for generating more accurate fingerprint image.By finger first pass through detector gap 107 or
107 " determine the moving direction of finger.In addition, can be become by comparing the signal of induction electrode 101 and the second induction electrode 101 "
Change determine finger movement speed (such as：The time for passing through detector gap 107 and 107 " by calculating identical fingerprint portion
Difference obtains the movement speed of finger), more accurate fingermark image is obtained with this.
Figure 10 schematically shows the structural schematic diagram of the fingerprint detection element according to another example embodiment of the disclosure.
As shown in Figure 10, fingerprint detection element 410 according to the present embodiment combines Fig. 8 and fingerprint shown in Fig. 9 inspection
Survey element.Difference lies in fingerprint detection elements 410 also to wrap with fingerprint detection element 310 shown in Fig. 9 for fingerprint detection element 410
Include two reference electrodes 101 ' and two groups of a plurality of illusory driving electrodes 103 '.Two groups of a plurality of illusory driving electrodes 103 ' can be electric each other
Connection.
One reference electrode 101 ' can be parallelly oppositely arranged with induction electrode 101 and positioned at induction electrode 101 with it is more
The opposite side of driving electrodes 103.Another reference electrode 101 ' can be parallelly oppositely arranged simultaneously with the second induction electrode 101 "
Positioned at the side opposite with a plurality of second driving electrodes 103 " of the second induction electrode 101 ".
One group of a plurality of illusory driving electrodes 103 ' is arranged in parallel and is electrically connected to each other.The a plurality of illusory driving electrodes of the group 103 '
It is arranged in correspondence in the side opposite with induction electrode 101 of reference electrode 101 ' with a plurality of driving electrodes 103.Another group a plurality of
Illusory driving electrodes 103 ' are arranged in parallel and are electrically connected to each other.The a plurality of illusory driving electrodes 103 ' of the group and a plurality of second driving electricity
Pole 103 " is arranged in correspondence in the side opposite with the second induction electrode 101 " of reference electrode 101 '.
Other aspects of fingerprint detection element 410 according to the present embodiment are similar with aforementioned fingerprint detecting element, herein
It repeats no more.
Figure 11 schematically shows the electronic device 500 according to one example embodiment of the disclosure, wherein may include above-mentioned
Fingerprint Identification sensor.Electronic device 500 is such as can be smart mobile phone, tablet computer.
As shown, electronic device includes transparent cover plate 501.Transparent cover plate 501 includes viewing area 511 and non-display area
515.Fingerprint Identification sensor may be disposed at viewing area 511 or non-display area 515.
According to some embodiments, a part for the non-display area of transparent cover plate is used as the substrate 111 of fingerprint Identification sensor.
Figure 12 is schematically shown according to the collection of the touch sensor of disclosure example embodiment and fingerprint sensor in groups
Part 600.
As shown in figure 12, the integrated package 600 of touch sensor and fingerprint sensor includes the first flexible and transparent substrate 611
With the first embossed layer 613.First embossed layer 613 is formed in the first flexible and transparent substrate 611, and 613 surface of the first embossed layer is set
It is equipped with multiple first grooves 615 and multiple second grooves 617.
Integrated package 600 further includes：First touch electrode layer 619 is arranged in multiple first grooves 615；And fingerprint
Detecting element 616 and a plurality of leads 618 being connect with fingerprint detection element 616 are arranged in multiple second grooves 617.
Integrated package 600 further includes：Second flexible and transparent substrate 621 is arranged on the part of the first embossed layer 613；With
And second embossed layer 623, it is formed in the second flexible and transparent substrate 621.It is recessed that second embossed layer, 623 surface is provided with multiple thirds
Slot 625.
Integrated package 600 further includes：Second touch electrode layer 629 is arranged in multiple third grooves 625.
First touch electrode layer 619 and the second touch electrode layer 629 are for constituting touch sensor, for brevity,
This is repeated no more.
The technique for manufacturing the integrated package is similar with the manufacture technique of fingerprint Identification sensor noted earlier, herein no longer
It repeats.Fingerprint Identification sensor noted earlier can be applied in integrated package 600, therefore repeat no more.According to some implementations
Example, the first flexible and transparent substrate 611 and the second flexible and transparent substrate 621 are PET film.
According to the embodiment of the disclosure, it is possible to provide a kind of integrated package of touch sensor and fingerprint sensor.By
Identical technique can be utilized to be fabricated to integrated package simultaneously in touch sensor and fingerprint Identification sensor, therefore can reduced into
This.Furthermore it is possible to which component wear caused by when avoiding composition, improves yield rate.
Figure 13 schematically shows the electronic device 700 according to disclosure example embodiment, shown in Figure 12
Integrated package.Electronic device 700 can be mobile phone, tablet computer etc..Figure 13 provides diagram by taking mobile phone as an example, but the disclosure not with
This is limited.
As shown in figure 13, electronic device 700 may include transparent cover plate 630.Transparent cover plate 630 has top surface 631 and top surface
631 opposite bottom surfaces 633 and the side 635 for connecting top surface 631 and bottom surface 633.Transparent cover plate 630 includes 636 He of viewing area
Non-display area 638.
Integrated package can fit in bottom surface 633 by OCA layers 651, and bend and fit in 635 He of side by OCA layers
The non-display area 638 of top surface 631.Fingerprint detection element 616 is located on top surface 631.A plurality of leads 618 is extended to from top surface 631
Bottom surface 633.
Set-up mode of the integrated package 600 on transparent cover plate is not limited to shown in Figure 13.For example, it is also possible to make the first flexibility
Transparent substrates 611 are adjacent with transparent cover plate 630, and bottom surface 633 is fitted in by OCA layers 651.
According to some embodiments, electronic device 700 may also include the protective layer 653 of covering fingerprint detection element 616, use
In protection fingerprint detection element 616.Protective layer 653 can be such as diamond-like-carbon, silica or UV glue.Protective layer can lead to
It crosses spraying technology or printing technology is formed.
First touch electrode layer 619 and the second touch electrode layer 629 and lead 618 can pass through 641 electricity of different side's conducting resinl
It is connected to external circuit, such as flexible printed circuit board 643, but the disclosure is not limited.
It is particularly shown and described the illustrative embodiments of the disclosure above.It should be understood that the present disclosure is not limited to institute
Disclosed embodiment, on the contrary, the disclosure is intended to cover the various modifications comprising in the spirit and scope of the appended claims
And equivalent arrangements.
Claims (15)
1. the integrated package of a kind of touch sensor and fingerprint sensor, including：
First flexible and transparent substrate；
First embossed layer is formed in the first flexible and transparent substrate, and the first coining layer surface is provided with multiple first
Groove and multiple second grooves；
First electrode layer is arranged in the multiple first groove；
Fingerprint detection element and a plurality of leads being connect with the fingerprint detection element are arranged in the multiple second groove；
Second flexible and transparent substrate is arranged on the part of first embossed layer；
Second embossed layer is formed in the second flexible and transparent substrate, and the second coining layer surface is provided with multiple thirds
Groove；
The second electrode lay is arranged in the multiple third groove, and the first electrode layer and the second electrode lay are used for structure
At touch sensor,
The wherein described fingerprint detection element includes：
First induction electrode；
A plurality of first driving electrodes, a plurality of first driving electrodes are arranged in parallel and are separated from each other, and described a plurality of first drives
Moving electrode is opposite to define multiple first detector gaps at interval with first induction electrode respectively；
Second induction electrode is parallelly oppositely arranged with first induction electrode and positioned at first induction electrode and institute
State the opposite side of a plurality of first driving electrodes；
A plurality of second driving electrodes, a plurality of second driving electrodes are arranged in parallel and are separated from each other, and described a plurality of second drives
Moving electrode is opposite to define multiple second detector gaps at interval with second induction electrode respectively, and described a plurality of second drives
Moving electrode is arranged in correspondence with a plurality of first driving electrodes in second induction electrode and first induction electrode
Opposite side；
Wherein, first groove, second groove and the third groove are formed by imprint process.
2. integrated package as described in claim 1, wherein the pitch between adjacent first driving electrodes and adjacent second driving
Pitch between electrode is equal to each other and in 50-60 μ m, the width of the width of the first driving electrodes and the second driving electrodes
Degree is equal to each other and in 20-45 μ ms, the size of the first detector gap and the second detector gap is equal to each other and in 20-40
In μ m.
3. integrated package as described in claim 1, wherein the first flexible and transparent substrate and the second flexible and transparent base
Bottom is PET film.
4. integrated package as claimed in claim 3, wherein first embossed layer and second embossed layer are ultra-violet curing
Resin, hot-setting adhesive, light binding or from dry glue.
5. integrated package as claimed in claim 4, wherein the first electrode layer, the second electrode lay and/or the finger
Line detecting element includes conductive grid.
6. a kind of electronic device, including such as integrated package described in any one of claim 1 to 5.
7. electronic device as claimed in claim 6 further includes transparent cover plate, the transparent cover plate have top surface, with top surface phase
To bottom surface and connect the sides of top and bottom, the transparent cover plate includes viewing area and non-display area, and the collection is in groups
Part fits in the bottom surface by OCA, and bends and fit in the described non-display of the side and the top surface by OCA
Area, wherein the fingerprint detection element is located on the top surface, a plurality of leads extends to the bottom surface from the top surface.
8. electronic device as claimed in claim 7, wherein the first flexible and transparent substrate is than the second flexible and transparent base
Bottom is closer to or further from the transparent cover plate.
9. electronic device as claimed in claim 7 further includes the protective layer for covering the fingerprint detection element.
10. a kind of fingerprint Identification sensor, including：
Substrate；
The embossed layer being formed in substrate, the coining layer surface are provided with multiple grooves；And
Fingerprint detection element is placed in the multiple groove；
The wherein described fingerprint detection element includes：
First induction electrode；
A plurality of first driving electrodes, a plurality of first driving electrodes are arranged in parallel and are separated from each other, and described a plurality of first drives
Moving electrode is opposite to define multiple first detector gaps at interval with first induction electrode respectively；
Second induction electrode is parallelly oppositely arranged with first induction electrode and positioned at first induction electrode and institute
State the opposite side of a plurality of first driving electrodes；
A plurality of second driving electrodes, a plurality of second driving electrodes are arranged side by side and are separated from each other, and described a plurality of second drives
Moving electrode is opposite to define multiple second detector gaps at interval with second induction electrode respectively, and described a plurality of second drives
Moving electrode is arranged in correspondence with a plurality of first driving electrodes in second induction electrode and first induction electrode
Opposite side；
Wherein, the multiple groove is formed by imprint process.
11. fingerprint Identification sensor as claimed in claim 10, wherein pitch between adjacent first driving electrodes and adjacent
Pitch between second driving electrodes is equal to each other and in 50-60 μ m, the width of the first driving electrodes and the second driving
The width of electrode is equal to each other and in 20-45 μ m, and the size of the first detector gap and the second detector gap is equal to each other
And in 20-40 μ ms.
12. fingerprint Identification sensor as claimed in claim 11, wherein the fingerprint detection element further includes the first reference electricity
Pole and the second reference electrode and a plurality of first illusory driving electrodes and a plurality of second illusory driving electrodes,
First reference electrode is parallelly oppositely arranged with first induction electrode and positioned at first induction electrode
The side opposite with a plurality of first driving electrodes, second reference electrode and second induction electrode are parallelly opposite
It is arranged and is located at the side opposite with a plurality of second driving electrodes of second induction electrode,
The a plurality of first illusory driving electrodes are arranged in parallel and are electrically connected to each other, a plurality of first illusory driving electrodes and institute
A plurality of first driving electrodes are stated to be arranged in correspondence in the side opposite with first induction electrode of first reference electrode,
The a plurality of second illusory driving electrodes are arranged in parallel and are electrically connected to each other, a plurality of second illusory driving electrodes and institute
A plurality of second driving electrodes are stated to be arranged in correspondence in the side opposite with second induction electrode of second reference electrode.
13. fingerprint Identification sensor as claimed in claim 11, wherein the fingerprint detection element includes metallic particles, graphite
Alkene, carbon nanotube or conducting polymer composite.
14. fingerprint Identification sensor as claimed in claim 13, wherein the fingerprint detection element includes conductive grid.
15. a kind of electronic device includes the fingerprint Identification sensor as described in any one of claim 10 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410313038.4A CN104050484B (en) | 2014-07-02 | 2014-07-02 | Fingerprint Identification sensor, integrated package and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410313038.4A CN104050484B (en) | 2014-07-02 | 2014-07-02 | Fingerprint Identification sensor, integrated package and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104050484A CN104050484A (en) | 2014-09-17 |
| CN104050484B true CN104050484B (en) | 2018-07-31 |
Family
ID=51503296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410313038.4A Expired - Fee Related CN104050484B (en) | 2014-07-02 | 2014-07-02 | Fingerprint Identification sensor, integrated package and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104050484B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106295477A (en) * | 2015-06-03 | 2017-01-04 | 小米科技有限责任公司 | A kind of terminal carrying out fingerprint recognition |
| WO2020151011A1 (en) * | 2019-01-25 | 2020-07-30 | 深圳市柔宇科技有限公司 | Flexible touch sensor electrode and manufacturing method therefor |
| CN110764657A (en) * | 2019-12-25 | 2020-02-07 | 南昌欧菲光科技有限公司 | Touch layer, touch module and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2178026B1 (en) * | 2008-10-17 | 2011-11-30 | Acer Incorporated | Fingerprint detection device and method and associated touch control device with fingerprint detection |
| CN102566840A (en) * | 2010-11-02 | 2012-07-11 | 爱特梅尔公司 | Capacitive sensor, device and method |
| CN103530609A (en) * | 2013-10-11 | 2014-01-22 | 北京京东方光电科技有限公司 | Fingerprint identification element, display screen and display device |
| CN103744571A (en) * | 2014-01-26 | 2014-04-23 | 苏州维业达触控科技有限公司 | Ultrathin touch sensor and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8866347B2 (en) * | 2010-01-15 | 2014-10-21 | Idex Asa | Biometric image sensing |
| CN103778410B (en) * | 2014-01-10 | 2017-09-22 | 南昌欧菲光科技有限公司 | Condenser type biometric sensor |
| CN104050466B (en) * | 2014-07-02 | 2019-03-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor, integrated package and electronic device |
| CN203930866U (en) * | 2014-07-02 | 2014-11-05 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor, integrated package and electronic installation |
-
2014
- 2014-07-02 CN CN201410313038.4A patent/CN104050484B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2178026B1 (en) * | 2008-10-17 | 2011-11-30 | Acer Incorporated | Fingerprint detection device and method and associated touch control device with fingerprint detection |
| CN102566840A (en) * | 2010-11-02 | 2012-07-11 | 爱特梅尔公司 | Capacitive sensor, device and method |
| CN103530609A (en) * | 2013-10-11 | 2014-01-22 | 北京京东方光电科技有限公司 | Fingerprint identification element, display screen and display device |
| CN103744571A (en) * | 2014-01-26 | 2014-04-23 | 苏州维业达触控科技有限公司 | Ultrathin touch sensor and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104050484A (en) | 2014-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104036264B (en) | Manufacture method, fingerprint Identification sensor and the electronic device of fingerprint Identification sensor | |
| CN104156714B (en) | Fingerprint Identification sensor and electronic device | |
| CN104050464B (en) | Manufacture method, fingerprint Identification sensor and the electronic device of fingerprint Identification sensor | |
| CN104050465B (en) | Fingerprint Identification sensor and electronic installation | |
| CN103778410B (en) | Condenser type biometric sensor | |
| CN104050405B (en) | Fingerprint identification detection assembly and electronic device thereof | |
| CN104036172B (en) | Fingerprint recognition detection components and its electronic installation | |
| CN104036173B (en) | Fingerprint recognition detection assembly and electronic device thereof | |
| CN104077573A (en) | Fingerprint recognition sensor, fingerprint recognition detection assembly and terminal device | |
| CN203838717U (en) | Capacitive biological feature identifying sensor | |
| CN106022207B (en) | Biometric identification device | |
| CN104050484B (en) | Fingerprint Identification sensor, integrated package and electronic device | |
| CN104050466B (en) | Fingerprint Identification sensor, integrated package and electronic device | |
| CN104077575B (en) | Push type fingerprint Identification sensor and electronic device | |
| CN104077574B (en) | Push type fingerprint Identification sensor and electronic device | |
| CN203930866U (en) | Fingerprint Identification sensor, integrated package and electronic installation | |
| CN104063695B (en) | Push type fingerprint Identification sensor and electronic installation | |
| CN204028943U (en) | Fingerprint Identification sensor and electronic installation | |
| CN204009943U (en) | Fingerprint Identification sensor, integrated package and terminal device | |
| CN104036265B (en) | Fingerprint Identification sensor and electronic device | |
| CN104063697B (en) | Fingerprint recognition detection components and its electronic installation | |
| CN203930873U (en) | Fingerprint Identification sensor, integrated package and electronic installation | |
| CN104091154B (en) | Fingerprint Identification sensor, integrated package and terminal device | |
| CN203930871U (en) | Fingerprint Identification sensor and electronic installation | |
| CN203930872U (en) | Fingerprint Identification sensor and electronic installation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant after: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: OFilm Tech Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: Shenzhen OFilm Tech Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20180620 Address after: 510507 Shenzhou Road, 7, Guangdong science and Technology Development Zone, Guangzhou Applicant after: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) Co.,Ltd. Applicant after: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: OFilm Tech Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: OFilm Tech Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 510507 Shenzhou Road, 7, Guangdong science and Technology Development Zone, Guangzhou Patentee after: Guangzhou delta Imaging Technology Co.,Ltd. Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 510507 Shenzhou Road, 7, Guangdong science and Technology Development Zone, Guangzhou Patentee before: Guangzhou delta Imaging Technology Co.,Ltd. Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 510507 Shenzhou Road, 7, Guangdong science and Technology Development Zone, Guangzhou Patentee after: Guangzhou delta Imaging Technology Co.,Ltd. Patentee after: OFilm Microelectronics Technology Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 510507 Shenzhou Road, 7, Guangdong science and Technology Development Zone, Guangzhou Patentee before: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) Co.,Ltd. Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180731 Termination date: 20210702 |