CN105038210A - PA10T compound heat dissipation material for dirt-resistant and ageing-resistant LED lamp and preparation method of PA10T compound heat dissipation material - Google Patents

PA10T compound heat dissipation material for dirt-resistant and ageing-resistant LED lamp and preparation method of PA10T compound heat dissipation material Download PDF

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Publication number
CN105038210A
CN105038210A CN201510348235.4A CN201510348235A CN105038210A CN 105038210 A CN105038210 A CN 105038210A CN 201510348235 A CN201510348235 A CN 201510348235A CN 105038210 A CN105038210 A CN 105038210A
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China
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pa10t
heat dissipation
parts
dissipation material
resistant
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CN201510348235.4A
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Chinese (zh)
Inventor
秦廷廷
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Fuyang City Light Illuminates Bright Science And Technology Ltd
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Fuyang City Light Illuminates Bright Science And Technology Ltd
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Priority to CN201510348235.4A priority Critical patent/CN105038210A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/92—Measuring, controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/242—Applying crosslinking or accelerating agent onto compounding ingredients such as fillers, reinforcements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00—Indexing scheme relating to extrusion moulding
    • B29C2948/92—Measuring, controlling or regulating
    • B29C2948/92504—Controlled parameter
    • B29C2948/9258—Velocity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00—Indexing scheme relating to extrusion moulding
    • B29C2948/92—Measuring, controlling or regulating
    • B29C2948/92504—Controlled parameter
    • B29C2948/92704—Temperature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

A PA10T compound heat dissipation material for a dirt-resistant and ageing-resistant LED lamp is prepared from the following raw materials in parts by weight: 40-42 parts of magnesium oxide, 20-22 parts of boron nitride, 2-3 parts of chopped glass fiber, 30-32 parts of polyamide PA10T, 7-8 parts of aluminum oxide whisker, 1-2 parts of maleic anhydride grafted polyethylene, 1-2 parts of polytetrafluoroethylene micro powder, 0.4-0.6 part of a cross linking agent TAIC, 0.4-0.6 part of nano chitin, 1-1.5 parts of polyvinyl butyral, 3-4 parts of ethyl alcohol and 3-4 parts of SEBS. According to the PA10T compound heat dissipation material, through the use of magnesium oxide and boron nitride, an excellent compound and synergetic heat dissipation effect is achieved; SEBS is utilized for modification of boron nitride, so that the notch impact strength of the PA10T compound heat dissipation material is improved; through the use of the polytetrafluoroethylene micro powder and nano chitin, the PA10T compound heat dissipation material has excellent dirt-resistant and ageing-resistant performance; through the use of maleic anhydride grafted polyethylene and the cross linking agent TAIC, the stretching and bending strength of the PA10T compound heat dissipation material is improved.

Description

A kind of anti-soiling aging-resisting LED PA10T composite heat dissipation material and preparation method thereof
Technical field
The present invention relates to LED heat sink material field, particularly relate to a kind of anti-soiling aging-resisting LED PA10T composite heat dissipation material and preparation method thereof.
Background technology
The thermal conductivity of most metallic substance is better, but the erosion resistance of metallic substance is bad, limits the application in the fields such as its heat exchanger, heat pipe, solar water heater and water reservoir water cooler in Chemical Manufacture and wastewater treatment.Compare with metallic substance, the insulation of plastics, corrosion-resistant, chemical resistance good, and light weight, inexpensive, easy processing, shaping energy consumption are low, is widely used, such as, can be used as electronic package material in the field such as electric.
Utilize high heat-conducting ceramic as aluminium nitride, boron nitride etc. for needing the device of insulating radiation more.Because the difficulty of processing of ceramic product is high, easily break, people start to seek the good polymkeric substance of easy processing, impact resistance to prepare insulating heat-conductive matrix material.
Unbound electron and the ion of conduction current and heat energy is generally there is not in polymer molecular chain.The imperfection of polymer crystallization, also limits the conduction of phonon to heat energy, and therefore polymer materials is the poor conductor of heat mostly, even if the high density polyethylene(HDPE) that thermal conductivity is best, its thermal conductivity is also only 0.44W/mK.But polymer materials has, and quality is light, easily processing, high-performance and low price advantage, needing the numerous areas such as the electronics of product " movement " and on-the-spot " construction ", electrical equipment and information technology to have active demand to high-strength, high-ductility, light weight, easily processing and thermal conductive polymer based composites, key to improve polymer bond (completing quick heat radiating) performance.So polymer materials heat conduction functionalization becomes one of advanced subject of polymer science and engineering subject.
The insulating resin based composites that research and development have high thermal conductivity has urgent practical significance.The most convenient efficient manner of current raising macromolecular material heat conductivility carries out composite heat-conducting modification to current material.
Heat resistant polyamide PA10T is a kind of bio-based semiaromatic polyamide composition, there is excellent mechanical property, thermotolerance and processing characteristics, water-intake rate is low, the advantage such as good stability of the dimension and resistance to chemical attack, is mainly used in electric, LED, automobile and other industries.But, the thermal conductivity of heat resistant polyamide PA10T is less, thus limit its application in some fields, as junctor, motor, transformer, solenoid coil, winding around system led illuminating and heat radiating etc., be therefore necessary the modification it being carried out to heat conductivility aspect.In existing method of modifying, filling heat conductive filler and there is the advantages such as cost is low, equipment simple, applicable scale operation, being best suited for the method as improving PA10T heat conductivility.
Boron nitride has atomic crystal form and fine and close structure, and based on phonon thermal conduction, thermal conductivity is very high, and the thermal expansivity of boron nitride is minimum in pottery in addition, and high temperature insulation characteristic is very outstanding, is that good height insulate high heat conductive filler.Although magnesium oxide thermal conductivity is lower, its low price.
Above-mentioned two kinds of fillers are carried out effective compounded combination, the heat conductive insulating matrix material that thermal conductivity is high, cost is low, formability is excellent may be obtained, can be widely used in insulating requirements higher while require again the LED illumination field of radiating of excellent heat conducting performance.Adopt boron nitride microsphere powder and spherical magnesium oxide as composite heat conductive filler, a small amount of short glass fiber is as reinforcing filler, prepare the high temperature resistant PA10T matrix material of heat conductive insulating, excellent radiation performance, but mechanical property is good not, thermal diffusivity can not meet the requirement of some relatively high power equipment, and weather resistance can not be guaranteed, and needs to improve.
Summary of the invention
The object of the present invention is to provide a kind of anti-soiling aging-resisting LED PA10T composite heat dissipation material, this composite heat dissipation material has good anti-soil and ageing-resistant performance, stretch and flexural strength high.
Technical scheme of the present invention is as follows:
A kind of anti-soiling aging-resisting LED PA10T composite heat dissipation material, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, maleic anhydride grafted polyethylene 1-2, ptfe micropowder 1-2, linking agent TAIC0.4-0.6, nano-chitosan 0.4-0.6, polyvinyl butyral acetal 1-1.5, ethanol 3-4, SEBS3-4.
The production method of described anti-soiling aging-resisting LED PA10T composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin and all dissolve, add ptfe micropowder, nano-chitosan again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, linking agent TAIC, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Beneficial effect of the present invention
Composite heat dissipation material of the present invention employs magnesium oxide, boron nitride, create good composite collaborative radiating effect, by using SEBS, modification is carried out to boron nitride, the notched Izod impact strength of material is improved, by using short glass fiber, alumina whisker, through modification, thermal conductivity and the mechanical property of matrix material are improved, and electrical property remains on higher level; By using ptfe micropowder, nano-chitosan, material is made to have good anti-soil and ageing-resistant performance; By using maleic anhydride grafted polyethylene, linking agent TAIC, improve stretching and the flexural strength of material.
Embodiment
A kind of anti-soiling aging-resisting LED PA10T composite heat dissipation material, is made up of the raw material of following weight part (kilogram): magnesium oxide 41, boron nitride 21, short glass fiber 2.5, polymeric amide PA10T31, alumina whisker 7.5, maleic anhydride grafted polyethylene 1.5, ptfe micropowder 1.5, linking agent TAIC0.5, nano-chitosan 0.5, polyvinyl butyral acetal 1.3, ethanol 3.5, SEBS3.5.
The production method of described anti-soiling aging-resisting LED PA10T composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 81 DEG C, be stirred to resin and all dissolve, add ptfe micropowder, nano-chitosan again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, linking agent TAIC, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 5h at 130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Experimental data: the normal direction thermal conductivity of this heat sink material is 3.22W/mK.

Claims (2)

1. an anti-soiling aging-resisting LED PA10T composite heat dissipation material, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, maleic anhydride grafted polyethylene 1-2, ptfe micropowder 1-2, linking agent TAIC0.4-0.6, nano-chitosan 0.4-0.6, polyvinyl butyral acetal 1-1.5, ethanol 3-4, SEBS3-4.
2. the production method of anti-soiling aging-resisting LED PA10T composite heat dissipation material according to claim 1, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin and all dissolve, add ptfe micropowder, nano-chitosan again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, linking agent TAIC, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
CN201510348235.4A 2015-06-23 2015-06-23 PA10T compound heat dissipation material for dirt-resistant and ageing-resistant LED lamp and preparation method of PA10T compound heat dissipation material Pending CN105038210A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101899209A (en) * 2010-03-30 2010-12-01 金发科技股份有限公司 Heat conductive insulation material and preparation method thereof
CN103044904A (en) * 2012-12-27 2013-04-17 安徽科聚新材料有限公司 Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101899209A (en) * 2010-03-30 2010-12-01 金发科技股份有限公司 Heat conductive insulation material and preparation method thereof
CN103044904A (en) * 2012-12-27 2013-04-17 安徽科聚新材料有限公司 Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
周文英、丁小卫著: "《导热高分子材料》", 30 April 2014, 北京：国防工业出版社 *
田琼主编: "《童装设计》", 30 April 2015, 北京：中国纺织出版社 *
钱颂文主编: "《换热器设计手册》", 31 August 2002, 化学工业出版社 *

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