CN105033456B - 覆涂层衬底和切割覆涂层衬底的工艺 - Google Patents
覆涂层衬底和切割覆涂层衬底的工艺 Download PDFInfo
- Publication number
- CN105033456B CN105033456B CN201510181898.1A CN201510181898A CN105033456B CN 105033456 B CN105033456 B CN 105033456B CN 201510181898 A CN201510181898 A CN 201510181898A CN 105033456 B CN105033456 B CN 105033456B
- Authority
- CN
- China
- Prior art keywords
- sapphire
- barrier layer
- absorption
- sapphire substrate
- absorber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 208
- 238000000034 method Methods 0.000 title claims abstract description 72
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 349
- 239000010980 sapphire Substances 0.000 claims abstract description 349
- 238000005520 cutting process Methods 0.000 claims abstract description 40
- 230000008569 process Effects 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims description 57
- 230000008018 melting Effects 0.000 claims description 41
- 238000002844 melting Methods 0.000 claims description 41
- 238000003698 laser cutting Methods 0.000 claims description 39
- 230000004888 barrier function Effects 0.000 claims description 19
- 230000004927 fusion Effects 0.000 claims description 18
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 238000005498 polishing Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 238000005240 physical vapour deposition Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims description 2
- 239000010437 gem Substances 0.000 claims 1
- 229910001751 gemstone Inorganic materials 0.000 claims 1
- 238000012216 screening Methods 0.000 claims 1
- 239000006096 absorbing agent Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 185
- 230000003287 optical effect Effects 0.000 description 19
- 230000001681 protective effect Effects 0.000 description 17
- 238000012545 processing Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000976 ink Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 5
- 229920006255 plastic film Polymers 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052593 corundum Inorganic materials 0.000 description 4
- 239000010431 corundum Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 230000000977 initiatory effect Effects 0.000 description 3
- 239000002648 laminated material Substances 0.000 description 3
- 229920005787 opaque polymer Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007518 final polishing process Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461981637P | 2014-04-18 | 2014-04-18 | |
| US61/981,637 | 2014-04-18 | ||
| US14/575,754 | 2014-12-18 | ||
| US14/575,754 US10537963B2 (en) | 2014-04-18 | 2014-12-18 | Coated substrate and process for cutting a coated substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105033456A CN105033456A (zh) | 2015-11-11 |
| CN105033456B true CN105033456B (zh) | 2018-04-27 |
Family
ID=54321205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510181898.1A Expired - Fee Related CN105033456B (zh) | 2014-04-18 | 2015-04-17 | 覆涂层衬底和切割覆涂层衬底的工艺 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10537963B2 (enExample) |
| JP (2) | JP6563674B2 (enExample) |
| CN (1) | CN105033456B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106808091B (zh) * | 2015-11-27 | 2018-12-07 | 南京魔迪多维数码科技有限公司 | 针对二维和三维脆性材料基板进行加工的激光系统 |
| EP3606309B1 (en) * | 2017-03-30 | 2023-09-06 | FUJIFILM Corporation | Electromagnetic wave absorber and method for producing electromagnetic wave absorber |
| CN110560923A (zh) * | 2019-08-23 | 2019-12-13 | 福建华清电子材料科技有限公司 | 一种氮化铝陶瓷激光加工工艺 |
| CN113031325B (zh) * | 2021-03-09 | 2022-10-11 | 厦门天马微电子有限公司 | 异形显示面板及显示装置 |
| CN114131182A (zh) * | 2021-12-21 | 2022-03-04 | 苏州沃特维自动化系统有限公司 | 一种散热膜辅助激光切割电池片结构及其工艺 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52111097A (en) * | 1976-03-13 | 1977-09-17 | Toshiba Corp | Laser processing method |
| JPS55151351A (en) | 1979-05-16 | 1980-11-25 | Mitsubishi Electric Corp | Cutting method of semiconductor chip |
| JPS62183984A (ja) * | 1986-02-07 | 1987-08-12 | Nippon Kokan Kk <Nkk> | レ−ザ−クラツデイング方法 |
| US5178725A (en) * | 1990-04-04 | 1993-01-12 | Mitsubishi Denki Kabushiki Kaisha | Method for working ceramic material |
| JP2682230B2 (ja) | 1990-11-14 | 1997-11-26 | 三菱電機株式会社 | レーザ加工方法 |
| KR20020019419A (ko) * | 2000-09-05 | 2002-03-12 | 이데이 노부유끼 | 박막 제조 방법, 반도체 박막, 반도체 디바이스, 반도체박막 제조 방법, 및 반도체 박막 제조 장치 |
| JP2004042140A (ja) * | 2002-07-12 | 2004-02-12 | Hitachi Zosen Corp | 薄膜除去方法及び装置 |
| JP4471632B2 (ja) | 2003-11-18 | 2010-06-02 | 株式会社ディスコ | ウエーハの加工方法 |
| US20050156353A1 (en) * | 2004-01-15 | 2005-07-21 | Watts Michael P. | Method to improve the flow rate of imprinting material |
| US7700413B2 (en) * | 2004-04-20 | 2010-04-20 | Showa Denko K.K. | Production method of compound semiconductor light-emitting device wafer |
| JP4683989B2 (ja) | 2004-04-20 | 2011-05-18 | 昭和電工株式会社 | 化合物半導体発光素子ウェハーの製造方法 |
| US20060032841A1 (en) * | 2004-08-10 | 2006-02-16 | Tan Kee C | Forming features in printhead components |
| JP4854061B2 (ja) | 2005-01-14 | 2012-01-11 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用保護シート |
| JP2006231628A (ja) * | 2005-02-23 | 2006-09-07 | Murata Mfg Co Ltd | セラミックグリーンシートの加工方法 |
| WO2008114470A1 (ja) * | 2007-03-16 | 2008-09-25 | Sharp Kabushiki Kaisha | プラスチック基板の切断方法、及びプラスチック基板の切断装置 |
| FR2935916B1 (fr) * | 2008-09-12 | 2011-08-26 | Air Liquide | Procede et installation de coupage laser avec modification du facteur de qualite du faisceau laser |
| JP2013006200A (ja) | 2011-06-27 | 2013-01-10 | Disco Corp | レーザ加工装置 |
| EP2564999A1 (en) * | 2011-08-31 | 2013-03-06 | Asahi Glass Company, Limited | A method of generating a high quality hole or recess or well in a substrate |
| CN103645818A (zh) * | 2013-11-26 | 2014-03-19 | 浙江上城科技有限公司 | 一种蓝宝石触摸屏及其制备方法 |
-
2014
- 2014-12-18 US US14/575,754 patent/US10537963B2/en active Active
-
2015
- 2015-04-17 CN CN201510181898.1A patent/CN105033456B/zh not_active Expired - Fee Related
- 2015-04-17 JP JP2015084703A patent/JP6563674B2/ja not_active Expired - Fee Related
-
2017
- 2017-03-14 JP JP2017048598A patent/JP2017114761A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017114761A (ja) | 2017-06-29 |
| US20150298251A1 (en) | 2015-10-22 |
| JP6563674B2 (ja) | 2019-08-21 |
| CN105033456A (zh) | 2015-11-11 |
| US10537963B2 (en) | 2020-01-21 |
| JP2015205344A (ja) | 2015-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180427 |