CN105032718B - A kind of continuity level dipping coating system and method - Google Patents
A kind of continuity level dipping coating system and method Download PDFInfo
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- CN105032718B CN105032718B CN201510353804.4A CN201510353804A CN105032718B CN 105032718 B CN105032718 B CN 105032718B CN 201510353804 A CN201510353804 A CN 201510353804A CN 105032718 B CN105032718 B CN 105032718B
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Abstract
The invention belongs to coating technique field, a kind of continuity level dipping coating system and method are disclosed.Continous way level dipping coating system includes robot, control centre of robot and circulation slide rail, and robot be connected with control centre of robot signal, and the robot slidingtype is arranged on circulation slide rail, circulates slide rail for robot cycle slip；The robot is provided with motion arm, and the motion arm front end sets several suckers for being used to adsorb substrate base, and robot drives motion arm action；Circulation slide rail is provided with coated solution groove and rinse bath by side.The present invention becomes one dipping plated film, cleaning treatment and drying process, overcome the defect that process is discontinuous, time-consuming in the prior art, full-automatic, the high stability production of any area dipping plated film can be achieved, and overcome vertical lifting and be immersed in the defect that serious confonnality deviations occurs in upper, middle and lower region, level dipping plated film each point is consistent, with excellent uniformity.
Description
Technical field
The invention belongs to coating technique field, and in particular to a kind of continuity level dipping coating system and method.
Background technology
Equipment for producing thin film refers to be prepared into lining by preparing the equipment of film by multi-function membrane on clean substrate
On bottom and possesses certain specific function.And impregnate plated film and refer to a certain specific substrate being impregnated into specific solution, so that
The film preparation mode for possessing certain function is formed on substrate.
It is domestic at present that to be made relatively ripe in terms of plated film is impregnated be by the way of Best-Effort request plated film.Dipping
Lifting plated film is also referred to as vertical lifting plated film, by the way of vertically lifting, by controlling pull rate, lifting time, plated film
The optimization of number and plated film spacing parameter is so as to realize the effect to form functional membrane.Vertical lifting mode is skill the more commonly used at present
Art, but there are many limitations in it：
1st, functional membrane is uneven.Film uniform difference of the functional membrane of vertical lifting plated film formation in each region in upper, middle and lower
Property can reach 10% or so, even more greatly.In particular for large area vertical lifting plated film when, the bottom of substrate is to enter earliest
Enter into solution, solution is left the latest, cause under dipping plating conditions on an equal basis, the solution accompanying by the region of upper, middle and lower has
Very big difference, so as to have influence on the optically and electrically characteristic of final functional membrane；
2nd, vertical lifting plated film uses the mode of fixture at present, the wide cut of fixture gripping glass edge it is optimal
10mm or so, during vertical plated film, these clamp bases can be immersed in solution or cleaning fluid, cause lifting process
In or the processing such as follow-up air-dried technique during, the current for having remnants re-enter into film surface, cause film surface to occur big
The defect of amount, so as to have influence on the steady production of technique.Generally, for fine plated film, it is not allow for fixture and touches
Substrate coated surface, because the region touched can not form plated film in the solution, can influence yield rate and final terminal to use；
3rd, because area increases, the uniformity of the functional membrane of vertical lifting plated film formation can be remarkably decreased, therefore vertical at present
The main scientific research field still applied in small area of lifting.It is vertical to lift the uniform of plated film for small area, such as 3cm*3cm
Property will not have an impact, and consider from scientific research angle to take middle most uniform point, without the uniformity for entire surface of worrying, and right
In large area, such as the substrate of 1400*1100mm, the requirement to its uniformity is then extremely harsh, and this is current vertical lifting
Mode can not stablize what is be achieved；
4th, vertical lifting plated film mode is not suitable for being switched fast for different-thickness substrate.During vertical lifting, solution
Groove design is that, with flat, high design, and substrate wants full wafer to be impregnated into bottom, it is meant that, solution face heavier with the weight of glass
What is risen is higher, easier to overflow.(T) mm of such as 1400 (L) * 1100 (W) * 3 and 1400 (L) * 1100 (W) * 4 (T) mm lining
Bottom, with homalographic, its weight difference 4.5KG, in the case of equal solution cell body volume, it may appear that different degrees of overflow,
Cause various substrates to need to go constantly to carry out fluid infusion by extra device when switching, increase additional investment cost；
5th, the beat of vertical lifting plated film takes long enough, and is influenceed by different sizes, different-thickness glass, it is lifted
Speed is very slow, otherwise easilys lead to that solution is unstable, and the unstable functional membrane for causing finally to be formed on substrate of solution is unstable
Determine, until influence uniformity.Especially, the functional membrane of most of dipping plated film is needed by the processes such as follow-up cleaning
Reason, then mean to take a substantial amount of time by the way of vertical lifting cleaning, so that can not large-scale production；
6th, vertical lifting plated film can be very sensitive to the defect and its attaching particles of substrate surface, during vertical lifting,
These defects or attaching particles are slided on functional membrane surface, are caused finally to form defect on functional membrane surface, are influenceed finally
Product yield；
7th, for the coated glass of architecture-integral, from safety considerations, its thickness of glass be 4mm, 6mm or
8mm or thicker, from outward appearance angle, builds extremely harsh to the appearance color coherence request of glass, it is meant that to uniformity
Requirement it is higher, therefore by the way of vertically lifting, its limitation can be highlighted more；
8th, for large area vertical lifting plated film is, it is necessary to design very deep solution cell body, such as 1.4 meters of high glass
Glass, it is meant that cell body is needed higher than 1.4 meters, and too deep solution tank, and bottom can be deposited to by being easily caused partial function solution, so that
Causing in cell body solution, concentration is stepped up from top to bottom, prepared by the uniformity for being unfavorable for functional membrane.
The content of the invention
In order to overcome the shortcoming and deficiency of prior art, primary and foremost purpose of the invention is to provide a kind of continous way level leaching
Stain coating system, can be achieved full-automatic, the high stability production of any area dipping plated film, process operation is greatly lowered and clear
Wash the spent time.
Realize that the technical scheme of above-mentioned purpose is as follows：
A kind of continous way level impregnates coating system, including robot, control centre of robot and circulation slide rail, robot
It is connected with control centre of robot signal, the robot slidingtype is arranged on circulation slide rail, circulation slide rail is used for robot
Circulation is slided；The robot is provided with motion arm, and the motion arm front end sets several suckers for being used to adsorb substrate base, machine
Device people drives motion arm to act；Circulation slide rail is provided with coated solution groove and rinse bath by side.
It is preferred that, the continous way level dipping coating system also includes substrate base prerinse and alignment system, described
Substrate base prerinse and alignment system are arranged at by circulation slide rail side, for carrying out prerinse to substrate base and positioning, with
Meet the requirement of follow-up filming process.
It is preferred that, the continous way level dipping coating system also includes drying system, and the drying system, which is arranged on, to follow
By ring slide rail side；It is preferred that, the drying system is oven or air blade device.
It is preferred that, the quantity of the robot is at least one；It is furthermore preferred that the quantity of the robot is 1~5.
It is preferred that, the horizontal cross-section of the coated solution groove is more than the area of substrate base.
It is preferred that, coated solution is placed in the coated solution groove, the coated solution is polystyrene microsphere solution, two
Silicon oxide microsphere solution or polymethyl methacrylate (PMMA) microspheres solution.
It is preferred that, the horizontal cross-section of the rinse bath is more than the area of substrate base.
It is preferred that, cleaning fluid is placed in the rinse bath, the cleaning fluid is deionized water.
It is preferred that, the substrate base is hard substrates, or deposits the hard substrates of functional film；
The function film is metal-oxide film or blended metal oxide film；The material of the function film is
Al-Doped ZnO, tin indium oxide, boron-doping zinc oxide, fluorine doped tin oxide or gallium-doped zinc oxide, or Al-Doped ZnO, tin indium oxide,
Boron-doping zinc oxide, fluorine doped tin oxide and both any mixing of gallium-doped zinc oxide.
The present invention also provides a kind of method that coating system progress plated film is impregnated using above-mentioned continous way level, including as follows
Step：
S01, absorption substrate base：The robot of starting point starts, and passes through the sucker suction substrate base on motion arm
The back side, subsequently into next step process；
Substrate base first through prerinse, improves the cleanliness factor of substrate base, and the motion arm for being then sent to robot is operable
In the range of and positioned, make the sucker of motion arm smoothly can be drawn from the back side of substrate base.Adjustment can be passed through
The quantity and adsorption strength of sucker are to adapt to different-thickness, various sizes of substrate base.
S02, coating film treatment：The robot for drawing substrate base is slid near coated solution groove by circulating slide rail,
The motion arm of absorption substrate base is located at directly over coated solution groove, adjusted by the control operation arm upset of control centre of robot
It is whole, make the face down of substrate base, then step-down operation arm immerses substrate base in coated solution, reaches dip time
Afterwards, substrate base is detached coated solution by lifting motion arm, subsequently into next step process；
When substrate base is immersed into coated solution, in the case where decrease speed ratio is very fast, solution can cause vibrations, and
Impulsive force is had to substrate base front, final functional membrane can be caused unstable.It is preferred, therefore, that the substrate base is entering
Enter before coated solution, adjustment motion arm makes the front of the substrate base of absorption have inclination angle with horizontal plane, and substrate base is immersed in
After coated solution, the front of substrate base is adjusted to level, reached after dip time, by the front of substrate base be adjusted to
Horizontal plane has inclination angle, and then substrate base is detached coated solution by lifting motion arm.It is furthermore preferred that the inclination angle is 3~15
Degree.
S03, cleaning treatment：Substrate base will draw the robot of substrate base by circulating slide rail after coating film treatment
Slide near rinse bath, the motion arm of absorption substrate base is located at directly over rinse bath, controlled by control centre of robot
Motion arm upset adjustment processed, makes the face down of substrate base, then step-down operation arm immerses substrate base in cleaning fluid, adjusts
Whole motion arm makes substrate base front drive motion arm parallel to horizontal plane, then by robot motion, makes what motion arm was drawn
Multidirectional reciprocating translational motion, to carry out level cleaning, reaches after scavenging period substrate base in the horizontal plane, stops level cleaning,
Substrate base is detached cleaning fluid by lifting motion arm, subsequently into next step process；
It is preferred that, the time of the level cleaning is 0.5~2min；
S04, drying process：After the cleaned processing of substrate base, the robot of substrate base will be drawn by circulating slide rail
Drying system is slid into, substrate base is put into drying system and air-dried, whole level dipping filming process is completed；Machine
Device people returns to starting point by circulating slide rail, and circulation carries out S01 to S04 operation.
It is preferred that, the drying system is oven, and the baking temperature of the oven is 40~80 DEG C；
The quantity of oven is not limited to 1, and quantitative design is carried out according to process rhythm.
Definition：It is front that substrate base, which need to carry out the one side of coating film treatment, and relative one side is the back side with front.
The present invention has the following advantages and effect relative to prior art：
(1) present invention becomes one dipping plated film, cleaning treatment and drying process, overcomes in the prior art that process is not
The coherent, defect that time-consuming, can be achieved full-automatic, the high stability production of any area dipping plated film.
(2) defect that serious confonnality deviations occurs in upper, middle and lower region, water are immersed in instant invention overcomes vertical lifting
Flat dipping plated film each point is consistent, with excellent uniformity.
(3) present invention carries out plating film immersion and cleaning treatment etc. by the way of the back of the body is inhaled by sucker suction substrate base
Operation, without setting fixture, solves defective effect and lifting process table of the fixture to functional membrane in vertical lifting dipping process
The defects such as the drawing lines that planar defect taxiway strip comes, can significantly lift the yield of product.
(4) process operation and cleaning spent time is greatly lowered in the present invention, and robot system In-line can be achieved
The circular flow of formula, the beat for solving the design of conventional tank formula or multi-groove type design appearance leads to not realize scale slowly
The defect of production.
Brief description of the drawings
Fig. 1 impregnates the structural representation of coating system for continous way level described in the embodiment of the present invention.
Fig. 2 is the structural representation of robot and motion arm absorption substrate base in embodiment.
Fig. 3 immerses and detached the operating diagram of coated solution for substrate base in embodiment coating film treatment step.
Fig. 4 be embodiment cleaning treatment step in substrate base rinse bath working condition top view.
Embodiment
With reference to embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited
In this.
As shown in figure 1, a kind of continous way level dipping coating system, including robot 1, control centre of robot 2 and follow
Ring slide rail 3, robot 1 is connected with control centre of robot 2 signal, and the slidingtype of robot 1 is arranged on 3 on circulation slide rail,
Circulating slide rail 3 is used for the circulation slip of robot 1；
The robot 1 is provided with motion arm 4, and the front end of motion arm 4 sets several suckers for being used to adsorb substrate base 5
6, robot 1 drives motion arm 4 to act；Circulation slide rail 3 is provided with coated solution groove 7 and rinse bath 8 by side.
The continous way level dipping coating system also includes substrate base prerinse and alignment system 9, for substrate
Substrate carries out prerinse and positioned, to meet the requirement of follow-up filming process.
The continous way level dipping coating system also includes drying system 10, and the drying system 10 is oven, institute
Oven is stated to be arranged on by circulation slide rail 3 side.
The horizontal cross-section of the coated solution groove 7, which is more than in the area of substrate base, the coated solution groove 7, places plated film
Solution, the coated solution is polystyrene microsphere solution, silicon dioxide microsphere solution or polymethyl methacrylate
(PMMA) microspheres solution.
The horizontal cross-section of the rinse bath 8, which is more than in the area of substrate base, the rinse bath 8, places cleaning fluid, described
Cleaning fluid is deionized water.
The substrate base 5 is hard substrates, or deposits the hard substrates of functional film；
The function film is metal-oxide film or blended metal oxide film；The material of the function film is
Al-Doped ZnO, tin indium oxide, boron-doping zinc oxide, fluorine doped tin oxide or gallium-doped zinc oxide, or Al-Doped ZnO, tin indium oxide,
Boron-doping zinc oxide, fluorine doped tin oxide and both any mixing of gallium-doped zinc oxide.
The method that coating system carries out plated film is impregnated using above-mentioned continous way level, comprised the following steps：
S01, absorption substrate base：The robot 1 of starting point starts, as shown in Fig. 2 robot passes through on motion arm 4
Sucker 6 adsorb substrate base 5 the back side, subsequently into next step process；
Substrate base 5 can first carry out prerinse in substrate base prerinse and alignment system 9, improve substrate base 5
Cleanliness factor, is then sent in the exercisable scope of motion arm 4 of robot 1 and is positioned, make the sucker 6 of motion arm 4 can be suitable
Drawn at the back side from substrate base 5 of profit.Different-thickness, no can be adapted to by adjusting the quantity and adsorption strength of sucker
With the substrate base of size.
S02, coating film treatment：Coated solution groove 7 is slid into by circulating slide rail 3 by the robot 1 for having drawn substrate base 5
Near, the motion arm 4 of absorption substrate base 5 is located at directly over coated solution groove 7, control to grasp by control centre of robot 2
Make the upset adjustment of arm 4, make the face down of substrate base 5, then step-down operation arm 4 immerses substrate base 5 in coated solution,
Reach after dip time, substrate base 5 is detached coated solution by lifting motion arm 4, subsequently into next step process；
When substrate base 5 is immersed into coated solution, in the case where decrease speed ratio is very fast, solution can cause vibrations,
And impulsive force is had to the front of substrate base 5, final functional membrane can be caused unstable.Therefore, as shown in figure 3, the substrate base
Piece 5 is before coated solution is entered, and adjustment motion arm 4 makes the front of the substrate base 5 of absorption have inclination angle, substrate base with horizontal plane
Piece 5 is immersed in after coated solution, and the front of substrate base 5 is adjusted into level, reached after dip time, by substrate base 5
Front is adjusted to have inclination angle with horizontal plane, and then substrate base 5 is detached coated solution by lifting motion arm 4.
The inclination angle is 3~15 degree, and inclination angle uses 5 degree in the present embodiment.
S03, cleaning treatment：Substrate base 5 will draw the machine of substrate base 5 by circulating slide rail 3 after coating film treatment
People 1 is slid near rinse bath 8, the motion arm 4 of absorption substrate base 5 is located at directly over rinse bath 8, is passed through robot control
The upset adjustment of control operation arm 4 of center 2, makes the face down of substrate base 5, then step-down operation arm 4 immerses substrate base 5
In cleaning fluid, adjustment motion arm 4 makes the front of substrate base 5 drive motion arm 4 parallel to horizontal plane, then by the motion of robot 1,
Make motion arm 4 draw substrate base 5 in the horizontal plane Multidirectional reciprocating translational motion to carry out level cleaning, as shown in figure 4, its
The top view worked for substrate base in rinse bath, with reference to Fig. 4, X-axis and Y of the substrate base 5 that motion arm 4 is drawn in horizontal plane
Direction of principal axis alternating translational movement；After scavenging period to be achieved, stop level cleaning, lifting motion arm 4 detaches substrate base 5 clearly
Washing lotion, subsequently into next step process；
The cleaning fluid is deionized water；The scavenging period is 0.5~2min；
S04, drying process：After the cleaned processing of substrate base 5, the machine of substrate base 5 will be drawn by circulating slide rail 3
People 1 slides into drying system 10, and substrate base 5 is put into drying system 5 and air-dried, and completes whole level dipping plated film
Process；Robot 1 returns to starting point by circulating slide rail 3, and circulation carries out S01 to S04 operation.
Drying system 10 described in the present embodiment is oven, and the baking temperature of the oven is 40~80 DEG C；
The quantity of oven is not limited to 1, and quantitative design is carried out according to process rhythm.
In above-mentioned continous way level dipping coating system, according to process and beat, the machine of more than two may also set up
People, each robot can all complete alone whole filming process, and in continous way level dipping coating system, robot passes through
Slide rail formation circulation production is circulated, in same time point, each robot carries out different process links respectively.Such as First machine
Device people enters cleaning link after dipping plated film link is completed, and second robot begins to impregnate plated film link；First
Robot is completed after cleaning link, is dried into oven or air blade device, or be returned directly to initial position, second machine
Device people enters cleaning link.So move in circles, realize Duo Tai robots while carrying out the work of pipeline system.
Above-described embodiment is preferably embodiment, but embodiments of the present invention are not by above-described embodiment of the invention
Limitation, other any Spirit Essences without departing from the present invention and the change made under principle, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (10)
1. a kind of continous way level impregnates coating system, it is characterised in that：The continous way level dipping coating system includes machine
Device people, control centre of robot and circulation slide rail, robot are connected with control centre of robot signal, the robot slidingtype
It is arranged on circulation slide rail, circulation slide rail is slided for robot cycle；The robot is provided with before motion arm, the motion arm
End sets several suckers for being used to adsorb substrate base, and robot drives motion arm action；Circulation slide rail is provided with plated film by side
Solution tank and rinse bath；
When continous way level dipping coating system is run to coating film treatment step, control centre of the robot control behaviour
Make arm upset adjustment, make the face down of substrate base, then step-down operation arm immerses substrate base in coated solution, reaches
After dip time, substrate base is detached coated solution by lifting motion arm.
2. a kind of continous way level dipping coating system according to claim 1, it is characterised in that：The continous way level
Impregnating coating system also includes substrate base prerinse and alignment system.
3. a kind of continous way level dipping coating system according to claim 1, it is characterised in that：The continous way level
Impregnating coating system also includes drying system, and the drying system is arranged on by circulation slide rail side.
4. a kind of continous way level dipping coating system according to claim 1, it is characterised in that：The number of the robot
Amount is at least one.
5. a kind of continous way level dipping coating system according to claim 1, it is characterised in that：The coated solution groove
Horizontal cross-section be more than substrate base area；The horizontal cross-section of the rinse bath is more than the area of substrate base.
6. a kind of continous way level dipping coating system according to claim 1, it is characterised in that：The substrate base is
Hard substrates.
7. the method that plated film is carried out using the continous way level dipping coating system described in any one of claim 1~6, including such as
Lower step：
S01, absorption substrate base：The robot of starting point starts, and passes through the back of the body of the sucker suction substrate base on motion arm
Face, subsequently into next step process；
S02, coating film treatment：The robot for drawing substrate base is slid near coated solution groove by circulating slide rail, makes suction
Take the motion arm of substrate base to be located at directly over coated solution groove, adjusted by the control operation arm upset of control centre of robot,
Make the face down of substrate base, then step-down operation arm immerses substrate base in coated solution, reaches after dip time, lift
Substrate base is detached coated solution by lift operations arm, subsequently into next step process；
S03, cleaning treatment：Substrate base is slided the robot for drawing substrate base by circulating slide rail after coating film treatment
To rinse bath, the motion arm of absorption substrate base is located at directly over rinse bath, control to grasp by control centre of robot
Make arm upset adjustment, make the face down of substrate base, then step-down operation arm immerses substrate base in cleaning fluid, adjustment behaviour
Substrate base front is set to drive motion arm parallel to horizontal plane, then by robot motion as arm, the substrate for drawing motion arm
Multidirectional reciprocating translational motion, to carry out level cleaning, reaches after scavenging period substrate in the horizontal plane, stops level cleaning, lifting
Substrate base is detached cleaning fluid by motion arm, subsequently into next step process；
S04, drying process：After the cleaned processing of substrate base, the robot for drawing substrate base is slided by circulating slide rail
To drying system, substrate base is put into drying system and air-dried, complete whole level dipping filming process；Robot
Starting point is returned to by circulating slide rail, circulation carries out S01 to S04 operation.
8. film plating process according to claim 7, it is characterised in that：In step S01, substrate base is carried first through prerinse
The cleanliness factor of high substrate base, is then sent in the exercisable scope of motion arm of robot and is positioned, make motion arm
Sucker smoothly can be drawn from the back side of substrate base.
9. film plating process according to claim 7, it is characterised in that：In step S02, the substrate base is entering plated film
Before solution, adjustment motion arm makes the front of the substrate base of absorption have inclination angle with horizontal plane, and it is molten that substrate base is immersed in plated film
After liquid, the front of substrate base is adjusted to level, reached after dip time, the front of substrate base is adjusted to and horizontal plane
With inclination angle, then substrate base is detached coated solution by lifting motion arm.
10. film plating process according to claim 7, it is characterised in that：Level described in step S02 cleaning time be
0.5~2min；Drying system described in step S03 is oven, and the baking temperature of the oven is 40~80 DEG C.
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| CN107030059A (en) * | 2016-12-27 | 2017-08-11 | 上海子创镀膜技术有限公司 | A kind of full-automatic 13 groove glass cleaning dip plating line |
| CN113001848B (en) * | 2021-02-24 | 2022-09-09 | 桂林恒保健康防护有限公司 | Preparation method of medical gloves with uniform thickness |
| CN115445852B (en) * | 2022-08-19 | 2023-09-01 | 东莞市周翔塑胶科技有限公司 | Automatic hardening treatment equipment for lens surface |
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| US4779562A (en) * | 1986-03-19 | 1988-10-25 | Fujitsu Limited | Apparatus for depositing mono-molecular layer |
| JPH06304512A (en) * | 1993-04-23 | 1994-11-01 | Daikin Ind Ltd | Producing device for lb film |
| CN201140162Y (en) * | 2007-12-21 | 2008-10-29 | 安徽江淮自动化装备有限公司 | Glue spread system glass turnover mechanism |
| DE102012012990B4 (en) * | 2011-06-30 | 2014-09-04 | Almex Pe Inc. | Surface treatment system and workpiece support support |
| CN103906857A (en) * | 2011-09-05 | 2014-07-02 | 富士胶片株式会社 | Chemical bath deposition apparatus, method of forming buffer layer and method of manufacturing photoelectric conversion device |
| CN103495528B (en) * | 2013-07-23 | 2016-02-24 | 湖州永昌贝诗讬电器实业有限公司 | A kind of continuous paint-dipping machine |
| CN103706510B (en) * | 2013-12-17 | 2016-03-09 | 惠州市易晖太阳能科技有限公司 | Large area, continous way Best-Effort request coating film production line and method thereof |
| CN204996666U (en) * | 2015-06-24 | 2016-01-27 | 惠州易晖能源科技股份有限公司 | Horizontal dip plating membrane system of continuity |
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Address after: 516025 Guangdong city of Huizhou province huiao Avenue South High-tech Industrial Park Huatai Road No. 1 Applicant after: HUIZHOU E-FLY OPTOELECTRONIC MATERIALS Co.,Ltd. Address before: 516006 Guangdong city of Huizhou province huiao Avenue South High-tech Industrial Park Huatai Road No. 1 Applicant before: HUIZHOU YIHUI ENERGY SCIENCE & TECHNOLOGY CO.,LTD. |
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Effective date of registration: 20230814 Address after: Building 1-4, Phase II Factory Building, Chancheng New Area, Anyuan County, Ganzhou City, Jiangxi Province, 342100 Patentee after: Jiangxi Yihui Optoelectronic Technology Co.,Ltd. Address before: No.1 Huatai South Road, Huinan hi tech Industrial Park, huiao Avenue, Huizhou City, Guangdong Province 516025 Patentee before: HUIZHOU E-FLY OPTOELECTRONIC MATERIALS Co.,Ltd. |
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