CN105025802B - 具有穿透基板通孔(tsv)的电容式微加工超声换能器(cmut)器件 - Google Patents

具有穿透基板通孔(tsv)的电容式微加工超声换能器(cmut)器件 Download PDF

Info

Publication number
CN105025802B
CN105025802B CN201480010856.5A CN201480010856A CN105025802B CN 105025802 B CN105025802 B CN 105025802B CN 201480010856 A CN201480010856 A CN 201480010856A CN 105025802 B CN105025802 B CN 105025802B
Authority
CN
China
Prior art keywords
cmut
substrate
layer
tsv
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480010856.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN105025802A (zh
Inventor
P·B·约翰逊
I·O·伍感特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CN105025802A publication Critical patent/CN105025802A/zh
Application granted granted Critical
Publication of CN105025802B publication Critical patent/CN105025802B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • H02N1/008—Laterally driven motors, e.g. of the comb-drive type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/70—Specific application
    • B06B2201/76—Medical, dental

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Medical Informatics (AREA)
  • Gynecology & Obstetrics (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Mechanical Engineering (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Micromachines (AREA)
CN201480010856.5A 2013-02-27 2014-02-27 具有穿透基板通孔(tsv)的电容式微加工超声换能器(cmut)器件 Active CN105025802B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/779,376 2013-02-27
US13/779,376 US9520811B2 (en) 2013-02-27 2013-02-27 Capacitive micromachined ultrasonic transducer (CMUT) device with through-substrate via (TSV)
PCT/US2014/019011 WO2014134301A1 (en) 2013-02-27 2014-02-27 Capacitive micromachined ultrasonic transducer (cmut) device with through-substrate via (tsv)

Publications (2)

Publication Number Publication Date
CN105025802A CN105025802A (zh) 2015-11-04
CN105025802B true CN105025802B (zh) 2018-01-05

Family

ID=51387424

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480010856.5A Active CN105025802B (zh) 2013-02-27 2014-02-27 具有穿透基板通孔(tsv)的电容式微加工超声换能器(cmut)器件

Country Status (4)

Country Link
US (2) US9520811B2 (enExample)
JP (1) JP6337026B2 (enExample)
CN (1) CN105025802B (enExample)
WO (1) WO2014134301A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9351081B2 (en) * 2013-02-27 2016-05-24 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug
US9520811B2 (en) * 2013-02-27 2016-12-13 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) device with through-substrate via (TSV)
US9470710B2 (en) * 2013-02-27 2016-10-18 Texas Instruments Incorporated Capacitive MEMS sensor devices
JP6221582B2 (ja) * 2013-09-30 2017-11-01 セイコーエプソン株式会社 超音波デバイスおよびプローブ並びに電子機器および超音波画像装置
US9761509B2 (en) * 2015-12-29 2017-09-12 United Microelectronics Corp. Semiconductor device with throgh-substrate via and method for fabrication the semiconductor device
EP3586093A4 (en) * 2017-02-27 2021-01-06 Butterfly Network, Inc. CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT), EQUIPMENT AND ASSOCIATED PROCESSES
US10662055B2 (en) 2017-04-27 2020-05-26 Seiko Epson Corporation MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle
KR102450580B1 (ko) 2017-12-22 2022-10-07 삼성전자주식회사 금속 배선 하부의 절연층 구조를 갖는 반도체 장치
WO2019173694A1 (en) * 2018-03-09 2019-09-12 Butterfly Network, Inc. Ultrasound transducer devices and methods for fabricating ultrasound transducer devices
WO2020100112A1 (en) * 2018-11-16 2020-05-22 Vermon S.A. Capacitive micromachined ultrasonic transducer and method of manufacturing the same
KR102244601B1 (ko) * 2019-05-29 2021-04-26 인하대학교 산학협력단 정전용량형 미세가공 초음파 트랜스듀서 및 그 제조방법
WO2021019296A1 (en) * 2019-07-26 2021-02-04 Vermon Sa Cmut transducer and method for manufacturing
EP4021649A1 (en) * 2019-08-30 2022-07-06 Vermon S.A. Cmut transducer
WO2021142554A1 (en) * 2020-01-17 2021-07-22 The University Of British Columbia Flexible capacitive micromachined ultrasonic transducer arrays
US11440051B2 (en) 2020-02-26 2022-09-13 General Electric Company Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing
US11587865B2 (en) * 2020-06-15 2023-02-21 Semiconductor Device Including Capacitor And Resistor Semiconductor device including capacitor and resistor
CN111889341B (zh) * 2020-07-30 2021-07-13 中国兵器工业集团第二一四研究所苏州研发中心 一种超薄柔性硅基电容式微机械超声波换能器及加工方法
EP4059440A1 (en) 2021-03-15 2022-09-21 Pulsify Medical Ultrasound system
WO2025117580A1 (en) * 2023-11-27 2025-06-05 The Penn State Research Foundation Photoacoustic transducer array and methods of making the same

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6312581B1 (en) * 1999-11-30 2001-11-06 Agere Systems Optoelectronics Guardian Corp. Process for fabricating an optical device
TWI221343B (en) 2003-10-21 2004-09-21 Advanced Semiconductor Eng Wafer structure for preventing contamination of bond pads during SMT process and process for the same
JP4347885B2 (ja) * 2004-06-03 2009-10-21 オリンパス株式会社 静電容量型超音波振動子の製造方法、当該製造方法によって製造された静電容量型超音波振動子を備えた超音波内視鏡装置、静電容量型超音波プローブおよび静電容量型超音波振動子
WO2005120360A1 (ja) * 2004-06-10 2005-12-22 Olympus Corporation 静電容量型超音波プローブ装置
US7405637B1 (en) * 2004-06-29 2008-07-29 Hrl Laboratories, Llc Miniature tunable filter having an electrostatically adjustable membrane
WO2006046471A1 (ja) * 2004-10-27 2006-05-04 Olympus Corporation 静電容量型超音波振動子及びその体腔内超音波診断システム
CA2607918A1 (en) * 2005-05-18 2006-11-23 Kolo Technologies, Inc. Micro-electro-mechanical transducers
EP1883956A4 (en) * 2005-05-18 2011-03-23 Kolo Technologies Inc BY-THE-WAFER CONNECTION
US8007167B2 (en) 2005-09-30 2011-08-30 Silicon Laboratories Inc. Integrated electronic sensor
DE102005058977A1 (de) 2005-12-09 2007-06-14 Atmel Germany Gmbh Transpondereinrichtung mit Mega-Pads
US7741686B2 (en) * 2006-07-20 2010-06-22 The Board Of Trustees Of The Leland Stanford Junior University Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame
JP4891182B2 (ja) * 2007-08-28 2012-03-07 オリンパスメディカルシステムズ株式会社 超音波トランスデューサ、超音波診断装置及び超音波顕微鏡
US7843022B2 (en) * 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US7799678B2 (en) * 2008-01-30 2010-09-21 Freescale Semiconductor, Inc. Method for forming a through silicon via layout
US7943514B2 (en) * 2009-09-03 2011-05-17 Texas Instruments Incorporated Integrated circuits having TSVs including metal gettering dielectric liners
US8563345B2 (en) * 2009-10-02 2013-10-22 National Semiconductor Corporated Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
US8143704B2 (en) * 2009-10-02 2012-03-27 Texas Instruments Incorporated Electronic assemblies including mechanically secured protruding bonding conductor joints
US8324006B1 (en) * 2009-10-28 2012-12-04 National Semiconductor Corporation Method of forming a capacitive micromachined ultrasonic transducer (CMUT)
US7969013B2 (en) * 2009-10-22 2011-06-28 Taiwan Semiconductor Manufacturing Company, Ltd. Through silicon via with dummy structure and method for forming the same
JP5404335B2 (ja) * 2009-11-17 2014-01-29 キヤノン株式会社 電気機械変換装置及びその作製方法
DE102010045649A1 (de) 2010-09-17 2012-03-22 Texas Instruments Deutschland Gmbh Elektronische Vorrichtung und Verfahren zum direkten Montieren passiver Komponenten
US20140187957A1 (en) * 2012-12-31 2014-07-03 Volcano Corporation Ultrasonic Transducer Electrode Assembly
US9351081B2 (en) * 2013-02-27 2016-05-24 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug
US9520811B2 (en) * 2013-02-27 2016-12-13 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) device with through-substrate via (TSV)
KR102176584B1 (ko) * 2013-11-20 2020-11-09 삼성전자주식회사 정전용량 미세가공 초음파 변환기 및 그 제조방법

Also Published As

Publication number Publication date
JP6337026B2 (ja) 2018-06-06
CN105025802A (zh) 2015-11-04
WO2014134301A1 (en) 2014-09-04
JP2016511607A (ja) 2016-04-14
US20170050217A1 (en) 2017-02-23
US10335827B2 (en) 2019-07-02
US9520811B2 (en) 2016-12-13
US20140239769A1 (en) 2014-08-28

Similar Documents

Publication Publication Date Title
CN105025802B (zh) 具有穿透基板通孔(tsv)的电容式微加工超声换能器(cmut)器件
US9937528B2 (en) Capacitive micromachined ultrasonic transducer (CMUT) forming
US11559827B2 (en) Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US10107830B2 (en) Method of forming capacitive MEMS sensor devices
US20240044846A1 (en) Microfabricated ultrasonic transducers and related apparatus and methods
US8563345B2 (en) Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
US10093534B2 (en) Capacitive micromachined ultrasonic transducer and method of fabricating the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant