CN105023897A - Prefabricated packaging structure, method for drilling same and drilling device - Google Patents
Prefabricated packaging structure, method for drilling same and drilling device Download PDFInfo
- Publication number
- CN105023897A CN105023897A CN201410181115.5A CN201410181115A CN105023897A CN 105023897 A CN105023897 A CN 105023897A CN 201410181115 A CN201410181115 A CN 201410181115A CN 105023897 A CN105023897 A CN 105023897A
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- CN
- China
- Prior art keywords
- electric connection
- connection pad
- semiconductor chip
- electronic pads
- encapsulating structure
- Prior art date
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- Granted
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 claims abstract description 55
- 239000000084 colloidal system Substances 0.000 claims abstract description 46
- 238000012856 packing Methods 0.000 claims description 44
- 230000037361 pathway Effects 0.000 claims description 41
- 230000005855 radiation Effects 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000007598 dipping method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Abstract
A prefabricated packaging structure, a method for drilling the prefabricated packaging structure and a drilling device are provided, wherein the prefabricated packaging structure comprises: a semiconductor chip having an active surface and an inactive surface opposed to each other and a side surface connecting the active surface and the inactive surface, the active surface having a plurality of electrode pads thereon; a redistribution layer having a first surface and a second surface opposite to each other, wherein the first surface is disposed on the active surface of the semiconductor chip and electrically connected to the electrode pads, and the first surface of the redistribution layer has a plurality of exposed electrical connection pads around the semiconductor chip; and a packaging colloid formed on the first surface of the redistribution layer to cover the electrical connection pad and the side surface of the semiconductor chip, and having an opening for exposing the non-active surface. The invention can avoid the failure of the electrical connection between the conductive blind hole and the electrical connection pad.
Description
Technical field
The invention provides a kind of prefabricated encapsulating structure, to its method of holing and drilling equipment, espespecially a kind of use infrared ray accurate location drilling position prefabricated encapsulating structure, to its method of holing and drilling equipment.
Background technology
Flourish along with electronic industry, electronic product is also marched toward the trend of multi-functional, high-performance and microminiaturization (miniaturization) gradually.In order to meet the package requirements of semiconductor package part microminiaturization, then develop many encapsulation technologies.
Please refer to Fig. 1, it is the existing cutaway view to the method that prefabricated encapsulating structure 1 is holed.Prefabricated encapsulating structure 1 comprises chip 10, the layer 11 that reroutes, loading plate 13 and packing colloid 12.
Chip 10 as above has the side 10c of relative acting surface 10a and non-active face 10b and connection function face 10a and non-active face 10b, and acting surface 10a has multiple electronic pads 101, and electronic pads 101 can be formed with copper bump 103, copper bump 103 is formed with solder 105.
Reroute layer (redistribution layer as above, RDL) 11 have relative first surface 11a and second surface 11b, and connect with its first surface 11a be placed in chip 10 acting surface 10a on and be electrically connected electronic pads 101 via solder 105 and copper bump 103, and the first surface 11a of the layer 11 that reroutes has the multiple electric connection pads 111 exposed around chip 10, wherein, the structure of layer 11 of rerouting is widely known by the people, therefore repeats no more.
Generally speaking, solder 105 and the layer 11 that reroutes can be electrically connected by reflow mode by chip 10, thus the electronic pads 101 on the acting surface 10a of chip 20 is electrically connected with the layer 11 that reroutes via copper bump 103 and solder 105, and the first surface 11a of the layer 11 that makes to reroute connects and is placed on the acting surface 10a of chip 10, and the first surface 11a of the layer 11 that reroutes has the multiple electric connection pads 111 exposing to first surface 11a around chip 10.
Loading plate 13 as above reroutes on the second surface 11b of layer 11 for connecing to be placed in, and packing colloid 12 be formed in the layer 11 that reroutes first surface 21a on to cover electric connection pad 111 and chip 10.
Existing when holing to prefabricated encapsulating structure 1, generally speaking be the packing colloid 12 directly aimed at the exposure pathways L of laser generator 32 on the electric connection pad 111 of prefabricated encapsulating structure 1, but, due to when making the exposure pathways L of laser generator 32 faced by packing colloid 12, packing colloid 12 covers electric connection pad 111, packing colloid 12 cannot be seen through to identify the exact position of electric connection pad 111 with optical means, and electric connection pad 111 and electronic pads 101 also cover by loading plate 13, and directly cannot judge the exact position of electric connection pad 111 or judge the exact position of electric connection pad 111 by the electronic pads 101 between itself and electric connection pad 111 with relative position difference, thus cause the exposure pathways L of laser generator 32 accurately cannot aim at packing colloid 12 on electric connection pad 111, therefore it certainly causes and burns out packing colloid perforate (non-icon) as shown in Figure 1 in the packing colloid 12 at errors present place, thus make the conductive blind hole (non-icon) formed in this packing colloid perforate subsequently cannot correctly be electrically connected electric connection pad 111, therefore cause being electrically connected unsuccessfully.
Therefore, how to overcome the existing problem that cannot find the exact position of electric connection pad when holing to prefabricated encapsulating structure, real is the large problem of those skilled in the art.
Summary of the invention
Because the disappearance of above-mentioned prior art, object of the present invention, for providing a kind of prefabricated encapsulating structure, to its method of holing and drilling equipment, can avoid the electric connection failure between conductive blind hole and electric connection pad.
Prefabricated encapsulating structure of the present invention comprises: have relative acting surface and non-active face and be connected the semiconductor chip of side in this acting surface and non-active face, this acting surface has multiple electronic pads; There is the layer that reroutes of relative first surface and second surface, its first surface connect be placed in this semiconductor chip this acting surface on and be electrically connected this electronic pads, and this reroutes, the first surface of layer has the multiple electric connection pads exposed around this semiconductor chip; And to cover the packing colloid of the side of this electric connection pad and this semiconductor chip on the first surface being formed in this layer that reroutes, and it has the opening exposing this non-active face.
The present invention also provides a kind of drilling equipment, it is for holing to prefabricated encapsulating structure, this prefabricated encapsulating structure comprises semiconductor chip, reroute layer and packing colloid, this semiconductor chip has relative acting surface and non-active face and the side being connected this acting surface and non-active face, this acting surface has multiple electronic pads, this layer that reroutes has relative first surface and second surface, and connect with its first surface be placed in this semiconductor chip this acting surface on and be electrically connected this electronic pads, and this reroutes, the first surface of layer has the multiple electric connection pads exposed around this semiconductor chip, to cover the side of this electric connection pad and this semiconductor chip on the first surface that this packing colloid is formed in this layer that reroutes, and there is the opening exposing this non-active face, this drilling equipment comprises: for the plummer placed for this prefabricated encapsulating structure, for burning the packing colloid on this electric connection pad, to form the laser generator that multiple correspondence exposes the packing colloid perforate of this electric connection pad, for irradiating the ultrared ray generator of this electronic pads from this side, non-active face, for sensing the image that presented by this electronic pads of infrared radiation to identify the sensing module of the position of this electronic pads, and for judging the control module of the position of this electric connection pad by the position of this electronic pads and the relative position relation between this electronic pads and electric connection pad, it also makes the exposure pathways of this laser generator aim at this electric connection pad place, to carry out follow-up burning.
The present invention also provides a kind of method of holing to prefabricated encapsulating structure, comprise: on plummer, place the encapsulating structure that this is prefabricated, this prefabricated encapsulating structure comprises semiconductor chip, reroute layer and packing colloid, this semiconductor chip has relative acting surface and non-active face and the side being connected this acting surface and non-active face, this acting surface has multiple electronic pads, this layer that reroutes has relative first surface and second surface, and connect with its first surface be placed in this semiconductor chip this acting surface on and be electrically connected this electronic pads, and this reroutes, the first surface of layer has the multiple electric connection pads exposed around this semiconductor chip, to cover the side of this electric connection pad and this semiconductor chip on the first surface that this packing colloid is formed in this layer that reroutes, and there is the opening exposing this non-active face, this electronic pads is irradiated from this side, non-active face with ultrared ray generator, the image presented by this electronic pads of infrared radiation is sensed, to identify the position of this electronic pads with sensing module, and utilize control module by the position of this electronic pads and the relative position relation between this electronic pads and electric connection pad to judge the position of this electric connection pad, this control module the packing colloid place that the exposure pathways of this laser generator is aimed on this electric connection pad are burnt, to form the packing colloid perforate that multiple correspondence exposes this electric connection pad.
Prefabricated encapsulating structure of the present invention, its method of holing and drilling equipment are covered to the side of semiconductor chip by making packing colloid and expose its non-active face, and use the drilling equipment with ultrared ray generator, the position of electric connection pad is judged with the position from electronic pads and the predefine relative position between electronic pads and electric connection pad, and thus make the exposure pathways of laser generator aim at the packing colloid on electric connection pad and burn, therefore the present invention can avoid conductive blind hole correctly cannot be electrically connected the problem of electric connection pad.
Accompanying drawing explanation
Fig. 1 is the existing cutaway view to the method that prefabricated encapsulating structure is holed.
Fig. 2 is the cutaway view of prefabricated encapsulating structure of the present invention.
Fig. 3 is the stereogram of prefabricated encapsulating structure of the present invention and drilling equipment.
Fig. 4 is the flow chart to the method that prefabricated encapsulating structure is holed of the present invention.
Symbol description
1,2 prefabricated encapsulating structures
10 chips
10a, 20a acting surface
10b, 20b non-active face
10c, 20c side
101,201 electronic padses
103,203 copper bumps
105,205 solders
11,21 to reroute layer
11a, 21a first surface
11b, 21b second surface
111,211 electric connection pads
12,22 packing colloids
13,23 loading plates
20 semiconductor chips
221 openings
3 drilling equipments
31 plummers
32 laser generators
33 ultrared ray generators
L exposure pathways
S401, S402, S403, S404a, S404b, S404c step.
Execution mode
By particular specific embodiment, embodiments of the present invention are described below, those skilled in the art can understand other advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented by other different specific embodiment or be applied, and the every details in this specification also based on different viewpoints and application, can carry out various modification and change under not departing from spirit of the present invention.
Please refer to Fig. 2, it is the cutaway view of prefabricated encapsulating structure 2 of the present invention.Prefabricated encapsulating structure 2 comprises semiconductor chip 20, reroute layer 21 and packing colloid 22, and each assembly of prefabricated encapsulating structure 2 of the present invention describes in detail hereinafter with reference to Fig. 2.
Semiconductor chip 20 as above has the side 20c of relative acting surface 20a and non-active face 20b and connection function face 20a and non-active face 20b, and acting surface 20a has multiple electronic pads 201, but be not limited thereto generally speaking, the main material of semiconductor chip 20 can be siliceous semi-conducting material, as pure silicon or the silicon-based semiconductor material doped with germanium, boron, phosphorus and carbon etc., and electronic pads 201 can be formed with copper bump 203, and copper bump 203 is formed with solder 205.
Reroute layer (Redistribution layer as above, i.e. RDL) 21 there is relative first surface 21a and second surface 21b, and connect with its first surface 21a be placed in semiconductor chip 20 acting surface 20a on and be electrically connected electronic pads 201, and the first surface 21a of the layer 21 that reroutes has the multiple electric connection pads 211 exposed around semiconductor chip 20, and predefined relative position can be had between electric connection pad 211 and electronic pads 201.The structure of layer 21 of rerouting is widely known by the people, therefore repeats no more, but in details of the words but be not limited thereto, the layer 21 that reroutes also can include at least one line layer (non-marking component symbol) of storehouse, and can be single or multiple lift structure.But be not limited thereto generally speaking, solder 205 and the layer 21 that reroutes can be electrically connected by reflow mode by semiconductor chip 20, thus the electronic pads 201 on the acting surface 20a of semiconductor chip 20 is electrically connected with the layer 21 that reroutes via copper bump 203 and solder 205, and the first surface 21a of the layer 21 that makes to reroute connects and is placed on the acting surface 20a of semiconductor chip 20, and the first surface 21a of the layer 21 that reroutes has the multiple electric connection pads 211 exposing to first surface 21a around semiconductor chip 20, particularly but be not limited thereto, electric connection pad 211 can be embedded in the layer 21 that reroutes and to expose to first surface 21a.
To cover the side 20c of electric connection pad 211 and semiconductor chip 20 on the first surface 21a that packing colloid 22 as above is formed in the layer 21 that reroutes, and there is the opening 221 exposing non-active face 20b.
In addition, prefabricated encapsulating structure 2 of the present invention can also comprise loading plate 23, it connects to be placed in and reroutes on the second surface 21b of layer 21, and second surface 21b can have adhesion coating (non-icon), connects put on loading plate 23 with the second surface 21b of the layer 21 that makes to reroute.
Please refer to Fig. 3, this figure is the stereogram of prefabricated encapsulating structure 2 of the present invention and drilling equipment 3.Drilling equipment 3 is for holing to above-mentioned prefabricated encapsulating structure 2, and each assembly of prefabricated encapsulating structure 2 is in above describing in detail, therefore does not repeat them here.Drilling equipment 3 of the present invention comprises plummer 31, laser generator 32, ultrared ray generator 33, sensing module (non-icon) and control module (non-icon), and each assembly of drilling equipment 3 describes in detail hereinafter with reference to Fig. 3.
Plummer 31 as above is for placing for prefabricated encapsulating structure 2, but be not limited thereto generally speaking, plummer 31 can have the structures (all non-icon) such as the tool of fixing prefabricated encapsulating structure 2, as fixture, sucker or recess etc., further, the prefabricated encapsulating structure 2 be positioned on plummer 31 can be a composing structure (sign) be made up of multiple prefabricated encapsulating structure 2.
Laser generator 32 as above for burning the packing colloid 22 on electric connection pad 211 as shown in Figure 2, to form the packing colloid perforate (non-icon) that multiple correspondence exposes electric connection pad 211.Specifically but be not limited thereto, laser generator 32 inside produces laser and along a particular path bright dipping, in one embodiment of this invention, the exposure pathways L that dotted line represents is may be defined as by the particular path of the direct bright dipping of laser generator 32, and exposure pathways L can aim at electric connection pad 211 perpendicular to the first surface 21a of the layer 21 that reroutes from packing colloid 22 side, and in another embodiment of the invention, exposure pathways L can be directed to via the optical module (non-icon) of such as lens and speculum etc. by the particular path of the direct bright dipping of laser generator 32, and in another embodiment of the invention, the laser that laser generator 32 sends can be aimed at electric connection pad 211 and focus on packing colloid 22 thereon on exposure pathways L by camera lens (non-icon).
Ultrared ray generator 33 as above is for from 20b side, non-active face irradiation electrode pad 201, specifically but be not limited thereto, due to for electronic pads 201, ultrared wavelength is high reverse--bias, and for silicon-based semiconductor material, ultrared wavelength is high-penetration, therefore infrared ray can be irradiated by 20b side, non-active face and penetrate the silicon-based semiconductor material of semiconductor chip 20, and reflected by electronic pads 201, thus obtain the infrared reflection image of electronic pads 201, to determine the position of electronic pads 201.Again specifically but be not limited thereto, in one embodiment of this invention, can be parallel but be not overlapped in exposure pathways L (namely the light beam of ultrared ray generator separates with exposure pathways L) by the infrared ray path of the direct bright dipping of ultrared ray generator 33, in another embodiment of the invention, can be directed to parallel but not be overlapped in exposure pathways L via the optical module (non-icon) of such as lens and speculum etc. by the infrared ray path of the direct bright dipping of ultrared ray generator 33, or, can be coupled with exposure pathways L via the optical module (non-icon) of such as lens and speculum etc. by the infrared ray path of the direct bright dipping of ultrared ray generator 33, but, the mode of ultrared ray generator 33 irradiation electrode pad 201 still can change according to different designs and not be limited to above-mentioned exemplary embodiments.
Sensing module as above (non-icon) is for sensing the image presented by infrared radiation electronic pads 201, to identify the position of electronic pads 201, but be not limited thereto generally speaking, this sensing module can receive the infrared ray of reflection, and by the position of its imaging for automatic or manual identification electronic pads 201 by being used for the camera lens of receiving infrared-ray.In addition, in other embodiments, this sensing module can be set together with ultrared ray generator 33, or this sensing module can be provided separately with ultrared ray generator 33, and the detailed set-up mode of this type of sensing module has been widely known by the people, repeats no more.
Control module as above (non-icon) is for judging the position of electric connection pad 211 by the position of electronic pads 201 and the relative position relation between electronic pads 201 and electric connection pad 211, and make the exposure pathways L of laser generator 32 aim at electric connection pad 211 place, to carry out follow-up burning.Specifically but be not limited thereto, this control module can receive the signal of the position of the electronic pads 201 identified by this sensing module, and coordinate the relative position relation between known or default electronic pads 201 and electric connection pad 211 to judge the position of electric connection pad 211, and the packing colloid 22 making the exposure pathways L of laser generator 32 aim at electric connection pad 211 and burn subsequently on electric connection pad 211.
Again specifically but be not limited thereto, the method making the exposure pathways L of laser generator 32 aim at electric connection pad 211 has following three kinds of embodiments: the position of the plummer 31 in one embodiment is fixing, and the exposure pathways L that this control module is used for mobile laser generator 32 aims at electric connection pad 211 to make it; The exposure pathways L of the laser generator 32 in its another embodiment is fixing, and this control module is used for mobile plummer 31 and aims at electric connection pad 211 to make the exposure pathways L of laser generator 32; The exposure pathways L of the laser generator 32 in its another embodiment and plummer 31 are all movably, and the exposure pathways L that this control module is used for mobile laser generator 32 aims at electric connection pad 211 with plummer 31 to make the exposure pathways L of laser generator 32, and the mode of the exposure pathways L of the mobile laser generator 32 of above three kinds of embodiments can be direct mobile laser generator 32 or make optical module start with mobile exposure pathways L.
Please refer to Fig. 4, it is the flow chart to the method that prefabricated encapsulating structure is holed of the present invention.In step S401, prefabricated encapsulating structure 2 placed by the plummer 31 of drilling equipment 3, and each assembly of drilling equipment 3 and prefabricated encapsulating structure 2 is in above describing in detail, therefore do not repeat them here, the relative position relation between the electronic pads 201 of now prefabricated encapsulating structure 2 and electric connection pad 211 is known.
In step S402, with ultrared ray generator 33 from 20b side, non-active face irradiation electrode pad 211, wherein, along or be parallel to exposure pathways L the light beam of infrared ray that can be collimation or diffusion by 20b side, non-active face irradiation electrode pad 201, to be irradiated by 20b side, non-active face and to penetrate the silicon-based semiconductor material of semiconductor chip 20, and reflected by electronic pads 201 and penetrate silicon-based semiconductor material again, thus obtain the infrared reflection image of electronic pads 201, and the set-up mode of ultrared ray generator 33 is in above describing in detail, therefore do not repeat them here.
In step S403, the image presented by infrared ray irradiation electrode pad 201 is sensed with sensing module, to identify the position of electronic pads 201, and then by the infrared ray of received reflection by the position of its imaging for automatic or manual identification electronic pads 201, then enter step S404a, step S404b or step S404c.
In step S404a to S404c, utilize control module by the position of electronic pads 201 and the relative position relation between electronic pads 201 and electric connection pad 211 to judge the position of electric connection pad 211, this control module also makes the exposure pathways L of laser generator 32 aim at the packing colloid 22 on electric connection pad 211 and burn, to form the packing colloid perforate (non-icon) that multiple correspondence exposes electric connection pad 211.Specifically but be not limited thereto, this control module can receive the signal of the position of the electronic pads 201 identified by this sensing module, and judge the position of electric connection pad 211 by the relative position relation between the electronic pads 201 set and electric connection pad 211, and the packing colloid 22 making the exposure pathways L of laser generator 32 aim at electric connection pad 211 and burn on electric connection pad 211.And wherein, the method making the exposure pathways L of laser generator 32 aim at electric connection pad 211 has following three kinds of embodiments, i.e. person as described in step S404a to S404c: in step S404a, the position of plummer 31 is fixing, and the exposure pathways L that this control module is used for mobile laser generator 32 burns after making it aim at electric connection pad 211; In step S404b, the exposure pathways L of laser generator 32 is fixing, and this control module is used for mobile plummer 31 and burns after making the exposure pathways L of this laser generator 32 aim at electric connection pad 211; In step S404c, the exposure pathways L of laser generator 32 and plummer 31 are all movably, and the exposure pathways L that this control module is used for this laser generator 32 mobile burns after making the exposure pathways L of laser generator 32 aim at electric connection pad 211 with plummer 31, and the mode of the exposure pathways L of the mobile laser generator 32 of above three steps (i.e. S404a, 404b and S404b) can be direct mobile laser generator 32 or make optical module start with mobile exposure pathways L.
In sum, compared to prior art, because the present invention exposes the packing colloid in non-active face by the side covering semiconductor chip, ultrared ray generator and the relative position between known electronic pads and electric connection pad, and can semiconductor chip be irradiated by ultrared ray generator and obtain its electronic pads position, to obtain the position of electric connection pad by the relative position between electronic pads and electric connection pad, and thus make the exposure pathways of laser generator aim at the packing colloid place at electric connection pad place, to carry out follow-up burning, therefore the present invention can avoid because the packed colloid of electric connection pad covers the position that accurately cannot judge electric connection pad that causes thus the packing colloid position of opening caused not problem accurately.
Above-described embodiment only for illustrative principle of the present invention and effect thereof, but not for limiting the present invention.Any those skilled in the art all without prejudice under spirit of the present invention and category, can modify to above-described embodiment.Therefore the scope of the present invention, should listed by claims.
Claims (12)
1. a prefabricated encapsulating structure, comprising:
Semiconductor chip, has relative acting surface and non-active face and the side being connected this acting surface and non-active face, this acting surface has multiple electronic pads;
Reroute layer, there is relative first surface and second surface, and connect with its first surface be placed in this semiconductor chip this acting surface on and be electrically connected this electronic pads, and this reroutes, the first surface of layer has the multiple electric connection pads exposed around this semiconductor chip; And
Packing colloid, to cover the side of this electric connection pad and this semiconductor chip on the first surface being formed in this layer that reroutes, and has the opening exposing this non-active face.
2. encapsulating structure prefabricated as claimed in claim 1, is characterized in that, this encapsulating structure also comprises loading plate, connects to be placed in this and to reroute on the second surface of layer.
3. a drilling equipment, it is for holing to prefabricated encapsulating structure, this prefabricated encapsulating structure comprises semiconductor chip, reroute layer and packing colloid, this semiconductor chip has relative acting surface and non-active face and the side being connected this acting surface and non-active face, this acting surface has multiple electronic pads, this layer that reroutes has relative first surface and second surface, and connect with its first surface be placed in this semiconductor chip this acting surface on and be electrically connected this electronic pads, and this reroutes, the first surface of layer has the multiple electric connection pads exposed around this semiconductor chip, to cover the side of this electric connection pad and this semiconductor chip on the first surface that this packing colloid is formed in this layer that reroutes, and there is the opening exposing this non-active face, this drilling equipment comprises:
Plummer, it is for placing for this prefabricated encapsulating structure;
Laser generator, it is for burning the packing colloid on this electric connection pad, to form the packing colloid perforate that multiple correspondence exposes this electric connection pad;
Ultrared ray generator, it is for irradiating this electronic pads from this side, non-active face;
Sensing module, it is for sensing the image presented by this electronic pads of infrared radiation, to identify the position of this electronic pads; And
Control module, it for judging the position of this electric connection pad by the position of this electronic pads and the relative position relation between this electronic pads and electric connection pad, and makes the exposure pathways of this laser generator aim at this electric connection pad place, to carry out follow-up burning.
4. drilling equipment as claimed in claim 3, it is characterized in that, the position of this plummer is fixing, and this control module is used for this laser generator mobile, aims at this electric connection pad to make it.
5. drilling equipment as claimed in claim 3, it is characterized in that, this laser generator is fixing, and this control module is used for this plummer mobile, aims at this electric connection pad to make this laser generator.
6. drilling equipment as claimed in claim 3, is characterized in that, this control module is used for this laser generator mobile and plummer, aims at this electric connection pad to make this laser generator.
7. drilling equipment as claimed in claim 3, it is characterized in that, this prefabricated encapsulating structure also comprises loading plate, and it connects and is placed in this and reroutes on the second surface of layer.
8., to the method that prefabricated encapsulating structure is holed, comprising:
Plummer is placed the encapsulating structure that this is prefabricated, this prefabricated encapsulating structure comprises semiconductor chip, reroute layer and packing colloid, this semiconductor chip has relative acting surface and non-active face and the side being connected this acting surface and non-active face, this acting surface has multiple electronic pads, this layer that reroutes has relative first surface and second surface, and connect with its first surface be placed in this semiconductor chip this acting surface on and be electrically connected this electronic pads, and this reroutes, the first surface of layer has the multiple electric connection pads exposed around this semiconductor chip, to cover the side of this electric connection pad and this semiconductor chip on the first surface that this packing colloid is formed in this layer that reroutes, and there is the opening exposing this non-active face,
This electronic pads is irradiated from this side, non-active face with ultrared ray generator;
The image presented by this electronic pads of infrared radiation is sensed, to identify the position of this electronic pads with sensing module; And
Utilize control module by the position of this electronic pads and the relative position relation between this electronic pads and electric connection pad to judge the position of this electric connection pad, this control module the packing colloid place that the exposure pathways of this laser generator is aimed on this electric connection pad are burnt, to form the packing colloid perforate that correspondence exposes this electric connection pad.
9. the method for holing to prefabricated encapsulating structure as claimed in claim 8, it is characterized in that, the position of this plummer is fixing, and this control module is used for this laser generator mobile, aims at this electric connection pad to make it.
10. the method for holing to prefabricated encapsulating structure as claimed in claim 8, it is characterized in that, this laser generator is fixing, and this control module is used for this plummer mobile, aims at this electric connection pad to make this laser generator.
11. methods of holing to prefabricated encapsulating structure as claimed in claim 8, is characterized in that, this control module is used for this laser generator mobile and plummer, aims at this electric connection pad to make this laser generator.
12. methods of holing to prefabricated encapsulating structure as claimed in claim 8, it is characterized in that, this prefabricated encapsulating structure also comprises loading plate, and it connects and is placed in this and reroutes on the second surface of layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103114636 | 2014-04-23 | ||
| TW103114636A TWI556365B (en) | 2014-04-23 | 2014-04-23 | Prefabricated package structure, method for drilling thereto and drilling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105023897A true CN105023897A (en) | 2015-11-04 |
| CN105023897B CN105023897B (en) | 2018-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410181115.5A Active CN105023897B (en) | 2014-04-23 | 2014-04-30 | Method and drilling device for drilling prefabricated packaging structure |
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| Country | Link |
|---|---|
| CN (1) | CN105023897B (en) |
| TW (1) | TWI556365B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105914157A (en) * | 2016-04-28 | 2016-08-31 | 合肥祖安投资合伙企业(有限合伙) | Chip package technology and chip package structure |
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| CN1677629A (en) * | 2005-03-10 | 2005-10-05 | 威盛电子股份有限公司 | Package process of chip built-in type |
| TW201029125A (en) * | 2009-01-16 | 2010-08-01 | Phoenix Prec Technology Corp | Packaging substrate having semiconductor chip embedded therein, and method for manufacturing the same |
| WO2013037102A1 (en) * | 2011-09-13 | 2013-03-21 | 深南电路有限公司 | Encapsulation method for embedding chip into substrate and structure thereof |
| US20130319982A1 (en) * | 2012-05-29 | 2013-12-05 | Electro Scientific Industries, Inc. | Method and apparatus for processing workpieces |
| CN103594418A (en) * | 2012-08-13 | 2014-02-19 | 矽品精密工业股份有限公司 | Semiconductor package and fabrication method thereof |
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| CN1677629A (en) * | 2005-03-10 | 2005-10-05 | 威盛电子股份有限公司 | Package process of chip built-in type |
| TW201029125A (en) * | 2009-01-16 | 2010-08-01 | Phoenix Prec Technology Corp | Packaging substrate having semiconductor chip embedded therein, and method for manufacturing the same |
| WO2013037102A1 (en) * | 2011-09-13 | 2013-03-21 | 深南电路有限公司 | Encapsulation method for embedding chip into substrate and structure thereof |
| US20130319982A1 (en) * | 2012-05-29 | 2013-12-05 | Electro Scientific Industries, Inc. | Method and apparatus for processing workpieces |
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| CN105914157A (en) * | 2016-04-28 | 2016-08-31 | 合肥祖安投资合伙企业(有限合伙) | Chip package technology and chip package structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105023897B (en) | 2018-08-28 |
| TWI556365B (en) | 2016-11-01 |
| TW201541567A (en) | 2015-11-01 |
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