CN105002465B - A kind of thermal evaporation film plating process and its device - Google Patents
A kind of thermal evaporation film plating process and its device Download PDFInfo
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- CN105002465B CN105002465B CN201510496271.5A CN201510496271A CN105002465B CN 105002465 B CN105002465 B CN 105002465B CN 201510496271 A CN201510496271 A CN 201510496271A CN 105002465 B CN105002465 B CN 105002465B
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Abstract
The present invention relates to technical field of vacuum plating, and in particular to a kind of thermal evaporation film plating process and its device.The implementation method of the plated film is：The coating materials particle diffused out from evaporation source, during it is transferred to substrate surface, the coating materials particle of part is allowed to pass through channel transfer to substrate surface, realize thin film deposition, remaining coating materials particle is blocked, and can not be deposited on substrate, passage is between substrate and evaporation source, the ratio and conversion speed of the logical resistance of passage are adjusted, realizes the diffusion control to coating materials particle.Present invention simultaneously provides the device that can realize this method.Methods and apparatus of the present invention is simple in construction, and cost is cheap, system compact, and deposition frequency and dutycycle can be adjusted as needed, realizes effective control to thickness and structure.
Description
Technical field
The present invention relates to technical field of vacuum plating, and in particular to a kind of thermal evaporation film plating process and its device.
Background technology
In optical thin film manufacturing field, thermal evaporation techniques are a kind of film deposition techniques to grow up earliest, have behaviour
Make the features such as simple, coating cost is low, monitoring is convenient, stability is good, be still that the main flow that optics manufacturing enterprise uses is thin at present
Membrane preparation technology.
Thermal evaporation plated film, it is in vacuum chamber, to container for evaporation（Such as crucible, tungsten boat）In thin film raw material（TiO2、
SiO2、MgF2Deng）Heated, at high temperature, the atom or molecule of raw material gasify and escaped from coating materials surface evaporation, true
Steam stream is formed in empty room and is spread to space, finally deposits to piece surface, attachment condensation or generation chemical reaction form thin
The method of film.Thermal evaporation plated film typically uses two ways to coating materials heating：Resistance heating and electron beam heating.Resistance heating is
Specific boat type is made in dystectic tungsten, molybdenum etc., by heated by electrodes boat body, boat body is reached very high temperature, from
And the Coating Materials inside fusing or gasification boat.Electron beam heating is to utilize high-power electron beam caused by electron gun（6000-
10000eV）Material in heating crucible, evaporate it and form the method for film.Due to electron beam can heat it is dystectic
The material such as oxide and ceramics, therefore obtained more being widely applied.
On the one hand, in film manufacturing processes, sometimes for the specific optical property of acquisition（Such as ultra-narrow band pass filter, bear
Optical filter etc.）, it is necessary to carry out thin layer or thin layer deposition（Several nanometers even several Ethylmercurichlorendimides）.Meanwhile in ultra-low loss film
Or laser film preparation when, it is also desirable to ultralow sedimentation rate（Such as 0.01-0.1nm/s）Excellent performance could be obtained.According to
The control mode of existing thickness, to realize the accurate control of superthin layer, it is necessary to reduce the sedimentation rate of film forming, that is to say, that overcast
Product speed can improve the control accuracy of thickness.But found in practical operation, using existing thermal evaporation techniques, pass through reduction
Come to obtain the accurate deposition thickness of superthin layer be still very difficult thing, reason is the mode of sedimentation rate：1st, when heavy
When product is to required thickness, even if cutting off the electricity supply, the coating materials of melting will not stop evaporating immediately, and close baffle plate and be also required to necessarily
Time；2nd, the evaporation region formed after melt material is a face evaporation source, and sedimentation rate will not be too low；3rd, most of materials
With specific fusing point, therefore coating materials evaporation is the process of a mutation；4th, can be one using the method for reducing source temperature
Determine to reduce sedimentation rate in scope, but low temperature can cause the kinetic energy of film forming particle to reduce, and film quality is deteriorated.These reasons cause
The thin layer control of thermal evaporation plated film is very difficult.
On the other hand, its performance of the structures shape of film.Film prepared by different technical parameters generally has different micro-
See structure and physicochemical property.Sedimentation rate size not only influences the optical absorption and scattering property of film, has an effect on the machine of film
Tool performance.Change sedimentation rate, the mobility of coating materials particle can be influenceed, so as to influence the quality of film layer.Existing magnetron sputtering,
The methods of ion beam sputtering, metal-organic chemical vapor deposition equipment and molecular beam epitaxy, has a good speed control, but by
Very limited in the thin-film material that these methods can deposit, film layer absorbs larger, therefore it is in the application in optical coating field
It is very limited.
In summary, it is current urgent problem to be solved how accurate control to be carried out to thin layer in thermal evaporation plated film.
The content of the invention
The core of the present invention is to provide a kind of thermal evaporation film plating process, while provides the device that can realize this method, with
Deposition frequency and dutycycle are adjusted as needed, realize effective control to thickness and structure.
To reach above-mentioned purpose, technical scheme provided by the invention is：
A kind of thermal evaporation film plating process, the coating materials particle diffused out from evaporation source, the mistake of substrate surface is transferred at it
Cheng Zhong, it is allowed to the coating materials particle of part realizes thin film deposition by channel transfer to substrate surface, remaining coating materials particle by
Blocking, can not deposit on substrate, passage is between substrate and evaporation source, ratio and conversion speed that regulation passage leads to-hindered,
Realize the diffusion control to coating materials particle.
A kind of thermal evaporation coating apparatus, including vacuum chamber and the evaporation source being arranged in vacuum chamber, set above evaporation source
The baffle plate of coating materials can be stopped by being equipped with, and chopper wheel is provided with above baffle plate, described chopper wheel is by rotating shaft and is arranged at true
Modulating motor connection outside empty room；Modulating motor is connected with driver and controller；
Described chopper wheel includes modulation panel fixed mount and the multi-disc moving blade being arranged in modulation panel fixed mount；
Described modulation panel fixed mount includes the framework of annular, multi-disc fixes blade and shaft coupling；
Described fixation blade is fan-shaped plate shape, and multi-disc is arranged in the annulus of framework between fixing blade etc., fixed leaf
The long segmental arc of piece is connected by welding with framework, and the short arc segments of fixed blade are by being welded to connect shaft coupling；
Described shaft coupling is arranged at the middle position that multi-disc fixes blade；Shaft coupling is connected with rotating shaft；In framework
Anchor ring on uniform multiple screwed holes；Clamp nut is provided with shaft coupling；
Described moving blade is fan-shaped plate shape, and the long arc end of moving blade is provided with multiple screwed holes, multi-disc movement
The long arc end of blade can be connected through a screw thread the diverse location for being arranged at framework, the short arc end of moving blade by clamp nut with
Shaft coupling connects.
Thermal evaporation coating apparatus according to claim, uniform 36 screwed holes on the anchor ring of the framework, phase
Adjacent screwed hole is 10 ° to the angle of frame center.
Described evaporation source is electron gun evaporation source or thermal resistance evaporation source.
Described modulating motor is direct current generator or stepper motor.
Described controller is PLC or industrial computer, and PLC is by LCD touch screen and carries out the parameter of electric machine
Set.
The present invention has advantages below：
1. the present invention can reduce the sedimentation rate of thermal evaporation plated film, film thickness monitoring precision is improved, and do not change over peplomer
Kinetic energy, during thermal evaporation deposition, deposition process can be optionally controlled, suitable for all of traditional thermal evaporation techniques
Thin-film material, such as ZnS, MgF2、Al2O3、ZrO2, H4, Al, Ag etc..
2. the deposition frequency of the present invention can be continuously adjusted as needed, when being not added with speed changer, deposition frequency highest
It can reach 1000Hz；The present invention only need to design different reticle configurations, so that it may the dutycycle of deposition coating materials is in 0:1-1:1
Between, so as to make the 0-100% that the sedimentation rate of film forming is current thermal evaporation deposition speed.
3. methods and apparatus of the present invention is simple in construction, cost is cheap, system compact, it is not necessary to which it is special that coating machine is carried out
Transformation, on original coating machine, as long as being reserved with standby hole, it is possible to conveniently installed.
Brief description of the drawings
Fig. 1 are the overall structure diagrams of the present invention；
Fig. 2 are the structural representations of modulation panel fixed mount of the present invention；
Fig. 3 are Fig. 2 A-A to sectional view；
Fig. 4 are moving blade schematic diagrames of the present invention；
In figure, 1-evaporation source, 2-baffle plate, 3-chopper wheel, 4-modulating motor, 5-driver, 6-controller, 7-
Vacuum chamber, 8-modulation panel fixed mount, 9-fixation blade, 10-clamp nut, 11-shaft coupling, 12-moving blade, 13-
Framework.
Embodiment
With reference to embodiment and accompanying drawing, the present invention is described further, but the guarantor of the present invention should not be limited with this
Protect scope.
A kind of thermal evaporation film plating process, its implementation are：
The coating materials particle diffused out from evaporation source, during it is transferred to substrate surface, using appropriate method
Coating materials transmitting procedure is intervened and regulated and controled.As needed, it is allowed to the coating materials particle of specific part is smoothly transferred on substrate,
And prevent the diffusion of remainder coating materials particle.Although evaporation of the evaporation source to coating materials is to continue to carry out, for substrate,
The coating materials deposition of realization is not continuous.In the present invention, the regulation and control to coating materials particle are come real by a special chopper wheel
Existing.Thang-kng part and light-blocking part are provided with chopper wheel, when thang-kng is partially rotated to evaporation source top, the coating materials being evaporated
Particle can smoothly be diffused into substrate surface, realize thin film deposition.When shading light part is rotated to above evaporation source, coating materials particle by
To blocking, because the particle that thermal evaporation comes out is not charged ion, shield portions can not be bypassed, therefore coating materials can not deposit to base
On piece, so as to realize the regulation and control of sedimentation rate.
A kind of thermal evaporation coating apparatus, as shown in Figure 1 including vacuum chamber 7 and the evaporation source 1 being arranged in vacuum chamber, evaporation
Source 1 is electron gun evaporation source or thermal resistance evaporation source, and the baffle plate 2 that can stop coating materials, coating materials fritting are provided with above evaporation source 1
During, to prevent the splash of bulky grain coating materials from, to substrate surface, preventing thin film deposition using baffle plate 2, after fritting terminates, opening
Baffle plate 2 carries out plated film, and evaporation source 1 and baffle plate 2 are the standard configurations of general coating machine.Chopper wheel 3 is provided with above baffle plate 2,
The interval of chopper wheel 3 and baffle plate is generally 2-3mm, and described chopper wheel 3 passes through rotating shaft and the modulation being arranged at outside vacuum chamber 7 electricity
Machine 4 connects；Modulating motor 4 is direct current generator or stepper motor, and modulating motor 4 is connected with driver 5 and controller 6；
As shown in Figure 2 and Figure 3, described chopper wheel 3 includes modulation panel fixed mount 8 and is arranged in modulation panel fixed mount 8
Multi-disc moving blade 12；
Described modulation panel fixed mount 8 includes the framework 13 of annular, multi-disc fixes blade 9 and shaft coupling 11；Described
Fixed blade 9 is fan-shaped plate shape, and the long segmental arc that multi-disc fixes blade 9 is welded in the annulus of framework 13 at equal intervals, fixed leaf
The short arc segments of piece 9 are by being welded to connect shaft coupling 11；Shaft coupling 11 is connected with rotating shaft；It is uniform on the anchor ring of framework 13
36 screwed holes, adjacent screw holes are 10 ° to the angle at the center of framework 13；Clamp nut 10 is provided with shaft coupling 11.
As shown in figure 4, described moving blade 12 is fan-shaped plate shape, the long arc end of moving blade 12 is provided with multiple spiral shells
Pit, the long arc end of multi-disc moving blade 12 can be connected through a screw thread the diverse location for being arranged at framework 13, moving blade 12
Short arc end is connected by clamp nut 10 with shaft coupling 11.
Described controller 6 is PLC or industrial computer, and PLC is by LCD touch screen and carries out the parameter of electric machine
Set.
When without using moving blade 12, the deposition frequency f and fixed quantity n of blade 9 and modulating motor rotating speed r（Rev/min）
Relation be：
By the rotating speed for adjusting modulating motor, it is possible to achieve the regulation of deposition frequency, the adjustable range of frequency are：0.1-
1000Hz。
According to above structure, than if desired for offer 1:The ratio between 2 intrinsic dutycycle, i.e. thang-kng part and the chopper wheel gross area
For 1:, can be by setting the fixation blade 9 of 90 degree of two panels when 2, either three 60 degree of fixation blade 9 or 4 45 degree
The fixed grade of blade 9 set-up mode is realized.
The dutycycle size of the present invention can also be adjusted using moving blade 12, and moving blade 12 is fanning strip, is fixed on
Between framework 13 and shaft coupling 11, uniform 36 screwed holes on the anchor ring of framework 13, adjacent screw holes are to the center of framework 13
Angle is 10 °, sectorial area corresponding to adjacent screw holes accounts for the 1/36 of the gross area, therefore blade 12 in rotary moving as needed
Position, and be fixed on modulation panel fixed mount 8, so that it may the regulation of dutycycle is realized, the structure type used with the present invention, accordingly
Moving blade fanning strip angle and quantity only need to simply adjust, the adjustable range of its dutycycle is：1:2-0:1.
The above-mentioned thickness of moving blade 12 is 0.5-1mm, is made of stainless steel, red copper or duralumin can also be used to be made.
It is evenly equipped with 36 screwed holes on the anchor ring of upper example middle frame 13, the screwed hole on moving blade 12 is matched.
The quantity of the screwed hole of the present invention is not limited to 36, and such as in order to increase the number of adjustable dutycycle, screwed hole can increase.
Embodiment 1：
Laser film, low-consumption optical film are being prepared, or during very thin layer film, it is often necessary to extremely low sedimentation rate
To increase transit time of the coating materials atom in substrate surface, film loss and internal stress are reduced, while increases the controllability of film layer,
But the kinetic energy of film forming particle can not be reduced.Using the deposition process and device of the present invention, need to adjust according to technological parameter first
Dutycycle is deposited, from the shaft coupling 11 of chopper wheel 3, clamp nut 10 of dismantling, adjusts a piece of moving blade 12 and fixed blade 9
Relative position, thang-kng part is covered, only retain 10 ° of scopes sectorial area thang-kng, then pass through clamp nut 10
Moving blade 12 is fixed with the screwed hole on the anchor ring of framework 13, by another moving blade 12 and first moving blade
12 are symmetrically installed fixation, tighten clamp nut 10, that is, complete duty cycle adjustment, the size of dutycycle is 1:18.
When the vacuum in vacuum chamber 7 reaches 5.0 × 10-3During Pa, ZrO is carried out2It is prepared by single thin film.Electron gun is opened to steam
Rise and carry out coating materials fritting, after fritting terminates, open modulation disk controller 6, set modulating motor rotating speed as 1200r/min, then
The modulating frequency of evaporation is 40Hz.Baffle plate 2 is opened, coating materials particle is spread by the thang-kng part on chopper wheel 3 to substrate surface,
Finally deposition forms film.Sedimentation rate is 0.025nm/s in the method.
Embodiment 2：
Investigation of materials field, it is often necessary to study the relation of deposition parameter and film microstructure and performance.Using this hair
Bright method and apparatus, without using moving blade 12, pass through 90 degree of fixation blade 9 of two panels, the deposition dutycycle of chopper wheel
For 1:2.
When the vacuum 3.0 × 10 in vacuum chamber 7-3During Pa, film preparation is carried out.Open electron gun evaporation source and carry out coating materials
Fritting.After fritting terminates, modulation disk controller 6 is opened, sets modulating motor rotating speed as 300r/min, then the modulating frequency of coating materials
For 10Hz.Baffle plate 2 is opened, coating materials atom is spread by the thang-kng part on chopper wheel 3 to substrate surface, and finally deposition is formed thin
Film.The method, realize deposition frequency 10Hz, dutycycle 1:2 thin film deposition.If the film for entering line frequency 20Hz sinks
Product, above step is repeated, only need to be 600r/min by modulating motor speed setting.In a word, deposition frequency regulation only needs to adjust
Section motor speed can conveniently realize.
Present disclosure is not limited to cited by embodiment, and those of ordinary skill in the art are by reading description of the invention
And any equivalent conversion taken technical solution of the present invention, it is that claim of the invention is covered.
Claims (6)
- A kind of 1. thermal evaporation film plating process, it is characterised in that：The coating materials particle diffused out from evaporation source, substrate is transferred at it During surface, it is allowed to which the coating materials particle of part realizes thin film deposition, remaining coating materials by channel transfer to substrate surface Particle is blocked, and can not be deposited on substrate, and between substrate and evaporation source, the ratio that regulation passage leads to-hindered is passage 1：18 or 1：2, corresponding modulating frequency is 40HZOr 10HZ, realize the diffusion control to coating materials particle.
- 2. a kind of thermal evaporation coating apparatus, including vacuum chamber（7）With the evaporation source being arranged in vacuum chamber（1）, it is characterised in that： In evaporation source（1）Top is provided with the baffle plate that can stop coating materials（2）, in baffle plate（2）Top is provided with chopper wheel（3）, it is described Chopper wheel（3）By rotating shaft and it is arranged at vacuum chamber（7）Outer modulating motor（4）Connection；Modulating motor（4）With driver （5）And controller（6）Connection；Described chopper wheel（3）Including modulation panel fixed mount（8）Be arranged at modulation panel fixed mount（8）Interior multi-disc moving blade （12）；Described modulation panel fixed mount（8）Framework including annular（13）, multi-disc fix blade（9）And shaft coupling（11）；Institute The fixation blade stated（9）For fan-shaped plate shape, multi-disc fixes blade（9）Framework is arranged at equal intervals（13）Annulus in, it is fixed Blade（9）Long segmental arc pass through welding and framework（13）Connection, fixed blade（9）Short arc segments by being welded to connect shaft coupling （11）；Described shaft coupling（11）It is arranged at multi-disc and fixes blade（9）Middle position；Shaft coupling（11）Coordinate with rotating shaft and connect Connect；In framework（13）Anchor ring on uniform multiple screwed holes；Clamp nut is provided with shaft coupling（10）；Described moving blade（12）For fan-shaped plate shape, moving blade（12）Long arc end be provided with multiple screwed holes, multi-disc Moving blade（12）Long arc end can be connected through a screw thread and be arranged at framework（13）Diverse location, moving blade（12）Short arc End passes through clamp nut（10）With shaft coupling（11）Connection.
- 3. thermal evaporation coating apparatus according to claim 2, it is characterised in that：The framework（13）Anchor ring on it is uniform 36 screwed holes, adjacent screw holes are to framework（13）The angle at center is 10 °.
- 4. the thermal evaporation coating apparatus according to Claims 2 or 3, it is characterised in that：Described evaporation source（1）For electron gun Evaporation source or thermal resistance evaporation source.
- 5. thermal evaporation coating apparatus according to claim 4, it is characterised in that：Described modulating motor（4）For direct current Machine or stepper motor.
- 6. thermal evaporation coating apparatus according to claim 5, it is characterised in that：Described controller（6）For PLC Or industrial computer, PLC is by LCD touch screen and carries out parameter of electric machine setting.
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| CN201510496271.5A CN105002465B (en) | 2015-08-14 | 2015-08-14 | A kind of thermal evaporation film plating process and its device |
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| CN201510496271.5A CN105002465B (en) | 2015-08-14 | 2015-08-14 | A kind of thermal evaporation film plating process and its device |
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| CN105002465B true CN105002465B (en) | 2017-12-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4336869B2 (en) * | 2001-11-27 | 2009-09-30 | 日本電気株式会社 | Vacuum film forming apparatus, vacuum film forming method, and battery electrode manufacturing method |
| JP2003286563A (en) * | 2002-03-28 | 2003-10-10 | Sony Corp | Film-forming apparatus and film-forming method |
| JP2004091858A (en) * | 2002-08-30 | 2004-03-25 | Toyota Industries Corp | Vacuum evaporation system and method for manufacturing evaporated film-applied product |
| JP4558375B2 (en) * | 2004-05-17 | 2010-10-06 | 株式会社アルバック | Evaporation source for organic materials and organic vapor deposition equipment |
| JP4673190B2 (en) * | 2005-11-01 | 2011-04-20 | 長州産業株式会社 | Molecular beam source for thin film deposition and its molecular dose control method |
| JP4768584B2 (en) * | 2006-11-16 | 2011-09-07 | 財団法人山形県産業技術振興機構 | Evaporation source and vacuum deposition apparatus using the same |
| CN101750639B (en) * | 2008-12-15 | 2012-06-20 | 鸿富锦精密工业（深圳）有限公司 | Optical coating device |
| CN204849008U (en) * | 2015-08-14 | 2015-12-09 | 西安工业大学 | Heat evaporation coating film device |
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