CN204849008U - Heat evaporation coating film device - Google Patents

Heat evaporation coating film device Download PDF

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Publication number
CN204849008U
CN204849008U CN201520609278.9U CN201520609278U CN204849008U CN 204849008 U CN204849008 U CN 204849008U CN 201520609278 U CN201520609278 U CN 201520609278U CN 204849008 U CN204849008 U CN 204849008U
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China
Prior art keywords
framework
moving blade
stator blades
shaft coupling
evaporation source
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Withdrawn - After Issue
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CN201520609278.9U
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Chinese (zh)
Inventor
徐均琪
杭良毅
惠迎雪
李建超
吴慎将
苏俊宏
梁海锋
杨利红
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Xian Technological University
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Xian Technological University
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Abstract

The utility model relates to a vacuum coating technical field, concretely relates to heat evaporation coating film device, the device include real empty room and set up the evaporation source in real empty room, are provided with the baffle that can stop the coating materials above the evaporation source, are provided with the reticule above the baffle, and the reticule is connected through pivot and the modulation motor that sets up outside real empty room, the modulation motor is connected with driver and controller, the utility model discloses simple structure, low cost, the system is compact, can adjust deposit frequency and duty cycle as required, realizes effective control thick to the membrane and the structure.

Description

A kind of thermal evaporation film coating apparatus
Technical field
The utility model relates to technical field of vacuum plating, is specifically related to a kind of thermal evaporation film coating apparatus.
Background technology
Manufacture field at optical thin film, thermal evaporation techniques is a kind of film deposition techniques grown up the earliest, has the features such as simple to operate, coating cost is low, monitoring is convenient, good stability, remains the main flow film preparing technology of optics manufacturing concern employing at present.
Thermal evaporation plated film is in vacuum chamber, to the thin film raw material (TiO in container for evaporation (as crucible, tungsten boat) 2, SiO 2, MgF 2deng) heat, at high temperature, raw-material atom or molecule gasify from coating materials surface evaporation and overflow, and form vapour stream in a vacuum chamber and to space diffusion, finally deposit to piece surface, attachment condensation or the film forming method of generation chemical reaction.Thermal evaporation plated film is generally adopted in two ways coating materials heating: resistive heating and electron beam heating.Resistive heating is that dystectic tungsten, molybdenum etc. are made specific boat type, by heated by electrodes boat body, makes the temperature that boat body reaches very high, thus fusing or gasification boat inside Coating Materials.Electron beam heating is the material in high-power electron beam (6000-10000eV) heating crucible utilizing electron beam gun to produce, and makes it evaporate and film forming method.Because electron beam can heat the material such as dystectic oxide compound and pottery, therefore obtain and apply more widely.
On the one hand, in film manufacturing processes, sometimes in order to obtain specific optical property (as ultra-narrow band pass filter, negative filter etc.), need to carry out thin layer or thin layer deposition (the even several Ethylmercurichlorendimide of several nanometer).Meanwhile, when the preparation of ultra-low loss film or laser film, also need ultralow sedimentation rate (as 0.01-0.1nm/s) that excellent performance could be obtained.According to the control mode of existing thickness, realize the accurate control of superthin layer, must reduce the sedimentation rate of film forming, that is low deposition rate can improve the control accuracy of thickness.But find in actually operating, adopt existing thermal evaporation techniques, the accurate deposition thickness being obtained superthin layer by the mode reducing sedimentation rate remains very difficult thing, reason is: 1, when depositing to required film thickness, even if cut off the electricity supply, the coating materials of melting can not stop evaporation immediately, and closing baffle plate also needs the regular hour; 2, the evaporation region formed after material melts is a face evaporation source, and sedimentation rate can not be too low; 3, most of material has specific fusing point, and therefore coating materials evaporation is the process of a sudden change; 4, adopt the method reducing source temperature can reduce sedimentation rate within the specific limits, but low temperature can cause the kinetic energy of film forming particle to reduce, film quality is deteriorated.It is very difficult that these reasons cause the thin layer of thermal evaporation plated film to control.
On the other hand, its performance of structures shape of film.Film prepared by different technical parameters has different microtextures and physicochemical property usually.Sedimentation rate size not only affects optical absorption and the scattering property of film, also affects the mechanical property of film.Change sedimentation rate, the mobility of coating materials particle can be affected, thus affect the quality of rete.The methods such as existing magnetron sputtering, ion beam sputtering, metal-organic chemical vapor deposition equipment and molecular beam epitaxy have good speed control, but the thin-film material that can deposit due to these methods is very limited, rete absorbs comparatively large, and therefore its application in optical coating field is very limited.
In sum, how to carry out accurately controlling being current problem demanding prompt solution to thin layer in thermal evaporation plated film.
Summary of the invention
Core of the present utility model is to provide a kind of thermal evaporation film coating apparatus, to regulate deposition frequency and dutycycle as required, realizes the effective control to thickness and structure.
For achieving the above object, the technical scheme that the utility model provides is:
A kind of thermal evaporation film coating apparatus, comprise vacuum chamber and be arranged at the evaporation source in vacuum chamber, above evaporation source, be provided with the baffle plate that can stop coating materials, above baffle plate, be provided with chopper wheel, described chopper wheel is connected with the modulating motor be arranged at outside vacuum chamber by rotating shaft; Modulating motor is connected with driving mechanism and controller;
Described chopper wheel comprises modulation panel anchor and is arranged at the multi-disc moving blade in modulation panel anchor;
Described modulation panel anchor comprises the framework of annular, multi-disc stator blades and shaft coupling;
Described stator blades is fanning strip shape, is arranged in the annulus of framework between multi-disc stator blades etc., and the long arc section of stator blades is connected with framework by welding, and the short arc segments of stator blades is by being welded to connect shaft coupling;
Described shaft coupling is arranged at the middle position of multi-disc stator blades; Shaft coupling and rotating shaft are connected; Uniform multiple threaded hole on the anchor ring of framework; Shaft coupling is provided with fitting nut;
Described moving blade is fanning strip shape, and the long arc end of moving blade is provided with multiple threaded hole, and the long arc end of multi-disc moving blade is arranged at the different positions of framework by being threaded, and the short arc end of moving blade is connected with shaft coupling by fitting nut.
Thermal evaporation film coating apparatus according to claim, uniform 36 threaded holes on the anchor ring of described framework, adjacent screw holes is 10 ° to the angle of frame center.
Described evaporation source is electron gun evaporation source or thermal resistance evaporation source.
Described modulating motor is direct-current machine or stepper-motor.
Described controller is PLC or industrial computer, and PLC is by LCD touch screen and carry out parameter of electric machine setting.
The utility model has the following advantages:
1. the utility model can reduce the sedimentation rate of thermal evaporation plated film, improves film thickness monitoring precision, and does not change over the kinetic energy of peplomer, in thermal evaporation deposition process, optionally can control deposition process, be applicable to all thin-film materials of traditional thermal evaporation techniques, as ZnS, MgF 2, Al 2o 3, ZrO 2, H4, Al, Ag etc.
2. deposition frequency of the present utility model can regulate as required continuously, and when not adding variator, deposition frequency can reach 1000Hz; The utility model only need design different reticle configurations, and the dutycycle of deposition coating materials just can be made to be between 0:1-1:1, thus the sedimentation rate of film forming can be made to be the 0-100% of current thermal evaporation deposition speed.
3. apparatus structure of the present utility model is simple, and with low cost, system compact, does not need to carry out special transformation to coating equipment, on original coating equipment, as long as be reserved with hole for subsequent use, just can conveniently install.
Accompanying drawing explanation
Fig. 1. be one-piece construction schematic diagram of the present utility model;
Fig. 2. be the structural representation of the utility model modulation panel anchor;
Fig. 3. be that the A-A of Fig. 2 is to sectional view;
Fig. 4. be the utility model moving blade schematic diagram;
In figure, 1-evaporation source, 2-baffle plate, 3-chopper wheel, 4-modulating motor, 5-driving mechanism, 6-controller, 7-vacuum chamber, 8-modulation panel anchor, 9-stator blades, 10-fitting nut, 11-shaft coupling, 12-moving blade, 13-framework.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described further, but protection domain of the present utility model should not be limited with this.
Implementation method of the present utility model is:
From the coating materials particle that evaporation source diffuses out, be transferred in the process of substrate surface at it, adopt appropriate means intervene coating materials transmitting procedure and regulate and control.As required, allow the coating materials particle of specific part to be transferred on substrate smoothly, and stop the diffusion of rest part coating materials particle.Although the evaporation of evaporation source to coating materials continues to carry out, for substrate, the coating materials deposition of realization is not continuous print.In the utility model, be realized by a special chopper wheel to the regulation and control of coating materials particle.Chopper wheel has logical light part and light-blocking part, when logical light part rotates to above evaporation source, the coating materials particle be evaporated can be diffused into substrate surface smoothly, realizes thin film deposition.When shading light part rotates to above evaporation source, coating materials particle is blocked, and because thermal evaporation particle is not out charged ion, cannot walk around shield portions, therefore coating materials cannot deposit on substrate, thus realizes the regulation and control of sedimentation rate.
A kind of thermal evaporation film coating apparatus, the evaporation source 1 comprising vacuum chamber 7 as shown in Figure 1 and be arranged in vacuum chamber, evaporation source 1 is electron gun evaporation source or thermal resistance evaporation source, the baffle plate 2 that can stop coating materials is provided with, in coating materials Pre melting process, for preventing the splash of macrobead coating materials to substrate surface above evaporation source 1, baffle plate 2 is adopted to stop thin film deposition, after fritting terminates, open baffle plate 2 and carry out plated film, evaporation source 1 and baffle plate 2 are standard configurations of general coating equipment.Above baffle plate 2, be provided with chopper wheel 3, the interval of chopper wheel 3 and baffle plate is generally 2-3mm, and described chopper wheel 3 is connected with the modulating motor 4 be arranged at outside vacuum chamber 7 by rotating shaft; Modulating motor 4 is direct-current machine or stepper-motor, and modulating motor 4 is connected with driving mechanism 5 and controller 6;
As shown in Figure 2 and Figure 3, the multi-disc moving blade 12 that described chopper wheel 3 comprises modulation panel anchor 8 and is arranged in modulation panel anchor 8;
Described modulation panel anchor 8 comprises the framework 13 of annular, multi-disc stator blades 9 and shaft coupling 11; Described stator blades 9 is fanning strip shape, and the long arc section of multi-disc stator blades 9 is welded in the annulus of framework 13 at equal intervals, and the short arc segments of stator blades 9 is by being welded to connect shaft coupling 11; Shaft coupling 11 and rotating shaft are connected; Uniform 36 threaded holes on the anchor ring of framework 13, the angle of adjacent screw holes to framework 13 center is 10 °; Shaft coupling 11 is provided with fitting nut 10.
As shown in Figure 4, described moving blade 12 is fanning strip shape, the long arc end of moving blade 12 is provided with multiple threaded hole, the long arc end of multi-disc moving blade 12 is arranged at the different positions of framework 13 by being threaded, the short arc end of moving blade 12 is connected with shaft coupling 11 by fitting nut 10.
Described controller 6 is PLC or industrial computer, and PLC is by LCD touch screen and carry out parameter of electric machine setting.
When not using moving blade 12, deposition frequency f and stator blades 9 quantity n and modulating motor rotating speed r(rev/min) pass be:
By regulating the rotating speed of modulating motor, can realize the adjustment of deposition frequency, the regulation range of frequency is: 0.1-1000Hz.
According to above structure, such as need the intrinsic dutycycle that 1:2 is provided, when namely logical light part is 1:2 with the ratio of the chopper wheel total area, can by arranging the stator blades 9 of two panels 90 degree, or the stator blades 9 of three 60 degree, or the set-up mode such as the stator blades 9 of 4 45 degree realizes.
Dutycycle size of the present utility model also can adopt moving blade 12 to regulate, moving blade 12 is fanning strip, be fixed between framework 13 and shaft coupling 11, uniform 36 threaded holes on the anchor ring of framework 13, the angle of adjacent screw holes to framework 13 center is 10 °, sectorial area corresponding to adjacent screw holes accounts for 1/36 of the total area, therefore the position of blade 12 in rotary moving as required, and be fixed on modulation panel anchor 8, just can realize the adjustment of dutycycle, with the structure formation that the utility model adopts, angle and the quantity of corresponding moving blade fanning strip only need simple adjustment, the regulation range of its dutycycle is: 1:2-0:1.
Above-mentioned moving blade 12 thickness is 0.5-1mm, adopts stainless steel to make, red copper or duralumin also can be adopted to make.
The anchor ring of upper routine middle frame 13 is evenly equipped with 36 threaded holes, the threaded hole on moving blade 12 coordinates with it.The quantity of threaded hole of the present utility model is not limited to 36, and as the number in order to increase adjustable dutycycle, threaded hole can increase.
Embodiment 1:
Preparing laser film, low-consumption optical film, or during thin layer film, usually need extremely low sedimentation rate to increase the transition time of coating materials atom at substrate surface, reduce film loss and internal stress, increase the controllability of rete simultaneously, but the kinetic energy of peplomer can not be lowered into.Adopt deposition method of the present utility model and device, first need to regulate deposition dutycycle according to processing parameter, from the shaft coupling 11 of chopper wheel 3, to dismantle fitting nut 10, the relative position of adjustment a slice moving blade 12 and stator blades 9, logical light part is covered, the sectorial area only retaining 10 ° of scopes leads to light, then by the threaded hole on the anchor ring of fitting nut 10 and framework 13, moving blade 12 is fixed, another sheet moving blade 12 and first moving blade 12 symmetry are installed fixing, tighten fitting nut 10, namely duty cycle adjustment is completed, the size of dutycycle is 1:18.
When the vacuum tightness in vacuum chamber 7 reaches 5.0 × 10 -3during Pa, carry out ZrO 2prepared by single thin film.Open electron gun evaporation source and carry out coating materials fritting, after fritting terminates, open chopper wheel controller 6, setting modulating motor rotating speed is 1200r/min, then the modulating frequency of evaporating is 40Hz.Open baffle plate 2, coating materials particle is spread to substrate surface by the logical light part on chopper wheel 3, last formation of deposits film.In this method, sedimentation rate is 0.025nm/s.
Embodiment 2:
Investigation of materials field, usually needs the relation studying deposition parameter and film microstructure and performance.Adopt method and apparatus of the present utility model, without the need to using moving blade 12, by the stator blades 9 of two panels 90 degree, the deposition dutycycle of chopper wheel is 1:2.
When the vacuum tightness 3.0 × 10 in vacuum chamber 7 -3during Pa, carry out film preparation.Open electron gun evaporation source and carry out coating materials fritting.After fritting terminates, open chopper wheel controller 6, setting modulating motor rotating speed is 300r/min, then the modulating frequency of coating materials is 10Hz.Open baffle plate 2, coating materials atom is spread to substrate surface by the logical light part on chopper wheel 3, last formation of deposits film.This method, achieves deposition frequency 10Hz, the thin film deposition of dutycycle 1:2.If carry out the thin film deposition of frequency 20Hz, repeating above step, need be only 600r/min by modulating motor speed setting.In a word, deposition frequency regulates and only motor speed need be regulated just can to realize easily.
Content of the present utility model is not limited to cited by embodiment, and the conversion of those of ordinary skill in the art by reading the utility model specification sheets to any equivalence that technical solutions of the utility model are taked, is claim of the present utility model and contains.

Claims (5)

1. a thermal evaporation film coating apparatus, comprise vacuum chamber (7) and be arranged at the evaporation source (1) in vacuum chamber, it is characterized in that: evaporation source (1) top is provided with the baffle plate (2) that can stop coating materials, baffle plate (2) top is provided with chopper wheel (3), described chopper wheel (3) by rotating shaft be arranged at vacuum chamber (7) modulating motor outward (4) and be connected; Modulating motor (4) is connected with driving mechanism (5) and controller (6);
Described chopper wheel (3) comprises modulation panel anchor (8) and is arranged at the multi-disc moving blade (12) in modulation panel anchor (8);
Described modulation panel anchor (8) comprises the framework (13) of annular, multi-disc stator blades (9) and shaft coupling (11); Described stator blades (9) is fanning strip shape, multi-disc stator blades (9) is arranged in the annulus of framework (13) at equal intervals, the long arc section of stator blades (9) is connected with framework (13) by welding, and the short arc segments of stator blades (9) is by being welded to connect shaft coupling (11); Described shaft coupling (11) is arranged at the middle position of multi-disc stator blades (9); Shaft coupling (11) and rotating shaft are connected; Uniform multiple threaded hole on the anchor ring of framework (13); Shaft coupling is provided with fitting nut (10);
Described moving blade (12) is fanning strip shape, the long arc end of moving blade (12) is provided with multiple threaded hole, the long arc end of multi-disc moving blade (12) is arranged at the different positions of framework (13) by being threaded, the short arc end of moving blade (12) is connected with shaft coupling (11) by fitting nut (10).
2. thermal evaporation film coating apparatus according to claim 1, is characterized in that: uniform 36 threaded holes on the anchor ring of described framework (13), the angle of adjacent screw holes to framework (13) center is 10 °.
3. thermal evaporation film coating apparatus according to claim 1 and 2, is characterized in that: described evaporation source (1) is electron gun evaporation source or thermal resistance evaporation source.
4. thermal evaporation film coating apparatus according to claim 3, is characterized in that: described modulating motor (4) is direct-current machine or stepper-motor.
5. thermal evaporation film coating apparatus according to claim 4, is characterized in that: described controller (6) is PLC or industrial computer, and PLC is by LCD touch screen and carry out parameter of electric machine setting.
CN201520609278.9U 2015-08-14 2015-08-14 Heat evaporation coating film device Withdrawn - After Issue CN204849008U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201520609278.9U CN204849008U (en) 2015-08-14 2015-08-14 Heat evaporation coating film device

Publications (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105002465A (en) * 2015-08-14 2015-10-28 西安工业大学 Method for thermal evaporation coating and device for method
CN111394700A (en) * 2020-04-22 2020-07-10 深圳恒泰克科技有限公司 Evaporation coating manufacturing device and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105002465A (en) * 2015-08-14 2015-10-28 西安工业大学 Method for thermal evaporation coating and device for method
CN111394700A (en) * 2020-04-22 2020-07-10 深圳恒泰克科技有限公司 Evaporation coating manufacturing device and method

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AV01 Patent right actively abandoned
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Granted publication date: 20151209

Effective date of abandoning: 20171219