CN104998957A - Aluminum substrate and punching method for same - Google Patents
Aluminum substrate and punching method for same Download PDFInfo
- Publication number
- CN104998957A CN104998957A CN201510469805.5A CN201510469805A CN104998957A CN 104998957 A CN104998957 A CN 104998957A CN 201510469805 A CN201510469805 A CN 201510469805A CN 104998957 A CN104998957 A CN 104998957A
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- China
- Prior art keywords
- punching
- pad
- hole
- aluminium base
- diameter
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
- B21D28/26—Perforating, i.e. punching holes in sheets or flat parts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses an aluminum substrate and a punching method for the same. The punching method comprises the steps that a PAD is arranged at the position to be punched of a PCB, the size of the PAD is smaller than the diameter of a punched hole by 0.2 mm, and the PAD and the punched hole are consistent in circle center; the PAD at the position to be punched is covered with oil, wherein the size of the area covered with oil is larger than the diameter of the PAD by 0.05 mm; a windowing ring is developed at the position to be punched, wherein the outer diameter of the windowing ring is larger than the diameter of the punched hole by 0.1 mm, and the inner diameter of the windowing ring is smaller than the diameter of the punched hole by 0.15 mm; and punching is carried out at the position to be punched. By means of the punching method, the element surface is flat relatively in punching, the problem of stepped holes can be solved after punching, and the hole diameter difference of the two faces can be controlled within +/-0.05 mm; a special die and a special punch press are not needed, and punching can be achieved through an aluminum substrate die and a common punch press. The use amount of ink is reduced, the developing area is reduced, and the service time of developing potions is prolonged; the amount of etching potions is reduced.
Description
Technical field
The present invention relates to aluminium base and make field, particularly relate to a kind of aluminium base and hole-punching method thereof.
Background technology
Aluminium base all shows good advantage in thermal conductivity, electric insulating quality, dimensional stability, machining property, add that country guides and supports the development of its product, increasing user makes the transition to aluminium base by original PCB, aluminium base is in fast growth at present, and an aluminium base technology especially road is advanced triumphantly.Aluminium base punching because of efficiency fast, progressively boring is replaced with punching in industry, aluminium base is when punching due to die theory, and in the quality hole after punching, flatness is worse than boring far away, and wherein the pore size of aluminium base of punching and circuit surface differs is the required technical barrier solved in industry.
The downward punching of aluminium base punching die circuit surface, in die punching process, an aluminium base part cuts off, another part is for breaking, breaking face (i.e. circuit surface) aperture can be larger than actual apertures, general aluminium base circuit surface aperture can 0.1mm more than larger than aluminium base face footpath, and namely punch pattern of the prior art causes aluminium base to there is the problem of step structure.
And improve the stair-stepping method of aluminium base punching mainly: 1, adopt bore mode to get out, but efficiency is low, speed is slow; 2, circuit surface adopts pad pasting operation, but cost is higher; 3, the gap of upper/lower die is improved in mould aspect, but there is low problem die life.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of aluminium base and hole-punching method thereof, be intended to solve punch pattern of the prior art and cause aluminium base to there is the problem of step structure.
Technical scheme of the present invention is as follows:
A hole-punching method for aluminium base, wherein, comprises step:
Treat that punching position arranges PAD at PCB, PAD size 0.2mm less of punching hole diameter, and the center of circle is consistent;
The PAD treating punching position carries out lid oil, covers oily area size 0.05mm larger than PAD diameter, and treating that punching position develops a ring of windowing, ring external diameter of windowing 0.1mm larger than punching hole diameter, internal diameter 0.15mm less of punching hole diameter;
Treat punching position and carry out punching.
The hole-punching method of described aluminium base, wherein, after punching, aperture, the two sides difference of PCB is within 0.05mm.
The hole-punching method of described aluminium base, wherein, uses aluminium base mould and punch press to treat punching position and carries out punching.
The hole-punching method of described aluminium base, wherein, etches after arranging PAD.
The hole-punching method of described aluminium base, wherein, described PAD is copper PAD.
A kind of aluminium base, is characterized in that, adopt hole-punching method as above to carry out punching.
Beneficial effect: during by the invention enables punching empty, component side is comparatively smooth, can improve the problem of shoulder hole after punching, aperture, two sides difference can be controlled in ± 0.05mm in, without the need to using special dies and punch press, use aluminium base mould and common punch press to realize.And save the use amount of ink, decreased the development area of development, improve the service time of development liquid medicine; Decrease the liquid medicine amount of etching.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention on aluminium base during punching.
Detailed description of the invention
The invention provides a kind of aluminium base and hole-punching method thereof, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The hole-punching method of aluminium base provided by the present invention, comprises step:
As shown in Figure 1, specifically comprise aluminium base 100 and dielectric layer 200 at PCB() PAD 300(is set until punching position etches after PAD 300 is set, described PAD is preferably copper PAD), PAD 300 size 0.2mm less of punching hole diameter, and the center of circle is consistent;
The PAD 300 treating punching position carries out lid oil, cover oily region 400(circular, the center of circle is consistent with the PAD center of circle) size 0.05mm larger than PAD 300 diameter, and treating that punching position develops a ring of windowing, ring external diameter of windowing 0.1mm larger than punching hole diameter, internal diameter 0.15mm less of punching hole diameter; The window center of circle of ring is consistent with the punching center of circle.
Treat punching position and carry out punching.Aluminium base mould and punch press specifically can be used to treat punching position and to carry out punching.
The method of aluminium base punching provided by the invention, by to dry film, optimizing and revising of the welding resistance film, before making punching, circuit surface reaches higher flatness, punching produces the problem of shoulder hole when using aluminium base mould and common punch press can solve punching, also a saving etching solution, development liquid medicine, the consumption of solder mask, manpower and materials are decreased with previous methods contrast, improve the punching ability of aluminium base, so improve the process capability of punching, make the aperture difference < 0.05mm of aluminium base and circuit surface, namely after punching aperture, the two sides difference of PCB within 0.05mm.
The present invention also provides a kind of aluminium base, and it adopts hole-punching method as above to carry out punching.
In sum, during by the invention enables punching empty, component side is comparatively smooth, can improve the problem of shoulder hole after punching, aperture, two sides difference can be controlled in ± 0.05mm in, without the need to using special dies and punch press, use aluminium base mould and common punch press to realize.And save the use amount of ink, decreased the development area of development, improve the service time of development liquid medicine; Decrease the liquid medicine amount of etching.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (6)
1. a hole-punching method for aluminium base, is characterized in that, comprises step:
Treat that punching position arranges PAD at PCB, PAD size 0.2mm less of punching hole diameter, and the center of circle is consistent;
The PAD treating punching position carries out lid oil, covers oily area size 0.05mm larger than PAD diameter, and treating that punching position develops a ring of windowing, ring external diameter of windowing 0.1mm larger than punching hole diameter, internal diameter 0.15mm less of punching hole diameter;
Treat punching position and carry out punching.
2. the hole-punching method of aluminium base according to claim 1, is characterized in that, after punching, aperture, the two sides difference of PCB is within 0.05mm.
3. the hole-punching method of aluminium base according to claim 1, is characterized in that, uses aluminium base mould and punch press to treat punching position and carries out punching.
4. the hole-punching method of aluminium base according to claim 1, is characterized in that, etches after arranging PAD.
5. the hole-punching method of aluminium base according to claim 1, is characterized in that, described PAD is copper PAD.
6. an aluminium base, is characterized in that, adopts the hole-punching method as described in any one of claim 1-5 to carry out punching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510469805.5A CN104998957B (en) | 2015-08-04 | 2015-08-04 | Aluminum substrate and punching method for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510469805.5A CN104998957B (en) | 2015-08-04 | 2015-08-04 | Aluminum substrate and punching method for same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104998957A true CN104998957A (en) | 2015-10-28 |
| CN104998957B CN104998957B (en) | 2017-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510469805.5A Active CN104998957B (en) | 2015-08-04 | 2015-08-04 | Aluminum substrate and punching method for same |
Country Status (1)
| Country | Link |
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| CN (1) | CN104998957B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
| JPH10314858A (en) * | 1997-05-22 | 1998-12-02 | Cmk Corp | Method for hardening treatment of die for punching printed circuit board and manufacture of printed circuit board |
| CN102647856A (en) * | 2012-04-13 | 2012-08-22 | 珠海元盛电子科技股份有限公司 | Method for producing COF (Chip on Film) flexible printed circuit board |
| CN103582317A (en) * | 2013-10-16 | 2014-02-12 | 镇江华印电路板有限公司 | Method for manufacturing tin leaking semicircular holes in flexible printed wiring board |
| CN104023486A (en) * | 2014-06-11 | 2014-09-03 | 深圳华麟电路技术有限公司 | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof |
-
2015
- 2015-08-04 CN CN201510469805.5A patent/CN104998957B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
| JPH10314858A (en) * | 1997-05-22 | 1998-12-02 | Cmk Corp | Method for hardening treatment of die for punching printed circuit board and manufacture of printed circuit board |
| CN102647856A (en) * | 2012-04-13 | 2012-08-22 | 珠海元盛电子科技股份有限公司 | Method for producing COF (Chip on Film) flexible printed circuit board |
| CN103582317A (en) * | 2013-10-16 | 2014-02-12 | 镇江华印电路板有限公司 | Method for manufacturing tin leaking semicircular holes in flexible printed wiring board |
| CN104023486A (en) * | 2014-06-11 | 2014-09-03 | 深圳华麟电路技术有限公司 | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104998957B (en) | 2017-03-22 |
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| CB03 | Change of inventor or designer information |
Inventor after: Wang Yuan Inventor after: Zhang Xia Inventor after: Zou Wenhui Inventor before: Zou Wenhui Inventor before: Wang Yuan |
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| COR | Change of bibliographic data | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |