CN104998957B - Aluminum substrate and punching method for same - Google Patents
Aluminum substrate and punching method for same Download PDFInfo
- Publication number
- CN104998957B CN104998957B CN201510469805.5A CN201510469805A CN104998957B CN 104998957 B CN104998957 B CN 104998957B CN 201510469805 A CN201510469805 A CN 201510469805A CN 104998957 B CN104998957 B CN 104998957B
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- China
- Prior art keywords
- punching
- pad
- hole
- aluminium base
- diameter
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
- B21D28/26—Perforating, i.e. punching holes in sheets or flat parts
Abstract
The invention discloses an aluminum substrate and a punching method for the same. The punching method comprises the steps that a PAD is arranged at the position to be punched of a PCB, the size of the PAD is smaller than the diameter of a punched hole by 0.2 mm, and the PAD and the punched hole are consistent in circle center; the PAD at the position to be punched is covered with oil, wherein the size of the area covered with oil is larger than the diameter of the PAD by 0.05 mm; a windowing ring is developed at the position to be punched, wherein the outer diameter of the windowing ring is larger than the diameter of the punched hole by 0.1 mm, and the inner diameter of the windowing ring is smaller than the diameter of the punched hole by 0.15 mm; and punching is carried out at the position to be punched. By means of the punching method, the element surface is flat relatively in punching, the problem of stepped holes can be solved after punching, and the hole diameter difference of the two faces can be controlled within +/-0.05 mm; a special die and a special punch press are not needed, and punching can be achieved through an aluminum substrate die and a common punch press. The use amount of ink is reduced, the developing area is reduced, and the service time of developing potions is prolonged; the amount of etching potions is reduced.
Description
Technical field
The present invention relates to aluminium base makes field, more particularly to a kind of aluminium base and its hole-punching method.
Background technology
Aluminium base all shows good advantage in thermal conductivity, electric insulating quality, dimensional stability, machining property,
The development of its product is guided and supported plus country, increasing user is started to aluminium base to make the transition from original PCB, aluminium base
Plate is currently in fast growth, and aluminium base plate technique is even more advanced triumphantly all the way.Aluminium base punching is fast because of efficiency, in industry by
Step punching replaces drilling, and in punching due to die theory, in the quality hole after punching, flatness is much worse than brill to aluminium base
Hole, it is the technical barrier solved needed in industry that the pore size of wherein punching aluminium base face and circuit surface differs.
Aluminium base punching die circuit faces down punching, and during die punching, an aluminium base part is turned off, another portion
It is divided into and breaks, breaks face（That is circuit surface）Aperture can be bigger than actual apertures, and general aluminium base circuit surface aperture can be than aluminium base face footpath
Big more than 0.1mm, i.e., punch pattern of the prior art cause aluminium base to there is step structure.
And improve the stair-stepping method of aluminium base punching and be mainly：1st, got out using bore mode, but efficiency is low, speed
Slowly；2nd, circuit surface adopts pad pasting operation, but relatively costly；3rd, improve the gap of upper/lower die in terms of mould, but there is the mould longevity
The low problem of life.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of aluminium base and its hole-punching method, purport
Solving the problems, such as that punch pattern of the prior art causes aluminium base to there is step structure.
Technical scheme is as follows：
A kind of hole-punching method of aluminium base, wherein, including step：
Treat that punching position arranges PAD, PAD sizes 0.2mm less than punching hole diameter in PCB, and the center of circle is consistent；
Lid oil, the oily area size of lid 0.05mm bigger than PAD diameter are carried out on the PAD for treat punching position, and is treating punching
Develop a windowing ring for position, windowing ring external diameter 0.1mm, internal diameter than punching hole diameter little 0.15mm bigger than punching hole diameter；
Treat punching position to be punched out.
The hole-punching method of described aluminium base, wherein, after punching, the two sides aperture difference of PCB is within 0.05mm.
The hole-punching method of described aluminium base, wherein, punching position is treated using aluminium base board mold and punch press be punched out.
The hole-punching method of described aluminium base, wherein, it is etched after PAD is set.
The hole-punching method of described aluminium base, wherein, the PAD is copper PAD.
A kind of aluminium base, it is characterised in that be punched out using hole-punching method as above.
Beneficial effect：By the invention enables rush that space-time component side is more smooth, the problem of shoulder hole can be improved after punching,
Two sides aperture difference is can be controlled in ± 0.05mm, without using special dies and punch press, using aluminium base board mold and common punching
Bed is capable of achieving.And the usage amount of ink is saved, the development area of development has been reduced, when improving the use of development liquid medicine
Between；Reduce the liquid medicine amount of etching.
Description of the drawings
Fig. 1 is structural representation of the present invention on aluminium base during punching.
Specific embodiment
The present invention provides a kind of aluminium base and its hole-punching method, to make the purpose of the present invention, technical scheme and effect more
Clear, clear and definite, the present invention is described in more detail below.It should be appreciated that specific embodiment described herein only to
The present invention is explained, is not intended to limit the present invention.
The hole-punching method of aluminium base provided by the present invention, including step：
As shown in figure 1, in PCB（Specifically include aluminium base 100 and dielectric layer 200）Treat that punching position arranges PAD 300（
It is etched after PAD 300 is set, the PAD is preferably copper PAD）, 300 sizes of PAD 0.2mm less than punching hole diameter, and circle
The heart is consistent；
Lid oil, the oily region 400 of lid are carried out on the PAD 300 for treat punching position（Circle, the center of circle are consistent with the PAD centers of circle）Greatly
Little 0.05mm bigger than 300 diameters of PAD, and treat punching position develop one windowing ring, windowing ring external diameter it is bigger than punching hole diameter
0.1mm, internal diameter 0.15mm less than punching hole diameter；The center of circle of windowing ring is consistent with the punching center of circle.
Treat punching position to be punched out.Specifically punching position can be treated using aluminium base board mold and punch press to be punched out.
The method of the aluminium base punching that the present invention is provided, by optimizing and revising to dry film, the welding resistance film so that before punching
Circuit surface has reached higher flatness, and punching produces shoulder hole when can solve punching using aluminium base board mold and common punch press
Problem, also a saving etching solution, development liquid medicine, the consumption of solder mask, and previous methods contrast reduce manpower and materials,
The punching ability of aluminium base is improve, so improve the process capability of punching so that the aperture difference of aluminium base face and circuit surface
After ＜ 0.05mm, i.e. punching, the two sides aperture difference of PCB is within 0.05mm.
The present invention also provides a kind of aluminium base, and which adopts hole-punching method as above to be punched out.
In sum, by the invention enables rush that space-time component side is more smooth, the problem of shoulder hole can be improved after punching,
Two sides aperture difference is can be controlled in ± 0.05mm, without using special dies and punch press, using aluminium base board mold and common punching
Bed is capable of achieving.And the usage amount of ink is saved, the development area of development has been reduced, when improving the use of development liquid medicine
Between；Reduce the liquid medicine amount of etching.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, and for those of ordinary skills, can
To be improved according to the above description or be converted, all these modifications and variations should all belong to the guarantor of claims of the present invention
Shield scope.
Claims (5)
1. a kind of hole-punching method of aluminium base, it is characterised in that including step：
Treat that punching position arranges PAD, PAD sizes 0.2mm less than punching hole diameter in PCB, and the center of circle is consistent；
Lid oil, the oily area size of lid 0.05mm bigger than PAD diameter are carried out on the PAD for treat punching position, and is treating punching position
Develop a windowing ring, windowing ring external diameter 0.1mm, internal diameter than punching hole diameter little 0.15mm bigger than punching hole diameter；
The center of circle of the windowing ring is consistent with the punching center of circle；
Treat punching position to be punched out；
It is etched after PAD is set.
2. the hole-punching method of aluminium base according to claim 1, it is characterised in that the two sides aperture difference of PCB after punching
Within 0.05mm.
3. the hole-punching method of aluminium base according to claim 1, it is characterised in that treated using aluminium base board mold and punch press
Punching position is punched out.
4. the hole-punching method of aluminium base according to claim 1, it is characterised in that the PAD is copper PAD.
5. a kind of aluminium base, it is characterised in that be punched out using the hole-punching method as described in any one of claim 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510469805.5A CN104998957B (en) | 2015-08-04 | 2015-08-04 | Aluminum substrate and punching method for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510469805.5A CN104998957B (en) | 2015-08-04 | 2015-08-04 | Aluminum substrate and punching method for same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104998957A CN104998957A (en) | 2015-10-28 |
| CN104998957B true CN104998957B (en) | 2017-03-22 |
Family
ID=54371962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510469805.5A Active CN104998957B (en) | 2015-08-04 | 2015-08-04 | Aluminum substrate and punching method for same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104998957B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
| JP3182113B2 (en) * | 1997-05-22 | 2001-07-03 | 日本シイエムケイ株式会社 | Method of quenching a die for printed circuit board press punching and method of manufacturing printed circuit board |
| CN102647856A (en) * | 2012-04-13 | 2012-08-22 | 珠海元盛电子科技股份有限公司 | Method for producing COF (Chip on Film) flexible printed circuit board |
| CN103582317B (en) * | 2013-10-16 | 2016-07-06 | 镇江华印电路板有限公司 | Flexible printed wiring board leakage stannum semicircle orifice manufacture method |
| CN104023486B (en) * | 2014-06-11 | 2017-01-25 | 深圳华麟电路技术有限公司 | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof |
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2015
- 2015-08-04 CN CN201510469805.5A patent/CN104998957B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104998957A (en) | 2015-10-28 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Yuan Inventor after: Zhang Xia Inventor after: Zou Wenhui Inventor before: Zou Wenhui Inventor before: Wang Yuan |
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| COR | Change of bibliographic data | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |