CN110429036A - The packaging technology and contact identification card of contact identification card - Google Patents

The packaging technology and contact identification card of contact identification card Download PDF

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Publication number
CN110429036A
CN110429036A CN201910531815.5A CN201910531815A CN110429036A CN 110429036 A CN110429036 A CN 110429036A CN 201910531815 A CN201910531815 A CN 201910531815A CN 110429036 A CN110429036 A CN 110429036A
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CN
China
Prior art keywords
conductive substrate
resist layer
identification card
reverse side
contact identification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910531815.5A
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Chinese (zh)
Inventor
康孝恒
蔡克林
李�瑞
许凯
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Huizhou Zhijin Electronic Technology Co Ltd
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Huizhou Zhijin Electronic Technology Co Ltd
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Priority to CN201910531815.5A priority Critical patent/CN110429036A/en
Publication of CN110429036A publication Critical patent/CN110429036A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4502—Disposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention discloses a kind of packaging technology of contact identification card and contact identification cards.Wherein, the packaging technology of contact identification card includes the following steps: to provide conductive substrate, prepares light-sensitive surface in the positive and negative of conductive substrate respectively；Exposure, development light-sensitive surface, are made line pattern structure；Resist layer is formed in the region of route graphic structure；Remove light-sensitive surface；The region for not having resist layer on conductive substrate is etched, several loading ends and several front electrodes are made in conductive substrate front, opposite electrode is made in conductive substrate reverse side, package substrate is made；It is implanted into chip on package substrate and carries out plastic packaging processing, chip-packaging structure is made；It cuts chip-packaging structure and contact identification card is made.The manufacture craft reduces production cost and product thickness using conductive substrate as basic material；In addition, the manufacture craft compared with traditional handicraft, saves drilling, heavy electrolytic copper, welding resistance printing, manufacture craft is simpler.

Description

The packaging technology and contact identification card of contact identification card
Technical field
The present invention relates to contact identification card encapsulation field more particularly to a kind of encapsulation of contact identification card Technique and a kind of contact identification card made of the packaging technology.
Background technique
With the development of wireless technology, the contacts identification card (contact such as mobile communication card, bank card, social security card SIM card) it is widely applied.With the broad mass market of Internet of Things, the market needs of SIM card are further increased.Existing skill In art, SIM card is usually used the insulating materials of double-sided copper-clad as substrate, needs in encapsulation process in encapsulation process It to drill on substrate, a series of cumbersome processes such as heavy copper facing, packaging technology is complicated, and production efficiency is low, and it is at high cost, in addition Product thickness is thicker, is not able to satisfy the requirement of people more and more.
Summary of the invention
For overcome the deficiencies in the prior art, an object of the present invention discloses a kind of encapsulation of contact identification card Technique, to solve, existing contact identification card packaging technology process is complicated, at high cost and thicker product thickness asks Topic.
The second object of the present invention discloses a kind of contact identification card, which uses above-mentioned envelope Fill technique production.
An object of the present invention adopts the following technical scheme that realization: a kind of packaging technology of contact identification card, Include the following steps:
Conductive substrate is provided, prepares light-sensitive surface in the positive and negative of the conductive substrate respectively；
The light-sensitive surface of the conductive substrate positive and negative is exposed respectively, development treatment, respectively in the conductive base Line pattern structure is made in the positive and negative of piece；
Corrosion stability processing is carried out to the line pattern structure of the conductive substrate positive and negative respectively, to lead respectively described Resist layer is formed in the line pattern structure of electric substrate positive and negative；
The light-sensitive surface of the conductive substrate positive and negative is removed respectively；
The region for not having resist layer on the conductive substrate positive and negative is etched respectively, in the conductive base Several are made for carrying the loading end and several front electrodes being arranged around the loading end of chip, in institute in piece front It states conductive substrate reverse side and opposite electrode is made, package substrate is made；
It is implanted into chip on the package substrate and carries out plastic packaging processing, chip-packaging structure is made；
The chip-packaging structure is cut, contact identification card is made.
Further, the preparation step of the light-sensitive surface includes: to coat photosensitive wet film in the positive and negative of the conductive substrate Or photosensitive dry film is overlayed, the light-sensitive surface of the conductive substrate positive and negative is made in the positive and negative of the conductive substrate.
Further, the preparation step of the line pattern structure includes: respectively to the institute of the conductive substrate positive and negative It states and is exposed after photosensitive film mask, developed, the conductive base is connected to be formed on the positive light-sensitive surface of the conductive substrate The front conducting pad of piece forms the reverse side conducting weldering that the conductive substrate is connected on the light-sensitive surface of the conductive substrate reverse side Disk, the front conducting pad form the positive line pattern structure of the conductive substrate, and the reverse side conducting pad is formed instead The line pattern structure in face.
Further, the making step of the resist layer includes: first respectively in the front conducting pad and the reverse side Electroless nickel layer in pad is connected, then the nickel layer in the front conducting pad and reverse side conducting pad powers on respectively Gold plated Layer, the layer gold and nickel layer stacking constitute the resist layer.
Further, the nickel layer with a thickness of 3-5um；And/or the layer gold with a thickness of 0.075-0.1um.
Further, the resist layer includes the setting of several intervals and to be laminated in the positive front of the conductive substrate anti- Erosion layer and several be laminated in the conductive substrate reverse side and respectively one by one with each front resist layer it is just opposite first instead Face resist layer and several be laminated in the conductive substrate reverse side and anti-with the first reverse side resist layer spaced second Face resist layer, frontal projected area of the front resist layer on the conductive substrate are less than the first reverse side resist layer in institute State the frontal projected area on conductive substrate.
Further, the preparation step of the front electrode, the loading end and the opposite electrode includes: while to institute It states the region on conductive substrate positive and negative without resist layer and carries out alkali etching, in the obverse and reverse of the conductive substrate Just with respect to and do not have resist layer region etch to form perforation, the front of the conductive substrate without resist layer and with institute It states the just opposite region of the first reverse side resist layer to etch to form step, front is formed in front resist layer corresponding region with this Electrode forms opposite electrode in the first reverse side resist layer corresponding region；Do not have in the front of the conductive substrate against corrosion Layer and the region just opposite with the second reverse side resist layer etch to form the loading end.
Further, the conductive substrate be copper sheet, the copper sheet with a thickness of 0.1-0.3um；And/or in the encapsulation It is implanted into chip on substrate and carries out plastic packaging to handle the step of chip-packaging structure is made including: to hold described in the package substrate Chip placement on section welds the chip and the front electrode with conducting wire, with the resin plastic-sealed encapsulation package substrate and Chip-packaging structure is made in the chip；And/or the chip-packaging structure is cut into the cutting of contact identification card Mode is punching press or laser cutting molding.
The second object of the present invention adopts the following technical scheme that realization: a kind of contact identification card, using above-mentioned The packaging technology of contact identification card is made.
Further, the contact identification card is mobile communication card or bank card or social security card.
Compared with prior art, the beneficial effects of the present invention are:
Contact identification card packaging technology provided by the invention makes line pattern structure directly on conductive substrate, Resist layer is formed along line pattern, the region for not having resist layer is etched, forms front electrode, opposite electrode and carrying Then the loading end of chip is implanted into the processing of chip plastic packaging, after cutting, can be obtained contact identification card.The manufacture craft By greatly reducing production cost using conductive substrate as basic material；In addition, there is no insulating layer among conductive substrate, Product thickness is reduced, realizes the lightening of product.The technique directly makes line pattern knot in the positive and negative of conductive substrate Structure saves the series of steps such as drilling, heavy electrolytic copper, welding resistance printing, simplifies production process, make to make compared with traditional handicraft Process simplification.
Detailed description of the invention
Fig. 1 is the flow diagram of contact identification card packaging technology disclosed by the embodiments of the present invention；
Fig. 2 is that the structure change in contact identification card encapsulation construction manufacturing process disclosed by the embodiments of the present invention is shown It is intended to；
Fig. 3 is contact identification card reverse side schematic diagram disclosed by the embodiments of the present invention；
Fig. 4 is contact identification card front schematic view disclosed by the embodiments of the present invention.
In figure: 1, conductive substrate, 2, light-sensitive surface, 3, line pattern structure, 31, front conducting pad, 32, reverse side conducting weldering Disk, 4, resist layer, 41, front resist layer, the 42, first reverse side resist layer, the 43, second reverse side resist layer, 44, front electrode, 45, Opposite electrode, 5, loading end, 6, package substrate, 7, chip-packaging structure, 71, chip, 72, conducting wire, 73, plastic-sealed body, 10, contact Formula identification card.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention, it should be noted that not Under the premise of conflicting, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination Example.
As shown in Figs. 1-2, the embodiment of the present invention provides a kind of packaging technology S100 of contact identification card 10, including Following steps:
Step S10 provides conductive substrate 1, prepares light-sensitive surface 2 in the positive and negative of conductive substrate 1 respectively；
Step S20 is respectively exposed the light-sensitive surface 2 of 1 positive and negative of conductive substrate, development treatment, respectively in conduction Line pattern structure 3 is made in the positive and negative of substrate 1；
Step S30 carries out corrosion stability processing to the line pattern structure 3 of 1 positive and negative of conductive substrate respectively, to exist respectively Resist layer 4 is formed in the line pattern structure 3 of 1 positive and negative of conductive substrate；
Step S40 removes the light-sensitive surface 2 of 1 positive and negative of conductive substrate respectively；
Step S50 is etched the region for not having resist layer 4 on 1 positive and negative of conductive substrate, respectively in conduction Several are made for carrying the loading end 5 of chip 71 and the front electrode of several circular settings of loading ends 5 in 1 front of substrate 44, opposite electrode 45 is made in 1 reverse side of conductive substrate, package substrate 6 is made；
Step S60 is implanted into chip 71 on package substrate 6 and carries out plastic packaging processing, chip-packaging structure 7 is made；
Step S70 cuts chip-packaging structure 7, and contact identification card 10 is made.
The packaging technology of contact identification card 10 provided in this embodiment directly makes line map on conductive substrate 1 Shape structure 3 forms resist layer 4 along line pattern, is etched to the region for not having resist layer 4, forms front electrode 44, anti- Then the loading end 5 of face electrode 45 and carrying chip 71 is implanted into the processing of 71 plastic packaging of chip, after cutting, can be obtained chip package Structure 7.The manufacture craft is by greatly reducing production cost using conductive substrate 1 as basic material；In addition, conductive base There is no insulating layer among piece 1, reduce product thickness, realizes the lightening of product.The technique directly conductive substrate 1 just, Reverse side makes line pattern structure 3, compared with traditional handicraft, saves the series of steps such as drilling, heavy electrolytic copper, welding resistance printing, Simplify production process, simplifies manufacture craft.
Preferably, at least two contact identification cards 10 of the cleavable formation of chip-packaging structure 7, in this way, using this The packaging technology for the contact identification card 10 that inventive embodiments provide can disposably be produced simultaneously more by a base material A contact identification card 10 manufactures conducive to the mass production of contact identification card 10, improves contact identity and knows Not Ka 10 production efficiency.
Preferably, conductive substrate 1 is copper sheet.It is to be appreciated that conductive substrate 1 is not limited to using copper sheet, or Other conductive metals.Copper sheet with a thickness of 0.1-0.3um, preferably 0.15um or 0.2um, in the present embodiment, the thickness of copper sheet Degree is 0.15um.By using the copper sheet with a thickness of 0.15um as conductive substrate 1, the thickness of product is greatly reduced, relatively For existing product, the contact identification card 10 of the present embodiment production is more lightening.In addition, directlying adopt copper sheet as female Material does not need the techniques such as electrolytic copper, welding resistance printing that drilled, sunk in process of production, simplifies production process, make manufacture craft more Fast, more time saving.
Preferably, the preparation step of light-sensitive surface 2 includes: to coat photosensitive wet film in the positive and negative of conductive substrate 1 or overlay The light-sensitive surface 2 of 1 positive and negative of conductive substrate is made in the positive and negative of conductive substrate 1 for photosensitive dry film.In the present embodiment, lead to It crosses and coats photosensitive wet film light-sensitive surface 2 is made in the positive and negative of conductive substrate 1.
Preferably, the preparation step of line pattern structure 3 includes: and covers respectively to the light-sensitive surface 2 of 1 positive and negative of conductive substrate It is exposed, develops after mould, the region of exposure, development has been carried out on light-sensitive surface, will form groove, i.e. pad area.Specifically, The front conducting pad 31 that conducting conductive substrate 1 is formed on the positive light-sensitive surface 2 of conductive substrate 1, in 1 reverse side of conductive substrate Pad 32 is connected in the reverse side that conducting conductive substrate 1 is formed on light-sensitive surface 2, and it is positive that front conducting pad 31 forms conductive substrate 1 The line pattern structure that pad 32 forms reverse side is connected in line pattern structure, reverse side.
Preferably, the making step of resist layer 4 includes: first to be connected in pad 32 in front conducting pad 31 and reverse side respectively Electroless nickel layer, then the nickel layer in front conducting pad 31 and reverse side conducting pad 32 powers on Gold plated Layer, layer gold and nickel layer respectively Stacking constitutes resist layer 4.Nickel layer with a thickness of 3-5um, layer gold with a thickness of 0.075-0.1um.
Preferably, resist layer 4 includes that several intervals are arranged and are laminated in positive 41 He of front resist layer of conductive substrate 1 Several be laminated in 1 reverse side of conductive substrate and respectively one by one the first reverse side resist layer 42 just opposite with each front resist layer 41 and Several be laminated in 1 reverse side of conductive substrate and with the spaced second reverse side resist layer 43 of the first reverse side resist layer 42, front Frontal plane of projection of the resist layer 41 in the frontal projected area on conductive substrate 1 less than the first reverse side resist layer 42 on conductive substrate 1 Product.
Preferably, the preparation step of front electrode 44, loading end 5 and opposite electrode 45 includes: while to conductive substrate 1 Region on positive and negative without resist layer 4 carries out alkali etching, just relatively and is not having in the obverse and reverse of conductive substrate 1 There is the region of resist layer 4 to etch to form perforation, the front of conductive substrate 1 do not have resist layer 4 and with the first reverse side resist layer 42 just opposite regions etch to form step, form front electrode 44 in 41 corresponding region of front resist layer with this, anti-first Resist layer 42 corresponding region in face forms opposite electrode 45；Do not have resist layer 4 in the front of conductive substrate 1 and resists with the second reverse side The just opposite region of erosion layer 43 etches to form loading end 5.In the present embodiment, not due to 1 positive and negative electrode size of conductive substrate Together, so when alkali etching, partial region carries out half-etching, forms step or loading end 5.
Preferably, it is being implanted into chip 71 on package substrate 6 and is carrying out the step of plastic packaging handles obtained chip-packaging structure 7 packet Include: the chip placement 71 on the loading end 5 of package substrate 6, with 72 welding chip 71 of conducting wire and front electrode 44, use is resin plastic-sealed Package substrate 6 and chip 71 are encapsulated, chip-packaging structure 7 is made.In the present embodiment, conducting wire 72 is gold thread.
Preferably, chip-packaging structure 7 is cut into the cutting method of contact identification card 10 for punching press or is swashed Light excision forming.
As shown in Figs 1-4, contact identification card 10 provided in an embodiment of the present invention, using above-mentioned contact identity The packaging technology of identification card 10 is made.Contact identification card 10 is mobile communication card or bank card or social security card.
Contact identification card 10 is including chip 71, the package substrate 6 for carrying chip 71 and for encapsulating chip 71 and package substrate 6 plastic-sealed body 73, package substrate 6 be equipped with for carrying the loading end 5 of chip 71, being set around loading end 5 The front electrode 44 and opposite electrode 45 corresponding with front electrode 44 set, conducting wire 72 are electrically connected chip 71 and front electrode 44.Conducting wire 72 is gold thread, welding chip 71 and front electrode 44 in the present embodiment.Plastic-sealed body 73 is epoxy molding material or ring Oxygen plastic packaging material encapsulates chip 71 and package substrate 6 by plastic packaging.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto, The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention Claimed range.

Claims (10)

1. a kind of packaging technology of contact identification card, which comprises the steps of:
Conductive substrate is provided, prepares light-sensitive surface in the positive and negative of the conductive substrate respectively；
The light-sensitive surface of the conductive substrate positive and negative is exposed respectively, development treatment, respectively in the conductive substrate Line pattern structure is made in positive and negative；
Corrosion stability processing is carried out to the line pattern structure of the conductive substrate positive and negative respectively, respectively in the conductive base Resist layer is formed in the line pattern structure of piece positive and negative；
The light-sensitive surface of the conductive substrate positive and negative is removed respectively；
To on the conductive substrate positive and negative do not have resist layer region be etched respectively, with the conductive substrate just Wheat flour is used to carry the loading end and several front electrodes being arranged around the loading end of chip at several, leads described Opposite electrode is made in electric substrate reverse side, and package substrate is made；
It is implanted into chip on the package substrate and carries out plastic packaging processing, chip-packaging structure is made；
The chip-packaging structure is cut, contact identification card is made.
2. the packaging technology of contact identification card according to claim 1, which is characterized in that the system of the light-sensitive surface Standby step includes: to coat photosensitive wet film in the positive and negative of the conductive substrate or overlay photosensitive dry film, in the conductive substrate Positive and negative the light-sensitive surfaces of the conductive substrate positive and negative is made.
3. the packaging technology of contact identification card according to claim 2, which is characterized in that the line pattern knot The preparation step of structure includes:
Respectively to being exposed, being developed after the photosensitive film mask of the conductive substrate positive and negative, in the conductive substrate The front conducting pad that the conductive substrate is connected is formed on positive light-sensitive surface, on the light-sensitive surface of the conductive substrate reverse side The reverse side conducting pad that the conductive substrate is connected is formed, the front conducting pad forms the positive route of the conductive substrate Graphic structure, the reverse side conducting pad form the line pattern structure of reverse side.
4. the packaging technology of contact identification card according to claim 3, which is characterized in that the system of the resist layer Include: as step
Electroless nickel layer in pad first is connected in the front conducting pad and the reverse side respectively, then respectively in the front conducting The nickel layer in pad and reverse side conducting pad powers on Gold plated Layer, and the layer gold and nickel layer stacking constitute described anti- Lose layer.
5. the packaging technology of contact identification card according to claim 4, which is characterized in that the thickness of the nickel layer For 3-5um；And/or the layer gold with a thickness of 0.075-0.1um.
6. the packaging technology of contact identification card according to claim 4, which is characterized in that the resist layer includes Several intervals are arranged and are laminated in the positive front resist layer of the conductive substrate and several are laminated in the conductive substrate Reverse side and respectively one by one the first reverse side resist layer just opposite with each front resist layer and several be laminated in the conduction Substrate reverse side and with the spaced second reverse side resist layer of the first reverse side resist layer, the front resist layer leads described Frontal projected area on electric substrate is less than frontal projected area of the first reverse side resist layer on the conductive substrate.
7. the packaging technology of contact identification card according to claim 6, which is characterized in that the front electrode, The preparation step of the loading end and the opposite electrode includes:
Alkali etching is carried out to the region for not having resist layer on the conductive substrate positive and negative simultaneously, in the conductive substrate Obverse and reverse just with respect to and do not have resist layer region etch to form perforation, do not have in the front of the conductive substrate The resist layer and region just opposite with the first reverse side resist layer etches to form step, it is corresponding in the front resist layer with this Region forms front electrode, forms opposite electrode in the first reverse side resist layer corresponding region；The conductive substrate just Face does not have resist layer and the region just opposite with the second reverse side resist layer etches to form the loading end.
8. the packaging technology of contact identification card according to any one of claims 1 to 7, which is characterized in that described Conductive substrate is copper sheet, the copper sheet with a thickness of 0.1-0.3um；And/or
Being implanted into chip on the package substrate and carrying out the step of plastic packaging handles obtained chip-packaging structure includes: in the envelope Chip placement on the loading end of substrate is filled, the chip and the front electrode are welded with conducting wire, with resin plastic-sealed encapsulation Chip-packaging structure is made in the package substrate and the chip；And/or
It is punching press or laser cutting molding by the cutting method that the chip-packaging structure is cut into contact identification card.
9. a kind of contact identification card, which is characterized in that use contact body as claimed in any one of claims 1 to 8 The packaging technology of part identification card is made.
10. contact identification card according to claim 9, which is characterized in that the contact identification card is Mobile communication card or bank card or social security card.
CN201910531815.5A 2019-06-19 2019-06-19 The packaging technology and contact identification card of contact identification card Pending CN110429036A (en)

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Application publication date: 20191108