CN104981090B - 差动传送线路、光传送装置及差动传送线路的制造方法 - Google Patents
差动传送线路、光传送装置及差动传送线路的制造方法 Download PDFInfo
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- CN104981090B CN104981090B CN201510150562.9A CN201510150562A CN104981090B CN 104981090 B CN104981090 B CN 104981090B CN 201510150562 A CN201510150562 A CN 201510150562A CN 104981090 B CN104981090 B CN 104981090B
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014075627A JP6310750B2 (ja) | 2014-04-01 | 2014-04-01 | 差動伝送線路、光伝送装置、及び差動伝送線路の製造方法 |
| JP2014-075627 | 2014-04-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104981090A CN104981090A (zh) | 2015-10-14 |
| CN104981090B true CN104981090B (zh) | 2019-02-05 |
Family
ID=54192453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510150562.9A Active CN104981090B (zh) | 2014-04-01 | 2015-04-01 | 差动传送线路、光传送装置及差动传送线路的制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9781824B2 (enExample) |
| JP (1) | JP6310750B2 (enExample) |
| CN (1) | CN104981090B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016122222A1 (de) * | 2016-11-18 | 2018-05-24 | Telegärtner Karl Gärtner GmbH | Elektrische Steckbuchse |
| JP6890966B2 (ja) * | 2016-12-20 | 2021-06-18 | 日本ルメンタム株式会社 | 光モジュール及び光伝送装置 |
| CN111062178B (zh) * | 2018-10-16 | 2023-12-01 | 群创光电股份有限公司 | 电子装置 |
| CN111262061A (zh) * | 2018-11-30 | 2020-06-09 | 技嘉科技股份有限公司 | 差动信号电连接组件及可传送差动信号的电路板 |
| US10813211B2 (en) * | 2018-12-14 | 2020-10-20 | Dell Products L.P. | Printed circuit board layout for mitigating near-end crosstalk |
| KR102758032B1 (ko) * | 2019-08-02 | 2025-01-21 | 삼성전자주식회사 | Fpcb를 포함하는 전자 장치 |
| US11758647B2 (en) * | 2021-01-26 | 2023-09-12 | Dell Products L.P. | Inhomogeneous dielectric medium high-speed stripline trace system |
| CN113347791B (zh) * | 2021-08-09 | 2021-10-08 | 四川英创力电子科技股份有限公司 | 一种带沉槽的pcb板及其工作方法 |
| CN116963377A (zh) * | 2022-04-20 | 2023-10-27 | 戴尔产品有限公司 | 差分对内侧阻抗补偿 |
| CN115275715B (zh) * | 2022-07-15 | 2025-07-22 | 番禺得意精密电子工业有限公司 | 传输板和连接件 |
| TWI842208B (zh) * | 2022-11-17 | 2024-05-11 | 瑞昱半導體股份有限公司 | 積體電路以及訊號傳輸方法 |
| JP2025177964A (ja) * | 2024-05-24 | 2025-12-05 | Ｆｉｃｔ株式会社 | 多層基板、多層基板の製造方法、及び電子機器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101877936A (zh) * | 2009-04-30 | 2010-11-03 | 日东电工株式会社 | 挠性布线电路基板 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62199095A (ja) * | 1986-02-26 | 1987-09-02 | 富士通株式会社 | プリント板のインピ−ダンス特性の制御方法 |
| JPH09294261A (ja) * | 1996-04-26 | 1997-11-11 | Sharp Corp | 衛星放送受信機用ｄｂｓチューナー |
| US6683260B2 (en) * | 2000-07-04 | 2004-01-27 | Matsushita Electric Industrial Co., Ltd. | Multilayer wiring board embedded with transmission line conductor |
| US7336139B2 (en) * | 2002-03-18 | 2008-02-26 | Applied Micro Circuits Corporation | Flexible interconnect cable with grounded coplanar waveguide |
| JP2004304134A (ja) | 2003-04-01 | 2004-10-28 | Toshiba Corp | 配線基板及びその製造方法 |
| US7230506B2 (en) * | 2003-10-09 | 2007-06-12 | Synopsys, Inc. | Crosstalk reduction for a system of differential line pairs |
| US7609125B2 (en) | 2006-10-13 | 2009-10-27 | Avago Technologies Enterprise IP (Singapore) Pte. Ltd. | System, device and method for reducing cross-talk in differential signal conductor pairs |
| US8212149B2 (en) | 2008-03-04 | 2012-07-03 | Broadcom Corporation | Mutual capacitance and magnetic field distribution control for transmission lines |
| JP4892514B2 (ja) * | 2008-04-22 | 2012-03-07 | 日本オプネクスト株式会社 | 光通信モジュールおよびフレキシブルプリント基板 |
| US8344819B2 (en) | 2008-10-28 | 2013-01-01 | Broadcom Corporation | Conformal reference planes in substrates |
| US9288893B2 (en) * | 2009-02-11 | 2016-03-15 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
| CN102083277B (zh) | 2009-12-01 | 2014-04-30 | 鸿富锦精密工业（深圳）有限公司 | 印刷电路板及其布线方法 |
| JP5473688B2 (ja) * | 2010-03-12 | 2014-04-16 | 三菱電機株式会社 | 伝送線路 |
| CN102238810B (zh) | 2010-05-05 | 2015-12-09 | 鸿富锦精密工业（深圳）有限公司 | 印刷电路板及其布线方法 |
| CN102333413A (zh) | 2010-07-12 | 2012-01-25 | 鸿富锦精密工业（深圳）有限公司 | 印刷电路板 |
| US8425236B2 (en) * | 2011-05-16 | 2013-04-23 | International Business Machines Corporation | Tall mezzanine connector |
| JP5951193B2 (ja) | 2011-06-16 | 2016-07-13 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
-
2014
- 2014-04-01 JP JP2014075627A patent/JP6310750B2/ja active Active
-
2015
- 2015-03-31 US US14/674,414 patent/US9781824B2/en active Active
- 2015-04-01 CN CN201510150562.9A patent/CN104981090B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101877936A (zh) * | 2009-04-30 | 2010-11-03 | 日东电工株式会社 | 挠性布线电路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104981090A (zh) | 2015-10-14 |
| US9781824B2 (en) | 2017-10-03 |
| JP6310750B2 (ja) | 2018-04-11 |
| JP2015198350A (ja) | 2015-11-09 |
| US20150282300A1 (en) | 2015-10-01 |
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Address after: Kanagawa Patentee after: Lang Mei Tong Co., Ltd. of Japan Address before: Kanagawa Patentee before: Oclaro Japan Inc. |
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