CN104968150A - High-layer circuit board manufactured by applying mirror symmetry and manufacturing method thereof - Google Patents
High-layer circuit board manufactured by applying mirror symmetry and manufacturing method thereof Download PDFInfo
- Publication number
- CN104968150A CN104968150A CN201510379071.1A CN201510379071A CN104968150A CN 104968150 A CN104968150 A CN 104968150A CN 201510379071 A CN201510379071 A CN 201510379071A CN 104968150 A CN104968150 A CN 104968150A
- Authority
- CN
- China
- Prior art keywords
- base plate
- substrates
- circuit board
- film
- symmetry axis
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a high-layer circuit board manufactured by applying mirror symmetry and a manufacturing method thereof. The high-layer circuit board comprises an axisymmetric bottom board, wherein the bottom board is provided with rivet holes which are symmetrically distributed, two sides of a symmetry axis of the bottom board are respectively provided with substrates which are symmetrical and identical in number of layers, the bottom board is folded along the symmetry axis so as to enable the substrates to be overlapped together and laminated, and the overlapped rivet holes are riveted and fixed by using rivets. According to the high-layer circuit board manufactured by applying mirror symmetry, two piles of symmetrical substrates are arranged on the same bottom board, circuit diagrams can be set corresponding to the two substrates on the same film when circuits are manufactured, only one set of film tools is needed, and half of the film consumption can be saved. In addition, the two piles of substrates are symmetrically arranged on the bottom board, substrates mixing does not occur, the time spent on changing films and making marks is reduced in the production process, the production efficiency can be improved, and the quality stability of products is improved.
Description
Technical field
The present invention relates to copper-clad plate field, be specifically related to a kind of high sandwich circuit board and preparation method thereof applied specular and make.
Background technology
Along with the development of wiring board techniques, particularly high laminate client is when designing, and in order to reduce area, N laminate can adopt N
1+ N
2structure (at N
1and N
2in layer, need to do the design of mechanical buried via hole), namely adopt two stacking multilayer boards to become high laminate.When adopting traditional handicraft to produce N laminate, at processing N
1and N
2time, be equivalent to do two multi-layer sheet, need two cover film instruments, cost is higher, and at N
1and N
2when switching making, need to change the film, reduce production efficiency; And in the process of making sheet, for avoiding mixed plate, also need N
1and N
2carry out class indication, affect production efficiency further.
Summary of the invention
In order to solve the problem that existing traditional handicraft is produced high laminate need two cover film instruments and carried out class indication, the object of the present invention is to provide a kind of high sandwich circuit board and preparation method thereof applied specular and make, only need a set of film instrument, and without the need to carrying out class indication, reduce costs, enhance productivity.
The technical solution adopted in the present invention is:
Apply the manufacture method that specular makes high sandwich circuit board, comprise the following steps:
S1, preparation one piece of axisymmetric base plate, base plate is placed the substrate that two lamination numbers are equal, and two laminated substrates are symmetrically distributed in the symmetry axis both sides of base plate;
S2, two laminated substrates are pressed together on base plate;
S3, the film is utilized to do copper wire at one piece of upper surface of two laminated substrate the tops;
S4, on base plate, offer rivet hole, rivet hole is symmetrically distributed on base plate;
S5, the half of base plate is turned over turnback along symmetry axis, two laminated substrates are superimposed together, simultaneously corresponding rivet hole coincides together, and utilizes rivet to be fixed by base plate both sides riveted, then carries out pressing, obtain high laminate.
As the further improvement of technique scheme, in above-mentioned steps S3, the described film is one piece, and on the film, corresponding two pieces of substrates are respectively arranged with line map.
A kind of high sandwich circuit board applied specular and make, comprise one piece of axisymmetric base plate, described base plate offers symmetrical rivet hole, bottom board symmetry axle both sides are respectively arranged with symmetrical, that the number of plies is equal substrate, base plate is amounted to along symmetry axis and is made superimposed substrate together and pressing, utilizes rivet to be fixed by the rivet hole riveted of coincidence.
The invention has the beneficial effects as follows:
The method of the present invention's application specular makes high laminate, same base plate arranges the substrate that two overlays claim, on same Zhang Feilin, line map can be set corresponding two pieces of substrates respectively when doing circuit, namely only need a set of film instrument, the film consumption of half can be saved; In addition, owing to being symmetricly set on base plate by two laminated substrates, mixed plate can not be there is, in process of production, reduce the time of the replacing film and do the time identified, can enhance productivity, improve the quality stability of product.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is the structural representation of the high sandwich circuit board that application specular of the present invention makes.
Drawing reference numeral illustrates: 1, base plate; 2, substrate; 3, rivet hole.
Embodiment
With reference to Fig. 1, the invention provides a kind of high sandwich circuit board applied specular and make, comprise one piece of axisymmetric base plate 1, base plate 1 offers symmetrical rivet hole 3, the symmetry axis both sides of base plate 1 are respectively arranged with symmetrical, that the number of plies is equal substrate 2, base plate 1 is amounted to along symmetry axis and substrate 2 is superimposed together and pressing, utilizes rivet to be fixed by rivet hole 3 riveted of coincidence.
In addition, present invention also offers the manufacture method that above-mentioned application specular makes high sandwich circuit board, to make n laminar substrate, comprise the following steps:
S1, preparation one piece of axisymmetric base plate 1, substrate 2, two laminated substrate 2 arranging L1-Ln/2 layer and L [(n/2)+1]-Ln layer on the symmetry axis both sides of base plate 1 is respectively symmetrical;
S2, two laminated substrates 2 to be pressed together on base plate 1, thus on one piece of base plate 1, to obtain L1-Ln/2 layer and L [(n/2)+1]-Ln layer two kinds of multilager base plate;
S3, utilize the same film to do copper wire at one piece of upper surface of two laminated substrate 2 the tops, on the described film, corresponding two pieces of substrates 2 are respectively arranged with line map;
S4, utilize laser aid to offer rivet hole 3 on base plate 1, rivet hole 3 is symmetrically distributed on base plate 1;
S5, the half of base plate 1 is turned over turnback along symmetry axis, two laminated substrates 2 are superimposed together, simultaneously corresponding rivet hole 3 coincides together, and utilizes rivet to be fixed by base plate 1 both sides riveted, then carries out pressing, obtain the high laminate of n layer.
The method of the present invention's application specular makes high laminate, same base plate 1 arranges the substrate 2 that two overlays claim, on same Zhang Feilin, line map can be set corresponding two pieces of substrates 2 respectively when doing circuit, namely only need a set of film instrument, the film consumption of half can be saved; In addition, owing to being symmetricly set on base plate 1 by two laminated substrates 2, mixed plate can not be there is, in process of production, reduce the time of the replacing film and do the time identified, can enhance productivity, improve the quality stability of product.
Above concrete structure and sized data illustrate preferred embodiment of the present invention, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent distortion or replacement are all included in the application's claim limited range.
Claims (3)
1. apply the manufacture method that specular makes high sandwich circuit board, it is characterized in that, comprise the following steps:
S1, preparation one piece of axisymmetric base plate (1), at the substrate (2) that the upper placement two lamination number of base plate (1) is equal, two laminated substrates (2) are symmetrically distributed in the symmetry axis both sides of base plate (1);
S2, two laminated substrates (2) are pressed together on base plate (1);
S3, the film is utilized to do copper wire at one piece of upper surface of two laminated substrates (2) the top;
S4, on base plate (1), offer rivet hole (3), rivet hole (3) is symmetrically distributed on base plate (1);
S5, the half of base plate (1) is turned over turnback along symmetry axis, two laminated substrates (2) are superimposed together, simultaneously corresponding rivet hole (3) coincides together, and utilizes rivet to be fixed by base plate (1) both sides riveted, then carries out pressing, obtain high laminate.
2. according to claim 1ly a kind ofly apply the manufacture method that specular makes high sandwich circuit board, it is characterized in that: in above-mentioned steps S3, the described film is one piece, and on the film, corresponding two pieces of substrates (2) are respectively arranged with line map.
3. the high sandwich circuit board applied specular and make, it is characterized in that: comprise one piece of axisymmetric base plate (1), described base plate (1) offers symmetrical rivet hole (3), base plate (1) symmetry axis both sides are respectively arranged with symmetrical, that the number of plies is equal substrate (2), base plate (1) is amounted to along symmetry axis and substrate (2) is superimposed together and pressing, utilizes rivet to be fixed by rivet hole (3) riveted overlapped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510379071.1A CN104968150A (en) | 2015-06-30 | 2015-06-30 | High-layer circuit board manufactured by applying mirror symmetry and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510379071.1A CN104968150A (en) | 2015-06-30 | 2015-06-30 | High-layer circuit board manufactured by applying mirror symmetry and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104968150A true CN104968150A (en) | 2015-10-07 |
Family
ID=54222027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510379071.1A Pending CN104968150A (en) | 2015-06-30 | 2015-06-30 | High-layer circuit board manufactured by applying mirror symmetry and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104968150A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009164166A (en) * | 2007-12-28 | 2009-07-23 | Suzuka Fuji Xerox Co Ltd | Printed circuit board |
| CN101662897A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for multilayer stacking printed wiring board |
| CN102056414A (en) * | 2010-12-29 | 2011-05-11 | 北大方正集团有限公司 | Manufacturing method of printed circuit board |
| CN103906379A (en) * | 2014-02-28 | 2014-07-02 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN204836807U (en) * | 2015-06-30 | 2015-12-02 | 开平依利安达电子第三有限公司 | Use high -rise circuit board of mirror symmetry preparation |
-
2015
- 2015-06-30 CN CN201510379071.1A patent/CN104968150A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009164166A (en) * | 2007-12-28 | 2009-07-23 | Suzuka Fuji Xerox Co Ltd | Printed circuit board |
| CN101662897A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for multilayer stacking printed wiring board |
| CN102056414A (en) * | 2010-12-29 | 2011-05-11 | 北大方正集团有限公司 | Manufacturing method of printed circuit board |
| CN103906379A (en) * | 2014-02-28 | 2014-07-02 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN204836807U (en) * | 2015-06-30 | 2015-12-02 | 开平依利安达电子第三有限公司 | Use high -rise circuit board of mirror symmetry preparation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151007 |
|
| RJ01 | Rejection of invention patent application after publication |