CN104966684A - Integrated circuit chip binding equipment and working method thereof - Google Patents
Integrated circuit chip binding equipment and working method thereof Download PDFInfo
- Publication number
- CN104966684A CN104966684A CN201510313641.7A CN201510313641A CN104966684A CN 104966684 A CN104966684 A CN 104966684A CN 201510313641 A CN201510313641 A CN 201510313641A CN 104966684 A CN104966684 A CN 104966684A
- Authority
- CN
- China
- Prior art keywords
- glue
- integrated circuit
- packing element
- drum
- piston
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 50
- 238000012856 packing Methods 0.000 claims description 43
- 239000000853 adhesive Substances 0.000 claims description 15
- 229920000715 Mucilage Polymers 0.000 claims description 13
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Details Of Spanners, Wrenches, And Screw Drivers And Accessories (AREA)
Abstract
The invention provides integrated circuit chip binding equipment and a working method thereof. The integrated circuit chip binding equipment includes a mounting support and an alarm, or also has a controller. A glue drum includes an upper segment of the drum, a drum body segment, a lower segment of the drum and a dispensing head; and the glue drum is internally provided with a piston, a magnetic body is arranged in a piston body, and the upper end of the piston is connected with a dispensing driver that drives the piston to run. An upper part of the mounting support is connected with an upper clamping support used for clamping the upper segment of the drum, and a lower part is connected with a lower clamping support used for clamping the lower segment of the drum. The mounting support is also connected with a sensor support used for placing a magnetic sensor. The controller can receive a signal instruction of the sensor, and can control the working state of a drive motor, the dispensing driver or the alarm respectively. The mounting support is also connected with a lamp support used for installing a green LED lamp outside the drum body segment of the glue drum. Through the working method of the integrated circuit chip binding equipment, the degree of automation of an integrated circuit chip module can be improved, capability of automatically detecting a glue solution is strong, a function of a timely alarm is achieved, the glue drum is easy to mount and dismount, and replacement time of the glue drum is short.
Description
Technical field
The present invention relates to integrated antenna package field, particularly a kind of integrated circuit (IC) chip mucilage binding equipment and method of work thereof.
Background technology
Load glue is the adhesives loading the use of chip operation in semiconductor package process, and chip and framework can bond together by load glue.Load glue divides conducting resinl and non-conductive adhesive two kinds, adopts packing element to hold load glue during use.Packing element is arranged on packing element fixture, completes intermittence and tell glue (some glue) splicing under a control of glue controller.
There is following shortcoming in traditional packing element fixture:
1, packing element trouble (time is long) is changed;
2, do not have packing element illuminating lamp, operating personnel can't see glue surplus in packing element (particularly elargol and tin glue), generally temporally calculate, change packing element in advance, cause waste of material;
3, do not possess glue and be finished detection, warning device, cause glue-free load, chip is come off.
Summary of the invention
An object of the present invention is: the clamping device structure overcoming traditional loader packing element is simple, the defect of function singleness, provides a kind of and clamps flexibly, integrated circuit (IC) chip mucilage binding equipment that automaticity is high, reliable.
Two of object of the present invention is: provide a kind of method of work clamping flexible, that automaticity is high, reliable integrated circuit (IC) chip mucilage binding equipment.
One of the object of the invention is achieved through the following technical solutions:
Integrated circuit (IC) chip mucilage binding equipment provided by the invention, is applicable to the loader in semi-conductor industry, for clamping the packing element of load glue.Load glue refers to glue semiconductor chip being bonded to chi frame and use, and packing element is made up of transparent plastics, and packing element is from top to bottom divided into an epimere, shell portion, cylinder hypomere and Glue dripping head; There is piston packing element inside, has glue below piston, and piston upper end (or having cover) is connected with the some glue driver that driven plunger is run; Loader be connected with drive motors (drive load action, or can also drive installation support move up and down).
This equipment comprises erection support, alarm, or also has controller.Erection support top is connected with clamp bracket, bottom is connected with lower clamp bracket, upper clamp bracket is used for clamping cylinder epimere (or being also connected with loader), lower clamp bracket is used for clamping cylinder hypomere, and (originally lower clamp bracket is used for the clamping of shell portion, due to the not enough easily distortion of packing element rigidity, affect the operation up and down of piston when causing lower clamp bracket to clamp, cause glue to extrude from glue head not smooth).
Erection support is also connected with sensor stand, for settling magnetic sensor; In piston body, there is cavity, in cavity, be placed with magnetic.
Erection support is also connected with lamp support, for being provided with green LED lamp outside the shell portion of packing element, LED is used for packing element illumination, spread by the light of packing element, can clearly illustrate that (green light can form sharp contrast with glue used for the situation of piston and glue in packing element, particularly elargol and tin glue, radiation response is good).Lamp support or lower clamp bracket can leave the light trough of vertical direction, be convenient to the whole shell portion of light lumine.
Upper clamp bracket, lower clamp bracket have regulating handle respectively, can manual adjustments clamp position, quick-replaceable packing element.
The upper-lower position of magnetic sensor is adjustable, and magnetic can be picked and placeed when changing packing element by equipment operator, and after packing element is discarded, magnetic can be reused.
Two of object of the present invention comprises the following steps by the following technical programs:
Step one, during work, controller accepts the signal instruction of transducer, controls separately or respectively the motion state of drive motors, some glue driver or alarm;
Step 2, when the glue in packing element reduces to alert locations, magnetic sensor senses magnetic, and controller receives the signal of transducer, sends instruction, controls drive motors and put glue driver synchronously to quit work, and alarm is synchronously reported to the police.
Beneficial effect:
Equipment of the present invention coordinates other parts to use, and automaticity is higher, and operating efficiency is high, reduces artificial, reduces misoperation;
The present invention possesses glue Position automatic detection, warning function, avoids causing glue-free load that chip is come off;
Packing element of the present invention handling easily, change packing element convenient, and magnetic can reuse, and use cost is lower;
Packing element of the present invention has lamp to throw light on, and operating personnel can be clear that the surplus of glue in packing element, can temporally calculate, accurately controls the gap periods changing packing element;
In the present invention, magnetic sensor and magnetic with the use of, and do not use infrared sensor or electrical property class transducer, the malfunctioning situation of detection signal that the light tight or conducting resinl of glue causes can be avoided.
Accompanying drawing explanation
Fig. 1 is a partial left side view of the present invention.
Fig. 2 is the front view of Fig. 1.
Fig. 3 is a cross-sectional view of the present invention.
In figure: 1, erection support; 2, lamp support; 3, shell portion; 4, regulating handle; 5, lower clamp bracket; 6, LED; 7, cylinder epimere; 8, upper clamp bracket; 9, Glue dripping head; 10, sensor stand; 11, magnetic sensor; 12, light trough; 13, magnetic; 14, piston; 15, cylinder hypomere; 16, alert locations; 17, cover; 18, glue driver is put; 19, controller; 20, alarm; 21, drive motors.
Embodiment
Below, in conjunction with the accompanying drawings and embodiments more specific description is done to the present invention.
Embodiment 1:
Integrated circuit (IC) chip mucilage binding equipment as shown in accompanying drawing 1, Fig. 2, Fig. 3, comprises bearing 1, alarm 20, controller 19; For clamping the packing element of load glue, packing element is made up of transparent plastics, and packing element is from top to bottom divided into an epimere 7, shell portion 3, cylinder hypomere 15 and Glue dripping head 9; There is piston 14 packing element inside, and piston 14 has glue below, and piston 14 upper end is connected with the some glue driver 18 that driven plunger is run; Loader is connected with and drives electric 21 machines.
Erection support 1 top is connected with clamp bracket 8, bottom is connected with lower clamp bracket 5, and upper clamp bracket 8 is for clamping cylinder epimere 7, and lower clamp bracket 5 is for clamping cylinder hypomere 15; Erection support 1 is also connected with sensor stand 10, for settling magnetic sensor 11; In piston 14 body, there is cavity, in cavity, be placed with magnetic 13.
Described erection support 1 is also connected with lamp support 2, is provided with green LED lamp 6, throws light on for packing element outside the shell portion 3 of packing element; Spread by the light of packing element, the situation of piston 14 and glue in packing element can be clearly illustrated.Described lower clamp bracket 5 is stayed the light trough 12 that can have vertical direction, be convenient to the whole shell portion 3 of light lumine.
Described upper clamp bracket 8, lower clamp bracket 5 have regulating handle 4 respectively, can manual adjustments clamp position.
Embodiment 2
The method of work method of work of this integrated circuit (IC) chip mucilage binding equipment is realized by following steps:
Step one, during work, controller 19 accepts the signal instruction of transducer 11, controls separately or respectively the motion state of drive motors 21, some glue driver 18 or alarm 20;
Step 2, when the glue in packing element reduces to alert locations 16, magnetic sensor 11 senses magnetic 13, controller 19 receives the signal of transducer 11, send instruction, control drive motors 21 and put glue driver 18 synchronously to quit work, alarm 20 is synchronously reported to the police.
Finally should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although done to explain to the present invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to technical scheme of the present invention or equivalent replacement, and not depart from essence and the scope of technical solution of the present invention.
Claims (6)
1. an integrated circuit (IC) chip mucilage binding equipment, comprises an epimere (7), shell portion (3), cylinder hypomere (15) and Glue dripping head (9); There is piston (14) packing element inside, and piston (14) has glue below, and piston (14) upper end is connected with some glue driver (18) that driven plunger (14) is run; Loader is connected with drive motors (21), it is characterized in that:
This equipment comprises erection support (1), alarm (20), or also has controller (19);
Described erection support (1) top is connected with clamp bracket (8), bottom is connected with lower clamp bracket (5), and upper clamp bracket (8) is for clamping cylinder epimere (7), and lower clamp bracket (5) is for clamping cylinder hypomere (15);
Described erection support (1) can also be connected with sensor stand (10), for settling magnetic sensor (11);
In described piston (14) body, there is cavity, in cavity, be placed with magnetic (13).
2. integrated circuit (IC) chip mucilage binding equipment according to claim 1, is characterized in that: described erection support (1) is also connected with lamp support (2), is provided with green LED lamp (6), throws light on for packing element outside the shell portion (3) of packing element; Spread by the light of packing element, the situation of piston in packing element (14) and glue can be clearly illustrated.
3. integrated circuit (IC) chip mucilage binding equipment according to claim 2, is characterized in that: described lower clamp bracket (5) is stayed the light trough (12) that can have vertical direction, be convenient to the whole shell portion of light lumine (3).
4. the integrated circuit (IC) chip mucilage binding equipment according to claim 1 or 3, is characterized in that: described upper clamp bracket (8), lower clamp bracket (5) have regulating handle (4) respectively, can manual adjustments clamp position.
5. integrated circuit (IC) chip mucilage binding equipment according to claim 5, is characterized in that: the upper-lower position of described magnetic sensor (11) is adjustable, and magnetic (13) can be picked and placeed when changing packing element by equipment operator.
6. adopt a method of work for the integrated circuit (IC) chip mucilage binding equipment described in claim 1 to 5 any one, it is characterized in that: comprise the following steps:
Step one, during work, controller (19) accepts the signal instruction of transducer (11), controls separately or respectively the motion state of drive motors (21), some glue driver (18) or alarm (20);
Step 2, when glue in packing element reduces to alert locations (16), magnetic sensor (11) senses magnetic (13), controller (19) receives the signal of transducer (11), send instruction, control drive motors (21) and put glue driver (18) synchronously to quit work, alarm (20) is synchronously reported to the police.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510313641.7A CN104966684A (en) | 2015-06-10 | 2015-06-10 | Integrated circuit chip binding equipment and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510313641.7A CN104966684A (en) | 2015-06-10 | 2015-06-10 | Integrated circuit chip binding equipment and working method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104966684A true CN104966684A (en) | 2015-10-07 |
Family
ID=54220705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510313641.7A Pending CN104966684A (en) | 2015-06-10 | 2015-06-10 | Integrated circuit chip binding equipment and working method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104966684A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040060162A1 (en) * | 2000-12-29 | 2004-04-01 | Stefan Moren | Production of antenna devices |
| CN103706526A (en) * | 2013-12-24 | 2014-04-09 | 南通华达微电子集团有限公司 | Clamp assembly for rubber barrel of chip bonding machine |
| CN204234283U (en) * | 2014-11-27 | 2015-04-01 | 荆门市幸科电子有限公司 | LED produces special glue feeding device |
-
2015
- 2015-06-10 CN CN201510313641.7A patent/CN104966684A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040060162A1 (en) * | 2000-12-29 | 2004-04-01 | Stefan Moren | Production of antenna devices |
| CN103706526A (en) * | 2013-12-24 | 2014-04-09 | 南通华达微电子集团有限公司 | Clamp assembly for rubber barrel of chip bonding machine |
| CN204234283U (en) * | 2014-11-27 | 2015-04-01 | 荆门市幸科电子有限公司 | LED produces special glue feeding device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151007 |
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| WD01 | Invention patent application deemed withdrawn after publication |