CN104953017B - 基于倒置涂粉带二次配光加固一体led封装件及生产工艺 - Google Patents
基于倒置涂粉带二次配光加固一体led封装件及生产工艺 Download PDFInfo
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- CN104953017B CN104953017B CN201510224215.6A CN201510224215A CN104953017B CN 104953017 B CN104953017 B CN 104953017B CN 201510224215 A CN201510224215 A CN 201510224215A CN 104953017 B CN104953017 B CN 104953017B
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- 238000009826 distribution Methods 0.000 title claims abstract description 39
- 238000005538 encapsulation Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000010410 dusting Methods 0.000 title claims abstract description 25
- 238000005516 engineering process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims abstract description 41
- 239000011324 bead Substances 0.000 claims abstract description 33
- 238000004020 luminiscence type Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 11
- 241000218202 Coptis Species 0.000 claims abstract description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 31
- 230000003014 reinforcing effect Effects 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910002601 GaN Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 238000010792 warming Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000499 gel Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 230000003534 oscillatory effect Effects 0.000 claims description 3
- 238000002271 resection Methods 0.000 claims description 3
- 238000012790 confirmation Methods 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000001035 drying Methods 0.000 abstract 1
- 238000009738 saturating Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 241001124569 Lycaenidae Species 0.000 description 2
- 235000014987 copper Nutrition 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000003752 improving hair Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510224215.6A CN104953017B (zh) | 2015-05-05 | 2015-05-05 | 基于倒置涂粉带二次配光加固一体led封装件及生产工艺 |
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CN201510224215.6A CN104953017B (zh) | 2015-05-05 | 2015-05-05 | 基于倒置涂粉带二次配光加固一体led封装件及生产工艺 |
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CN104953017A CN104953017A (zh) | 2015-09-30 |
CN104953017B true CN104953017B (zh) | 2018-05-22 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105374923A (zh) * | 2015-10-28 | 2016-03-02 | 江苏新广联半导体有限公司 | 五面出光的led封装结构及其制备方法 |
CN107394029A (zh) * | 2017-08-29 | 2017-11-24 | 江苏欧密格光电科技股份有限公司 | 一种防渗透型二次封装led器件 |
CN108281536A (zh) * | 2017-12-27 | 2018-07-13 | 张红 | 一种散光型贴片led灯珠 |
CN108758381B (zh) * | 2018-07-17 | 2024-04-12 | 赛尔富电子有限公司 | 一种led长条灯具透镜的装配设备及装配方法 |
CN114963054A (zh) * | 2021-02-25 | 2022-08-30 | 杭州赛美蓝光电科技有限公司 | 一种生物照明光源 |
CN114023863A (zh) * | 2021-09-15 | 2022-02-08 | 深圳市华笙光电子有限公司 | 一种圆片级led芯片的封装方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101852385A (zh) * | 2009-04-01 | 2010-10-06 | 香港理工大学 | 用于led路灯的配光透镜 |
CN102221178A (zh) * | 2011-06-02 | 2011-10-19 | 佛山市中山大学研究院 | Led光源透镜及led灯具 |
CN202469873U (zh) * | 2011-12-15 | 2012-10-03 | 黄婉 | Led双蝙蝠翼光学透镜及led灯 |
CN102980090A (zh) * | 2011-09-07 | 2013-03-20 | 王元成 | 一种led路灯 |
CN103022024A (zh) * | 2008-05-23 | 2013-04-03 | 克利公司 | 固态照明部件 |
CN104251417A (zh) * | 2013-06-28 | 2014-12-31 | 展晶科技(深圳)有限公司 | 光源模组 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005106973A1 (ja) * | 2004-04-27 | 2005-11-10 | Kyocera Corporation | 発光素子用配線基板 |
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- 2015-05-05 CN CN201510224215.6A patent/CN104953017B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103022024A (zh) * | 2008-05-23 | 2013-04-03 | 克利公司 | 固态照明部件 |
CN101852385A (zh) * | 2009-04-01 | 2010-10-06 | 香港理工大学 | 用于led路灯的配光透镜 |
CN102221178A (zh) * | 2011-06-02 | 2011-10-19 | 佛山市中山大学研究院 | Led光源透镜及led灯具 |
CN102980090A (zh) * | 2011-09-07 | 2013-03-20 | 王元成 | 一种led路灯 |
CN202469873U (zh) * | 2011-12-15 | 2012-10-03 | 黄婉 | Led双蝙蝠翼光学透镜及led灯 |
CN104251417A (zh) * | 2013-06-28 | 2014-12-31 | 展晶科技(深圳)有限公司 | 光源模组 |
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Address after: 511400 room 701, building A15, Dashan Industrial Zone, Dashi street, Panyu District, Guangzhou City, Guangdong Province Patentee after: Pushis (Guangzhou) Technology Co.,Ltd. Address before: 511400 room 701, building A15, Dashan Industrial Zone, Dashi street, Panyu District, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU PUXISI INTELLIGENT TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20210820 Address after: 236000 Industrial Park, Yingshang County, Fuyang City, Anhui Province Patentee after: ANHUI YINGSHANG COUNTY TIANCHENG PRINTING PACKAGING Co.,Ltd. Address before: 511400 room 701, building A15, Dashan Industrial Zone, Dashi street, Panyu District, Guangzhou City, Guangdong Province Patentee before: Pushis (Guangzhou) Technology Co.,Ltd. |
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