CN104945853B - 一种适用于高电压表面贴装器件封装的环氧树脂组合物 - Google Patents
一种适用于高电压表面贴装器件封装的环氧树脂组合物 Download PDFInfo
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- CN104945853B CN104945853B CN201510433427.5A CN201510433427A CN104945853B CN 104945853 B CN104945853 B CN 104945853B CN 201510433427 A CN201510433427 A CN 201510433427A CN 104945853 B CN104945853 B CN 104945853B
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- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
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- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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CN201510433427.5A CN104945853B (zh) | 2015-07-22 | 2015-07-22 | 一种适用于高电压表面贴装器件封装的环氧树脂组合物 |
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CN107286325B (zh) * | 2016-04-01 | 2021-06-01 | 深圳光启高等理工研究院 | 树脂组合物及其应用 |
CN106398112B (zh) * | 2016-05-31 | 2019-09-13 | 江苏华海诚科新材料股份有限公司 | 一种适用于esop封装的环氧树脂组合物 |
CN107195756A (zh) * | 2017-07-05 | 2017-09-22 | 斯内尔特种材料有限公司 | 半导体发光装置的预封装结构及半导体发光装置 |
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CN102108184B (zh) * | 2009-12-24 | 2015-04-22 | 汉高股份有限及两合公司 | 一种环氧树脂组合物及其应用 |
JP5821481B2 (ja) * | 2011-09-30 | 2015-11-24 | 東レ株式会社 | ネガ型感光性樹脂組成物およびそれを用いた保護膜およびタッチパネル部材 |
CN103450632A (zh) * | 2012-05-28 | 2013-12-18 | 汉高华威电子有限公司 | 一种电子封装用环氧树脂组合物及其制备方法 |
CN102850984A (zh) * | 2012-09-19 | 2013-01-02 | 江苏华海诚科新材料有限公司 | 适用于小型表面贴装器件封装的低应力环氧树脂组合物 |
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Address after: 222047 Jiangsu Lianyungang Lianyungang economic and Technological Development Zone Lingang Industrial Zone, east of Gu Wei Road and East Avenue North. Applicant after: JIANGSU HUAHAI CHENGKE NEW MATERIAL CO., LTD. Address before: 222047 Jiangsu Lianyungang Lianyungang economic and Technological Development Zone Lingang Industrial Zone, east of Gu Wei Road and East Avenue North. Applicant before: Jiangsu Huahai Chengke New Materials Co.,Ltd. |
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Denomination of invention: Epoxy resin composition suitable for high voltage surface mounting device packaging Effective date of registration: 20190417 Granted publication date: 20180727 Pledgee: Bank of China Limited Lianyungang Economic and Technological Development Zone Branch Pledgor: JIANGSU HUAHAI CHENGKE NEW MATERIAL CO., LTD. Registration number: 2019320000185 |
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Date of cancellation: 20200616 Granted publication date: 20180727 Pledgee: Bank of China Limited Lianyungang Economic and Technological Development Zone Branch Pledgor: JIANGSU HUAHAI CHENGKE NEW MATERIAL Co.,Ltd. Registration number: 2019320000185 |
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Denomination of invention: Epoxy resin composition suitable for high voltage surface mounting device packaging Effective date of registration: 20200706 Granted publication date: 20180727 Pledgee: Bank of China Limited Lianyungang Economic and Technological Development Zone Branch Pledgor: JIANGSU HUAHAI CHENGKE NEW MATERIAL Co.,Ltd. Registration number: Y2020980003819 |
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Date of cancellation: 20211217 Granted publication date: 20180727 Pledgee: Bank of China Limited Lianyungang Economic and Technological Development Zone Branch Pledgor: JIANGSU HUAHAI CHENGKE NEW MATERIAL Co.,Ltd. Registration number: Y2020980003819 |
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