CN104923606B - A kind of light path device for large-scale workpiece laser shot forming and method - Google Patents

A kind of light path device for large-scale workpiece laser shot forming and method Download PDF

Info

Publication number
CN104923606B
CN104923606B CN201510197097.4A CN201510197097A CN104923606B CN 104923606 B CN104923606 B CN 104923606B CN 201510197097 A CN201510197097 A CN 201510197097A CN 104923606 B CN104923606 B CN 104923606B
Authority
CN
China
Prior art keywords
laser
galvanometer
scanning
scanning direction
shot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510197097.4A
Other languages
Chinese (zh)
Other versions
CN104923606A (en
Inventor
胡永祥
余雄超
姚振强
李志�
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Jiaotong University
Original Assignee
Shanghai Jiaotong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Jiaotong University filed Critical Shanghai Jiaotong University
Priority to CN201510197097.4A priority Critical patent/CN104923606B/en
Publication of CN104923606A publication Critical patent/CN104923606A/en
Application granted granted Critical
Publication of CN104923606B publication Critical patent/CN104923606B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

A kind of light path device for large-scale workpiece laser shot forming and method,This device includes laser instrument、Dynamic focusing and orthopedic system、Scanning galvanometer system、Forming Workpiece、Computer、Laser controlling card and motion control card,Described laser controlling card is connected with laser instrument,For controlling the unlatching of laser instrument and the parameters of laser,Motion control card is connected with dynamic focusing and orthopedic system and scanning galvanometer system simultaneously,Laser controlling card and motion control card are controlled by computer,After giving specific shot-peening path,Corresponding motion is made in computer controls dynamic focusing and orthopedic system and scanning galvanometer system,There is cross sectional shape change and the change of focal position in the high energy pulse laser beam that laser instrument sends after dynamic focusing and orthopedic system,It is scanned through galvanometer system again and subsequently point to specific exit direction,Thus scanning shot-peening on large-scale workpiece for the laser is realized by the continuous motion of dynamic focusing and orthopedic system and scanning galvanometer system.

Description

A kind of light path device for large-scale workpiece laser shot forming and method
Technical field
The present invention relates to mechanical manufacturing field, more particularly, to a kind of laser peening light path device based on high energy pulse laser And method, it passes through laser scanning confocal and the laser peening of the orthopedic large-scale plate that can be effectively applicable to difficult movement of target surface hot spot Shape.
Background technology
Large-scale plate is formed in aviation and national defence has a wide range of applications, such as the wing of aircraft, eyelid covering, propeller for turboprop Machine blade etc..In order that these large-scale workpieces can be stablized in harsh environment and effectively work, they are generally set Count into the shape of various complexity.In process of production, while meeting their complex appearances, also to ensure there are enough mechanics Performance.
For this kind of plate, traditional processing method is shot peen forming.This is to clash into metal using High-velocity Projectiles stream Surface, makes the surface being impacted and its lower metal produce plastic deformation and extend, thus causing raised generation of sheet material to bend change A kind of manufacturing process of shape.The method has developed the method such as prestress peen forming and heat auxiliary contour peening again, improves The ability of deformation.But, shot peen forming suffers from the drawback that.First, the prestressing force that mechanic shot peening produces is less, deformation energy Power is limited;Second, mechanic shot peening Effect Factors for Sythetic Technology numerous it is difficult to precise control, accurate simulation has difficulties;3rd, processing Site environment is severe, machines rear bullet scale removal process loaded down with trivial details.
By contrast, laser shot forming more has superiority, can be answered with the more deeper residual pressure of producing ratio mechanic shot peening 3~5 times of power, about mechanic shot peening, also enhance the strengthening to surface of the work while having higher deformability and make With improve resisting fatigue and the corrosion resistance of workpiece.And, laser peening working environment is relatively good, and production process is also more For simple.
Laser shot forming one of them be technically characterized in that the realization in shot-peening path.Existing patent " medium-thick plate laser The method and apparatus of contour peening " (patent No. ZL200510040116.9) proposes and a set of is applied to medium-thick plate laser peening Formation system, it goes out various process parameters according to the shape generating curved surface by computer optimization, designs shot-peening path, controls The work of laser instrument, light-conducting system and workbench carries out shot-peening.In the realization in path, its light path remains stationary as, using five axles Linkage numerical control machine controls workpiece motion s, and so that laser is according to path, each point on workpiece implements impact.The shortcoming of this design exists In workpiece motion s to be allowed, for larger workpiece, the difficulty of machine tool motion and power consumption will greatly increase, if workpiece is excessive, will Cannot be fixed on lathe and implement processing.A kind of another patent " sheet material double face precise forming based on laser blast wave effect Method and device " (patent No. 200810019757.X) on path is realized, the method that do not adopt workpiece motion s, but adopt Flight scanning, by the motion of incident laser light-conducting system, including upper and lower and left and right translation, makes incident laser according to predetermined Path is scanned shot-peening to vertical plate face.The shortcoming of the method is the realization of whole light-conducting system motion.First, make whole Whole target target surface is covered in the motion of individual light-conducting system, will account for very big space, and flexibility is also poor.Secondly, entirely guide-lighting System is moved on a large scale and is difficult to ensure that the positional precision of each point in motor process, and the vibration in motion is likely to can be to guide-lighting system Part in system produces harmful effect.Patent " the FLEXIBLE BEAM DELIVERY SYSTEM FOR of MIC company of the U.S. HIGH POWER LASER SYSTEMS " (patent No. US20110253690A1) is on path is realized, anti-using a universal joint The motion penetrating mirror changes the direction of shoot laser, so that incident laser is scanned by path, and another one telescope of cooperation focuses on system System adjusts the spot size on target surface, and the shape of laser can also be corrected by the motion of field revolving mirror and cylinder microscope group.It is excellent Point is it is only necessary to control the motion of several small parts can to improve and be so that laser carries out shot-peening scanning on target surface The stability of system.But, the disadvantage is that, first, in light-conducting system, telescopic system and stokes lens group are separate for it, Number of lenses is more, constitutes not simple;Second, universal joint reflecting mirror motion complexity is it is ensured that kinematic accuracy is more difficult.
Content of the invention
The present invention is directed to above-mentioned the deficiencies in the prior art, provides a kind of light path for large-scale workpiece laser peening Device and method, can realize the scanning shot-peening to large-scale plate for the laser by the less motion of parts several in light path, and fill Dividing and simplify light path, thus conveniently realizing the good shot-peening path of technological design, correcting the light that laser is formed in surface of the work simultaneously The shape of speckle is so as to meet technological requirement.
For reaching above-mentioned purpose, the technical solution adopted in the present invention is as follows:
A kind of light path device for large-scale workpiece laser peening, including laser instrument, dynamic focusing and orthopedic system, scanning Galvanometer system, Forming Workpiece (target surface), computer, laser controlling card and motion control card, described laser controlling card and laser instrument Be connected, for controlling the unlatching of laser instrument and the parameters of laser, described motion control card simultaneously with dynamic focusing and orthopedic System and scanning galvanometer system are connected, and described laser controlling card and motion control card are controlled by computer, give specific After shot-peening path, corresponding motion, laser instrument are made in computer controls dynamic focusing and orthopedic system and scanning galvanometer system There is cross sectional shape change and the change of focal position in the high energy pulse laser beam sending after dynamic focusing and orthopedic system, It is scanned through galvanometer system again and subsequently points to specific exit direction, thus passing through dynamic focusing and orthopedic system and scanning galvanometer system Scanning shot-peening on large-scale workpiece for the laser is realized in the continuous motion of system.
Described dynamic focusing and orthopedic system, including two recessed cylindrical lenses and spherical convex lens.Three face lens Arrange successively by the direction of radiating laser beams, its axis is all located on the optical axis of laser beam.The cylinder of two recessed cylindrical lenses is female Line keeps orthogonal, and all can translate independently along optical axis direction, can also synchronously rotate around optical axis.
Described scanning galvanometer system, including x scanning direction galvanometer and z scanning direction galvanometer.
Described x scanning direction galvanometer and z scanning direction galvanometer, are the plane mirrors that can rotate around own torque.
Wherein x scanning direction galvanometer can be around the axis of rotation in the y direction of itself, and z scanning direction galvanometer can be around the x side of itself To axis of rotation.Its part driving rotating by servomotor or having identical function, is controlled by motion control card.Swash Light beam is beaten in the origin position of Forming Workpiece, and laser beam falls successively at the center of x scanning direction galvanometer and z scanning direction galvanometer On.The rotation of x scanning direction galvanometer and z scanning direction galvanometer will change the direction of laser beam exits, now should keep laser beam Fully fall in x scanning direction galvanometer and effective reflected range of z scanning direction galvanometer.
Described motion control card, for controlling two recessed cylindrical lenses and x scanning direction galvanometer and z scanning direction galvanometer Motion.Computer is the operation interface of the present invention, and laser controlling card and motion control card are controlled by computer.
A kind of light path method for large-scale workpiece laser peening that the present invention provides, is come real using above-mentioned light path device Existing, its workflow is as follows:
(1) input shot-peening path first on computers.In a certain moment in scanning process, it is true that processing route pressed by computer Determine when this, to be engraved in the coordinate of scan position in Forming Workpiece;
(2) computer calculates two recessed cylindrical lenses and x scanning direction galvanometer according to coordinate and z scanning direction galvanometer should Some poses, control motion control card, two recessed cylindrical lenses of motor control card control and x scanning direction galvanometer and z direction Scanning galvanometer moves to corresponding pose;
(3) laser controlling card control pulse laser beam sends from laser instrument, first passes through dynamic focusing and orthopedic system, pulse The cross sectional shape of laser beam and focal position change, then pass through scanning galvanometer system, and the direction of propagation of pulse laser beam changes Become, get to the corresponding coordinate in Forming Workpiece;
(4) carry out the shot-peening of next point by processing route.
Beneficial effects of the present invention are as follows:
(1) achieve the laser peening of large-scale workpiece by the motion of several compact parts, device taken up space little, fortune Energy consumption is little, flexible preferable;
(2) light path device arrangement is simple, and motion is simple and range of movement is little, and precision is easily guaranteed that, on workpiece target surface Hot spot overlapping rate and scanning speed can conveniently be adjusted;
(3) cross sectional shape of incident laser is changed by set of cylindrical lenses, thus by the shot-peening light on workpiece target surface Speckle is corrected as circle, meets technological requirement.
Brief description
Fig. 1 is the light path device schematic diagram for large-scale workpiece laser peening provided by the present invention;
Fig. 2 is scanning galvanometer system schematic of the present invention;
Fig. 3 is dynamic focusing principle schematic of the present invention;
Fig. 4 is one embodiment of the invention dynamic focusing effect diagram;
Fig. 5 is set of cylindrical lenses principle schematic of the present invention;
Fig. 6 is set of cylindrical lenses effect diagram of the present invention.
In figure:1. laser instrument, 2. pulse laser beam, 3. the first recessed cylindrical lenses, 4. the second recessed cylindrical lenses, 5. sphere convex Lens, 6. dynamic focusing and orthopedic system, 7. scanning galvanometer system, 8. Forming Workpiece (target surface), 9. work piece holder, 10. calculating Machine, 11. laser controlling cards, 12. motion control cards, 13.x scanning direction galvanometer, 14.z scanning direction galvanometer, 15. dynamically do not gather Burnt hot spot, 16. have dynamic focusing hot spot, 17. no orthopedic system hot spot, 18. have orthopedic system hot spot.
Specific embodiment
With reference to Figure of description and specific embodiment, technical solution of the present invention is made a detailed description.
It is the schematic diagram of the light path device that the present invention is used for large-scale workpiece laser peening shown in Fig. 1.Device includes laser instrument 1st, dynamic focusing and orthopedic system 6, scanning galvanometer system 7, Forming Workpiece 8, work piece holder 9, computer 10, laser controlling card 11 With motion control card 12.In the present embodiment, the YAG laser of 532nm selected by laser instrument, launches circular light spot laser, section chi Very little it isLarge-scale Forming Workpiece 8 is the metallic plate of 1m × 1m, its light-emitting window distance with scanning galvanometer system 7 1500mm.This device one embodiment will be accomplished that makes laser be formed on large-scale workpieceThe circular light spot of size is carried out Laser peening.
Wherein dynamic focusing and orthopedic system 6 include the first recessed cylindrical lenses 3, the second recessed cylindrical lenses 4 and sphere convex lens Mirror 5.Three face lens are arranged successively by the direction that laser beam 2 is launched, and its axis is all located on the optical axis of laser beam 2.First recessed post The segment of a cylinder of face lens 3 and the second recessed cylindrical lenses 4 keeps orthogonal.First recessed cylindrical lenses 3 and the second recessed cylindrical lenses 4 are equal Can translate independently along optical axis direction, can also synchronously rotate around optical axis.The the first recessed cylindrical lenses 3 selected in the present embodiment Focal length is 250mm, and the second recessed cylindrical lenses 4 focal length is 300mm, and spherical convex lens 5 focal length is 400mm.First recessed cylindrical lenses 3 Moving range with the second recessed cylindrical lenses 4 is 15mm, and slewing area is 360 °.
Scanning galvanometer system 7 includes x scanning direction galvanometer 13 and z scanning direction galvanometer 14.X scanning direction galvanometer 13 and z Scanning direction galvanometer 14 is the plane mirror that can rotate around own torque.Wherein x scanning direction galvanometer 13 can be around the y of itself The axis of rotation in direction, z scanning direction galvanometer 14 can be around the axis of rotation in the x direction of itself.It rotates by servomotor or tool The part having identical function drives, and is controlled by motion control card 12.During the origin position in Forming Workpiece 8 for the laser beam 2 dozens, Laser beam 2 falls in x scanning direction galvanometer 13 and z scanning direction galvanometer 14 in the heart successively.X scanning direction galvanometer 13 and z side The direction of laser beam 2 outgoing will be changed to the rotation of scanning galvanometer 14, laser beam 2 now should be kept to fully fall in x scanning direction In effective reflected range of galvanometer 13 and z scanning direction galvanometer 14.The galvanometer rotational angle selected in the present embodiment is ± 20 °, Can be applicable to maximumLaser beam, the sweep limitss of 1m × 1m can be met.
Laser controlling card 11 is connected with laser instrument 1, for controlling the unlatching of laser instrument and the parameters of laser.Motion control Fabrication 12 is connected with dynamic focusing and orthopedic system 6 and scanning galvanometer system 7, for controlling first, second recessed cylindrical lenses 3rd, the motion of 4 and x scanning direction galvanometers 13 and z scanning direction galvanometer 14.Computer 10 is the operation interface of this device, laser Control card 11 and motion control card 12 are controlled by computer 10.
Fig. 2 show the schematic diagram of scanning galvanometer system.Scanning galvanometer system is made up of two galvanometers, and they are respectively Control the scanning of two orthogonal directions.In figure x scanning direction galvanometer 13 rotates around y-axis direction, controls the scanning in x direction, z side Rotate around x-axis direction to scanning galvanometer 14, control the scanning in z direction.When control some directions galvanometer rotate one small Angle, the hot spot in Forming Workpiece (target surface) 8 just moves a segment distance in the direction.By controlling the rotation of two galvanometers, just Position in Forming Workpiece (target surface) 8 for the hot spot can be controlled.The continuous rotation of two galvanometers can realize laser on target surface Scanning.The galvanometer rotational angle adopting in the present embodiment is ± 20 °, can be applicable to maximumLaser beam, Ke Yiman Foot is apart from the scanning of 1m × 1m target surface of galvanometer 1500mm.
Fig. 3 is dynamic focusing principle schematic.Dynamic focusing system in dynamic focusing and orthopedic system 6 is saturating by recessed cylinder Mirror 3 (or 4) and spherical convex lens 5 form, when recessed cylindrical lenses 3 (or 4) move a certain distance in the direction of the optical axis, such as In figure moves at b or at c at a, and the focal position after laser beam 2 leaves dynamic focusing and orthopedic system 6 will change. In scanning galvanometer system 7 scanning process, because in Forming Workpiece (target surface) 8, each point light path is different, in the case of fixed focal length The focal plane producing is curved surface 15, and it is the plane 16 on target surface that dynamic focusing and orthopedic system 6 can be corrected, and effect is such as Shown in Fig. 4.In the present embodiment, the first recessed cylindrical lenses 3 focal length is 250mm, and the second recessed cylindrical lenses 4 focal length is 300mm, sphere Convex lenss 5 focal length is 400mm.The change that the mobile 10mm of first recessed cylindrical lenses 3 will make focal position produce 177mm.
The first two recessed cylindrical lenses composition orthopedic system in dynamic focusing and orthopedic system 6.Fig. 5 is set of cylindrical lenses principle Schematic diagram.During laser beam 2 incident recessed cylindrical lenses, the directional divergence vertical with bus, and the direction parallel with bus does not occur Change.The mutually orthogonal biconcave cylindrical lenses of bus will make mutually orthogonal two axles on laser beam 2 section that different multiplying to occur Dissipate, formed oval cross section.First, second recessed cylindrical lenses 3,4 are directed on laser section with spherical convex lens 5 composition respectively The dynamic focusing system of orthogonal two axles.Circular section laser is beaten through vibration mirror scanning and will be deformed into ellipse in Forming Workpiece (target surface) 8 Hot spot 17, and the oval cross section laser of definite shape can obtain circular light after vibration mirror scanning in Forming Workpiece (target surface) 8 Speckle 18.The orthopedic effect of the present embodiment is as shown in Figure 6.
The workflow of embodiment is as follows:
(1) input shot-peening path first on computer 10.In a certain moment in scanning process, determining by processing route should When be engraved in the coordinate of scan position in Forming Workpiece 8;
(2) computer 10 calculates first, second recessed cylindrical lenses 3,4 and x scanning direction galvanometer 13 and z side according to coordinate To the due pose of scanning galvanometer 14, motion control card 12 is then controlled to make first, second recessed cylindrical lenses 3,4 and x direction Scanning galvanometer 13 and z scanning direction galvanometer 14 move to corresponding pose;
(3) laser controlling card 11 controls pulse laser beam 2 to send from laser instrument 1, first passes through dynamic focusing and orthopedic system 6, the cross sectional shape of pulse laser beam 2 and focal position change, then pass through scanning galvanometer system 7, the biography of pulse laser beam 2 Broadcast direction to change, from getting to the corresponding coordinate Forming Workpiece (target surface) 8, and formation process requiresThe circle of size Hot spot;
(4) carry out the shot-peening of next point by processing route, until shot-peening path is terminated, complete laser peening.
Above-described embodiment is merely to illustrate technical solution of the present invention, but it is not for limiting the present invention.Any ability Without departing from the spirit and scope of the present invention, the content that may be by the disclosure above is to proposed by the invention for field technique personnel Scheme make possible variation and modification, therefore, every technology contents without departing from the present invention, the technology according to the present invention is real Any simple modification, equivalent variations and modification that confrontation above example is made, belong to protection scope of the present invention.

Claims (6)

1. a kind of light path device for large-scale workpiece laser shot forming is it is characterised in that including laser instrument (1), dynamically gathering Burnt and orthopedic system (6), scanning galvanometer system (7), Forming Workpiece (8), computer (10), laser controlling card (11) and motion are controlled Fabrication (12), described laser controlling card is connected with laser instrument, for controlling the unlatching of laser instrument and the parameters of laser, described Motion control card is connected with dynamic focusing and orthopedic system and scanning galvanometer system simultaneously, and described laser controlling card and motion are controlled Fabrication is controlled by computer, after giving specific shot-peening path, computer controls dynamic focusing and orthopedic system and scanning Galvanometer system makes corresponding motion, and the high energy pulse laser beam that laser instrument sends occurs after dynamic focusing and orthopedic system Cross sectional shape change and the change of focal position, then be scanned through galvanometer system and subsequently point to specific exit direction, thus passing through Scanning shot-peening on large-scale workpiece for the laser is realized in the continuous motion of dynamic focusing and orthopedic system and scanning galvanometer system.
2. the light path device for large-scale workpiece laser shot forming according to claim 1 is it is characterised in that described move State focuses on and orthopedic system (6) includes two recessed cylindrical lenses (3,4) and a spherical convex lens (5), and laser pressed by three face lens Arrange successively in the direction that bundle (2) is launched, its axis is all located on the optical axis of laser beam, and the segment of a cylinder of two recessed cylindrical lenses is protected Hold orthogonal, and all can rotate around optical axis independently along optical axis direction translation and synchronization.
3. the light path device for large-scale workpiece laser shot forming according to claim 2 is it is characterised in that described sweep Retouch galvanometer system and include x scanning direction galvanometer (13) and z scanning direction galvanometer (14), wherein x scanning direction galvanometer (13) can Around the axis of rotation in the y direction of itself, z scanning direction galvanometer (14) can be around the axis of rotation in the x direction of itself, and its rotation is subject to To the control of motion control card (12), when laser beam (2) is beaten in the origin position of Forming Workpiece (8), laser beam (2) falls successively In x scanning direction galvanometer (13) and z scanning direction galvanometer (14) in the heart, x scanning direction galvanometer (13) and z scanning direction shake The rotation of mirror (14) will change the direction of laser beam (2) outgoing, laser beam (2) now should be kept to fully fall in x scanning direction and shake In effective reflected range of mirror (13) and z scanning direction galvanometer (14).
4. the light path device for large-scale workpiece laser shot forming according to claim 3 is it is characterised in that described x Scanning direction galvanometer (13) and z scanning direction galvanometer (14) are the plane mirrors that can rotate around own torque.
5. the light path device for large-scale workpiece laser shot forming according to claim 3 is it is characterised in that described fortune Dynamic control card (12) controls the fortune of recessed cylindrical lenses (3,4) and x scanning direction galvanometer (13) and z scanning direction galvanometer (14) Dynamic.
6. a kind of method for large-scale workpiece laser shot forming is it is characterised in that adopt light path as claimed in claim 5 Realizing, workflow is as follows for device:
1) first in computer (10) upper input shot-peening path, in a certain moment in scanning process, technique road pressed by computer (10) Footpath is engraved in the coordinate of Forming Workpiece (8) upper scan position when determining this;
2) computer (10) calculates recessed cylindrical lenses (3,4) according to coordinate and x scanning direction galvanometer (13), z scanning direction shake The due pose of mirror (14), controls motion control card (12), and motion control card (12) controls recessed cylindrical lenses (3,4) and x side Move to corresponding pose to scanning galvanometer (13), z scanning direction galvanometer (14);
3) laser controlling card (11) controls pulse laser beam (2) to send from laser instrument (1), first passes through dynamic focusing and orthopedic system (6), the cross sectional shape of pulse laser beam (2) and focal position change, then pass through scanning galvanometer system (7), pulse laser The direction of propagation of bundle (2) changes, and gets to the corresponding coordinate in Forming Workpiece (8);
4) carry out the shot-peening of next point by processing route.
CN201510197097.4A 2015-04-23 2015-04-23 A kind of light path device for large-scale workpiece laser shot forming and method Active CN104923606B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510197097.4A CN104923606B (en) 2015-04-23 2015-04-23 A kind of light path device for large-scale workpiece laser shot forming and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510197097.4A CN104923606B (en) 2015-04-23 2015-04-23 A kind of light path device for large-scale workpiece laser shot forming and method

Publications (2)

Publication Number Publication Date
CN104923606A CN104923606A (en) 2015-09-23
CN104923606B true CN104923606B (en) 2017-03-01

Family

ID=54111214

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510197097.4A Active CN104923606B (en) 2015-04-23 2015-04-23 A kind of light path device for large-scale workpiece laser shot forming and method

Country Status (1)

Country Link
CN (1) CN104923606B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105567946B (en) * 2016-01-06 2017-11-07 广东工业大学 Laser peening strengthens the path planning apparatus and its paths planning method of curved surface
CN107336440A (en) * 2017-08-09 2017-11-10 英诺激光科技股份有限公司 A kind of laser 3D printing method and its system with orthopaedic function
CN108866317B (en) * 2018-06-19 2019-11-19 上海交通大学 Dynamic optical focusing mechanism suitable for scanning light spot school shape
CN109513927A (en) * 2018-12-26 2019-03-26 西安铂力特增材技术股份有限公司 A kind of high-power part forming device of SLM and manufacturing process
CN110539068A (en) * 2019-09-16 2019-12-06 广东镭奔激光科技有限公司 Rapid scanning type laser shock peening method and system for directional area
CN113427138A (en) * 2020-03-21 2021-09-24 赣州市普希德工具有限公司 Laser processing equipment for turning and grinding by laser
CN117047285A (en) * 2023-08-14 2023-11-14 上海智能制造功能平台有限公司 Laser shot blasting forming large-breadth dynamic scanning closed-loop control system and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937421A (en) * 1989-07-03 1990-06-26 General Electric Company Laser peening system and method
US6900409B2 (en) * 2003-08-22 2005-05-31 General Electric Company Single head laser high throughput laser shock peening
JP4690895B2 (en) * 2005-01-11 2011-06-01 新日本製鐵株式会社 Laser peening treatment method of metal object and metal object manufactured by laser peening treatment method
CN101011777A (en) * 2006-12-11 2007-08-08 江苏大学 Method and apparatus of forming cut deal laser prestress composite shot blasting
CN100591456C (en) * 2007-11-16 2010-02-24 江苏大学 Method and device based on micro-nano laser-induced shock wave three dimensional non-invasive mark
CN101745740B (en) * 2009-12-23 2013-07-10 江苏大学 Metal plate material ring-shaped light spot laser impact forming method and device

Also Published As

Publication number Publication date
CN104923606A (en) 2015-09-23

Similar Documents

Publication Publication Date Title
CN104923606B (en) A kind of light path device for large-scale workpiece laser shot forming and method
CN108838551B (en) A kind of three-dimension curved surface laser etching method
JP6634074B2 (en) Laser processing machine for additive manufacturing by laser sintering and corresponding method
CN106695118B (en) A kind of four-degree-of-freedom XY galvanometer scanning devices and control method
CN106271044B (en) Laser marking machine and CCD coaxial optical path localization method
CN106825918A (en) A kind of hybrid laser beam scanning device and control method
CN109365993B (en) Roller laser texturing processing equipment and processing method thereof
CN109848564A (en) A kind of laser processing of glass material surface frosting
CN203171139U (en) Laser equipment for stereoscopic direct forming
JP2009520995A (en) Scanner head and processing equipment using the scanner head
CN106903434A (en) A kind of manufacture device and manufacture method of micro turning cutter Surface Texture
CN114700629A (en) Laser ablation method with fragmentation optimization
WO2022052162A1 (en) Three-dimensional scanning system having double-paraboloidal mirror dynamic focusing module
CN103418911A (en) Narrow-space laser marking method and marking machine thereof
CN101522357A (en) Laser working apparatus
US6727463B2 (en) Arrangement for the working of three-dimensional, expandable upper surfaces of work pieces by means of a laser
JP2008009661A5 (en)
CN105458492A (en) Precision laser processing device based on swing angle compression
CN106112268B (en) A kind of band muscle wallboard laser shot forming system and method
CN100571979C (en) The parallel grinding and cutting method of non-axisymmetric aspheric surface optical element
CN106191384B (en) Metal blank laser shot forming dynamic self-adapting equipment and method based on guide rail motion
CN105710369B (en) Device for successively manufacturing three-dimension object
JP2019126816A (en) Laser beam machine
CN206286708U (en) Three-dimensional ultraviolet laser machining apparatus
CN108788151B (en) Synchronous selective laser melting S L M forming device and printing method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant