CN104923606B - A kind of light path device for large-scale workpiece laser shot forming and method - Google Patents
A kind of light path device for large-scale workpiece laser shot forming and method Download PDFInfo
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Abstract
A kind of light path device for large-scale workpiece laser shot forming and method,This device includes laser instrument、Dynamic focusing and orthopedic system、Scanning galvanometer system、Forming Workpiece、Computer、Laser controlling card and motion control card,Described laser controlling card is connected with laser instrument,For controlling the unlatching of laser instrument and the parameters of laser,Motion control card is connected with dynamic focusing and orthopedic system and scanning galvanometer system simultaneously,Laser controlling card and motion control card are controlled by computer,After giving specific shot-peening path,Corresponding motion is made in computer controls dynamic focusing and orthopedic system and scanning galvanometer system,There is cross sectional shape change and the change of focal position in the high energy pulse laser beam that laser instrument sends after dynamic focusing and orthopedic system,It is scanned through galvanometer system again and subsequently point to specific exit direction,Thus scanning shot-peening on large-scale workpiece for the laser is realized by the continuous motion of dynamic focusing and orthopedic system and scanning galvanometer system.
Description
Technical field
The present invention relates to mechanical manufacturing field, more particularly, to a kind of laser peening light path device based on high energy pulse laser
And method, it passes through laser scanning confocal and the laser peening of the orthopedic large-scale plate that can be effectively applicable to difficult movement of target surface hot spot
Shape.
Background technology
Large-scale plate is formed in aviation and national defence has a wide range of applications, such as the wing of aircraft, eyelid covering, propeller for turboprop
Machine blade etc..In order that these large-scale workpieces can be stablized in harsh environment and effectively work, they are generally set
Count into the shape of various complexity.In process of production, while meeting their complex appearances, also to ensure there are enough mechanics
Performance.
For this kind of plate, traditional processing method is shot peen forming.This is to clash into metal using High-velocity Projectiles stream
Surface, makes the surface being impacted and its lower metal produce plastic deformation and extend, thus causing raised generation of sheet material to bend change
A kind of manufacturing process of shape.The method has developed the method such as prestress peen forming and heat auxiliary contour peening again, improves
The ability of deformation.But, shot peen forming suffers from the drawback that.First, the prestressing force that mechanic shot peening produces is less, deformation energy
Power is limited;Second, mechanic shot peening Effect Factors for Sythetic Technology numerous it is difficult to precise control, accurate simulation has difficulties;3rd, processing
Site environment is severe, machines rear bullet scale removal process loaded down with trivial details.
By contrast, laser shot forming more has superiority, can be answered with the more deeper residual pressure of producing ratio mechanic shot peening
3~5 times of power, about mechanic shot peening, also enhance the strengthening to surface of the work while having higher deformability and make
With improve resisting fatigue and the corrosion resistance of workpiece.And, laser peening working environment is relatively good, and production process is also more
For simple.
Laser shot forming one of them be technically characterized in that the realization in shot-peening path.Existing patent " medium-thick plate laser
The method and apparatus of contour peening " (patent No. ZL200510040116.9) proposes and a set of is applied to medium-thick plate laser peening
Formation system, it goes out various process parameters according to the shape generating curved surface by computer optimization, designs shot-peening path, controls
The work of laser instrument, light-conducting system and workbench carries out shot-peening.In the realization in path, its light path remains stationary as, using five axles
Linkage numerical control machine controls workpiece motion s, and so that laser is according to path, each point on workpiece implements impact.The shortcoming of this design exists
In workpiece motion s to be allowed, for larger workpiece, the difficulty of machine tool motion and power consumption will greatly increase, if workpiece is excessive, will
Cannot be fixed on lathe and implement processing.A kind of another patent " sheet material double face precise forming based on laser blast wave effect
Method and device " (patent No. 200810019757.X) on path is realized, the method that do not adopt workpiece motion s, but adopt
Flight scanning, by the motion of incident laser light-conducting system, including upper and lower and left and right translation, makes incident laser according to predetermined
Path is scanned shot-peening to vertical plate face.The shortcoming of the method is the realization of whole light-conducting system motion.First, make whole
Whole target target surface is covered in the motion of individual light-conducting system, will account for very big space, and flexibility is also poor.Secondly, entirely guide-lighting
System is moved on a large scale and is difficult to ensure that the positional precision of each point in motor process, and the vibration in motion is likely to can be to guide-lighting system
Part in system produces harmful effect.Patent " the FLEXIBLE BEAM DELIVERY SYSTEM FOR of MIC company of the U.S.
HIGH POWER LASER SYSTEMS " (patent No. US20110253690A1) is on path is realized, anti-using a universal joint
The motion penetrating mirror changes the direction of shoot laser, so that incident laser is scanned by path, and another one telescope of cooperation focuses on system
System adjusts the spot size on target surface, and the shape of laser can also be corrected by the motion of field revolving mirror and cylinder microscope group.It is excellent
Point is it is only necessary to control the motion of several small parts can to improve and be so that laser carries out shot-peening scanning on target surface
The stability of system.But, the disadvantage is that, first, in light-conducting system, telescopic system and stokes lens group are separate for it,
Number of lenses is more, constitutes not simple;Second, universal joint reflecting mirror motion complexity is it is ensured that kinematic accuracy is more difficult.
Content of the invention
The present invention is directed to above-mentioned the deficiencies in the prior art, provides a kind of light path for large-scale workpiece laser peening
Device and method, can realize the scanning shot-peening to large-scale plate for the laser by the less motion of parts several in light path, and fill
Dividing and simplify light path, thus conveniently realizing the good shot-peening path of technological design, correcting the light that laser is formed in surface of the work simultaneously
The shape of speckle is so as to meet technological requirement.
For reaching above-mentioned purpose, the technical solution adopted in the present invention is as follows:
A kind of light path device for large-scale workpiece laser peening, including laser instrument, dynamic focusing and orthopedic system, scanning
Galvanometer system, Forming Workpiece (target surface), computer, laser controlling card and motion control card, described laser controlling card and laser instrument
Be connected, for controlling the unlatching of laser instrument and the parameters of laser, described motion control card simultaneously with dynamic focusing and orthopedic
System and scanning galvanometer system are connected, and described laser controlling card and motion control card are controlled by computer, give specific
After shot-peening path, corresponding motion, laser instrument are made in computer controls dynamic focusing and orthopedic system and scanning galvanometer system
There is cross sectional shape change and the change of focal position in the high energy pulse laser beam sending after dynamic focusing and orthopedic system,
It is scanned through galvanometer system again and subsequently points to specific exit direction, thus passing through dynamic focusing and orthopedic system and scanning galvanometer system
Scanning shot-peening on large-scale workpiece for the laser is realized in the continuous motion of system.
Described dynamic focusing and orthopedic system, including two recessed cylindrical lenses and spherical convex lens.Three face lens
Arrange successively by the direction of radiating laser beams, its axis is all located on the optical axis of laser beam.The cylinder of two recessed cylindrical lenses is female
Line keeps orthogonal, and all can translate independently along optical axis direction, can also synchronously rotate around optical axis.
Described scanning galvanometer system, including x scanning direction galvanometer and z scanning direction galvanometer.
Described x scanning direction galvanometer and z scanning direction galvanometer, are the plane mirrors that can rotate around own torque.
Wherein x scanning direction galvanometer can be around the axis of rotation in the y direction of itself, and z scanning direction galvanometer can be around the x side of itself
To axis of rotation.Its part driving rotating by servomotor or having identical function, is controlled by motion control card.Swash
Light beam is beaten in the origin position of Forming Workpiece, and laser beam falls successively at the center of x scanning direction galvanometer and z scanning direction galvanometer
On.The rotation of x scanning direction galvanometer and z scanning direction galvanometer will change the direction of laser beam exits, now should keep laser beam
Fully fall in x scanning direction galvanometer and effective reflected range of z scanning direction galvanometer.
Described motion control card, for controlling two recessed cylindrical lenses and x scanning direction galvanometer and z scanning direction galvanometer
Motion.Computer is the operation interface of the present invention, and laser controlling card and motion control card are controlled by computer.
A kind of light path method for large-scale workpiece laser peening that the present invention provides, is come real using above-mentioned light path device
Existing, its workflow is as follows:
(1) input shot-peening path first on computers.In a certain moment in scanning process, it is true that processing route pressed by computer
Determine when this, to be engraved in the coordinate of scan position in Forming Workpiece;
(2) computer calculates two recessed cylindrical lenses and x scanning direction galvanometer according to coordinate and z scanning direction galvanometer should
Some poses, control motion control card, two recessed cylindrical lenses of motor control card control and x scanning direction galvanometer and z direction
Scanning galvanometer moves to corresponding pose;
(3) laser controlling card control pulse laser beam sends from laser instrument, first passes through dynamic focusing and orthopedic system, pulse
The cross sectional shape of laser beam and focal position change, then pass through scanning galvanometer system, and the direction of propagation of pulse laser beam changes
Become, get to the corresponding coordinate in Forming Workpiece;
(4) carry out the shot-peening of next point by processing route.
Beneficial effects of the present invention are as follows:
(1) achieve the laser peening of large-scale workpiece by the motion of several compact parts, device taken up space little, fortune
Energy consumption is little, flexible preferable;
(2) light path device arrangement is simple, and motion is simple and range of movement is little, and precision is easily guaranteed that, on workpiece target surface
Hot spot overlapping rate and scanning speed can conveniently be adjusted;
(3) cross sectional shape of incident laser is changed by set of cylindrical lenses, thus by the shot-peening light on workpiece target surface
Speckle is corrected as circle, meets technological requirement.
Brief description
Fig. 1 is the light path device schematic diagram for large-scale workpiece laser peening provided by the present invention;
Fig. 2 is scanning galvanometer system schematic of the present invention;
Fig. 3 is dynamic focusing principle schematic of the present invention;
Fig. 4 is one embodiment of the invention dynamic focusing effect diagram;
Fig. 5 is set of cylindrical lenses principle schematic of the present invention;
Fig. 6 is set of cylindrical lenses effect diagram of the present invention.
In figure:1. laser instrument, 2. pulse laser beam, 3. the first recessed cylindrical lenses, 4. the second recessed cylindrical lenses, 5. sphere convex
Lens, 6. dynamic focusing and orthopedic system, 7. scanning galvanometer system, 8. Forming Workpiece (target surface), 9. work piece holder, 10. calculating
Machine, 11. laser controlling cards, 12. motion control cards, 13.x scanning direction galvanometer, 14.z scanning direction galvanometer, 15. dynamically do not gather
Burnt hot spot, 16. have dynamic focusing hot spot, 17. no orthopedic system hot spot, 18. have orthopedic system hot spot.
Specific embodiment
With reference to Figure of description and specific embodiment, technical solution of the present invention is made a detailed description.
It is the schematic diagram of the light path device that the present invention is used for large-scale workpiece laser peening shown in Fig. 1.Device includes laser instrument
1st, dynamic focusing and orthopedic system 6, scanning galvanometer system 7, Forming Workpiece 8, work piece holder 9, computer 10, laser controlling card 11
With motion control card 12.In the present embodiment, the YAG laser of 532nm selected by laser instrument, launches circular light spot laser, section chi
Very little it isLarge-scale Forming Workpiece 8 is the metallic plate of 1m × 1m, its light-emitting window distance with scanning galvanometer system 7
1500mm.This device one embodiment will be accomplished that makes laser be formed on large-scale workpieceThe circular light spot of size is carried out
Laser peening.
Wherein dynamic focusing and orthopedic system 6 include the first recessed cylindrical lenses 3, the second recessed cylindrical lenses 4 and sphere convex lens
Mirror 5.Three face lens are arranged successively by the direction that laser beam 2 is launched, and its axis is all located on the optical axis of laser beam 2.First recessed post
The segment of a cylinder of face lens 3 and the second recessed cylindrical lenses 4 keeps orthogonal.First recessed cylindrical lenses 3 and the second recessed cylindrical lenses 4 are equal
Can translate independently along optical axis direction, can also synchronously rotate around optical axis.The the first recessed cylindrical lenses 3 selected in the present embodiment
Focal length is 250mm, and the second recessed cylindrical lenses 4 focal length is 300mm, and spherical convex lens 5 focal length is 400mm.First recessed cylindrical lenses 3
Moving range with the second recessed cylindrical lenses 4 is 15mm, and slewing area is 360 °.
Scanning galvanometer system 7 includes x scanning direction galvanometer 13 and z scanning direction galvanometer 14.X scanning direction galvanometer 13 and z
Scanning direction galvanometer 14 is the plane mirror that can rotate around own torque.Wherein x scanning direction galvanometer 13 can be around the y of itself
The axis of rotation in direction, z scanning direction galvanometer 14 can be around the axis of rotation in the x direction of itself.It rotates by servomotor or tool
The part having identical function drives, and is controlled by motion control card 12.During the origin position in Forming Workpiece 8 for the laser beam 2 dozens,
Laser beam 2 falls in x scanning direction galvanometer 13 and z scanning direction galvanometer 14 in the heart successively.X scanning direction galvanometer 13 and z side
The direction of laser beam 2 outgoing will be changed to the rotation of scanning galvanometer 14, laser beam 2 now should be kept to fully fall in x scanning direction
In effective reflected range of galvanometer 13 and z scanning direction galvanometer 14.The galvanometer rotational angle selected in the present embodiment is ± 20 °,
Can be applicable to maximumLaser beam, the sweep limitss of 1m × 1m can be met.
Laser controlling card 11 is connected with laser instrument 1, for controlling the unlatching of laser instrument and the parameters of laser.Motion control
Fabrication 12 is connected with dynamic focusing and orthopedic system 6 and scanning galvanometer system 7, for controlling first, second recessed cylindrical lenses
3rd, the motion of 4 and x scanning direction galvanometers 13 and z scanning direction galvanometer 14.Computer 10 is the operation interface of this device, laser
Control card 11 and motion control card 12 are controlled by computer 10.
Fig. 2 show the schematic diagram of scanning galvanometer system.Scanning galvanometer system is made up of two galvanometers, and they are respectively
Control the scanning of two orthogonal directions.In figure x scanning direction galvanometer 13 rotates around y-axis direction, controls the scanning in x direction, z side
Rotate around x-axis direction to scanning galvanometer 14, control the scanning in z direction.When control some directions galvanometer rotate one small
Angle, the hot spot in Forming Workpiece (target surface) 8 just moves a segment distance in the direction.By controlling the rotation of two galvanometers, just
Position in Forming Workpiece (target surface) 8 for the hot spot can be controlled.The continuous rotation of two galvanometers can realize laser on target surface
Scanning.The galvanometer rotational angle adopting in the present embodiment is ± 20 °, can be applicable to maximumLaser beam, Ke Yiman
Foot is apart from the scanning of 1m × 1m target surface of galvanometer 1500mm.
Fig. 3 is dynamic focusing principle schematic.Dynamic focusing system in dynamic focusing and orthopedic system 6 is saturating by recessed cylinder
Mirror 3 (or 4) and spherical convex lens 5 form, when recessed cylindrical lenses 3 (or 4) move a certain distance in the direction of the optical axis, such as
In figure moves at b or at c at a, and the focal position after laser beam 2 leaves dynamic focusing and orthopedic system 6 will change.
In scanning galvanometer system 7 scanning process, because in Forming Workpiece (target surface) 8, each point light path is different, in the case of fixed focal length
The focal plane producing is curved surface 15, and it is the plane 16 on target surface that dynamic focusing and orthopedic system 6 can be corrected, and effect is such as
Shown in Fig. 4.In the present embodiment, the first recessed cylindrical lenses 3 focal length is 250mm, and the second recessed cylindrical lenses 4 focal length is 300mm, sphere
Convex lenss 5 focal length is 400mm.The change that the mobile 10mm of first recessed cylindrical lenses 3 will make focal position produce 177mm.
The first two recessed cylindrical lenses composition orthopedic system in dynamic focusing and orthopedic system 6.Fig. 5 is set of cylindrical lenses principle
Schematic diagram.During laser beam 2 incident recessed cylindrical lenses, the directional divergence vertical with bus, and the direction parallel with bus does not occur
Change.The mutually orthogonal biconcave cylindrical lenses of bus will make mutually orthogonal two axles on laser beam 2 section that different multiplying to occur
Dissipate, formed oval cross section.First, second recessed cylindrical lenses 3,4 are directed on laser section with spherical convex lens 5 composition respectively
The dynamic focusing system of orthogonal two axles.Circular section laser is beaten through vibration mirror scanning and will be deformed into ellipse in Forming Workpiece (target surface) 8
Hot spot 17, and the oval cross section laser of definite shape can obtain circular light after vibration mirror scanning in Forming Workpiece (target surface) 8
Speckle 18.The orthopedic effect of the present embodiment is as shown in Figure 6.
The workflow of embodiment is as follows:
(1) input shot-peening path first on computer 10.In a certain moment in scanning process, determining by processing route should
When be engraved in the coordinate of scan position in Forming Workpiece 8;
(2) computer 10 calculates first, second recessed cylindrical lenses 3,4 and x scanning direction galvanometer 13 and z side according to coordinate
To the due pose of scanning galvanometer 14, motion control card 12 is then controlled to make first, second recessed cylindrical lenses 3,4 and x direction
Scanning galvanometer 13 and z scanning direction galvanometer 14 move to corresponding pose;
(3) laser controlling card 11 controls pulse laser beam 2 to send from laser instrument 1, first passes through dynamic focusing and orthopedic system
6, the cross sectional shape of pulse laser beam 2 and focal position change, then pass through scanning galvanometer system 7, the biography of pulse laser beam 2
Broadcast direction to change, from getting to the corresponding coordinate Forming Workpiece (target surface) 8, and formation process requiresThe circle of size
Hot spot;
(4) carry out the shot-peening of next point by processing route, until shot-peening path is terminated, complete laser peening.
Above-described embodiment is merely to illustrate technical solution of the present invention, but it is not for limiting the present invention.Any ability
Without departing from the spirit and scope of the present invention, the content that may be by the disclosure above is to proposed by the invention for field technique personnel
Scheme make possible variation and modification, therefore, every technology contents without departing from the present invention, the technology according to the present invention is real
Any simple modification, equivalent variations and modification that confrontation above example is made, belong to protection scope of the present invention.
Claims (6)
1. a kind of light path device for large-scale workpiece laser shot forming is it is characterised in that including laser instrument (1), dynamically gathering
Burnt and orthopedic system (6), scanning galvanometer system (7), Forming Workpiece (8), computer (10), laser controlling card (11) and motion are controlled
Fabrication (12), described laser controlling card is connected with laser instrument, for controlling the unlatching of laser instrument and the parameters of laser, described
Motion control card is connected with dynamic focusing and orthopedic system and scanning galvanometer system simultaneously, and described laser controlling card and motion are controlled
Fabrication is controlled by computer, after giving specific shot-peening path, computer controls dynamic focusing and orthopedic system and scanning
Galvanometer system makes corresponding motion, and the high energy pulse laser beam that laser instrument sends occurs after dynamic focusing and orthopedic system
Cross sectional shape change and the change of focal position, then be scanned through galvanometer system and subsequently point to specific exit direction, thus passing through
Scanning shot-peening on large-scale workpiece for the laser is realized in the continuous motion of dynamic focusing and orthopedic system and scanning galvanometer system.
2. the light path device for large-scale workpiece laser shot forming according to claim 1 is it is characterised in that described move
State focuses on and orthopedic system (6) includes two recessed cylindrical lenses (3,4) and a spherical convex lens (5), and laser pressed by three face lens
Arrange successively in the direction that bundle (2) is launched, its axis is all located on the optical axis of laser beam, and the segment of a cylinder of two recessed cylindrical lenses is protected
Hold orthogonal, and all can rotate around optical axis independently along optical axis direction translation and synchronization.
3. the light path device for large-scale workpiece laser shot forming according to claim 2 is it is characterised in that described sweep
Retouch galvanometer system and include x scanning direction galvanometer (13) and z scanning direction galvanometer (14), wherein x scanning direction galvanometer (13) can
Around the axis of rotation in the y direction of itself, z scanning direction galvanometer (14) can be around the axis of rotation in the x direction of itself, and its rotation is subject to
To the control of motion control card (12), when laser beam (2) is beaten in the origin position of Forming Workpiece (8), laser beam (2) falls successively
In x scanning direction galvanometer (13) and z scanning direction galvanometer (14) in the heart, x scanning direction galvanometer (13) and z scanning direction shake
The rotation of mirror (14) will change the direction of laser beam (2) outgoing, laser beam (2) now should be kept to fully fall in x scanning direction and shake
In effective reflected range of mirror (13) and z scanning direction galvanometer (14).
4. the light path device for large-scale workpiece laser shot forming according to claim 3 is it is characterised in that described x
Scanning direction galvanometer (13) and z scanning direction galvanometer (14) are the plane mirrors that can rotate around own torque.
5. the light path device for large-scale workpiece laser shot forming according to claim 3 is it is characterised in that described fortune
Dynamic control card (12) controls the fortune of recessed cylindrical lenses (3,4) and x scanning direction galvanometer (13) and z scanning direction galvanometer (14)
Dynamic.
6. a kind of method for large-scale workpiece laser shot forming is it is characterised in that adopt light path as claimed in claim 5
Realizing, workflow is as follows for device:
1) first in computer (10) upper input shot-peening path, in a certain moment in scanning process, technique road pressed by computer (10)
Footpath is engraved in the coordinate of Forming Workpiece (8) upper scan position when determining this;
2) computer (10) calculates recessed cylindrical lenses (3,4) according to coordinate and x scanning direction galvanometer (13), z scanning direction shake
The due pose of mirror (14), controls motion control card (12), and motion control card (12) controls recessed cylindrical lenses (3,4) and x side
Move to corresponding pose to scanning galvanometer (13), z scanning direction galvanometer (14);
3) laser controlling card (11) controls pulse laser beam (2) to send from laser instrument (1), first passes through dynamic focusing and orthopedic system
(6), the cross sectional shape of pulse laser beam (2) and focal position change, then pass through scanning galvanometer system (7), pulse laser
The direction of propagation of bundle (2) changes, and gets to the corresponding coordinate in Forming Workpiece (8);
4) carry out the shot-peening of next point by processing route.
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CN105567946B (en) * | 2016-01-06 | 2017-11-07 | 广东工业大学 | Laser peening strengthens the path planning apparatus and its paths planning method of curved surface |
CN107336440A (en) * | 2017-08-09 | 2017-11-10 | 英诺激光科技股份有限公司 | A kind of laser 3D printing method and its system with orthopaedic function |
CN108866317B (en) * | 2018-06-19 | 2019-11-19 | 上海交通大学 | Dynamic optical focusing mechanism suitable for scanning light spot school shape |
CN109513927A (en) * | 2018-12-26 | 2019-03-26 | 西安铂力特增材技术股份有限公司 | A kind of high-power part forming device of SLM and manufacturing process |
CN110539068A (en) * | 2019-09-16 | 2019-12-06 | 广东镭奔激光科技有限公司 | Rapid scanning type laser shock peening method and system for directional area |
CN113427138A (en) * | 2020-03-21 | 2021-09-24 | 赣州市普希德工具有限公司 | Laser processing equipment for turning and grinding by laser |
CN117047285A (en) * | 2023-08-14 | 2023-11-14 | 上海智能制造功能平台有限公司 | Laser shot blasting forming large-breadth dynamic scanning closed-loop control system and method |
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US4937421A (en) * | 1989-07-03 | 1990-06-26 | General Electric Company | Laser peening system and method |
US6900409B2 (en) * | 2003-08-22 | 2005-05-31 | General Electric Company | Single head laser high throughput laser shock peening |
JP4690895B2 (en) * | 2005-01-11 | 2011-06-01 | 新日本製鐵株式会社 | Laser peening treatment method of metal object and metal object manufactured by laser peening treatment method |
CN101011777A (en) * | 2006-12-11 | 2007-08-08 | 江苏大学 | Method and apparatus of forming cut deal laser prestress composite shot blasting |
CN100591456C (en) * | 2007-11-16 | 2010-02-24 | 江苏大学 | Method and device based on micro-nano laser-induced shock wave three dimensional non-invasive mark |
CN101745740B (en) * | 2009-12-23 | 2013-07-10 | 江苏大学 | Metal plate material ring-shaped light spot laser impact forming method and device |
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