CN104918454A - Electronic equipment and supply unit having the same - Google Patents

Electronic equipment and supply unit having the same Download PDF

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Publication number
CN104918454A
CN104918454A CN201410775755.9A CN201410775755A CN104918454A CN 104918454 A CN104918454 A CN 104918454A CN 201410775755 A CN201410775755 A CN 201410775755A CN 104918454 A CN104918454 A CN 104918454A
Authority
CN
China
Prior art keywords
coil
substrate
electronic equipment
transfer member
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410775755.9A
Other languages
Chinese (zh)
Other versions
CN104918454B (en
Inventor
久保正彦
鹰取浩二
丸茂克也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Publication of CN104918454A publication Critical patent/CN104918454A/en
Application granted granted Critical
Publication of CN104918454B publication Critical patent/CN104918454B/en
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/08Cooling; Ventilating
    • H01F27/22Cooling by heat conduction through solid or powdered fillings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2895Windings disposed upon ring cores

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The present invention provides electronic equipment and a supply unit having the same for providing improved exothermal efficiency. The supply unit has a housing portion (11) in a box-type shape, a first substrate (13a) configured within the interior of the housing portion, an annular coil (38) formed by installation of an annular core (38a) and coiling at a winding (38b) of the core on the first substrate (13a). The coil (38) has an approximately cylindric cavity (38c) in which filling members (39) by the means of filling the periphery of windings (38b).

Description

Electronic equipment and there is the supply unit of this electronic equipment
Technical field
The present invention relates to a kind of electronic equipment and there is the supply unit of this electronic equipment.
Background technology
In the electronic equipments such as supply unit in the past, energising produces the inside that hot heat generating components is arranged at housing section.The coil (such as with reference to patent documentation 1) of the ring-type of winding portion heating when being included in energising in such heat generating components.
Patent documentation 1: Japanese Unexamined Patent Publication 2005-150330 publication
But there is following problem in above-mentioned existing structure.
That is, the middle core of the coil of ring-type is intensive coiling, can the route of heat release few, the heat being therefore hidden in the middle core of coil cannot be released into outside completely, and the temperature of middle core can uprise unavoidably.
Summary of the invention
The object of the present invention is to provide and a kind ofly improve the electronic equipment of exothermal efficiency by the heat of core in coil being released into effectively outside and there is the supply unit of this electronic equipment, solve the problem thus.
The electronic equipment of the first technical scheme has: the housing section of box shape, and substrate is configured at the inside of housing, the coil of ring-type, is configured on substrate, is made up of core and the coiling be winding and installed on core of ring-type; Coil has roughly cylindric hollow bulb, is filled with noggin piece in hollow bulb in the mode of gapless landfill.
Thus, the heat of the middle core of coil is released into coil outer via noggin piece.
In addition, noggin piece alleged herein refers to have insulating properties, having mobility, not having the component of the solid shape of mobility after filling, and do not have mobility under the common serviceability temperature of electronic equipment when filling.
In addition, alleged herein heat transfer member refers to have insulating properties and the component higher than air conduction rate.
In addition, the mode that packing material forms with the two ends of the axis direction of the central shaft of the hollow bulb at coil the face that coiling is not given prominence to is filled.
The feature of the electronic equipment of the second technical scheme is, in the electronic equipment of the first technical scheme, the side of noggin piece also on the axis direction of the central shaft of hollow bulb has the first end face, first end face is configured with heat transfer member, heat transfer member has first surface in opposite directions and second, and the first surface of heat transfer member contacts the first end face.
Thus, the heat of the middle core of coil can be released into outside coil effectively via noggin piece and heat transfer member.
The feature of the electronic equipment of the 3rd technical scheme is, in the electronic equipment of the second technical scheme, coil is at the side contact substrate along axis direction, and the first end face is configured in the opposite side along axis direction of coil, second contact housing of heat transfer member.
Thus, the heat of the middle core of coil can be released into outside housing effectively via heat transfer member.
The feature of the electronic equipment of the 4th technical scheme is, in the electronic equipment of the second technical scheme, coil also has outer peripheral face, and substrate is also configured with heat liberation board, coil is configured on substrate in the mode of a part for outer peripheral face and substrate contacts, second contact heat liberation board of heat transfer member.
Thus, the heat of the middle core of coil can be released into outside coil effectively via heat transfer member and heat liberation board.
The feature of the electronic equipment of the 5th technical scheme is to have the electronic equipment according to any one of first to fourth technical scheme.
Thus, the supply unit that can obtain the effect identical with above-mentioned electronic equipment can be provided.
Invention effect
Electronic equipment of the present invention, by by being hidden in the Thermal release of core in coil to outside, can improve exothermal efficiency.
Accompanying drawing explanation
Fig. 1 is the stereogram of supply unit of the present invention.
Fig. 2 is the assembling stereogram of the supply unit of embodiments of the present invention 1.
Fig. 3 is the end view of the state that coil that the 1st substrate of the inside of the supply unit of Fig. 2 configures and housing section combine.
Fig. 4 is the left surface perspective view of the supply unit of Fig. 2.
Fig. 5 is the A-A line profile of Fig. 4.
Fig. 6 is the vertical view of the coil before the noggin piece of the 1st, the 2nd execution mode is filled.
Fig. 7 is the assembling stereogram of the supply unit of embodiments of the present invention 2.
Fig. 8 is the end view of the state that coil that the 1st substrate of the inside of the supply unit of embodiments of the present invention 2 configures and heat liberation board combine.
Fig. 9 is the left surface perspective view of the supply unit of embodiments of the present invention 2.
Figure 10 is the A-A line profile of Fig. 9.
The explanation of Reference numeral
10: supply unit (electronic equipment)
11: housing section
11a: end face
11b: bottom surface
11c: left surface
11d: right flank
11e: front openings portion
The inner surface of 11g left surface
12: cap above
13: electric substrate unit
13a: the 1 substrate
13b: the 2 substrate
32: switch element
33: fin
34: transformer
35: aluminium electrolytic capacitor
36: fin
37: aluminium electrolytic capacitor
38: coil
38a: core
38b: coiling
38c: hollow bulb
38d: side
38e: opposite side
38f: outer peripheral face
39: resin (example of noggin piece)
39a: the first end face
40: heat transfer member
40a: first surface
40b: the second
41: slide plate
42: heat liberation board
Embodiment
(execution mode 1)
Use Fig. 1 ~ Fig. 6, the supply unit (electronic equipment) 10 of one embodiment of the present invention is described.
In addition, in following explanation, as direction of the arrows shown in fig, fore-and-aft direction refers to, using the front face side of supply unit 10 as front, using opposition side as the direction consistent with the assembling direction described later of supply unit 10 time rear.In addition, left and right directions refers to, the left and right directions from the state that cap 12 before supply unit 10 is observed in front.In addition, above-below direction refers to, is expressed as upper and lower direction in Fig. 1 with arrow, is the vertical under the setting posture of supply unit 10.
< overall structure >
The supply unit 10 of present embodiment is for alternating voltage being converted to direct voltage and the device of stable supplying, as shown in Figure 1 and Figure 2, has housing section 11, above cap 12, electric substrate unit 13.
Housing section 11 is components that front face side has the box shape of opening portion (front openings portion 11e), is equipped with electric substrate unit 13 in inner space.In addition, in the front face side of housing section 11, cap 12 is above installed, the 11e side, front openings portion of cover housing body 11.That is, assemble direction to refer to, electric substrate unit 13 is inserted the direction of housing section 11.
As shown in Figure 2, with regard to electric substrate unit 13, two substrates (the 1st substrate 13a, the 2nd substrate 13b) are provided with multiple electronic unit and form, major part inserts the inside of housing section 11, and the part of front side is covered by cap 12 above.In addition, describe in detail after the detailed construction for the 1st substrate.
< the 1st substrate 13a >
As shown in Figure 2, the 1st substrate 13a is placed in housing section 11 along the above-below direction arranged under posture of supply unit.
As shown in Figure 2, the surface of the left surface 11c side by housing section 11 of the 1st substrate 13a is provided with the electronic units such as switch element (heat generating components) 32, fin (heat generating components) 33, transformer (heat generating components) 34, aluminium electrolytic capacitor 35, fin (heat generating components) 36, aluminium electrolytic capacitor 37, coil 38 (heat generating components).
As shown in Figure 2, the 1st substrate 13a is roughly parallel to the side 11d of housing section 11, and configures along the direction that the end face 11a and bottom surface 11b with housing section 11 is substantially vertical.
< coil >
Coil 38 is heat generating components of the heating when being energized, and as shown in Figure 2 to 4, the coiling 38b being installed on core by core 38a and the winding of ring-type is formed, and has roughly cylindric hollow bulb 38c and outer peripheral face 38f.In this embodiment, coil 38, at the side 38d contact substrate of the axis direction of the central shaft along hollow bulb 38c, is configured with the first end face 39a at opposite side 38e.
Be filled with the resin 39 as noggin piece in the mode of the surrounding of seamlessly landfill coiling 38b in hollow bulb 38c, the first end face 39a of the resin 39 of filling is configured to roughly planar (with reference to Fig. 4, Fig. 5).
In addition, the first end face 39a of resin 39 is also configured with heat transfer member 40, and this heat transfer member 40 is formed by silicon, has insulating properties, and thermal conductivity ratio air is high.
This heat transfer member 40 has first surface 40a and second 40b opposite each other, the first surface 40a of this heat transfer member 40 contacts with the first end face 39a of filled resin 39, directly contact slide plate 41 described later at second 40b of this heat transfer member 40, contact housing (with reference to Fig. 3, Fig. 5) via slide plate 41.
This slide plate 41 inserts in housing section 11 for the electric substrate unit 13 of the state by being configured with heat transfer member 40.
Slide plate 41 is configured between the inner surface 11g of second 40b of heat transfer member 40 and the left surface 11c of housing in the mode of second of direct contact heat transfer component 40 40b and left surface 11c.
Thus, the heat being hidden in the roughly cylindric hollow bulb 38c of coil 38 is released into the outside of housing section 11 via the resin 39 be filled in hollow bulb 38c and heat transfer member 40, can improve exothermal effect thus.
Its result, can provide the supply unit 10 that exothermal effect is high.
(execution mode 2)
Below, the supply unit for embodiments of the present invention 2 is described.The supply unit of present embodiment 2 is identical with the basic structure of execution mode 1, but be different from execution mode 1, the coil 38 being installed on substrate 13a is configured on substrate in the mode of outer peripheral face 38f contact substrate, configures heat liberation board 42 (reference of Fig. 7, Fig. 8, Fig. 9 The) in the mode being approximately perpendicular to substrate 13a on the Width of coil.Therefore, being described for main relative to the difference of execution mode 1 with present embodiment 2.In addition, in present embodiment 2, identical Reference numeral is marked for the structure identical with execution mode 1.
< the 1st substrate 13a >
Fig. 7 is the assembling stereogram of the supply unit of present embodiment 2.
As shown in Figure 7, the coil 38 being installed on the 1st substrate 13a is different from execution mode 1, is arranged on substrate 13a in the mode that outer peripheral face 38f contacts with substrate 13a.In addition, coil 38 be transversely roughly orthogonal to substrate 13a, and to configure heat liberation board 42 with the first end face 39a mode in opposite directions of resin 39 of the hollow bulb 38c being filled in coil 38.
Heat liberation board 42 is the heat that produces in the heat generating components such as receiving coil and indirectly makes the heat generating components that temperature rises, and is the component of the tabular formed by aluminium.In the present embodiment, heat liberation board 42 is set in order to the heat of the inner side generation of heat release coil 38 effectively.Be filled with noggin piece 39 (not shown) in the mode of the surrounding of seamlessly landfill coiling 38b in hollow bulb 38c, and the first end face 39a being cured as resin 39 forms the state of roughly planar.
First end face 39a of this resin 39 is also configured with the heat transfer member 40 identical with execution mode 1, first end face 39a of the first surface 40a contact pressure resin 39 of this heat transfer member 40, second 40b of this heat transfer member 40 directly contacts heat liberation board 42 (with reference to Fig. 8, Figure 10).
Thus, the heat be hidden in the roughly cylindric hollow bulb 38c of coil 38 is released into the outside of coil 38 via the resin 39 be filled in hollow bulb 38c and heat transfer member 40, can improve exothermal effect thus.
Its result, can provide the supply unit 10 that exothermal effect is high.
(other execution mode)
Above, although be illustrated two kinds of execution modes of the present invention, the present invention is not defined in above-mentioned execution mode, can carry out various change without departing from the spirit and scope of the invention.
(A)
In above-mentioned execution mode, enumerate the example transferring heat to housing or heat liberation board via heat transfer member 40, and it is illustrated.But the present invention is not defined in this.
Such as, do not use heat transfer member 40, in the hollow bulb 38c of coil, only fill the resin 39 as noggin piece, so also can the heat of the effective middle core of heat release coil 38.In addition, by making the resin 39 as noggin piece directly contact housing, also can by Thermal release to the outside of housing.
(B)
In above-mentioned execution mode 1, enumerate to electric substrate unit 13 be inserted the example using slide plate 41 in housing section 11, and it is illustrated.But the present invention is not defined in this.
Such as, can be do not use slide plate, heat transfer member 40 directly contacts the structure of housing section 11.
(C)
In above-mentioned execution mode, enumerate the example of housing section 11 by metal forming, and it is illustrated.But the present invention is not defined in this.
Such as, housing section can by ester moulding.Or, also can be the structure of pasting metal plate on the side of resinous housing section.
(D)
In above-mentioned execution mode, list the example of resin as noggin piece, and it is illustrated.But the present invention is not defined in this.
Such as, silicon bonding agent can be used as filling material.That is, as long as have insulating properties, thermal endurance, and shape when entering hollow bulb freely, enter the material of Post RDBMS.
(E)
In above-mentioned execution mode, enumerate the example applying the present invention to supply unit 10, and it is illustrated.But the present invention is not defined in this.
Such as, the inside that can be applicable to housing section is provided with other electronic equipment of the coil of ring-type.
Industrial applicibility
Electronic equipment of the present invention can bring by by the Thermal release of core in the coil being installed on substrate to the outside effect improving exothermal efficiency, therefore, it is possible to the various electronic equipments of coil are installed in the inside being extensively useful in housing section.

Claims (5)

1. an electronic equipment, is characterized in that,
Have:
The housing section of box shape,
Substrate, is configured at the inside of described housing,
The coil of ring-type, is configured on described substrate, the core comprising ring-type and the coiling be winding and installed on described core;
Described coil has roughly cylindric hollow bulb,
Noggin piece is filled with in the mode of gapless landfill in described hollow bulb.
2. electronic equipment as claimed in claim 1, is characterized in that,
The side of described noggin piece also on the axis direction of the central shaft of described hollow bulb has the first end face,
Described first end face is configured with heat transfer member,
Described heat transfer member has first surface in opposite directions and second,
Described first end face of first surface contact of described heat transfer member.
3. electronic equipment as claimed in claim 2, is characterized in that,
Described coil is substrate described in the side contacts along described axis direction, and described first end face is configured in the opposite side along described axis direction of described coil,
Second described housing of contact of described heat transfer member.
4. electronic equipment as claimed in claim 2, is characterized in that,
Described coil also has outer peripheral face,
Described substrate is also configured with heat liberation board,
Described coil is configured on described substrate in the mode of a part for described outer peripheral face and described substrate contacts,
Second described heat liberation board of contact of described heat transfer member.
5. a supply unit, is characterized in that, has the electronic equipment according to any one of Claims 1 to 4.
CN201410775755.9A 2014-03-14 2014-12-15 Electronic equipment and the supply unit with the electronic equipment Active CN104918454B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-050984 2014-03-14
JP2014050984A JP6287391B2 (en) 2014-03-14 2014-03-14 Electronic device and power supply device including the same

Publications (2)

Publication Number Publication Date
CN104918454A true CN104918454A (en) 2015-09-16
CN104918454B CN104918454B (en) 2017-10-24

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CN (1) CN104918454B (en)
DE (1) DE102014221631A1 (en)

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CN111435623A (en) * 2019-01-11 2020-07-21 泰达电子股份有限公司 Encapsulated inductive component
CN112542898A (en) * 2019-09-20 2021-03-23 Tdk株式会社 Coil unit, wireless power transmission device, wireless power reception device, and wireless power transmission system
CN112825608A (en) * 2019-11-20 2021-05-21 富士电机株式会社 Programmable controller module and programmable controller system

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JP6455450B2 (en) * 2016-01-12 2019-01-23 トヨタ自動車株式会社 Reactor
JP7129658B2 (en) * 2018-09-14 2022-09-02 パナソニックIpマネジメント株式会社 Power conversion device, reactor device and heat dissipation structure
JP7124795B2 (en) * 2019-06-27 2022-08-24 株式会社村田製作所 Electronic component module, electronic component unit, and electronic component module manufacturing method
KR102328273B1 (en) * 2021-06-10 2021-11-18 주식회사 티엔씨 Routing Type Line Filter
JP7151852B1 (en) 2021-10-11 2022-10-12 富士電機株式会社 POWER CONVERTER, MAGNETIC COMPONENT, AND METHOD FOR MANUFACTURING POWER CONVERTER

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Publication number Priority date Publication date Assignee Title
CN111435623A (en) * 2019-01-11 2020-07-21 泰达电子股份有限公司 Encapsulated inductive component
CN112542898A (en) * 2019-09-20 2021-03-23 Tdk株式会社 Coil unit, wireless power transmission device, wireless power reception device, and wireless power transmission system
CN112542898B (en) * 2019-09-20 2024-02-27 Tdk株式会社 Coil unit, wireless power transmission device, wireless power reception device, and wireless power transmission system
CN112825608A (en) * 2019-11-20 2021-05-21 富士电机株式会社 Programmable controller module and programmable controller system
CN112825608B (en) * 2019-11-20 2022-09-20 富士电机株式会社 Programmable controller module and programmable controller system

Also Published As

Publication number Publication date
DE102014221631A1 (en) 2015-09-17
CN104918454B (en) 2017-10-24
JP6287391B2 (en) 2018-03-07
JP2015176942A (en) 2015-10-05

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