CN104918454B - Electronic equipment and the supply unit with the electronic equipment - Google Patents
Electronic equipment and the supply unit with the electronic equipment Download PDFInfo
- Publication number
- CN104918454B CN104918454B CN201410775755.9A CN201410775755A CN104918454B CN 104918454 B CN104918454 B CN 104918454B CN 201410775755 A CN201410775755 A CN 201410775755A CN 104918454 B CN104918454 B CN 104918454B
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- Prior art keywords
- face
- coil
- substrate
- electronic equipment
- heat
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2895—Windings disposed upon ring cores
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Present invention offer is a kind of can to improve the electronic equipment of exothermal efficiency and the supply unit with the electronic equipment.The supply unit of the present invention has, housing section (11) with box shape, the 1st substrate (13a) for being configured at the inside of housing section, the coil (38) for being configured at the core (38a) on the 1st substrate (13a) and by ring-type and being winding and installed in the ring-type that the coiling (38b) of the core is constituted, coil have substantially cylindric hollow bulb (38c).Noggin piece (39) is filled with hollow bulb (38c) in the way of seamlessly filling around coiling (38b).
Description
Technical field
The present invention relates to a kind of electronic equipment and the supply unit with the electronic equipment.
Background technology
In the electronic equipments such as conventional supply unit, it is powered and produces the inside that hot heat generating components is arranged at housing section.This
The coil for the ring-type that winding portion is generated heat when being included in energization in the heat generating components of sample (referring for example to patent document 1).
Patent document 1：Japanese Unexamined Patent Publication 2005-150330 publications
But, the problem of above-mentioned existing structure has following.
That is, the middle core of the coil of ring-type is intensive coiling, and the route for being capable of heat release is few, therefore is hidden in the SMIS of coil
The heat in portion can not be discharged to outside completely, and the temperature of middle core can be uprised unavoidably.
The content of the invention
Improved it is an object of the invention to provide a kind of by the way that the heat of the middle core of coil is effectively discharged to outside
The electronic equipment of exothermal efficiency and the supply unit with the electronic equipment, thus solve the above problems.
The electronic equipment of first technical scheme has：The housing section of box shape, substrate is configured at the inside of housing, ring
The coil of shape, is configured on substrate, is made up of the core and the coiling being winding and installed on core of ring-type；Coil, which has, substantially to be justified
Noggin piece is filled with the hollow bulb of tubular, hollow bulb in the way of gapless is filled.
Thus, the heat of the middle core of coil is discharged to coil outer via noggin piece.
In addition, noggin piece referred to herein refers to, with insulating properties, there is mobility in filling, do not have after filling
The component of the solid-like of mobility, and there is no mobility under the common temperature in use of electronic equipment.
In addition, heat transfer member referred to herein refers to, with insulating properties and the component higher than air conduction rate.
In addition, packing material is not prominent to form at the two ends of the axis direction of the central shaft of the hollow bulb of coil coiling
The mode in face is filled.
The electronic equipment of second technical scheme is characterised by, in the electronic equipment of the first technical scheme, and noggin piece is also
Side on the axis direction of the central shaft of hollow bulb has first end face, and heat transfer member is configured with first end face, passes
Hot component has opposite the first face and the second face, the first face contact first end face of heat transfer member.
Thus, the heat of the middle core of coil can be effectively discharged to outside coil via noggin piece and heat transfer member.
The electronic equipment of 3rd technical scheme is characterised by, in the electronic equipment of the second technical scheme, coil along
One side contacts substrate of axis direction, first end face configures the opposite side along axis direction in coil, the of heat transfer member
Two faces contact housing.
Thus, the heat of the middle core of coil can be effectively discharged to outside housing via heat transfer member.
The electronic equipment of 4th technical scheme is characterised by that in the electronic equipment of the second technical scheme, coil also has
Heat liberation board is also configured with outer peripheral face, substrate, coil is configured on substrate in the way of a part for outer peripheral face is contacted with substrate,
The second face contact heat liberation board of heat transfer member.
Thus, the heat of the middle core of coil can be effectively discharged to outside coil via heat transfer member and heat liberation board.
The electronic equipment of 5th technical scheme is characterised by, with any one of first to fourth technical scheme
Electronic equipment.
Thus, it is possible to provide the supply unit with above-mentioned electronic equipment identical effect can be obtained.
Invention effect
The electronic equipment of the present invention, is discharged to outside, it is possible to increase heat release by would fit snugly within the heat of middle core of coil
Efficiency.
Brief description of the drawings
Fig. 1 is the stereogram of the supply unit of the present invention.
Fig. 2 is the assembling stereogram of the supply unit of embodiments of the present invention 1.
Fig. 3 is the side for the state that the coil that is configured on the 1st substrate of the inside of Fig. 2 supply unit and housing section are combined
View.
Fig. 4 is the left side perspective view of Fig. 2 supply unit.
Fig. 5 is Fig. 4 line A-A profile.
Fig. 6 be the 1st, the 2nd embodiment noggin piece filling before coil top view.
Fig. 7 is the assembling stereogram of the supply unit of embodiments of the present invention 2.
Fig. 8 is the coil and heat liberation board configured on the 1st substrate of the inside of the supply unit of embodiments of the present invention 2
The side view for the state being combined.
Fig. 9 is the left side perspective view of the supply unit of embodiments of the present invention 2.
Figure 10 is Fig. 9 line A-A profile.
The explanation of reference
10：Supply unit (electronic equipment)
11：Housing section
11a：Top surface
11b：Bottom surface
11c：Left surface
11d：Right flank
11e：Front openings portion
The inner surface of 11g left surfaces
12：Above cap
13：Electric substrate unit
13a：1st substrate
13b：2nd substrate
32：Switch element
33：Fin
34：Transformer
35：Aluminium electrolutic capacitor
36：Fin
37：Aluminium electrolutic capacitor
38：Coil
38a：Core
38b：Coiling
38c：Hollow bulb
38d：Side
38e：Opposite side
38f：Outer peripheral face
39：Resin (one of noggin piece)
39a：First end face
40：Heat transfer member
40a：First face
40b：Second face
41：Slide plate
42：Heat liberation board
Embodiment
(embodiment 1)
Using Fig. 1~Fig. 6, the supply unit (electronic equipment) 10 of one embodiment of the present invention is illustrated.
In addition, in the description below, as direction of the arrows shown in fig, fore-and-aft direction refers to, using the front face side of supply unit 10 as
Before, using opposite side as it is rear when the direction consistent with the assembly orientation described later of supply unit 10.In addition, left and right directions is
Refer to, the left and right directions from front before supply unit 10 in the state of cap 12.In addition, above-below direction refers to, in Fig. 1
Be depicted with arrows as upper and lower direction, be supply unit 10 setting posture under vertical.
＜ overall structures ＞
The supply unit 10 of present embodiment is the device for alternating voltage to be converted to DC voltage and stable supplying,
As shown in Figure 1 and Figure 2, with housing section 11, above cap 12, electric substrate unit 13.
Housing section 11 is the component for the box shape that front face side has opening portion (front openings portion 11e), inner space
In be equipped with electric substrate unit 13.In addition, the front face side in housing section 11 is provided with above cap 12, covering housing section 11
Front openings portion 11e sides.That is, assembly orientation refers to, electric substrate unit 13 is inserted to the direction of housing section 11.
As shown in Fig. 2 for electric substrate unit 13, pacifying on two substrates (the 1st substrate 13a, the 2nd substrate 13b)
Constituted equipped with multiple electronic units, the inside of most of insertion housing section 11 a, part for front side is covered by above cap 12.
In addition, for being described in detail behind the detailed construction of the 1st substrate.
The substrate 13a ＞ of ＜ the 1st
As shown in Fig. 2 the above-below direction under setting postures of the 1st substrate 13a along supply unit is placed in housing section 11
It is interior.
As shown in Fig. 2 being provided with switch element on the 1st substrate 13a surface by the left surface 11c sides of housing section 11
(heat generating components) 32, fin (heat generating components) 33, transformer (heat generating components) 34, aluminium electrolutic capacitor 35, fin (heating
Part) 36, aluminium electrolutic capacitor 37, the electronic unit such as coil 38 (heat generating components).
As shown in Fig. 2 the 1st substrate 13a is roughly parallel to the side 11d of housing section 11, and along the top with housing section 11
Face 11a and the configuration of bottom surface 11b generally perpendicular directions.
＜ coils ＞
Coil 38 is the heat generating components generated heat when being powered, as shown in Figure 2 to 4, is pacified by the core 38a and winding of ring-type
Coiling 38b loaded on core is constituted, with substantially cylindric hollow bulb 38c and outer peripheral face 38f.In this embodiment, line
Circle 38 contacts substrate in the side 38d of the axis direction of the central shaft along hollow bulb 38c, and first is configured with opposite side 38e
End face 39a.
Filled with the resin as noggin piece in the way of seamlessly filling around coiling 38b in hollow bulb 38c
39, the first end face 39a for the resin 39 filled is configured to roughly planar (reference picture 4, Fig. 5).
In addition, being also configured with heat transfer member 40 on the first end face 39a of resin 39, the heat transfer member 40 is formed by silicon,
With insulating properties, thermal conductivity ratio air is high.
The heat transfer member 40 has the first face 40a and the second face 40b opposite each other, the first face of the heat transfer member 40
40a is contacted with the first end face 39a for the resin 39 filled, and directly contacts described later in the second face 40b of the heat transfer member 40
Slide plate 41, housing (reference picture 3, Fig. 5) is contacted via slide plate 41.
The slide plate 41 is used to insert the electric substrate unit 13 for the state for being configured with heat transfer member 40 in housing section 11.
Slide plate 41 is configured in heat transfer member in the way of the second face 40b and left surface 11c of direct contact heat transfer component 40
Between 40 the second face 40b and the left surface 11c of housing inner surface 11g.
Thus, the substantially cylindric hollow bulb 38c heat of coil 38 is hidden in via the tree being filled in hollow bulb 38c
Fat 39 and heat transfer member 40 are discharged to the outside of housing section 11, thus can improve exothermal effect.
As a result, can provide exothermal effect high supply unit 10.
(embodiment 2)
Below, illustrated for the supply unit of embodiments of the present invention 2.The supply unit of present embodiment 2 with
The basic structure of embodiment 1 is identical, but different from embodiment 1, the coil 38 for being installed on substrate 13a is connect with outer peripheral face 38f
The mode for touching substrate is configured on substrate, and heat release is configured in the way of substrate 13a is approximately perpendicular on the width in coil
Plate 42 (reference picture 7, Fig. 8, Fig. 9).Therefore, said based on the difference relative to embodiment 1 of present embodiment 2
It is bright.In addition, in present embodiment 2, for marking identical reference with the identical structure of embodiment 1.
The substrate 13a ＞ of ＜ the 1st
Fig. 7 is the assembling stereogram of the supply unit of present embodiment 2.
As shown in fig. 7, the coil 38 for being installed on the 1st substrate 13a is different from embodiment 1, with outer peripheral face 38f and substrate
The mode that 13a is in contact is arranged on substrate 13a.In addition, generally normal to substrate 13a in the transverse direction of coil 38, and with filling out
Fill and configure heat liberation board 42 in the opposite modes of the first end face 39a of the hollow bulb 38c of coil 38 resin 39.
Heat liberation board 42 is the heat produced in the heat generating components such as receiving coil and the heat generating components for making temperature increase indirectly, is
The component of the tabular formed by aluminium.In the present embodiment, set for the heat that the inner side of effectively heat release coil 38 is produced
Heat liberation board 42.(do not schemed filled with noggin piece 39 in the way of seamlessly filling around coiling 38b in hollow bulb 38c
Show), and it is cured as the state that the first end face 39a of resin 39 constitutes roughly planar.
It is also configured with the first end face 39a of the resin 39 and the identical heat transfer member 40 of embodiment 1, the heat transfer member
The first end face 39a of 40 the first face 40a contact pressure resins 39, the second face 40b of the heat transfer member 40 directly contact heat liberation board 42
(reference picture 8, Figure 10).
Thus, the heat being hidden in the substantially cylindric hollow bulb 38c of coil 38 is via being filled in hollow bulb 38c
Resin 39 and heat transfer member 40 are discharged to the outside of coil 38, thus can improve exothermal effect.
As a result, can provide exothermal effect high supply unit 10.
(other embodiment)
Above, although two kinds of embodiments to the present invention are illustrated, and still, the present invention is not limited to above-mentioned reality
Mode is applied, various change can be carried out without departing from the spirit and scope of the invention.
(A)
In above-mentioned embodiment, the example that housing or heat liberation board are transferred heat to via heat transfer member 40 is enumerated, and to it
It is illustrated.But, the present invention is not limited to this.
For example, without using heat transfer member 40, the resin 39 as noggin piece is only filled into the hollow bulb 38c of coil,
So also it is capable of the heat of the effective middle core of heat release coil 38.In addition, by making the resin 39 as noggin piece directly contact
Housing, also can be by heat release to the outside of housing.
(B)
In above-mentioned embodiment 1, enumerate and use slide plate 41 in order to which electric substrate unit 13 is inserted in housing section 11
Example, and it is illustrated.But, the present invention is not limited to this.
For example, it may be without using slide plate, heat transfer member 40 directly contacts the structure of housing section 11.
(C)
In above-mentioned embodiment, example of the housing section 11 by metal forming is enumerated, and it is illustrated.But, this
Invention is not limited to this.
For example, housing section can be by ester moulding.Or or paste golden on the side of resinous housing section
Belong to the structure of the plate of system.
(D)
In above-mentioned embodiment, the example of resin is listed as noggin piece, and it is illustrated.But, this
Invention is not limited to this.
For example, can be used silicon bonding agent as filling material.That is, as long as having insulating properties, heat resistance, and entering
Shape during hollow bulb freely, into the material of solidify afterwards.
(E)
In above-mentioned embodiment, the example for applying the present invention to supply unit 10 is enumerated, and it is illustrated.But
It is that the present invention is not limited to this.
For example, the inside that can be applied to housing section is provided with other electronic equipments of the coil of ring-type.
Industrial applicibility
The electronic equipment of the present invention can bring the heat of the middle core by the coil by substrate is installed on to discharge to outside
To improve the effect of exothermal efficiency, the various electronic equipments of coil are installed therefore, it is possible to the generally applicable inside in housing section.
Claims (4)
1. a kind of electronic equipment, it is characterised in that
Have：
The housing of box shape,
Substrate, is configured at the inside of the housing,
The coil of ring-type, is configured on the substrate, includes core and the coiling being winding and installed on the core of ring-type；
The coil has cylindric hollow bulb,
Noggin piece is filled with the way of gapless is filled in the hollow bulb,
Side of the noggin piece also on the axis direction of the central shaft of the hollow bulb has first end face,
Heat transfer member is configured with the first end face,
The heat transfer member has opposite the first face and the second face,
First face of the heat transfer member contacts the first end face.
2. electronic equipment as claimed in claim 1, it is characterised in that
The coil is in substrate described in the side contacts along the axis direction, and the first end face configuration is in the coil
Along the opposite side of the axis direction,
Second face of the heat transfer member contacts the housing.
3. electronic equipment as claimed in claim 1, it is characterised in that
The coil also has outer peripheral face,
Heat liberation board is also configured with the substrate,
The coil is configured on the substrate in the way of a part for the outer peripheral face is contacted with the substrate,
Second face of the heat transfer member contacts the heat liberation board.
4. a kind of supply unit, it is characterised in that with electronic equipment according to any one of claims 1 to 3.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-050984 | 2014-03-14 | ||
| JP2014050984A JP6287391B2 (en) | 2014-03-14 | 2014-03-14 | Electronic device and power supply device including the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104918454A CN104918454A (en) | 2015-09-16 |
| CN104918454B true CN104918454B (en) | 2017-10-24 |
Family
ID=54010262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410775755.9A Active CN104918454B (en) | 2014-03-14 | 2014-12-15 | Electronic equipment and the supply unit with the electronic equipment |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6287391B2 (en) |
| CN (1) | CN104918454B (en) |
| DE (1) | DE102014221631A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6190851B2 (en) * | 2015-07-30 | 2017-08-30 | 三菱電機株式会社 | Power converter |
| JP6455450B2 (en) * | 2016-01-12 | 2019-01-23 | トヨタ自動車株式会社 | Reactor |
| JP7129658B2 (en) * | 2018-09-14 | 2022-09-02 | パナソニックＩｐマネジメント株式会社 | Power conversion device, reactor device and heat dissipation structure |
| EP3680920A1 (en) * | 2019-01-11 | 2020-07-15 | Delta Electronics (Thailand) Public Co., Ltd. | Packaged inductive component |
| JP7124795B2 (en) * | 2019-06-27 | 2022-08-24 | 株式会社村田製作所 | Electronic component module, electronic component unit, and electronic component module manufacturing method |
| JP7318446B2 (en) * | 2019-09-20 | 2023-08-01 | Tdk株式会社 | Coil unit, wireless power transmission device, wireless power reception device, and wireless power transmission system |
| JP7439468B2 (en) * | 2019-11-20 | 2024-02-28 | 富士電機株式会社 | Programmable controller module and programmable controller system |
| KR102328273B1 (en) * | 2021-06-10 | 2021-11-18 | 주식회사 티엔씨 | Routing Type Line Filter |
| JP7151852B1 (en) | 2021-10-11 | 2022-10-12 | 富士電機株式会社 | POWER CONVERTER, MAGNETIC COMPONENT, AND METHOD FOR MANUFACTURING POWER CONVERTER |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201663038U (en) * | 2010-02-05 | 2010-12-01 | 海南威特电气集团有限公司 | Novel dry-type transformer coil structure |
| CN102360835A (en) * | 2011-08-03 | 2012-02-22 | 扬州华鼎电器有限公司 | Epoxy resin pouring dry type transformer |
| CN203166744U (en) * | 2013-03-22 | 2013-08-28 | 胜美达电机（香港）有限公司 | Power source supply module |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615774Y2 (en) * | 1976-01-29 | 1981-04-14 | ||
| JPH0644125U (en) * | 1992-11-19 | 1994-06-10 | 株式会社トーキン | Toroidal coil |
| JP2005150330A (en) | 2003-11-14 | 2005-06-09 | Cosel Co Ltd | Transformer |
| JP2008211043A (en) * | 2007-02-27 | 2008-09-11 | Denso Corp | Electronic equipment |
| US20140176291A1 (en) * | 2011-08-01 | 2014-06-26 | Sumitomo Electric Industries, Ltd. | Choke coil |
| JP5529100B2 (en) * | 2011-10-27 | 2014-06-25 | シャープ株式会社 | Switching regulator and power supply device including the same |
-
2014
- 2014-03-14 JP JP2014050984A patent/JP6287391B2/en active Active
- 2014-10-24 DE DE102014221631.1A patent/DE102014221631A1/en active Pending
- 2014-12-15 CN CN201410775755.9A patent/CN104918454B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201663038U (en) * | 2010-02-05 | 2010-12-01 | 海南威特电气集团有限公司 | Novel dry-type transformer coil structure |
| CN102360835A (en) * | 2011-08-03 | 2012-02-22 | 扬州华鼎电器有限公司 | Epoxy resin pouring dry type transformer |
| CN203166744U (en) * | 2013-03-22 | 2013-08-28 | 胜美达电机（香港）有限公司 | Power source supply module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104918454A (en) | 2015-09-16 |
| DE102014221631A1 (en) | 2015-09-17 |
| JP2015176942A (en) | 2015-10-05 |
| JP6287391B2 (en) | 2018-03-07 |
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