JP2015176942A - Electronic device and power source device including the same - Google Patents

Electronic device and power source device including the same Download PDF

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Publication number
JP2015176942A
JP2015176942A JP2014050984A JP2014050984A JP2015176942A JP 2015176942 A JP2015176942 A JP 2015176942A JP 2014050984 A JP2014050984 A JP 2014050984A JP 2014050984 A JP2014050984 A JP 2014050984A JP 2015176942 A JP2015176942 A JP 2015176942A
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coil
substrate
heat
transfer member
electronic device
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JP6287391B2 (en
Inventor
正彦 久保
Masahiko Kubo
正彦 久保
浩二 鷹取
Koji Takatori
浩二 鷹取
克也 丸茂
Katsuya Marumo
克也 丸茂
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Omron Corp
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Omron Corp
Omron Tateisi Electronics Co
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Priority to JP2014050984A priority Critical patent/JP6287391B2/en
Priority to DE102014221631.1A priority patent/DE102014221631A1/en
Priority to CN201410775755.9A priority patent/CN104918454B/en
Publication of JP2015176942A publication Critical patent/JP2015176942A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2895—Windings disposed upon ring cores

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device with improved heat dissipation efficiency, and to provide a power source device including the electronic device.SOLUTION: A power source device according to the invention includes: a housing part 11 having a mold shape; a first substrate 13a disposed in the housing part; and an annular coil 38 disposed on the first substrate 13a and composed of an annular core 38a and a winding wire 38b wound around the core. The coil has a hollow part 38c having a substantially cylindrical shape. A filler member 39 fills the hollow part 38c to bury a periphery of the winding wire 38b without causing gaps.

Description

本発明は、電子機器およびこれを備えた電源装置に関する。   The present invention relates to an electronic device and a power supply device including the same.

従来の電源装置等のような電子機器には通電によって熱を発生させる発熱部品が筐体部の内部に設けられている。こういう発熱部品の中に通電時に巻き線部分が発熱する環状のコイルが含まれる（例えば特許文献１参照）。   In a conventional electronic device such as a power supply device, a heat-generating component that generates heat when energized is provided inside the casing. Such a heat-generating component includes an annular coil that generates heat when energized (see, for example, Patent Document 1).

特開２００５−１５０３３０号公報JP 2005-150330 A

しかしながら、上記従来の構成では、以下に示すような問題点を有している。
すなわち、環状のコイルの中心部に巻線が密集しており、放熱できる経路が少ないため、コイルの中心部にこもっている熱は、なかなか外へ放出できず、中心部の温度はどうしても高くなってしまう。 However, the above conventional configuration has the following problems.
That is, since the windings are densely arranged in the center of the annular coil and there are few paths that can dissipate heat, the heat confined in the center of the coil cannot be easily released to the outside, and the temperature of the center is inevitably high. End up.

本発明は、コイルの中心部の熱を効率よく外部へ放出させることで、放熱効率を向上させることが可能な電子機器およびこれを備えた電源装置を提供することにより上記課題を解決することを目的とする。   This invention solves the said subject by providing the electronic device which can improve the thermal radiation efficiency by discharging | emitting the heat | fever of the center part of a coil outside efficiently, and a power supply device provided with the same. Objective.

第１の発明に係る電子機器は、箱型形状を有する筐体部と、筐体部の内部に配置された基板と、基板上に配置され、環状のコアと前記コアに巻装された巻線からなる環状のコイルと、を備え、コイルは、略円筒状の中空部と有する。中空部には、充填材料が前記巻線の周囲を隙間無く埋めるように充填される。
これにより、コイルの中心部の熱は、充填部材を介してコイルの外へ放熱される。 An electronic apparatus according to a first aspect of the present invention includes a box-shaped housing part, a substrate disposed inside the housing part, a circular core disposed on the substrate, and a winding wound around the core. An annular coil made of wire, and the coil has a substantially cylindrical hollow portion. The hollow portion is filled with a filling material so as to fill the periphery of the winding without a gap.
Thereby, the heat at the center of the coil is radiated to the outside of the coil through the filling member.

なお、ここでいう充填部材とは、絶縁性を有し、充填時に流動性があり、充填後に流動性がなくなる固体状の部材であり、電子機器の通常の使用温度では流動性がないものである。
また、ここでいう伝熱部材とは、絶縁性を有し、空気より熱伝導率が高いものである。
また、充填材料は、コイルの中空部の中心軸の軸線方向における両端において、巻線が突出しない面を形成するように充填されてもよい。 The filling member here is a solid member that has insulating properties, fluidity at the time of filling, and loses fluidity after filling, and does not have fluidity at the normal use temperature of electronic equipment. is there.
In addition, the heat transfer member referred to here has an insulating property and has a higher thermal conductivity than air.
Further, the filling material may be filled so as to form a surface from which the winding does not protrude at both ends in the axial direction of the central axis of the hollow portion of the coil.

第２の発明に係る電子機器は、第１の発明に係る電子機器であって、充填部材は、さらに中空部の中心軸の軸線方向において、一方に第１の端面を有し、第１の端面に伝熱部材が配置され、伝熱部材は、対向する第１の面と第２の面とを有し、伝熱部材の第１の面は、第１の端面に接触することを特徴とする。
これにより、コイルの中心部の熱は、充填部材と伝熱部材を介して効率的にコイルの外へ放熱することができる。 An electronic device according to a second invention is the electronic device according to the first invention, wherein the filling member further has a first end face on one side in the axial direction of the central axis of the hollow portion, A heat transfer member is disposed on the end surface, the heat transfer member has a first surface and a second surface facing each other, and the first surface of the heat transfer member is in contact with the first end surface. And
Thereby, the heat of the central part of the coil can be efficiently radiated to the outside of the coil via the filling member and the heat transfer member.

第３の発明に係る電子機器は、第２の発明に係る電子機器であって、コイルは、軸線方向に沿う一方の側で基板に接触し、他方の側に第1の端面が配置される。伝熱部材の第２
の面は、筐体に接触することを特徴とする。
これにより、コイルの中心部の熱は、伝熱部材を介して効率的に筐体の外へ放熱することができる。 An electronic device according to a third invention is the electronic device according to the second invention, wherein the coil contacts the substrate on one side along the axial direction, and the first end face is arranged on the other side. . 2nd heat transfer member
This surface is in contact with the housing.
Thereby, the heat at the center of the coil can be efficiently radiated to the outside of the housing via the heat transfer member.

第４の発明に係る電子機器は、第２の発明に係る電子機器であって、基板の上にさらに放熱板が配置され、コイルはその外周面の一部が基板と接触するように基板上に配置され、伝熱部材の第２の面は、放熱板に接触していることを特徴とする。
これにより、コイルの中心部の熱は、伝熱部材と放熱板を介して効率的にコイルの外へ放熱することができる。 An electronic device according to a fourth invention is the electronic device according to the second invention, wherein a heat sink is further disposed on the substrate, and the coil is on the substrate such that a part of the outer peripheral surface thereof is in contact with the substrate. The second surface of the heat transfer member is in contact with the heat radiating plate.
Thereby, the heat of the central part of the coil can be efficiently radiated to the outside of the coil via the heat transfer member and the heat radiating plate.

第５の発明に係る電子機器は、第１から第４の発明のいずれか１項に記載の電子機器を備えていることを特徴とする。
これにより、上記電子機器によって得られる効果と同等の効果を得ることが可能な電源装置を提供することができる。 An electronic device according to a fifth aspect of the invention includes the electronic device according to any one of the first to fourth aspects of the invention.
Thereby, the power supply device which can acquire the effect equivalent to the effect acquired by the said electronic device can be provided.

本発明に係る電子機器によれば、コイルの中心部で篭った熱を外へ放熱させることで、放熱効率を向上させることができる。   According to the electronic device of the present invention, the heat dissipation efficiency can be improved by dissipating the heat generated at the center of the coil to the outside.

本発明に係わる電源装置の斜視図。The perspective view of the power supply device concerning this invention. 本発明の実施形態１の電源装置の組立斜視図。1 is an assembled perspective view of a power supply device according to a first embodiment of the present invention. 図２の電源装置の内部に設けられた第１基板に配置されたコイルと筐体部とが繋がる状態の側面図。FIG. 3 is a side view of a state in which a coil disposed on a first substrate provided in the power supply device of FIG. 2 is connected to a housing portion. 図２の電源装置の左側面透視図。FIG. 3 is a left side perspective view of the power supply device of FIG. 2. 図４のＡＡ間の矢示断面図。FIG. 5 is a cross-sectional view taken along line AA in FIG. 4. 第１、第２実施形態の充填部材が充填される前のコイルの俯瞰図。The bird's-eye view of the coil before being filled with the filling member of 1st, 2nd embodiment. 本発明の実施形態２の電源装置の組立斜視図。The assembly perspective view of the power supply device of Embodiment 2 of the present invention. 本発明の実施形態２の電源装置の内部に設けられた第１基板に配置されたコイルと放熱板とが繋がる状態の側面図。The side view of the state which the coil and heat sink which are arrange | positioned at the 1st board | substrate provided in the inside of the power supply device of Embodiment 2 of this invention connect. 本発明の実施形態２の電源装置の左側面透視図。The left side perspective drawing of the power supply device of Embodiment 2 of this invention. 図９のＡＡ間の矢示断面図。FIG. 10 is a cross-sectional view taken along the line AA in FIG. 9.

（実施形態１）
本発明の一実施形態に係る電源装置（電子機器）１０について、図１〜図６を用いて説明する。 (Embodiment 1)
A power supply device (electronic device) 10 according to an embodiment of the present invention will be described with reference to FIGS.

なお、以下の説明において、前後方向とは、図１に矢印で示すように、電源装置１０の前面側を前、その反対側を後とした場合の電源装置１０の後述する組立方向と一致する方向を意味している。また、左右方向とは、電源装置１０の前面蓋部１２を正面に見た状態の左右方向を意味している。さらに、上下方向とは、図１中に矢印で上、下と示される方向であり、電源装置１０の設定姿勢における鉛直方向を意味している。   In the following description, the front-rear direction coincides with the assembly direction of the power supply device 10 described later when the front side of the power supply device 10 is the front and the opposite side is the rear, as indicated by arrows in FIG. Means direction. Moreover, the left-right direction means the left-right direction of the state which looked at the front cover part 12 of the power supply device 10 in the front. Further, the up and down direction is a direction indicated by an arrow in FIG. 1 as an upper side and a lower side, and means a vertical direction in the set posture of the power supply device 10.

＜全体構成＞
本実施形態に係る電源装置１０は、交流電圧を直流電圧に変換して安定的に供給するための装置であって、図１および図２に示すように、筐体部１１と、前面蓋部１２と、電子基板ユニット１３とを備えている。 <Overall configuration>
A power supply device 10 according to the present embodiment is a device for converting an AC voltage into a DC voltage and supplying it stably, and as shown in FIGS. 1 and 2, a casing 11 and a front lid 12 and an electronic board unit 13.

筐体部１１は、前面側に開口部分（前面開口部１１ｅ）を有する箱型形状の部材であって、内部空間に、電子基板ユニット１３を格納する。また、筐体部１１は、前面側に前面
蓋部１２が取り付けられることで、前面開口部１１ｅ側が覆われる。すなわち、組立方向とは、電子基板ユニット１３を筐体部１１に挿入する方向である。 The casing 11 is a box-shaped member having an opening (front opening 11e) on the front side, and stores the electronic board unit 13 in the internal space. Moreover, the front surface opening part 11e side is covered by the housing | casing part 11 by attaching the front cover part 12 to the front side. In other words, the assembly direction is a direction in which the electronic board unit 13 is inserted into the housing part 11.

電子基板ユニット１３は、図２に示すように、２つの基板（第１・第２基板１３ａ，１３ｂ）上に複数の電子部品が搭載されて構成されており、その大部分が筐体部１１の内部に挿入され、前側の一部が前面蓋部１２によって覆われる。なお、第１基板の詳細な構成については、後段にて詳述する。   As shown in FIG. 2, the electronic board unit 13 is configured by mounting a plurality of electronic components on two boards (first and second boards 13 a and 13 b), and most of the electronic board unit 13 is a housing section 11. And a part of the front side is covered by the front lid portion 12. The detailed configuration of the first substrate will be described in detail later.

＜第１基板１３ａ＞
第１基板１３ａは、図２に示すように、電源装置の設置姿勢においての上下方向に沿って筐体部１１内に収納されている。
第１基板１３ａにおける筐体部１１の左側面１１c側の表面には、図２に示すように、
スイッチング素子（発熱部品）３２、ヒートシンク（発熱部品）３３、トランス（発熱部品）３４、アルミ電解コンデンサ３５、ヒートシンク（発熱部品）３６、アルミ電解コンデンサ３７、コイル３８（発熱部品）等の電子部品が実装されている。
第１基板１３ａは、図２に示すように、筐体部１１の側面１１ｄに略平行、かつ筐体部１１の上面１１ａおよび下面１１ｂに対して略垂直な方向に沿って配置されている。 <First substrate 13a>
As shown in FIG. 2, the first substrate 13 a is housed in the housing 11 along the vertical direction in the installation posture of the power supply device.
As shown in FIG. 2, on the surface of the first substrate 13a on the left side surface 11c side of the housing portion 11,
Electronic components such as a switching element (heat generating component) 32, a heat sink (heat generating component) 33, a transformer (heat generating component) 34, an aluminum electrolytic capacitor 35, a heat sink (heat generating component) 36, an aluminum electrolytic capacitor 37, and a coil 38 (heat generating component) Has been implemented.
As shown in FIG. 2, the first substrate 13 a is disposed along a direction substantially parallel to the side surface 11 d of the housing part 11 and substantially perpendicular to the upper surface 11 a and the lower surface 11 b of the housing part 11.

＜コイル＞
コイル３８は、通電時に発熱する発熱部品であって、図２〜図４に示すように、環状のコア３８ａとコアに巻装された巻線３８ｂから構成され、略円筒状の中空部３８ｃと、外周面３８ｆと、を有している。この実施形態においては、コイル３８は、中空部３８ｃの中心軸の軸線方向に沿う一方の側３８ｄで基板に接触し、他方の側３８ｅに第１の端面３９aが配置される。 <Coil>
The coil 38 is a heat-generating component that generates heat when energized. As shown in FIGS. 2 to 4, the coil 38 includes an annular core 38a and a winding 38b wound around the core, and a substantially cylindrical hollow portion 38c. And an outer peripheral surface 38f. In this embodiment, the coil 38 contacts the substrate on one side 38d along the axial direction of the central axis of the hollow portion 38c, and the first end face 39a is disposed on the other side 38e.

中空部３８ｃには、充填部材としての樹脂３９が巻線３８ｂの周囲を隙間無く埋めるように充填され、充填された樹脂３９の第１の端面３９ａは略平面状となっている（図４、図５参照）。
なお、樹脂３９の第１の端面３９ａにさらに伝熱部材４０が配置され、この伝熱部材４０はシリコーンによって形成されており、絶縁性を有し、空気より熱伝導率が高い。 The hollow portion 38c is filled with a resin 39 as a filling member so as to fill the periphery of the winding 38b without a gap, and the first end surface 39a of the filled resin 39 has a substantially planar shape (FIG. 4, FIG. (See FIG. 5).
A heat transfer member 40 is further disposed on the first end surface 39a of the resin 39. The heat transfer member 40 is made of silicone, has an insulating property, and has a higher thermal conductivity than air.

この伝熱部材４０は、互いに対向する第１の面４０ａと第２の面４０ｂと有し、この伝熱部材４０の第１の面４０ａが充填された樹脂３９の第１の端面３９ａに接触するよう配置されており、この伝熱部材４０の第２の面４０ｂにおいて、後述するスライドシート４１と直接接触し、スライドシート４１を介して筐体と接触している（図３、図５を参照）。   The heat transfer member 40 has a first surface 40a and a second surface 40b facing each other, and is in contact with the first end surface 39a of the resin 39 filled with the first surface 40a of the heat transfer member 40. The second surface 40b of the heat transfer member 40 is in direct contact with a slide sheet 41, which will be described later, and is in contact with the housing via the slide sheet 41 (see FIGS. 3 and 5). reference).

このスライドシート４１は、伝熱部材４０が配置された状態の電子基板ユニット１３を筐体部１１内に挿入するために用いられる。
スライドシート４１は、伝熱部材４０の第２の面４０ｂと筐体の左側面１１cの内表面
１１ｇの間に、伝熱部材４０の第２の面４０ｂと左側面１１ｃと直接的に接触して配置されている。 The slide sheet 41 is used for inserting the electronic board unit 13 in a state in which the heat transfer member 40 is arranged into the housing unit 11.
The slide sheet 41 directly contacts the second surface 40b and the left side surface 11c of the heat transfer member 40 between the second surface 40b of the heat transfer member 40 and the inner surface 11g of the left side surface 11c of the housing. Are arranged.

これにより、コイル３８の略円筒状の中空部３８ｃにこもった熱は、中空部３８ｃの中に充填された樹脂３９及び伝熱部材４０を介して筐体部１１の外部へと放出され、放熱効果を向上させることができる。
この結果、放熱効果の高い電源装置１０を提供することができる。 As a result, the heat trapped in the substantially cylindrical hollow portion 38c of the coil 38 is released to the outside of the housing portion 11 through the resin 39 and the heat transfer member 40 filled in the hollow portion 38c, and the heat is dissipated. The effect can be improved.
As a result, the power supply device 10 having a high heat dissipation effect can be provided.

（実施形態２）
以下に、本発明に係る実施形態２の電源装置について説明する。本実施形態２の電源装
置は、実施形態１と基本的な構成は同じであるが、実施形態１と異なり、基板１３ａに実装されたコイル３８は、外周面３８ｆが基板と接触するよう基板に配置され、コイルの横に基板１３ａに略直交するように放熱板４２が配置される（図７、図８、図９を参照）。そのため、本実施形態２の実施形態１に対する相違点を中心に説明する。尚、本実施形態２において実施形態１と同様の構成については同一の符号が付されている。 (Embodiment 2)
Below, the power supply device of Embodiment 2 which concerns on this invention is demonstrated. The basic configuration of the power supply device of the second embodiment is the same as that of the first embodiment, but unlike the first embodiment, the coil 38 mounted on the substrate 13a is placed on the substrate so that the outer peripheral surface 38f contacts the substrate. The heat dissipating plate 42 is disposed beside the coil so as to be substantially orthogonal to the substrate 13a (see FIGS. 7, 8, and 9). Therefore, the difference between the second embodiment and the first embodiment will be mainly described. Note that the same reference numerals in the second embodiment denote the same components as those in the first embodiment.

＜第１基板１３ａ＞
図７は、本実施形態２の電源装置の組立斜視図である。
図７に示すように、第１基板１３ａに実装されたコイル３８は、実施形態１と異なり、外周面３８ｆが基板１３ａと接触するよう基板１３aに実装されている。また、コイル３
８の横に基板１３ａに略直交し、かつコイル３８の中空部３８ｃに充填された樹脂３９の第１の端面３９ａに対向するように放熱板４２が配置される。 <First substrate 13a>
FIG. 7 is an assembled perspective view of the power supply device according to the second embodiment.
As shown in FIG. 7, unlike the first embodiment, the coil 38 mounted on the first substrate 13a is mounted on the substrate 13a so that the outer peripheral surface 38f contacts the substrate 13a. Coil 3
8, a heat radiating plate 42 is disposed so as to be substantially orthogonal to the substrate 13a and to face the first end surface 39a of the resin 39 filled in the hollow portion 38c of the coil 38.

放熱板４２は、コイル等の発熱部品において発生した熱が伝達されて間接的に温度上昇する発熱部品であって、アルミニウムによって形成された板状の部材である。放熱板４２は、本実施形態においては、コイル３８の内側において発生した熱を効率よく放熱するために設けられている。中空部３８ｃには、充填部材３９（図示せず）が巻線３８ｂの周囲を隙間無く埋めるように充填され、かつ樹脂３９の第１の端面３９ａが略平面状になる状態で固まっている。   The heat radiating plate 42 is a heat generating component that indirectly increases in temperature when heat generated in a heat generating component such as a coil is transmitted, and is a plate-like member formed of aluminum. In the present embodiment, the heat radiating plate 42 is provided in order to efficiently radiate the heat generated inside the coil 38. The hollow portion 38c is filled with a filling member 39 (not shown) so as to fill the periphery of the winding 38b without any gaps, and the first end surface 39a of the resin 39 is solidified in a substantially flat state.

この樹脂３９の第１の端面３９ａにさらに実施形態１と同じような伝熱部材４０が配置され、この伝熱部材４０の第１の面４０ａは樹脂３９の第１の端面３９ａに接触し、この伝熱部材４０の第２の面４０ｂは直接に放熱板４２に接触している（図８、図１０参照）。   A heat transfer member 40 similar to that of the first embodiment is further disposed on the first end surface 39a of the resin 39, and the first surface 40a of the heat transfer member 40 contacts the first end surface 39a of the resin 39, The second surface 40b of the heat transfer member 40 is in direct contact with the heat radiating plate 42 (see FIGS. 8 and 10).

これにより、コイル３８の略円筒状の中空部３８ｃの中で篭った熱は、中空部３８ｃの中に充填された樹脂３９及び伝熱部材４０を介してコイル３８の外部へと放出され、放熱効果を向上させることができる。
この結果、放熱効果の高い電源装置１０を提供することができる。 As a result, the heat generated in the substantially cylindrical hollow portion 38c of the coil 38 is released to the outside of the coil 38 through the resin 39 and the heat transfer member 40 filled in the hollow portion 38c. The effect can be improved.
As a result, the power supply device 10 having a high heat dissipation effect can be provided.

（他の実施形態）
以上、本発明の二つの実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、発明の要旨を逸脱しない範囲で種々の変更が可能である。 (Other embodiments)
As mentioned above, although two embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible in the range which does not deviate from the summary of invention.

（Ａ）
上記実施形態では、伝熱部材４０を介して熱を筐体または放熱板に伝える例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
例えば、伝熱部材４０を使わずコイルの中空部３８ｃに充填部材としての樹脂３９を充填するだけでもコイル３８の中心部の熱を効率的に放熱することができる。さらに、充填部材としての樹脂３９を直接筐体に接触させることによって筐体の外部へと放熱させることもできる。 (A)
In the said embodiment, the example which conveys heat to a housing | casing or a heat sink via the heat-transfer member 40 was given and demonstrated. However, the present invention is not limited to this.
For example, the heat of the central portion of the coil 38 can be efficiently radiated only by filling the hollow portion 38c of the coil with the resin 39 as the filling member without using the heat transfer member 40. Furthermore, the resin 39 as the filling member can be radiated to the outside of the casing by directly contacting the casing.

（Ｂ）
上記実施形態１では、電子基板ユニット１３を筐体部１１内に挿入するためにスライドシート４１が用いられる例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
例えば、スライドシートを使わず伝熱部材４０は直接に筐体部１１と接触するような構成であってもよい。 (B)
In the first embodiment, an example in which the slide sheet 41 is used to insert the electronic board unit 13 into the housing unit 11 has been described. However, the present invention is not limited to this.
For example, the heat transfer member 40 may be configured to directly contact the casing unit 11 without using a slide sheet.

（Ｃ）
上記実施形態では、筐体部１１が金属によって成形されている例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
例えば、筐体部を樹脂によって成形した構成であってもよい。あるいは、樹脂製の筐体部の側面に金属製の板を貼り付けた構成であってもよい。 (C)
In the said embodiment, the housing | casing part 11 demonstrated and demonstrated the example currently shape | molded with the metal. However, the present invention is not limited to this.
For example, the structure which shape | molded the housing | casing part with resin may be sufficient. Or the structure which affixed the metal board on the side surface of the resin-made housing | casing parts may be sufficient.

（Ｄ）
上記実施形態では、充填部材として樹脂の例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
例えば、シリコーンボンドを充填材として使ってよい。つまり、絶縁性、耐熱性を有し、中空部に入れる時の形が自由で、入れた後に固まるような材料であればよい。 (D)
In the said embodiment, the example of resin was mentioned and demonstrated as a filling member. However, the present invention is not limited to this.
For example, a silicone bond may be used as a filler. That is, any material that has insulating properties and heat resistance, can be freely shaped when placed in the hollow portion, and can be solidified after being placed.

（Ｅ）
上記実施形態では、本発明を電源装置１０に対して適用した例を挙げて説明した。しかし、本発明はこれに限定されるものではない。
例えば、筐体部の内部に環状のコイルが搭載された他の電子機器に対して適用してもよい。 (E)
In the above embodiment, an example in which the present invention is applied to the power supply device 10 has been described. However, the present invention is not limited to this.
For example, you may apply with respect to the other electronic device by which the cyclic | annular coil was mounted in the inside of a housing | casing part.

本発明の電子機器は、基板に取り付けられているコイルの中心部の熱を外へ放熱させることで、放熱効率を向上させることができるという効果を奏することから、筐体部の内部にコイルを搭載した各種電子機器に対して広く適用可能である。   The electronic device of the present invention has the effect of improving the heat dissipation efficiency by dissipating the heat of the central part of the coil attached to the substrate to the outside. It can be widely applied to various electronic devices installed.

１０ 電源装置（電子機器）
１１ 筐体部
１１ａ 上面
１１ｂ 下面
１１ｃ 左側面
１１ｄ 右側面
１１ｅ 前面開口部
１１ｇ 左側面の内表面
１２ 前面蓋部
１３ 電子基板ユニット
１３ａ 第１基板
１３ｂ 第２基板
３２ スイッチング素子
３３ ヒートシンク
３４ トランス
３５ アルミ電解コンデンサ
３６ ヒートシンク
３７ アルミ電解コンデンサ
３８ コイル
３８ａ コア
３８ｂ 巻線
３８ｃ 中空部
３８ｄ 一方の側
３８ｅ 他方の側
３８ｆ 外周面
３９ 樹脂（充填部材の一例）
３９ａ 第１の端面
４０ 伝熱部材
４０ａ 第１の面
４０ｂ 第２の面
４１ スライドシート
４２ 放熱板 10 Power supply (electronic equipment)
DESCRIPTION OF SYMBOLS 11 Housing | casing part 11a Upper surface 11b Lower surface 11c Left side surface 11d Right side surface 11e Front opening part 11g Left side inner surface 12 Front cover part 13 Electronic board unit 13a First board 13b Second board 32 Switching element 33 Heat sink 34 Transformer 35 Aluminum electrolysis Capacitor 36 Heat sink 37 Aluminum electrolytic capacitor 38 Coil 38a Core 38b Winding 38c Hollow portion 38d One side 38e The other side 38f Outer peripheral surface 39 Resin (an example of a filling member)
39a First end surface 40 Heat transfer member 40a First surface 40b Second surface 41 Slide sheet 42 Heat radiation plate

Claims (5)

箱型形状を有する筐体部と、
前記筐体の内部に配置された基板と、
前記基板上に配置され、環状のコアと前記コアに巻装された巻線からなる環状のコイルと、
を備え、
前記コイルは、略円筒状の中空部を有し、
前記中空部には、充填材料が前記巻線の周囲を隙間無く埋めるように充填されたことを特徴とする電子機器。 A casing having a box shape;
A substrate disposed inside the housing;
An annular coil that is disposed on the substrate and includes an annular core and a winding wound around the core;
With
The coil has a substantially cylindrical hollow portion,
An electronic apparatus, wherein the hollow portion is filled with a filling material so as to fill the periphery of the winding without a gap. 前記充填部材は、さらに前記中空部の中心軸の軸線方向において、一方に第１の端面を有し、
前記第１の端面に伝熱部材が配置され、
前記伝熱部材は、対向する第１の面と第２の面と、
を有し、
前記伝熱部材の第１の面は、前記第１の端面に接触することを特徴とする請求項１に記載の電子機器。 The filling member further has a first end face on one side in the axial direction of the central axis of the hollow portion,
A heat transfer member is disposed on the first end face;
The heat transfer member includes a first surface and a second surface facing each other,
Have
The electronic device according to claim 1, wherein the first surface of the heat transfer member is in contact with the first end surface. 前記コイルは、前記軸線方向に沿う一方の側で前記基板に接触し、他方の側に前記第1
の端面が配置され、
前記伝熱部材の第２の面は、前記筐体に接触することを特徴とする請求項２に記載の電子機器。 The coil contacts the substrate on one side along the axial direction, and the first side on the other side.
The end face of
The electronic device according to claim 2, wherein the second surface of the heat transfer member is in contact with the housing. 前記コイルはさらに外周面を有し、
前記基板上にさらに放熱板が配置され、
前記コイルは、前記外周面の一部が前記基板と接触するように前記基板上に配置され、
前記伝熱部材の第２の面は、前記放熱板に接触することを特徴とする請求項２に記載の電子機器。 The coil further has an outer peripheral surface,
A heat sink is further disposed on the substrate,
The coil is disposed on the substrate such that a part of the outer peripheral surface is in contact with the substrate,
The electronic device according to claim 2, wherein the second surface of the heat transfer member is in contact with the heat radiating plate. 請求項１から４のいずれか１項に記載の電子機器を備えた電源装置。   The power supply device provided with the electronic device of any one of Claim 1 to 4.
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