CN112825608B - Programmable controller module and programmable controller system - Google Patents

Programmable controller module and programmable controller system Download PDF

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Publication number
CN112825608B
CN112825608B CN202011059282.4A CN202011059282A CN112825608B CN 112825608 B CN112825608 B CN 112825608B CN 202011059282 A CN202011059282 A CN 202011059282A CN 112825608 B CN112825608 B CN 112825608B
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China
Prior art keywords
circuit board
metal plate
printed circuit
programmable controller
base
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CN202011059282.4A
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Chinese (zh)
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CN112825608A (en
Inventor
宫下裕史
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/04Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/05Programmable logic controllers, e.g. simulating logic interconnections of signals according to ladder diagrams or function charts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00Climate change mitigation technologies for sector-wide applications
    • Y02P80/10Efficient use of energy, e.g. using compressed air or pressurized fluid as energy carrier

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Programmable Controllers (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The invention provides a programmable controller module and a programmable controller system. In the PLC module, heat dissipation, vibration resistance and impact resistance are ensured without increasing the size. The PLC module (3) is provided with: a printed board (6) on one surface of which a heat generating component (C) is disposed; and a box part (30) for accommodating and supporting the printed substrate. The box body part has: a metal plate (31) which is provided so as to cover one surface of the printed board; and a resin case (32) that is provided so as to cover a portion of the printed circuit board other than the one surface of the printed circuit board. The metal plate is in contact with a heat generating component via a heat sink (S), and a heat sink fin (33) is formed on the surface of the metal plate on the side opposite to the heat generating component. The printed circuit board and the resin case are fixed to the metal plate.

Description

Programmable controller module and programmable controller system
Technical Field
The invention relates to a programmable controller module and a programmable controller system.
Background
A Programmable Logic Controller (PLC) executes a sequence program called a ladder program to control operations of control target devices such as motors and sensors. A system using such a programmable controller (hereinafter referred to as a programmable controller system) is used in, for example, a plant facility and performs input/output control with respect to an external device (see patent document 1).
Such a programmable controller system is generally configured by combining a plurality of units (modules) such as a CPU unit, a power supply unit, and an I/O unit. As an example, a module unit (hereinafter, may be referred to as a PLC module) including a control circuit, an input/output circuit, and the like and a base unit (hereinafter, may be referred to as a base plate) to which the module unit is attached are separately configured and detachably coupled.
The module unit described in patent document 1 includes a circuit board therein, and a heat generating component such as a CPU is disposed on the circuit board. Further, a heat dissipating fin (heat sink) made of aluminum or the like is provided on the rear surface of the base unit to which the plurality of module units are attached. Heat generated by the heat generating component is released from the heat dissipating fins to the outside air via the base unit.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 4-188796
Disclosure of Invention
Problems to be solved by the invention
However, in recent years, the PLC has increased the speed of arithmetic processing and communication speed and has become a complex function, and there is a concern that the amount of heat generated per unit module will increase. On the other hand, in the above-mentioned so-called building block type PLC, in view of mounting, installation compatibility with existing products is required. Therefore, it is difficult to bring the components mounted inside the PLC within the allowable operating temperature.
As a countermeasure for heat dissipation of the PLC module, it is conceivable to mount a heat sink as in patent document 1, for example. In addition, it is also conceivable to enlarge the heat radiation area by using a metal material having high heat radiation property as the housing itself of the PLC module.
However, in a block-type PLC cabinet having a limited space, the size of a heat sink to be mounted is limited. Consider the following scenario: in some cases, the flow of air to the components mounted on the circuit board is obstructed, and the required heat dissipation performance cannot be obtained. In addition, although the method of discharging heat to the metal case can secure a wide surface area and is advantageous for heat dissipation, the metal case is expensive in material cost and processing cost and also heavy in product weight compared to the plastic case. Therefore, it is difficult to achieve both of the product cost and vibration resistance and impact resistance.
The present invention has been made in view of the above, and an object thereof is to provide a programmable controller module and a programmable controller system capable of ensuring heat dissipation, vibration resistance, and impact resistance without increasing the size.
Means for solving the problems
A programmable controller module according to an aspect of the present invention is a programmable controller module including: a printed circuit board having a heat generating component disposed on one surface thereof; and a box portion that houses and supports the printed circuit board, the box portion including: a metal plate provided so as to cover one surface of the printed circuit board; and a resin case provided so as to cover a portion of the printed circuit board other than one surface of the printed circuit board, wherein the metal plate is in contact with the heat generating component via a heat radiating fin, the metal plate has a heat radiating fin formed on a surface thereof opposite to the heat generating component, and the printed circuit board and the resin case are fixed to the metal plate.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, the PLC module can ensure heat dissipation, vibration resistance, and impact resistance without increasing its size.
Drawings
Fig. 1 is a perspective view showing an example of a PLC system according to the present embodiment.
Fig. 2 is an exploded perspective view showing an example of a PLC module according to the present embodiment.
Fig. 3 is a perspective view showing a state in the middle of assembly of the PLC module.
Fig. 4 is a perspective view showing a state in the middle of assembly of the PLC module.
Fig. 5 is a perspective view showing a state in the middle of assembly of the PLC module.
Fig. 6 is a perspective view showing a state in the middle of assembly of the PLC module.
Fig. 7 is a partial sectional view showing a coupling portion between the PLC module and the base plate.
Description of the reference numerals
1. PLC systems (programmable controller systems); 2. a base plate; 3. a PLC module (programmable controller module); 4. a module holder; 5. a locking mechanism; 6. a printed substrate; 7. a front case (resin case); 8. a rear case (resin case); 9. a ground fitting; 20. a metal plate; 21. a base substrate; 22. a connecting portion; 23. a rail portion; 24. a rail portion; 25. a base-side hinge section; 30. a tank portion; 31. a metal plate; 32. a resin case; 33. a heat dissipating fin; 34. a heat dissipating section; 34a, a through hole; 35. a flat plate portion; 35a, a through hole; 36. a bending section; 36a, a threaded hole; 37. a notch portion; 60. a 1 st circuit substrate; 61. a 2 nd circuit board; 62. a spacer; 63. a socket; 64. a connector section; 65. a threaded portion; 70. a front wall portion; 70a, a rectangular hole; 71. an upper wall portion; 71a, a slit; 72. a lower wall portion; 72a, a slit; 73. a sidewall portion; 74. a notch portion; 75. a screw seat portion; 76. a clamping sheet; 77. a clamped part; 80. a rear wall portion; 80a, a rectangular hole; 80b, a slit; 80c, a through hole; 80d, a slit; 81. an upper wall portion; 81a, a slit; 82. a lower wall portion; 82a, a slit; 83. a sidewall portion; 84. a notch portion; 85. a clamping sheet; 86. a clamped part; 87. a module side hinge portion; 87a, a notch portion; 88. a snap-fit protrusion; 88a, a through hole; 90. a planar portion; 91. a slice section; B. a screw; C. electronic components (heat generating components); s, cooling fins.
Detailed Description
A programmable controller system (hereinafter referred to as a PLC system) to which the present invention can be applied will be described below. Fig. 1 is a perspective view showing an example of a PLC system according to the present embodiment. Fig. 2 is an exploded perspective view showing an example of a PLC module according to the present embodiment. Fig. 3 to 6 are perspective views showing a state in the middle of assembly of the PLC module. Fig. 7 is a partial sectional view showing a coupling portion between the PLC module and the base plate. The PLC system (PLC module and base board) described below is merely an example, and is not limited thereto, and can be modified as appropriate.
In the following drawings, the direction in which a plurality of rectangular parallelepiped PLC modules are arranged (the short side direction of the PLC modules) is defined as the X direction, the longitudinal direction of the PLC modules is defined as the Y direction, and the inserting/removing direction of the connector (PLC module) is defined as the Z direction. In some cases, the X direction is referred to as the left-right direction, the Y direction is referred to as the up-down direction, and the Z direction is referred to as the front-back direction. These directions (front-rear, left-right, up-down directions) are terms used for convenience of explanation, and the correspondence relationship corresponding to each of the XYZ directions may be changed depending on the installation posture of the PLC system.
As shown in fig. 1 and 2, a PLC system 1 according to the present embodiment is configured by mounting a plurality of PLC modules 3 on a base plate 2. The PLC module 3 has a substantially rectangular parallelepiped shape as a whole, and has a rectangular shape elongated in the Y direction when viewed from the Z direction. That is, in the present embodiment, the X direction is the short side direction of the PLC module 3, and the Y direction is the longitudinal direction of the PLC module 3. The Z direction indicates the insertion/removal direction (may be referred to as the mounting direction) of the PLC module 3 with respect to the base plate 2.
Specifically, the PLC module 3 is configured to house and support the printed board 6, on one surface (right side surface) of which heat generating components (electronic components C to be discussed later) are arranged, in the rectangular parallelepiped case 30. The casing portion 30 is composed of a metal plate 31 provided so as to cover one surface (right side surface) of the printed circuit board 6, and a resin case 32 provided so as to cover a portion of the printed circuit board 6 other than the one surface of the printed circuit board 6.
The printed board 6 has a rectangular shape when viewed from the X direction. The printed board 6 is formed by arranging a plurality of boards in the thickness direction (X direction). Specifically, the printed circuit board 6 includes two circuit boards (the 1 st circuit board 60 and the 2 nd circuit board 61) arranged in a left-right direction. A plurality of electronic components C including predetermined heat generating components are arranged on the main surface of the 1 st circuit board 60 located on the right side (negative side in the X direction). The 1 st circuit board 60 and the 2 nd circuit board 61 are arranged with a predetermined gap in the thickness direction by spacers 62 provided at four corners.
A socket 63 for connecting various cables (not shown) is disposed on the front surface side (Z-direction positive side) of the printed circuit board 6. A plurality of sockets 63 are arranged in the vertical direction (Y direction) between the 1 st circuit board 60 and the 2 nd circuit board 61. On the rear surface side (Z-direction negative side) of the printed board 6, a connector portion 64 is disposed as a connecting portion electrically connected to the base plate 2. The connector portion 64 is attached to the main surface of the rear edge portion of the 1 st circuit board 60 so that the tip end thereof faces rearward. The connector portion 64 is located above the Y-direction center of the printed circuit board 6. In addition, the 2 nd circuit board 61 is provided with screw portions 65 for fixing the metal plate 31 at positions corresponding to the four corners. The heat generating component is exemplified by a CPU, but the present invention is not limited thereto, and various circuit components can be applied. The arrangement position, the number of arrangements, the shape, and the like of the heat generating components can be appropriately changed.
The metal plate 31 is made of a metal material having good thermal conductivity, such as aluminum or copper. The metal plate 31 has a substantially rectangular shape corresponding to the printed board 6 when viewed from the X direction. Details will be discussed later, but the metal plate 31 is arranged in such a manner that the surface opposing the electronic component C is in contact with a predetermined electronic component C (heat generating component) via the heat sink S.
More specifically, the metal plate 31 has: a rectangular heat dissipation portion 34 having a plurality of heat dissipation fins 33 formed on a surface thereof opposite to the electronic component C; a flat plate portion 35 extending forward (Z-direction positive side) from a front edge portion (Z-direction positive side end portion) of the heat dissipation portion 34; and a bent portion 36 bent leftward (X-direction positive side) from a rear edge portion (Z-direction negative side end portion) of the heat dissipation portion 34.
The heat dissipation fins 33 are formed by, for example, protrusions protruding to the negative side in the X direction and extending in the Y direction. A plurality of the heat dissipating fins 33 are arranged in the Z direction. The plurality of heat dissipation fins 33 form a concave-convex shape on the front surface of the heat dissipation portion 34. The shape of the heat dissipation fins 33 is not limited to this, and can be appropriately changed. For example, the heat radiation fins 33 may extend in the Z direction and be arranged in plural in the X direction.
Through holes 34a are formed at four corners of the heat dissipation portion 34 so as to correspond to the screw portions 65 of the printed circuit board 6. These through holes 34a constitute fixing holes for fixing the printed board 6. In addition, through holes 35a for fixing a resin case 32 (front case 7) to be discussed later are formed in upper and lower end portions of flat plate portion 35.
Due to the notch 37, the bent portion 36 is removed from a portion corresponding to the connector portion 64. Thereby, the bent portion 36 is divided into two upper and lower portions. Each bent portion 36 is formed with a screw hole 36a for fixing a resin case 32 (rear case 8) to be discussed later. The screw hole 36a is formed to penetrate through the bent portion 36 in the thickness direction (Z direction). The bent portion 36 covers at least a part of the side (rear) of the printed circuit board 6 except for the connector portion 64. Details are discussed later, but the bent portion 36 on the lower side is provided with the grounding fitting 9 for grounding.
The resin case 32 is molded from a resin material such as a synthetic resin. The resin case 32 is constituted by a front case 7 (1 st case) and a rear case 8 (2 nd case) which are separable in a direction (front-rear direction) intersecting (orthogonal to) the thickness direction of the printed circuit board 6. The front case 7 and the rear case 8 are joined by, for example, a snap.
The front case 7 is formed to cover a substantially front half of the printed board 6. Specifically, the front case 7 is constituted by: a front wall portion 70; an upper wall portion 71 extending rearward from an upper end of the front wall portion 70; a lower wall portion 72 extending rearward from a lower end of the front wall portion 70; and a pair of side walls 73 extending rearward from both left and right ends of the front wall 70.
A plurality of rectangular holes 70a are formed in the front wall portion 70 so as to correspond to the sockets 63 of the printed circuit board 6. A plurality of slits 71a for discharging air in case 30 are formed in upper wall 71. A plurality of slits 72a for discharging air in case 30 are formed in lower wall 72 in the same manner. The side wall portion 73 on the right side is largely formed with a notch portion 74 so that the heat dissipation portion 34 is exposed to the outside. A screw seat portion 75 for fixing a screw is formed inside the cutout portion 74. Two screw receiving portions 75 are provided vertically so as to correspond to the through holes 35a of the metal plate 31. Further, an engaging piece 76 and an engaged portion 77 for engaging with the rear case 8 are formed at the rear edge portion of each of the upper wall portion 71, the lower wall portion 72, and the side wall portion 73 positioned on the left side.
The rear case 8 is formed to cover a substantially rear half of the printed circuit board 6. Specifically, the rear case 8 is constituted by: a rear wall portion 80; an upper wall portion 81 extending forward from an upper end of the rear wall portion 80; a lower wall portion 82 extending forward from a lower end of the rear wall portion 80; and a pair of side walls 83 extending forward from both left and right ends of the rear wall 80.
A rectangular hole 80a that is long in the vertical direction is formed in the rear wall portion 80 so as to correspond to the connector portion 64 of the printed circuit board 6. Further, a plurality of slits 80b for discharging air in case 30 are formed below rectangular hole 80 a. Similarly, a plurality of slits 81a and 82a are formed in the upper wall portion 81 and the lower wall portion 82, respectively. The side wall portion 83 on the right side is largely formed with a notch portion 84 so that the heat dissipation portion 34 is exposed to the outside. As will be described in detail later, the cutout 74 on the front case 7 side and the cutout 84 on the rear case 8 side form openings that expose the heat dissipation fins 33 to the outside. Further, an engaging piece 85 and an engaged portion 86 for engaging with the front case 7 are formed at the front edge portions of the upper wall portion 81, the lower wall portion 82, and the side wall portion 83 located on the left side.
Two through holes 80c are formed in the rear wall portion 80 so as to correspond to the screw holes 36a of the metal plate 31 (see fig. 6). Further, a module-side hinge portion 87 supported by the base-side hinge portion 25 of the base plate 2, which will be described later, is formed on the lower end side of the rear surface of the rear wall portion 80. The module-side hinge portion 87 is provided between the rectangular hole 80a and the slit 80 b. Further, an engaging projection 88 fixed to the lock mechanism 5 of the base plate 2 is formed on the upper end of the rear surface of the rear wall portion 80. The engaging projection 88 constitutes an engaged portion with respect to the lock mechanism 5. The engaging protrusion 88 is provided on the opposite side of the module-side hinge 87 with the connector portion 64 therebetween when viewed in the X direction.
The module-side hinge portion 87 is formed of a plate-like body projecting rearward from the lower end of the rear surface of the rear wall portion 80. An arc-shaped notch 87a is formed at the lower end of the module-side hinge 87 (see fig. 7). The notch 87a constitutes an engaged portion with respect to the base-side hinge portion 25 to be discussed later. The engaging projection 88 projects rearward from the upper end of the rear surface of the rear wall 80 and has a substantially triangular shape in a side view in the X direction. The engaging projection 88 is formed so that its tip end becomes thinner toward the rear. Further, the engagement projection 88 is formed with a through hole 88a penetrating in the vertical direction (Y direction). The through hole 88a constitutes an engaged portion with respect to the lock mechanism 5 to be discussed later.
Next, the assembly sequence of the PLC modules will be described with reference to fig. 3 to 6. As shown in fig. 3, first, the metal plate 31 is mounted on the printed circuit board 6. In this case, the heat sink S is disposed on the front surface of a predetermined electronic component C such as a CPU as a heat generating component. The heat sink S is formed in a larger, for example, rectangular shape than the electronic component C in consideration of the heat diffusion range of the electronic component C.
The metal plate 31 is disposed so that the heat dissipation portion 34 covers the right side surface of the printed board 6. The back surface (the flat surface on the opposite side from the heat radiation fins 33) of the metal plate 31 is in contact with the front surface of a predetermined electronic component C via the heat radiation fins S. The metal plate 31 is disposed so that the through hole 34a corresponds to the screw portion 65 of the printed circuit board 6. As shown in fig. 4, the printed circuit board 6 and the metal plate 31 are fixed integrally by inserting the screw B through each through hole 34a and fastening the tip of the screw B to the screw portion 65.
Next, as shown in fig. 5, the rear case 8 is attached from the rear of the printed board 6, and the front case 7 is attached from the front of the printed board 6. The printed circuit board 6 and the front case 7, and the printed circuit board 6 and the rear case 8 are fixed by a not-shown clip. The front case 7 and the rear case 8 are integrally fixed by engaging the engaging pieces 76 and 85 with the corresponding engaged portions 77 and 86. On the right side surface of 1 resin case 32 in which front case 7 and rear case 8 are integrated, notches 74 and 84 cooperate to form an opening portion that exposes heat dissipation fin 33 to the outside.
As shown in fig. 6, screws B are inserted through the through holes 35a of the flat plate portion 35 exposed from the opening portion, and distal ends of the screws B are fastened to screw receiving portions 75 (see fig. 5) of the front case 7, whereby the metal plate 31 and the front case 7 are integrally fixed. Further, on the rear surface side of the rear case 8, screws B are inserted through the through holes 80c of the rear wall portion 80, and distal ends of the screws B are fastened to the screw holes 36a of the metal plate 31 (bent portion 36), whereby the metal plate 31 and the rear case 8 are fixed integrally.
The PLC module 3 thus configured is mounted on the base plate 2. Here, a schematic structure of the base plate 2 will be described. As shown in fig. 1, the base plate 2 is configured by disposing a base substrate 21 on the front surface of a metal plate 20 disposed on the XY plane. The metal plate 20 has a rectangular shape elongated in the X direction when viewed in the Z direction, and is formed of a metal material such as aluminum. The base substrate 21 is disposed at the center of the metal plate 20 in the Y direction, and has a rectangular shape elongated in the X direction. A plurality of connection portions 22 corresponding to the connector portion 64 of the mounted PLC module 3 are provided on the front surface of the base substrate 21. The connector portion 64 of the PLC module 3 is connected to the connection portion 22. The plurality of connecting portions 22 are arranged in the X direction. The number of the connection portions 22 can be changed as appropriate according to the number of the PLC modules 3 to be mounted.
A pair of rail portions 23 and 24 are formed on the metal plate 20 on the lower side (one end side) and the upper side (the other end side) of the base substrate 21. The pair of rail portions 23 and 24 are formed to extend in the X direction. The pair of rail portions 23 and 24 are arranged to be vertically spaced from the base substrate 21. The module holder 4 is disposed on a rail portion 23 (1 st rail portion) on the lower side (one end side of the base substrate 21), and the lock mechanism 5 is disposed on a rail portion 24 (2 nd rail portion) on the upper side (the other end side of the base substrate 21). One module holder 4 and one lock mechanism 5 are arranged for each 1 PLC module 3. That is, in the present embodiment, a plurality of module holders 4 and lock mechanisms 5 are arranged so as to correspond to a plurality of PLC modules 3. The number of PLC modules 3, module holders 4, and lock mechanisms 5 can be changed as appropriate.
A base-side hinge portion 25 engageable with the module-side hinge portion 87 is formed at the lower end of the rail portion 23. The base-side hinge portion 25 protrudes upward from the lower end of the rail portion 23, and extends in the X direction along the rail portion 23. The base-side hinge portion 25 rotatably supports the module-side hinge portion 87. Details are discussed later, but the base-side hinge portion 25 constitutes a frame ground (japanese: フレームグランド) that is grounded.
The module holder 4 is a block body that engages with the rail portion 23, and is formed of, for example, synthetic resin. The lock mechanism 5 is used to fix the upper end side (the other end side) of the PLC module 3. The module holder 4 is disposed in plurality along the rail portion 23.
The lock mechanism 5 is engaged with the rail portion 24, and is disposed at a predetermined position in the X direction of the rail portion 24 by sliding the lock mechanism 5 in the X direction along the rail portion 24. The module holder 4 and the lock mechanism 5 are arranged in line with the connector portion 64 on the base substrate 21 in the Y direction.
The PLC module 3 engages the module-side hinge portion 87 with the base-side hinge portion 25, and rotates and moves the entire body about the base-side hinge portion 25 as a fulcrum. Then, the engagement projection 88 (through hole 88a) on the upper end side is engaged with the lock mechanism 5, so that the connector portion 64 is connected to the connection portion 22, and the PLC module 3 is coupled to the base plate 2.
However, in recent PLCs, cooling measures against heat generation are being sought due to the improvement in the processing capacity of CPUs. On the other hand, the size of the building block PLC is limited in order to ensure installation compatibility with existing products.
For example, it is considered to secure a heat radiation area by using a metal material as the entire housing of the PLC, but this is not preferable from the viewpoint of increase in cost and weight. In addition, in the case of a metal material, although high rigidity is obtained, it is easily affected by vibration.
Therefore, the present inventors conceived the present invention with the object of obtaining vibration resistance and impact resistance without increasing the size while ensuring heat dissipation. Specifically, in the present embodiment, the case 30 for housing the printed circuit board 6 is composed of a metal plate 31 and a resin case 32. The metal plate 31 is provided so as to cover one surface (right side surface) of the printed circuit board 6. The resin case 32 is provided so as to cover a portion of the printed circuit board 6 other than one surface of the printed circuit board 6. A heat generating component (electronic component C) is disposed on one surface of the printed circuit board 6, and the heat generating component is brought into contact with the back surface of the metal plate 31 via the heat sink S. Further, a plurality of heat radiating fins 33 are formed on the front surface of the metal plate 31. The printed circuit board 6 and the resin case 32 are fixed to the metal plate 31 by screws B.
According to this configuration, by providing the case portion 30 with a mixed structure of metal and resin and fixing the printed circuit board 6 and the resin case 32 to the highly rigid metal plate 31, it is possible to secure heat radiation and obtain vibration resistance and impact resistance. More specifically, the heat generated in the electronic component C can be released from the metal plate 31 to the outside via the heat sink S. Further, the metal plate 31 having relatively high rigidity can provide impact resistance, and the resin case 32 can provide vibration resistance. The electronic component C is covered with the metal plate 31, and can shield noise from external devices such as a transducer, a servo mechanism, and various communicators. Therefore, even if a noise generation source is present in the vicinity of the PLC module 3, the metal plate 31 can be less susceptible to noise. That is, the metal plate 31 of the present embodiment functions as a heat sink, a case, and a shield plate for shielding noise.
In this way, by providing the metal plate 31 with a plurality of functions and preferentially covering the portion necessary for heat dissipation with the metal plate 31, it is possible to achieve both heat dissipation, impact resistance, and the like while minimizing the weight of the metal plate 31 and without increasing the size of the entire PLC. In addition, the influence on the cost can be suppressed.
In the present embodiment, the resin case 32 is constituted by the front case 7 (1 st case) and the rear case 8 (2 nd case) which are separable in the direction intersecting the thickness direction of the printed circuit board 6. The front case 7 and the rear case 8 have openings (notches 74 and 84) that expose the heat dissipation fins 33 to the outside.
According to this configuration, the front case 7 and the rear case 8 can be coupled to each other by sandwiching the printed circuit board 6 in a predetermined direction (Z direction), and the assembling property can be improved. In addition, the heat dissipating fins 33 are exposed to the outside from the resin case 32, and thus heat from the heat generating component can be easily discharged to the outside.
In the present embodiment, the printed board 6 includes the 1 st circuit board 60 and the 2 nd circuit board 61 arranged with a predetermined gap in the thickness direction. The heat generating components are disposed on the 1 st circuit board 60. The metal plate 31 is provided on the 1 st circuit board 60 side.
According to this configuration, the heat generating components (electronic components C) as the heat source are collectively arranged on one side of the printed circuit board 6, and the metal plate 31 as the heat sink is arranged on the heat source side, so that the heat can be efficiently discharged to the outside.
In the present embodiment, the printed circuit board 6 has a connector portion 64 on the side (rear). The metal plate 31 has a bent portion 36 that is bent so as to cover at least a part of the lateral side (rear side) of the printed circuit board 6.
According to this configuration, by forming the metal plate 31 in the L-letter shape, the rigidity of the metal plate 31 itself can be increased, and the rigidity of the entire PLC module 3 can be increased. Further, the area of the heat radiation surface can be increased by the bent portion 36, and the heat radiation performance can be further improved.
In the present embodiment, base plate 2 to which PLC module 3 is attached has base-side hinge portion 25 to which a part (module-side hinge portion 87) of case 30 is engaged. The base-side hinge portion 25 constitutes a frame ground to be grounded. The PLC module 3 further includes a ground fitting 9 for electrically connecting the metal plate 31 and the base-side hinge portion 25.
More specifically, as shown in fig. 7, the ground fitting 9 is formed by bending a metal plate made of stainless steel or the like. The ground fitting 9 has: a flat surface portion 90 that abuts against the rear surface of the bent portion 36; and a cut-out portion 91 connected to the planar portion 90 and abutting against the tip end of the base-side hinge portion 25. The flat portion 90 has a substantially rectangular shape when viewed from the rear, and is disposed between the bent portion 36 and the rear wall portion 80. The segment 91 has a letter L shape in side view, which is bent rearward from the upper end of the flat surface portion 90 and then slightly bent upward.
In the rear wall portion 80, a flat slit 80d is formed at a portion corresponding to the module-side hinge portion 87 (notch portion 87 a). The slit 80d is formed at a position at least partially overlapping the module-side hinge portion 87 when viewed from the rear. The above-described piece 91 is located at a portion of the rear surface exposed from the slit 80 d.
As shown in fig. 7, the ground metal fitting 9 is disposed such that the front surface of the flat surface portion 90 abuts against the rear surface of the bent portion 36, and the rear surface of the cut-out portion 91 abuts against the tip end of the base-side hinge portion 25. As described above, since the base-side hinge portion 25 constitutes a frame ground to be grounded, the potential of the metal plate 31 is grounded via the ground fitting. As a result, the printed circuit board 6 can be made less susceptible to external noise. Grounding the metal plate 31 to the outside ground in this way is based on the idea of trying to make the route through which the external noise passes as far as possible from the printed circuit board 6.
In addition, the ground metal fitting 9 can be used as a heat sink. For example, the heat of the metal plate 31 is transmitted to the base-side hinge portion 25 via the ground fitting 9. This heat is also transmitted to metal plate 20 constituting base-side hinge portion 25. In this way, the heat generated in the PLC module 3 is transferred to the base plate 2 side by the ground metal fittings 9, and the PLC system 1 can release the heat to the outside as a whole.
As described above, according to the present embodiment, heat dissipation, vibration resistance, and impact resistance can be ensured without increasing the size of the PLC module 3.
In the above embodiment, the case where the module holder 4 is disposed on the lower end side of the base substrate 21 and the lock mechanism 5 is disposed on the upper end side of the base substrate 21 has been described, but the present invention is not limited to this configuration. Their arrangement may also be reversed upside down. The arrangement relationship between the engaging projection 88 of the PLC module 3 and the module-side hinge 87 may be reversed in the vertical direction.
In the above embodiment, the case where the module holder 4 is attached to the rail portion 23 and the lock mechanism 5 is attached to the rail portion 24 has been described, but the present invention is not limited to this configuration. The module holder 4 may be formed integrally with the rail portion 23, and the lock mechanism 5 may be formed integrally with the rail portion 24.
In the above embodiment, the resin case 32 is configured to be separable in the front-rear direction, but the present invention is not limited to this. The resin case 32 may be left-right separable.
In the above embodiment, the metal plate 31 is formed to have a size covering the entire surface of the printed circuit board 6, but the invention is not limited to this configuration. The size of the metal plate 31 can be changed as appropriate depending on the heat generating component to be radiated.
The present embodiment and the modification are explained, but as another embodiment, the above embodiment and the modification may be combined wholly or partially.
The present embodiment is not limited to the above-described embodiments and modifications, and various changes, substitutions, and alterations can be made without departing from the spirit and scope of the technical idea. The present invention can be implemented by a method that can be realized by other methods using other techniques derived from or developed from the above-described techniques. Therefore, the claims cover all embodiments that can be included in the scope of the technical idea.
The features of the above embodiments are summarized below.
The programmable controller module according to the above embodiment is characterized by including: a printed circuit board having a heat generating component disposed on one surface thereof; and a box portion that houses and supports the printed circuit board, the box portion including: a metal plate provided so as to cover one surface of the printed circuit board; and a resin case provided so as to cover a portion of the printed circuit board other than one surface of the printed circuit board, wherein the metal plate is in contact with the heat generating component via a heat radiating fin, the metal plate has a heat radiating fin formed on a surface thereof opposite to the heat generating component, and the printed circuit board and the resin case are fixed to the metal plate.
In the programmable controller module according to the above-described embodiment, the resin case includes a 1 st case and a 2 nd case that are separable from each other in a direction intersecting a thickness direction of the printed circuit board, and the 1 st case and the 2 nd case have openings that expose the heat dissipation fins to the outside.
In the programmable controller module according to the above-described embodiment, the printed board includes a 1 st circuit board and a 2 nd circuit board disposed with a predetermined gap in a thickness direction, the heat generating component is disposed on the 1 st circuit board, and the metal plate is provided on the 1 st circuit board.
In the programmable controller module according to the above-described embodiment, the printed circuit board has a connector portion on a side, and the metal plate has a bent portion bent so as to cover at least a part of the side of the printed circuit board.
In addition, the programmable controller system according to the above-described embodiment is characterized by including: the programmable controller module described above; and a base plate having a connecting portion to which the connector portion is connected, the base plate having a base-side hinge portion to which a part of the box portion is engaged, the base-side hinge portion constituting a frame ground to be grounded, the programmable controller module including a ground metal fitting to electrically connect the metal plate and the base-side hinge portion.
Industrial applicability
As described above, the present invention has an effect of ensuring heat dissipation, vibration resistance, and impact resistance without increasing the size, and is particularly useful for a PLC module and a PLC system.

Claims (1)

1. A programmable controller system, characterized in that,
the programmable controller system comprises a programmable controller module and a base plate,
the programmable controller module is provided with:
a printed circuit board having a heat generating component disposed on one surface thereof; and
a box part for receiving and supporting the printed circuit board,
the box body portion has:
a metal plate provided so as to cover one surface of the printed circuit board; and
a resin case provided so as to cover a portion of the printed circuit board other than one surface of the printed circuit board,
the metal plate is in contact with the heat generating component via a heat radiating fin, the heat radiating fin is formed on the surface of the metal plate opposite to the heat generating component,
the printed substrate and the resin case are fixed to the metal plate,
the printed circuit board has a connector portion on a side,
the metal plate has a bent portion bent so as to cover at least a part of a side of the printed circuit board,
the base plate has a connecting portion to which the connector portion is connected and a base-side hinge portion to which a part of the box portion is engaged,
the base-side hinge portion constitutes a frame ground to be grounded,
the programmable controller module is provided with a grounding fitting for electrically connecting the metal plate and the base-side hinge portion,
the grounding fitting has: a flat surface portion abutting against a rear surface of the bent portion; and a slice part which is connected with the plane part and is abutted with the top end of the hinge part on the base side,
the slice part is bent backward from the upper end of the plane part and then slightly bent upward to form a side-view letter L shape.
CN202011059282.4A 2019-11-20 2020-09-30 Programmable controller module and programmable controller system Active CN112825608B (en)

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