CN104914316A - Monolithic planar electrode conductivity sensor - Google Patents
Monolithic planar electrode conductivity sensor Download PDFInfo
- Publication number
- CN104914316A CN104914316A CN201510246593.4A CN201510246593A CN104914316A CN 104914316 A CN104914316 A CN 104914316A CN 201510246593 A CN201510246593 A CN 201510246593A CN 104914316 A CN104914316 A CN 104914316A
- Authority
- CN
- China
- Prior art keywords
- electrode
- substrate
- interdigital
- rectangle
- conductivity sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a monolithic planar electrode conductivity sensor which is composed of a substrate, a rectangular spiral coil electrode, a rectangular interdigital electrode, a via, a back lead, insulating regions, a feeding interface, a back feeding interface, a surface metal layer and an underlying metal layer. The rectangular spiral coil electrode and the rectangular interdigital electrode are tightly attached to the substrate. The rectangular interdigital electrode is located at the center of the substrate. The rectangular spiral coil electrode is led out from one port of the rectangular interdigital electrode, spirally extends counterclockwise from the inside out, is connected with the feeding interface, and wraps the rectangular interdigital electrode. The via is located in a port at the lower right corner of the rectangular interdigital electrode. The via in the back of the substrate is connected with the back feeding interface through the back lead. The back lead is parallel to a feeder which is connected between a rectangular spiral coil the feeding interface. The insulating regions are located in lead regions on both sides of the lower end of the substrate. The monolithic planar electrode conductivity sensor provided by the invention has the advantages of miniaturization, simple process, low cost, good reliability and the like, and is suitable for industrial production.
Description
Technical field
The invention belongs to water quality inspection technique field.
Background technology
Conductivity is the base attribute of material.Conductivity sensor technology is a very important engineering and technological research field, for detecting the conductivity of liquid or gas.According to the difference of Cleaning Principle, conductivity sensor is mainly divided into electrode type and induction type conductivity sensor two class.Electrode type conductivity sensor adopts resistance method of temperature measurement to realize measuring to conductivity, in order to improve the impact of measuring accuracy and reduction galvanic polarization, general employing multi-electrode system, and there is very high requirement to electrode material, the measuring method of this single parameter simultaneously, makes the reliability of detection and robustness be subject to certain restrictions.Induction type conductivity sensor adopts electromagnetic field principle, transmitting coil and receiving coil two parts are comprised in sensor probe inside, transmitting coil applies sinusoidal excitation and can produce alternating magnetic field, receiving coil can produce induction current, and the linear relationship according to induction current and dielectric conductance rate determines conductivity value.In order to ensure the accuracy measured, drive coil and inductive coil need strictly on an axis, want close-packed arrays and ensure good shielding between coil, and the medium simultaneously in electrode pod apertures should keep flowing to ensure the real-time measured.Therefore, inductive type conductivity sensor also belongs to single parameter measuring method, and reliability and robustness are restricted, and there is assembly difficulty large, cost is higher simultaneously, safeguards the shortcoming of inconvenience.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, propose a kind of one chip plane electrode conductivity sensor novel based on ac impedance technology.
One chip plane electrode conductivity sensor of the present invention, is made up of substrate (1), square spiral coil electrode (2), rectangle interdigital electrode (3), via hole (4), the back side lead-in wire (5), insulation layer (6), feeding interface (7), back side feeding interface (8), coating metal layer (9), bottom metal layer (10).
Square spiral coil electrode (2) and rectangle interdigital electrode (3) adhere well on substrate (1), rectangle interdigital electrode (3) is at substrate (1) center, square spiral coil electrode (2) is drawn outwardly from rectangle interdigital electrode (3) Single port, counter clockwise direction spiral extension from inside to outside, be connected to feeding interface (7), and in rectangle interdigital electrode (3) is wrapped in.Via hole (4) is positioned at the lower right corner port of rectangle interdigital electrode (3), be connected with back side feeding interface (8) by back side lead-in wire (5) at substrate (1) back side via hole (4), back side lead-in wire (5) is parallel with the feeder line that rectangular coil shape coil (2) is connected to feeding interface (7).Insulation layer (6) is positioned at the double-edged lead district in substrate (1) lower end.
Described substrate (1), adopts stupalith or thermoset resin to do substrate, is coated in substrate reinforcing material, on such as paper, cloth or glass cloth, dries rear compressing.
Described rectangle interdigital electrode (3), the width of electrode is 1mm, two adjacent interdigital be spaced apart 2mm, interdigital length is 18mm, and interdigital logarithm is 6 right.
Described square spiral coil electrode (2) spiral winding width is 1mm, and helix pitch is 2mm, and all numbers of spiral are 3 weeks.Square spiral coil electrode (2) is the 30mm of spiral extension terminal prolongation from inside to outside counterclockwise, terminates with feeding interface (7).
Cover copper in described via hole (4), in order to ensure the insulativity gone between, being about 0.1-0.3mm insulating gel at substrate pros and cons lead areas coating thickness, being insulation layer (6).
Described square spiral coil electrode (2) and rectangle interdigital electrode (3) are double-layer metal structure, coating metal layer (9) is the tin that thickness is about 30 μm, and bottom metal layer (10) thickness is about the copper of 30 μm.
The preparation method of one chip plane electrode conductivity sensor of the present invention, comprises the following steps:
Step 1: use electronic circuit design automation software, according to one chip plane electrode conductivity sensor electrode structure parameter, draw PCB file, and make egative film.
Step 2: select with thermoset resin or stupalith as substrate, be coated in substrate reinforcing material, on such as paper, cloth or glass cloth, dry rear upper and lower and place Copper Foil, immerse in laminating machine, make material cured at high temperature under high pressure, form the copper clad laminate that thickness is roughly 1.6mm-2.0mm, and cut into suitable dimension (3cm*7cm).
Step 3: behind through hole location, holes drilled through.New layers of copper is covered with on hole wall and plate face.Remove the pollutant on copper face by polish-brush, increase copper face roughness.
Step 4: the substrate copper face processed is sticked dry film against corrosion through hot pressing mode, covers egative film.Through light radiation by the image transfer on original negative film on photosensitive base plate, there is photopolymerization reaction in white light transmission part, black part is then light tight, does not react, and the dry film partial flushing for generation chemical reaction fallen with alkali lye effect.
Step 5: utilize etching liquid (CuCl
2) will the copper eating away that expose after development, form inner line figure.Utilize highly basic (NaOH) to be peeled off by the resist layer of protection copper face, expose line pattern.
Step 6: at the tin of copper surface spraying one deck about 30 μm after inspection cleaning.
Step 7: cover green oil to non-electrode part, remainder exposes bilayer conductive metal.
Step 8: be about 0.1-0.3mm insulating gel at substrate pros and cons lead areas coating thickness.
The present invention has miniaturization, and technique is simple, low cost, the advantages such as good reliability, is applicable to suitability for industrialized production.
Accompanying drawing explanation
Fig. 1 is vertical view of the present invention.
Fig. 2 is front view of the present invention.
Fig. 3 is left view of the present invention.
Wherein, 1 is substrate; 2 is square spiral coil electrode; 3 is rectangle interdigital electrode; 4 is via hole; 5 is back side lead-in wire; 6 is insulation layer; 7 is feeding interface; 8 is back side feeding interface; 9 is coating metal layer; 10 is bottom metal layer; 11 is via hole inner conducting layer copper.
Fig. 4 is test circuit schematic diagram of the present invention.Wherein V
gt voltage excitation signals that () exports for sinusoidal signal generator; R
gfor sinusoidal signal generator internal resistance; R
sfor the resistance of series connection, resistance 1k Ω; V
1t () is feeding interface 8 place response signal; V
2t () is feeding interface 7 place response signal.
Embodiment
Below in conjunction with drawings and Examples, the present invention will be further described.
A kind of one chip plane electrode conductivity sensor (as shown in Figure 1), its feature is that printing copper-clad plate by two-sided rigidity makes, comprise baseplate material, substrate prints double-deck rectangle interdigital structure and square spiral coil structures in series metal electrode, electrode under-layer is the copper that thickness is about 30 μm, and electrode top layer sprays the tin of one deck about 30 μm.In reality test, lead-in wire of the feeding interface 7,8 of plane electrode conductivity sensor being burn-on, accesses (accompanying drawing 4) feeding interface 7,8 respectively, and it is 1v that sinusoidal signal generator exports peak-to-peak value, and frequency is the sine voltage pumping signal of 10Khz.Dropped into by sensor (rectangle below the coating adhesive that only insulate is interdigital is divided into water with square spiral coil electrode section) in water body to be measured, from feeding interface 7,8 places can record output response signal V respectively
1(t) and V
2(t).Circular is:
Wherein, σ is conductivity values, and unit is s/m, k is scale-up factor, R
sfor the resistance of series connection, resistance 1k Ω.
Its preparation method is described as follows:
The first step: use electronic circuit design automation software, according to one chip plane electrode conductivity sensor electrode structure parameter, draw PCB file, and make egative film.
Second step: select with thermoset resin or stupalith as substrate, be coated in substrate reinforcing material, on such as paper, cloth or glass cloth, dry rear upper and lower and place Copper Foil, immerse in laminating machine, make material cured at high temperature under high pressure, form the copper clad laminate that thickness is roughly 1.6mm-2.0mm, and cut into suitable dimension (3cm*7cm).
3rd step: behind through hole location, holes drilled through.New layers of copper is covered with on hole wall and plate face.Remove the pollutant on copper face by polish-brush, increase copper face roughness.
4th step: the substrate copper face processed is sticked dry film against corrosion through hot pressing mode, covers egative film.Through light radiation by the image transfer on original negative film on photosensitive base plate, there is photopolymerization reaction in white light transmission part, black part is then light tight, does not react, and the dry film partial flushing for generation chemical reaction fallen with alkali lye effect.
5th step: utilize etching liquid (CuCl
2) will the copper eating away that expose after development, form inner line figure.Utilize highly basic (NaOH) to be peeled off by the resist layer of protection copper face, expose line pattern.
6th step: at the tin of copper surface spraying one deck about 30 μm after inspection cleaning.
7th step: cover green oil to non-welding portion, remainder exposes bilayer conductive metal.
8th step: be about 0.1-0.3mm insulating gel at substrate pros and cons lead areas coating thickness.
Claims (6)
1. an one chip plane electrode conductivity sensor, is characterized in that being made up of substrate (1), square spiral coil electrode (2), rectangle interdigital electrode (3), via hole (4), the back side lead-in wire (5), insulation layer (6), feeding interface (7), back side feeding interface (8), coating metal layer (9), bottom metal layer (10); Square spiral coil electrode (2) and rectangle interdigital electrode (3) adhere well on substrate (1), rectangle interdigital electrode (3) is at substrate (1) center, square spiral coil electrode (2) is drawn outwardly from rectangle interdigital electrode (3) Single port, counter clockwise direction spiral extension from inside to outside, be connected to feeding interface (7), and in rectangle interdigital electrode (3) is wrapped in; Via hole (4) is positioned at the lower right corner port of rectangle interdigital electrode (3), be connected with back side feeding interface (8) by back side lead-in wire (5) at substrate (1) back side via hole (4), back side lead-in wire (5) is parallel with the feeder line that rectangular coil shape coil (2) is connected to feeding interface (7); Insulation layer (6) is positioned at the double-edged lead district in substrate (1) lower end.
2. one chip plane electrode conductivity sensor according to claim 1, it is characterized in that described substrate (1) adopts stupalith or thermoset resin to do substrate, be coated in substrate reinforcing material, on such as paper, cloth or glass cloth, dry rear compressing.
3. one chip plane electrode conductivity sensor according to claim 1, is characterized in that the width of the electrode of described rectangle interdigital electrode (3) is 1mm, two adjacent interdigital be spaced apart 2mm, interdigital length is 18mm, and interdigital logarithm is 6 right.
4. one chip plane electrode conductivity sensor according to claim 1, it is characterized in that described square spiral coil electrode (2) spiral winding width is 1mm, helix pitch is 2mm, and all numbers of spiral are 3 weeks; Square spiral coil electrode (2) is the 30mm of spiral extension terminal prolongation from inside to outside counterclockwise, terminates with feeding interface (7).
5. one chip plane electrode conductivity sensor according to claim 1, it is characterized in that covering copper in described via hole (4), is 0.1-0.3mm insulating gel at the double-edged insulation layer of substrate (6) coating thickness.
6. one chip plane electrode conductivity sensor according to claim 1, it is characterized in that described square spiral coil electrode (2) and rectangle interdigital electrode (3) are double-layer metal structure, coating metal layer (9) to be thickness the be tin of 30 μm, bottom metal layer (10) thickness is the copper of 30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510246593.4A CN104914316A (en) | 2015-05-15 | 2015-05-15 | Monolithic planar electrode conductivity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510246593.4A CN104914316A (en) | 2015-05-15 | 2015-05-15 | Monolithic planar electrode conductivity sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104914316A true CN104914316A (en) | 2015-09-16 |
Family
ID=54083556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510246593.4A Pending CN104914316A (en) | 2015-05-15 | 2015-05-15 | Monolithic planar electrode conductivity sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104914316A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106017515A (en) * | 2016-05-28 | 2016-10-12 | 惠州市力道电子材料有限公司 | Double-face interdigital electrode, and processing method and application thereof |
| CN106501615A (en) * | 2016-11-16 | 2017-03-15 | 河海大学 | A kind of MEMS electrode formula low conductivity sensor and its measuring method |
| US20200271603A1 (en) * | 2019-02-25 | 2020-08-27 | The University Of Toledo | Sensor for detection and measurement of ice, snow and liquid water content (lwc) and methods of using same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0464243A1 (en) * | 1990-07-04 | 1992-01-08 | Siemens Aktiengesellschaft | Oxygen sensor with semiconducting gallium oxide |
| CN101383020A (en) * | 2008-10-14 | 2009-03-11 | 厦门大学 | Environment sensitive type passive electronic label |
| CN103076500A (en) * | 2012-12-31 | 2013-05-01 | 中国电子科技集团公司第四十九研究所 | Conductivity sensor in cofiring structure and manufacturing method thereof |
| CN103946698A (en) * | 2011-11-22 | 2014-07-23 | 西门子医疗保健诊断公司 | Interdigitated array and method of manufacture |
-
2015
- 2015-05-15 CN CN201510246593.4A patent/CN104914316A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0464243A1 (en) * | 1990-07-04 | 1992-01-08 | Siemens Aktiengesellschaft | Oxygen sensor with semiconducting gallium oxide |
| CN101383020A (en) * | 2008-10-14 | 2009-03-11 | 厦门大学 | Environment sensitive type passive electronic label |
| CN103946698A (en) * | 2011-11-22 | 2014-07-23 | 西门子医疗保健诊断公司 | Interdigitated array and method of manufacture |
| CN103076500A (en) * | 2012-12-31 | 2013-05-01 | 中国电子科技集团公司第四十九研究所 | Conductivity sensor in cofiring structure and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| XIAOLEI WANG 等: "Mechanism and experiment of planar electrode sensors in water pollutant measurement", 《IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106017515A (en) * | 2016-05-28 | 2016-10-12 | 惠州市力道电子材料有限公司 | Double-face interdigital electrode, and processing method and application thereof |
| CN106501615A (en) * | 2016-11-16 | 2017-03-15 | 河海大学 | A kind of MEMS electrode formula low conductivity sensor and its measuring method |
| CN106501615B (en) * | 2016-11-16 | 2019-03-01 | 河海大学 | A kind of MEMS electrode formula low conductivity sensor and its measurement method |
| US20200271603A1 (en) * | 2019-02-25 | 2020-08-27 | The University Of Toledo | Sensor for detection and measurement of ice, snow and liquid water content (lwc) and methods of using same |
| US11619603B2 (en) * | 2019-02-25 | 2023-04-04 | The University Of Toledo | Sensor system for detecting of a presence and a phase of a medium on a surface and methods of using the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104914316A (en) | Monolithic planar electrode conductivity sensor | |
| CN105043310B (en) | The straight incoming electromagnetic sonac of shear wave | |
| JP4469251B2 (en) | Printed circuit board having a weak magnetic field sensor and method of manufacturing the same | |
| CN110519910A (en) | The PCB detection method and PCB of heat eliminating medium are bonded by conducting medium | |
| CN103906344A (en) | Heat-conductive two-side circuit board | |
| KR101884905B1 (en) | Leak liquid sensing device and manufacturing method the same | |
| KR101969575B1 (en) | Leak liquid sensing device | |
| WO2017206769A1 (en) | Printed circuit board | |
| US20130033256A1 (en) | Sensor and sensor element | |
| US20090278528A1 (en) | Sensor for determining the electrical conductivity of liquid media, and method for the production thereof | |
| GB2403016A (en) | Electromagnetic flow meter | |
| WO2019143176A1 (en) | Conductive liquid leak detection device | |
| CN109859919A (en) | A method of reducing potting formula resistance error | |
| CN204694225U (en) | The straight incoming electromagnetic sonac of shear wave | |
| CN209691605U (en) | A kind of microminiature large capacity through condenser | |
| CN201409254Y (en) | Thick copper circuit board | |
| JP6479370B2 (en) | Flexible current sensor and manufacturing method thereof | |
| CN203774059U (en) | Planar coil module and planar transformer using same | |
| CN203896578U (en) | Heat conduction-type double-sided circuit board | |
| CN108732408A (en) | A kind of strain-type current sensor based on magnetized film | |
| CN102938499A (en) | Ultrahigh frequency radio frequency identification (RFID) etching antenna and manufacturing technique thereof | |
| CN210052625U (en) | Thin film inductor | |
| CN203136347U (en) | Metal-core printed circuit board jointed plate sealing edge | |
| CN209085807U (en) | Become capacitive pressure transducer | |
| CN220399477U (en) | Current sensor shell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150916 |
|
| WD01 | Invention patent application deemed withdrawn after publication |