CN104900560B - The crystal grain that high-aspect-ratio crystal grain can be picked picks device and method - Google Patents
The crystal grain that high-aspect-ratio crystal grain can be picked picks device and method Download PDFInfo
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- CN104900560B CN104900560B CN201410080895.4A CN201410080895A CN104900560B CN 104900560 B CN104900560 B CN 104900560B CN 201410080895 A CN201410080895 A CN 201410080895A CN 104900560 B CN104900560 B CN 104900560B
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Abstract
The invention discloses it is a kind of pick high-aspect-ratio crystal grain pick crystal grain method and crystal grain picks device, the crystal grain method of picking is used for that a plurality of crystal grain are picked and are placed on a silicon chip frame by a chip bearing disc, it is described pick crystal grain method and include mobile one pick arm, the one first anchor point overlapping alignment for making this pick a central point of two vacuum sucking crystal grains heads and the chip bearing disc on arm, and calculate one first coordinate value；Mobile this picks arm, the one second anchor point overlapping alignment for making this pick the central point of two vacuum sucking crystal grains heads and the chip bearing disc on arm, and calculates an anglec of rotation；And arrangement position or spacing according to the coordinate value, the anglec of rotation, the size of the chip bearing disc and a plurality of crystal grain, this is picked into two vacuum sucking crystal grains heads on arm and is moved on a crystal grain, to draw the crystal grain.
Description
Technical field
The present invention relates to a kind of crystal grain to pick device and method, more particularly to a kind of crystal grain for picking high-aspect-ratio crystal grain
Pick device and method.
Background technology
In general, then integrated circuit (Integrated Circuit, IC) manufactures through circuit design, synthesis, layout
Afterwards, all chip dies regular as matrix can be distributed on a piece of silicon chip (wafer).Although some basic chips
Functional test can be completed via silicon on-chip testing (On Wafer Test), but be tested on electrical characteristic and chip performance, still
So tester table must be transported to test via crystal grain carrier (Chip Tray) after crystal grain cuts (Die Saw), and
Movement of the crystal grain between crystal grain carrier and tester table, board (Pick＆Place) must be just picked via crystal grain and has been come
Into.Crystal grain carrier is moved to by silicon chip frame (Wafer Frame) similarly, for by crystal grain, or moved to by crystal grain carrier
The process of silicon chip frame, and board is picked to complete by crystal grain.
Common chip such as SOC (System on Chip) or ASIC (Application Specific Integrated
Circuit) etc., for the consideration of the optimization and most short coiling of area, its crystal grain (die) designs more tries one's best close to positive square,
That is the length-width ratio of crystal grain is about 1.Fig. 1 is refer to, Fig. 1 is that a crystal grain of prior art picks a sucking crystal grains of device
First 108 pick the schematic diagram of a crystal grain 102.In order to which icon is succinct, the icon that device is picked on crystal grain only draws sucking crystal grains
The position of head.Shown in Fig. 1, because the length-width ratio of crystal grain 102 is about 1, if crystal grain 102 is in X-direction, Y-direction or crystal grain and suction
The relative rotation angle (Theta angles) between head is taken to have a little skew, sucking crystal grains first 108 still may be used in sucking crystal grains 102
There is the overlapping of large area with crystal grain 102, therefore in crystal grain picks flow, the precision requirement of board is picked also just for crystal grain
Will not be too high.Arranged as shown in Fig. 2 crystal grain is big on chip bearing disc 200 in regular shape, as long as sucking crystal grains first 208 will
First, lower left corner crystal grain is set to the first anchor point 217, after being aligned, via user input 202 spacing of crystal grain,
The central point 207 of sucking crystal grains first 208 can be on crystal grain 202, to all crystal grain in a manner of by grain or to specify crystalline substance
The mode of grain is picked.
However, the crystal grain of high-aspect-ratio will run into contraposition, absorption, the difficulty placed in flow is picked, then just lead
The problem of having caused Reliability.For example, driving IC (Driver IC) crystal grain length-width ratio is likely larger than 10, and crystal grain picking machine
There was only a sucking crystal grains head on platform, be then possible to produce suction deficiency and drop, or positioning is inaccurate and center of gravity is inclined
Move, or even because crystal grain carrier and crystal grain pick the skew of angle between board, the corresponding contraposition picked to crystal grain in flow, inhale
Take, put and the step such as put and just have larger deviation, and cause crystal grain not picked effectively.
Therefore, the crystal grain of high-aspect-ratio crystal grain can be picked by, which how developing, picks method and crystal grain picks device, actually ability
One of the important topic in domain.
The content of the invention
An object of the present invention is that providing a kind of crystal grain picks device and method, and it is using with multiple vacuum crystalline substance
The crystal grain of grain absorption heads picks board, and solves traditional crystal grain and pick board can not accurately or effectively to pick high-aspect-ratio crystal grain
Problem.
The invention discloses a kind of method for picking crystal grain, for that will be positioned on a chip bearing disc (Chip Tray)
A plurality of crystal grain pick device (Pick and Place) using a crystal grain and picked by the chip bearing disc and be placed into a silicon
On piece frame (Wafer Frame).This method includes the size for setting the chip bearing disc, and sets the row of a plurality of crystal grain
Column position or spacing；The mobile crystal grain picks the one of device and picks arm, this is picked two vacuum sucking crystal grains head (vacuum on arm
One first anchor point overlapping alignment of a central point chuck) and the chip bearing disc, and calculate first anchor point relative to
The crystal grain picks one first coordinate value of device；The mobile crystal grain pick device this pick arm, this is picked two vacuum on arm
The central point of sucking crystal grains head and one second anchor point overlapping alignment of the chip bearing disc, and calculate the chip bearing disc phase
One first anglec of rotation of device is picked for the crystal grain；And according to first coordinate value, first anglec of rotation, the chip
The arrangement position or spacing of the size of carrier and a plurality of crystal grain, this is picked into two vacuum sucking crystal grains heads on arm and is moved to
In a plurality of crystal grain on a crystal grain, to draw the crystal grain.
The invention also discloses a kind of crystal grain for picking high-aspect-ratio crystal grain to pick device, for that will be positioned over a chip
A plurality of crystal grain on carrier (Chip Tray) are picked by the chip bearing disc and are placed into a silicon chip frame (Wafer
Frame on).The crystal grain picks device and includes a setting module, for setting the size of a chip bearing disc, and for setting
The arrangement position or spacing of a plurality of crystal grain；One contraposition module, the one of device is picked for moving the crystal grain and picks arm, makes this
Pick one first anchor point of a central point of two vacuum sucking crystal grains heads (vacuum chuck) and the chip bearing disc on arm
Overlapping alignment, one first coordinate value of device is picked to calculate first anchor point relative to the crystal grain, and be somebody's turn to do for mobile
Crystal grain pick device this pick arm, this is picked the central point of two vacuum sucking crystal grains heads and the chip bearing disc on arm
One second anchor point overlapping alignment, one first anglec of rotation of device is picked to calculate the chip bearing disc relative to the crystal grain；
And a sucking crystal grains module, for according to first coordinate value, first anglec of rotation, the size of the chip bearing disc and should
The arrangement position or spacing of a plurality of crystal grain, this is picked into two vacuum sucking crystal grains heads on arm and is moved to one in a plurality of crystal grain
On crystal grain, to draw the crystal grain.
Brief description of the drawings
Fig. 1 is that a crystal grain of prior art picks a sucking crystal grains choicest of device and picks the schematic diagram of a crystal grain.
Fig. 2 is that Fig. 1 sucking crystal grains head operates in the upward view of a chip bearing disc.
Fig. 3 is the schematic diagram that the crystal grain of the embodiment of the present invention one picks flow.
Fig. 4 is the partial schematic diagram for the vacuum sucking crystal grains head that the crystal grain of the embodiment of the present invention one picks device with crystal grain.
Fig. 5 is the upward view that vacuum sucking crystal grains head of the embodiment of the present invention operates in a chip bearing disc.
Fig. 6 is the upward view that vacuum sucking crystal grains of embodiment of the present invention head draws a crystal grain.
Fig. 7 illustrates when chip bearing disc and crystal grain pick schematic diagram when device has angular error.
Fig. 8 is the schematic diagram aligned using two anchor points to Fig. 7 chip bearing disc.
Fig. 9 is the schematic diagram that the crystal grain of the embodiment of the present invention one picks device.
Wherein, description of reference numerals is as follows：
102nd, 202,402,502,602,702 crystal grain
602 ' dotted lines
108th, 208 sucking crystal grains head
408th, 418,508,518,608,618 vacuum sucking crystal grains head
200th, 500,700 chip bearing disc
217th, 517,717 first anchor point
737 second anchor points
207th, 507,607,707 central point
θ c error angles
The θ t anglecs of rotation
30 flows
300~310 steps
90 crystal grain pick device
900 carrier carriers
902 setting modules
904 image acquisition modules
906 contraposition modules
908 sucking crystal grains modules
Embodiment
Fig. 3 is refer to, Fig. 3 is the schematic diagram that the crystal grain of the embodiment of the present invention one picks flow 30.Crystal grain picks flow 30
For a plurality of crystal grain being positioned on a chip bearing disc (Chip Tray) are picked into device (Pick and using a crystal grain
Place) picked and be placed on a silicon chip frame (Wafer Frame) by the chip bearing disc.Crystal grain is picked flow 30 and can applied
In the crystal grain with high-aspect-ratio, for driving chip (Driver IC) of the length-width ratio more than 10, also can effectively pick.It is brilliant
Grain picks flow 30 and includes following steps：
Step 300：Start.
Step 302：The size of the chip bearing disc is set, and sets the arrangement position or spacing of a plurality of crystal grain.
Step 304：The mobile crystal grain picks the one of device and picks arm, this is picked two vacuum sucking crystal grains head on arm
One central point of (vacuum chuck) and one first anchor point overlapping alignment of the chip bearing disc, and calculate first positioning
Point picks one first coordinate value of device relative to the crystal grain.
Step 306：The mobile crystal grain pick device this pick arm, make that this picks two vacuum sucking crystal grains heads on arm should
One second anchor point overlapping alignment of central point and the chip bearing disc, and calculate the chip bearing disc and picked relative to the crystal grain
One first anglec of rotation of device.
Step 308：According to first coordinate value, first anglec of rotation, the size of the chip bearing disc and this is a plurality of
The arrangement position or spacing of crystal grain, this is picked into two vacuum sucking crystal grains heads on arm and is moved to a crystal grain in a plurality of crystal grain
On, to draw the crystal grain.
Step 310：Terminate.
Flow 30 is picked according to crystal grain, crystal grain is picked into device first and makees initializing set.Initializing set can be included and set
Determine the size of chip bearing disc, and set the arrangement position and spacing of a plurality of crystal grain.Then, set according to user, it is mobile
What the crystal grain picked device one picks arm, the central point for picking two vacuum sucking crystal grains heads on arm is moved to chip bearing disc
One it is set in advance first positioning point coordinates, then corrected using image capture unit until the central point and chip bearing
The one first completely overlapped alignment of anchor point of disk, and calculate one first coordinate that first anchor point picks device relative to crystal grain
Value.In addition, according to user's setting and the correction of image capture unit, what mobile crystal grain picked device picks arm, makes to pick
One second anchor point overlapping alignment of the central point of two vacuum sucking crystal grains heads and chip bearing disc on arm, and computing chip carries
Disk picks one first anglec of rotation of device relative to crystal grain.Then, according to first coordinate value, first anglec of rotation, should
The arrangement position or spacing of the size of chip bearing disc and a plurality of crystal grain, learn the physical location of crystal grain, according to this choose this
Pick two vacuum sucking crystal grains heads on arm to be moved on the crystal grain to be picked, and suitably adjust the angle of two vacuum sucking crystal grains heads
Degree, to draw the crystal grain.The operation of flow 30 is picked by crystal grain, crystal grain can be learnt in X-direction, Y-direction or crystal grain and absorption
The actual value of relative rotation angle (Theta angles) between head, with correction pick on arm the position of two vacuum sucking crystal grains heads and
Angle, therefore the crystal grain of high-aspect-ratio can be picked.
Specifically, Fig. 4 is refer to, Fig. 4 is the vacuum crystal grain that the crystal grain 402 of the embodiment of the present invention one picks device with crystal grain
The partial schematic diagram of absorption heads 408,418.For illustrative simplicity, Fig. 4 only draws the position that crystal grain picks the sucking crystal grains head of device
Put.Crystal grain picks picking for device can be equipped with two or more vacuum sucking crystal grains first 408,418, for drawing height on arm
The both sides of length-width ratio crystal grain 402.Crystal grain picks device and also includes an image capture unit, for amplifying and capturing the shadow of crystal grain
Picture, the position of arm is picked with fine setting.Fig. 5 is refer to, Fig. 5 is that vacuum sucking crystal grains of the embodiment of the present invention first 508,518 operate in
The upward view of one chip bearing disc 500.Crystal grain picks device first according to crystal grain set in advance and locating point position, mobile to be somebody's turn to do
What crystal grain picked device one picks arm, and the central point 507 for making to pick two vacuum sucking crystal grains first 508,518 on arm moves to the core
One coordinate of first anchor point 517 set in advance of piece carrier, is then corrected until the center using image capture unit
Point with the first anchor point 517 is completely overlapped aligns, and calculate one first seat that the first anchor point 517 picks device relative to crystal grain
Scale value is (for example, in ideal conditions, the first coordinate value is (a/2, b/2), and wherein a, b is respectively the width of crystal grain 502, length
Degree).If the angle that chip bearing disc picks device with crystal grain is zero, that is to say, that in the absence of any error, following crystal grain
Pick device only need to pick or pick one by one what is specified according to the size of chip bearing disc and the arrangement position of crystal grain and spacing
Crystal grain.
However, due to the limitation of precision, the angle Theta that chip bearing disc picks device with crystal grain may be not zero.
As shown in fig. 6, the part of dotted line 602 ' represents original preferable die locations, and when solid line 602 then represents to have angular error
Crystal grain physical location, between the two in the presence of an error angle theta c.If it will be appreciated from fig. 6 that using existing single vacsorb head
To pick the way of the crystal grain of high-aspect-ratio, it is possible to center of gravity unbalanced problem when generation is picked less than or picked.So
And if using first 608,618 sucking crystal grains 602 of two vacuum sucking crystal grains, although two vacuum sucking crystal grains first 608,618
Central point 607 has deviated from crystal grain, but has larger chance smoothly to pick.It follows that the crystal grain pair of high-aspect-ratio
In there is higher requirement on the precision of positioning.
Further, Fig. 7 illustrates when chip bearing disc 700 and crystal grain pick device and the error of angle theta be present, to picking
Influence.In Fig. 7,717 represent the position of the first anchor point, and be shaped as the 707 of round dot represent crystal grain pick device through pair
The central point for the sucking crystal grains position that position is drawn after calculating.Wherein, the central point 707 of sucking crystal grains position is that basis is determined by first
Calculated first coordinate value in site 717, the set size of chip bearing disc 700 and the arrangement position of crystal grain or spacing
Calculating is learnt.As shown in Figure 7, site error can significantly be amplified in the region away from the first anchor point 717, be in turn resulted in
Pick the probability of failure.In order to which angle error is minimized, one second anchor point 737 can be added on chip bearing disc, such as
Shown in Fig. 8.After being positioned to the first anchor point 717 and recording its coordinate, similarly, mobile crystal grain picks the one of device
Arm is picked, this is picked the central point of two vacuum sucking crystal grains heads and the second anchor point 737 of chip bearing disc 700 on arm overlapping
Alignment, and the coordinate value that the second anchor point 737 picks device relative to crystal grain is calculated, with chip bearing disc 700 relative to crystal grain
Pick an anglec of rotation θ t of device.Consequently, it is possible to can be to be aligned to each crystal grain, and a contraposition result is produced to carry
The accurate die coordinates of device are picked for crystal grain, accurately to draw each crystal grain.
It is noted that first anchor point and second of the present invention using two corners relative on chip bearing disc respectively
The crystal grain of high-aspect-ratio is aligned anchor point and adjustment, and each crystal grain is accurately drawn with sharp two vacuum sucking crystal grains heads.
Those skilled in the art, which works as, can do different modifications according to this, and not limited to this.For example, what crystal grain picked device picks arm
A upper settable rotating member, the online and crystal grain of two vacuum sucking crystal grains heads is picked the angle of device body can be adjusted,
With the anglec of rotation of sharp correcting chip carrier.Inhaled in addition, picking two vacuum sucking crystal grains heads on arm and can share same vacuum
Take side Pu, but not limited to this.In second of embodiment, two can be respectively connecting to solely by picking two vacuum sucking crystal grains heads on arm
Vertical vacsorb side Pu.
Crystal grain, which picks device image acquisition module (for example, an amplifying device add a camera) can be utilized to capture, include the
One first image of one anchor point, camera can use more powerful resolution ratio clearly to capture a high-aspect-ratio crystal grain
Whole images.First image can transmit to a processing module, by the image of image identification technical Analysis crystal grain, to calculate first
Anchor point picks the first coordinate value of device relative to crystal grain.Similarly, the image acquisition module is also used to capture comprising the
One second image of two anchor points, and the second image is sent to processing module, pass through the shadow of image identification technical Analysis crystal grain
Picture, first anglec of rotation of device is picked relative to crystal grain with computing chip carrier.
Crystal grain picks device and the crystal grain of absorption can be positioned in silicon chip frame, subsequently makees crystal grain using tester table to facilitate
Electrical characteristic and chip performance test.Similarly, first fixed relative two corners there can be one the 3rd positioning respectively on silicon chip frame
Point and one the 4th anchor point, for correct silicon chip frame and pick one second coordinate value on arm between two vacuum sucking crystal grains heads with
The error of one second anglec of rotation.It is similar that flow and the crystal grain that crystal grain is placed pick flow, main difference is that crystal grain is picked
Flow is to behind correct position and angle, and by sucking crystal grains, and the flow that crystal grain is placed is to correct position
And after angle, crystal grain is put down.Therefore, detailed process repeats no more.
Fig. 9 is refer to, Fig. 9 is the schematic diagram that the crystal grain of the embodiment of the present invention one picks device 90.Crystal grain picks device 90 can
For picking such as the crystal grain in Fig. 8 chips carrier 700.Crystal grain picks device 90 and includes a carrier carrier (Tray
Loader) 900, one setting module 902, an image acquisition module 904, a contraposition module 906 and a sucking crystal grains module
908.Carrier carrier 900 is used for carrying chip bearing disc 700.Setting module 902 is used for setting the chi of chip bearing disc 700
It is very little, and the arrangement position or spacing of a plurality of crystal grain 702 of setting.Image acquisition module 904 is used for capturing comprising the first positioning
First image of point 717, contraposition module 906 are used for moving crystal grain and picking the one of device 90 picking arm, make to pick two vacuum on arm
The central point of sucking crystal grains head and the overlapping alignment of the first anchor point 717 of chip bearing disc 700, to calculate the first anchor point 717
The first coordinate value of device 90 is picked relative to crystal grain.Image acquisition module 904 is also used for capturing comprising the second anchor point 737
Second image, and arm is picked by what contraposition module 906 moved that crystal grain picks device 90, make to pick two vacuum sucking crystal grains on arm
The central point of head and the overlapping alignment of the second anchor point 737 of chip bearing disc 700, with computing chip carrier 700 relative to crystalline substance
Grain picks first anglec of rotation of device 90.Sucking crystal grains module 908 is used for according to the first coordinate value, first anglec of rotation, core
The arrangement position or spacing of the size of piece carrier 700 and a plurality of crystal grain 702, two vacuum sucking crystal grains heads on arm will be picked and moved
Move to a plurality of crystal grain 702 wherein on a crystal grain, to draw the crystal grain.In addition, pick the other parts of device 90 on crystal grain
Design details, pick board with existing crystal grain and have no difference, therefore be not described in detail herein.
In addition, above-described embodiment is explained with being picked by chip bearing disc and being placed on silicon chip frame crystal grain, wherein
Chip bearing disc has the groove of a plurality of matrix type arrangements, for carrying a plurality of crystal grain after cutting, but is not limited to
This.Above-mentioned flow and embodiment are equally applicable for that crystal grain is picked and is placed on another silicon chip frame by a silicon chip frame, or by crystalline substance
Grain is picked and is placed on a chip bearing disc by a silicon chip frame.
In summary, crystal grain of the invention picks flow and crystal grain picks the crystal grain that device can be used to pick high-aspect-ratio,
The both sides that length-width ratio is substantially larger than the strip crystal grain equal to 2 are drawn using multiple vacuum sucking crystal grains heads on arm are picked.And
And chosen during contraposition with the first anchor point on chip bearing disc and the second anchor point correcting chip carrier with crystal grain
The coordinate position and anglec of rotation error in device between sucking crystal grains head module are picked, accurately and effectively to pick or place height
Length-width ratio crystal grain.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (16)
- A kind of 1. method for picking crystal grain, for a plurality of crystal grain being positioned on a chip bearing disc are picked using a crystal grain Device is picked and is placed on a silicon chip frame by the chip bearing disc, and this method includes：The size of the chip bearing disc is set, and sets the arrangement position or spacing of a plurality of crystal grain；The mobile crystal grain picks the one of device and picks arm, this is picked a central point of two vacuum sucking crystal grains heads and the core on arm One first anchor point overlapping alignment of piece carrier, and calculate first anchor point picks device relative to the crystal grain one first Coordinate value；The mobile crystal grain pick device this pick arm, this is picked the central point of two vacuum sucking crystal grains heads and the core on arm One second anchor point overlapping alignment of piece carrier, and calculate the chip bearing disc picks device relative to the crystal grain one first The anglec of rotation；AndAccording to first coordinate value, the arrangement position of first anglec of rotation, the size of the chip bearing disc and a plurality of crystal grain Put or spacing, this is picked into two vacuum sucking crystal grains heads on arm and is moved in a plurality of crystal grain on a crystal grain, to draw the crystalline substance Grain.
- 2. the method as described in claim 1, it is characterised in that first anchor point and second anchor point are located at the core respectively Relative two corners on piece carrier.
- 3. the method as described in claim 1, it is characterised in that the chip bearing disc has the ditch of a plurality of matrix type arrangements Groove, for carrying a plurality of crystal grain after cutting.
- 4. the method as described in claim 1, it is characterised in that the crystal grain picks device and captures bag using an image acquisition module One first image containing first anchor point, first coordinate of device is picked to calculate first anchor point relative to the crystal grain Value, and one second image for including second anchor point is captured using the image acquisition module, to calculate the chip bearing disc phase First anglec of rotation of device is picked for the crystal grain.
- 5. the method as described in claim 1, it is characterised in that the silicon chip frame is used for placing a plurality of crystal grain for a test Board is tested, and two corners relative on the silicon chip frame have one the 3rd anchor point and one the 4th anchor point respectively, for correcting this Silicon chip frame and this pick the error of one second coordinate value on arm between two vacuum sucking crystal grains heads and one second anglec of rotation.
- 6. the method as described in claim 1, it is characterised in that this pick two vacuum sucking crystal grains heads on arm share it is same true Suction takes side Pu.
- 7. the method as described in claim 1, it is characterised in that this is picked two vacuum sucking crystal grains heads on arm and is respectively connecting to two Individual independent vacsorb side Pu.
- 8. the method as described in claim 1, it is characterised in that this is picked two vacuum sucking crystal grains heads on arm and is used for drawing length and width Than the both sides of the strip crystal grain more than or equal to 2.
- 9. a kind of crystal grain for picking high-aspect-ratio crystal grain picks device, a plurality of on a chip bearing disc for that will be positioned over Crystal grain is picked and is placed on a silicon chip frame by the chip bearing disc, and the crystal grain is picked device and included：One setting module, for setting the size of the chip bearing disc, and for setting the arrangement position of a plurality of crystal grain Or spacing；One contraposition module, the one of device is picked for moving the crystal grain and picks arm, this is picked two vacuum sucking crystal grains head on arm A central point and the chip bearing disc one first anchor point overlapping alignment, to calculate first anchor point relative to the crystal grain Pick one first coordinate value of device, and pick this of device for moving the crystal grain and pick arm, this is picked on arm two true The central point of negative crystal grain absorption heads and one second anchor point overlapping alignment of the chip bearing disc, to calculate the chip bearing disc One first anglec of rotation of device is picked relative to the crystal grain；AndOne sucking crystal grains module, for according to first coordinate value, first anglec of rotation, the size of the chip bearing disc and should The arrangement position or spacing of a plurality of crystal grain, this is picked into two vacuum sucking crystal grains heads on arm and is moved to one in a plurality of crystal grain On crystal grain, to draw the crystal grain.
- 10. crystal grain as claimed in claim 9 picks device, it is characterised in that first anchor point and second anchor point difference The relative two corners on the chip bearing disc.
- 11. crystal grain as claimed in claim 9 picks device, it is characterised in that the chip bearing disc has a plurality of matrix types The groove of arrangement, for carrying a plurality of crystal grain after cutting.
- 12. crystal grain as claimed in claim 9 picks device, also comprising an image acquisition module, for capture include this first One first image of anchor point, first coordinate value of device is picked to calculate first anchor point relative to the crystal grain, and For capturing one second image for including second anchor point, device is picked relative to the crystal grain to calculate the chip bearing disc First anglec of rotation.
- 13. crystal grain as claimed in claim 9 picks device, it is characterised in that the silicon chip frame be used for place a plurality of crystal grain with Tested for a tester table, and two corners relative on the silicon chip frame have one the 3rd anchor point and one the 4th anchor point respectively, use To correct the silicon chip frame and this picks one second coordinate value and one second anglec of rotation on arm between two vacuum sucking crystal grains heads Error.
- 14. crystal grain as claimed in claim 9 picks device, it is characterised in that this is picked two vacuum sucking crystal grains heads on arm and shared Same vacsorb helps Pu.
- 15. crystal grain as claimed in claim 9 picks device, it is characterised in that this is picked two vacuum sucking crystal grains heads on arm and distinguished It is connected to two independent vacsorb side Pus.
- 16. crystal grain as claimed in claim 9 picks device, it is characterised in that this is picked two vacuum sucking crystal grains heads on arm and is used for Draw the both sides of strip crystal grain of the length-width ratio more than or equal to 2.
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| CN201410080895.4A CN104900560B (en) | 2014-03-06 | 2014-03-06 | The crystal grain that high-aspect-ratio crystal grain can be picked picks device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0653781A1 (en) * | 1993-11-15 | 1995-05-17 | Hughes Aircraft Company | Method for co-registering semiconductor wafers undergoing work in one or more blind process modules |
| TW201103098A (en) * | 2009-07-02 | 2011-01-16 | Novatek Microelectronics Corp | Fabricating method of wafer |
| TWI389244B (en) * | 2008-10-17 | 2013-03-11 | Wecon Automation Co Ltd | Model Picker Method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002094296A (en) * | 2000-09-13 | 2002-03-29 | Fuji Mach Mfg Co Ltd | Suction nozzle, method for detecting holding position of electric component, method for detecting curvature of suction tube, method for specifying rotational position of suction nozzle, and electric component handling unit |
| KR101233222B1 (en) * | 2011-04-04 | 2013-02-14 | 세메스 주식회사 | Semiconductor device test apparatus and method for aligning semiconductor device using multi-picker |
-
2014
- 2014-03-06 CN CN201410080895.4A patent/CN104900560B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0653781A1 (en) * | 1993-11-15 | 1995-05-17 | Hughes Aircraft Company | Method for co-registering semiconductor wafers undergoing work in one or more blind process modules |
| TWI389244B (en) * | 2008-10-17 | 2013-03-11 | Wecon Automation Co Ltd | Model Picker Method |
| TW201103098A (en) * | 2009-07-02 | 2011-01-16 | Novatek Microelectronics Corp | Fabricating method of wafer |
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