CN104893309B - 一种硅胶支架、led器件及led器件的制造方法 - Google Patents
一种硅胶支架、led器件及led器件的制造方法 Download PDFInfo
- Publication number
- CN104893309B CN104893309B CN201510316796.6A CN201510316796A CN104893309B CN 104893309 B CN104893309 B CN 104893309B CN 201510316796 A CN201510316796 A CN 201510316796A CN 104893309 B CN104893309 B CN 104893309B
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- silica gel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Compositions Of Macromolecular Compounds (AREA)
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Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510316796.6A CN104893309B (zh) | 2015-06-10 | 2015-06-10 | 一种硅胶支架、led器件及led器件的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510316796.6A CN104893309B (zh) | 2015-06-10 | 2015-06-10 | 一种硅胶支架、led器件及led器件的制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN104893309A CN104893309A (zh) | 2015-09-09 |
CN104893309B true CN104893309B (zh) | 2017-11-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510316796.6A Expired - Fee Related CN104893309B (zh) | 2015-06-10 | 2015-06-10 | 一种硅胶支架、led器件及led器件的制造方法 |
Country Status (1)
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CN (1) | CN104893309B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107035987B (zh) * | 2017-05-27 | 2023-04-21 | 深圳市毅宁亮照明有限公司 | 一种柔性灯条及其生产方法 |
CN107246553A (zh) * | 2017-07-30 | 2017-10-13 | 黄琴 | 一种可直接交流驱动led灯片 |
CN114290598A (zh) * | 2021-12-20 | 2022-04-08 | 隆扬电子(昆山)股份有限公司 | 一种吸嘴成型工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101509227B1 (ko) * | 2008-07-21 | 2015-04-10 | 서울반도체 주식회사 | Led 패키지 제조방법 |
CN103131191B (zh) * | 2013-02-05 | 2015-05-13 | 广州市爱易迪新材料科技有限公司 | 一种led封装用的单组份自成型透镜硅胶及其封装工艺 |
CN103872227B (zh) * | 2014-03-27 | 2016-06-08 | 广州市爱易迪新材料科技有限公司 | 一种360度发光的led灯丝光源的制造方法 |
CN204289439U (zh) * | 2014-11-20 | 2015-04-22 | 佛山市国星光电股份有限公司 | 一种全周发光的led灯丝 |
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2015
- 2015-06-10 CN CN201510316796.6A patent/CN104893309B/zh not_active Expired - Fee Related
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CN104893309A (zh) | 2015-09-09 |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 510000 Guangdong province Jinxiu Road, Guangzhou economic and Technological Development Zone Minghua three Street No. 10 on the third floor of Arts crafts emporium of Huaxing Patentee after: Guangzhou AI Hong Di new Mstar Technology Ltd Address before: One of the Jinxiu Road Economic Development Zone Guangdong city Guangzhou Province China 510730 Street No. 10, Huaxing building, third floor Patentee before: IED Technologies Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171103 Termination date: 20190610 |