CN104889905A - Machine chip clamping jig for high temperature and high pressure test - Google Patents
Machine chip clamping jig for high temperature and high pressure test Download PDFInfo
- Publication number
- CN104889905A CN104889905A CN201510226201.8A CN201510226201A CN104889905A CN 104889905 A CN104889905 A CN 104889905A CN 201510226201 A CN201510226201 A CN 201510226201A CN 104889905 A CN104889905 A CN 104889905A
- Authority
- CN
- China
- Prior art keywords
- chip
- placement
- chip clamping
- pressure test
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
Abstract
Disclosed is a machine chip clamping jig for a high temperature and high pressure test. The machine chip clamping jig for the high temperature and high pressure test comprises a jig body. A first placement layer and a second placement layer are arranged on the jig body, and a plurality of placement holes are formed in the first placement layer and the second placement layer. A chip clamping body is arranged in each placement hole, clamping openings of the chip clamping bodies are perpendicular to each other, and chromium is plated on the surfaces of the chip clamping bodies. Due to the facts that the two placement layers are arranged on the body of the machine chip clamping jig for the high temperature and high pressure test, the placement holes are formed in the placement layers, and the clamping bodies which can clamp chips are placed in the placement holes, the whole chips are in a uniformly tested state when the high temperature and high pressure test is conducted on the chips, and the accuracy of chip testing is greatly improved.
Description
Technical field
The present invention relates to a kind of clamping fixture, or rather, is a kind of HTHP test machine chip clamping fixture.
Background technology
HTHP test is one of method for testing reliability that industrial production is relatively commonly used.Corresponding reliability testing will be carried out too for chip manufacturing.But the chip HTHP measurement jig generally used at present can not allow chip be in a kind of state of thermally equivalent, has certain influence to test result.
Summary of the invention
The present invention mainly solves the technical problem existing for prior art, thus provides a kind of HTHP test machine chip clamping fixture that can allow chip thermally equivalent.
Above-mentioned technical problem of the present invention is mainly solved by following technical proposals:
A kind of HTHP test machine chip clamping fixture, comprise a jig body, described jig body is provided with one first display layer and one second display layer, the described first display layer and the second display layer is provided with some display holes, in described display hole, is respectively provided with a chip cramping body.
As preferred embodiment of the present invention, the clamp port on described chip cramping body is mutually vertical.
As preferred embodiment of the present invention, the surface of described chip cramping body is coated with one deck chromium.
Because HTHP test machine chip clamping fixture of the present invention is provided with two-layer display layer on body, display layer is provided with multiple display hole, display placed the cramping body that can clamp chip in hole, when chip carries out HTHP test, whole chip is in a kind of state of Uniform testing, thus substantially increases the accuracy of chip testing.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the perspective view of HTHP test machine chip clamping fixture of the present invention;
Fig. 2 is the perspective view of the HTHP test machine chip clamping fixture in Fig. 1, is now another visual angle.
Detailed description of the invention
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
The invention provides a kind of HTHP test machine chip clamping fixture that can allow chip thermally equivalent.
As shown in Figure 1 and Figure 2, a kind of HTHP test machine chip clamping fixture 1, comprise a jig body 2, described jig body 2 is provided with one first display layer 31 and one second display layer 32, described first display layer 31 and the second display layer 32 are provided with some display holes 4, in described display hole 4, are respectively provided with a chip cramping body 5.
As shown in Figure 1 and Figure 2, the clamp port on described chip cramping body 5 is mutually vertical.
As shown in Figure 1 and Figure 2, the surface of described chip cramping body 5 is coated with one deck chromium.
The HTHP test machine chip clamping fixture of this invention is provided with two-layer display layer on body, display layer is provided with multiple display hole, display placed the cramping body that can clamp chip in hole, when chip carries out HTHP test, whole chip is in a kind of state of Uniform testing, thus substantially increases the accuracy of chip testing.
Below only in one embodiment mentality of designing of the present invention is described, when system allows, the present invention can expand to external more functional module simultaneously, thus expands its function to greatest extent.
The above, be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (3)
1. HTHP test machine chip clamping fixture (1), comprise a jig body (2), it is characterized in that, described jig body (2) is provided with one first display layer (31) and one second display layer (32), described first display layer (31) and the second display layer (32) are provided with some display holes (4), in described display hole (4), are respectively provided with a chip cramping body (5).
2. HTHP test machine chip clamping fixture according to claim 1, is characterized in that, the clamp port on described chip cramping body (5) is mutually vertical.
3. HTHP test machine chip clamping fixture according to claim 2, is characterized in that, the surface of described chip cramping body (5) is coated with one deck chromium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510226201.8A CN104889905A (en) | 2015-05-06 | 2015-05-06 | Machine chip clamping jig for high temperature and high pressure test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510226201.8A CN104889905A (en) | 2015-05-06 | 2015-05-06 | Machine chip clamping jig for high temperature and high pressure test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104889905A true CN104889905A (en) | 2015-09-09 |
Family
ID=54023080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510226201.8A Pending CN104889905A (en) | 2015-05-06 | 2015-05-06 | Machine chip clamping jig for high temperature and high pressure test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104889905A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105855927A (en) * | 2016-05-26 | 2016-08-17 | 苏州卓诚钛设备有限公司 | Plastic jig |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100854747B1 (en) * | 2006-09-29 | 2008-08-27 | 삼성전기주식회사 | Assembling jig for camera module and assembling method for using it |
| CN202212722U (en) * | 2011-07-27 | 2012-05-09 | 松下能源(无锡)有限公司 | Positioning jig |
| CN203074679U (en) * | 2013-01-21 | 2013-07-24 | 中国计量学院 | Electronic thermometer fixture support for electronic thermometer verification |
| CN204304040U (en) * | 2014-12-02 | 2015-04-29 | 武汉隽龙科技有限公司 | Ceramic socket and TO packaging aging clamp |
| CN204302112U (en) * | 2014-12-04 | 2015-04-29 | 中国建材检验认证集团股份有限公司 | Elastic modulus device for testing under high temperature and hyperthermal environments |
-
2015
- 2015-05-06 CN CN201510226201.8A patent/CN104889905A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100854747B1 (en) * | 2006-09-29 | 2008-08-27 | 삼성전기주식회사 | Assembling jig for camera module and assembling method for using it |
| CN202212722U (en) * | 2011-07-27 | 2012-05-09 | 松下能源(无锡)有限公司 | Positioning jig |
| CN203074679U (en) * | 2013-01-21 | 2013-07-24 | 中国计量学院 | Electronic thermometer fixture support for electronic thermometer verification |
| CN204304040U (en) * | 2014-12-02 | 2015-04-29 | 武汉隽龙科技有限公司 | Ceramic socket and TO packaging aging clamp |
| CN204302112U (en) * | 2014-12-04 | 2015-04-29 | 中国建材检验认证集团股份有限公司 | Elastic modulus device for testing under high temperature and hyperthermal environments |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105855927A (en) * | 2016-05-26 | 2016-08-17 | 苏州卓诚钛设备有限公司 | Plastic jig |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150909 |
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| WD01 | Invention patent application deemed withdrawn after publication |