CN104889599A - Multi-element copper-base brazing filler - Google Patents
Multi-element copper-base brazing filler Download PDFInfo
- Publication number
- CN104889599A CN104889599A CN201510255270.1A CN201510255270A CN104889599A CN 104889599 A CN104889599 A CN 104889599A CN 201510255270 A CN201510255270 A CN 201510255270A CN 104889599 A CN104889599 A CN 104889599A
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- CN
- China
- Prior art keywords
- brazing filler
- filler
- element copper
- low
- solder
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Arc Welding In General (AREA)
Abstract
The invention discloses a multi-element copper-base brazing filler. The filler is formed by Mn, Ni, Sn, Al, Cu and Zn. The filler is low in cost and melting point. An appropriate amount of Mn and Sn, and accordingly, the brazing filler lubrication performance and the brazing seam cutting strength are further improved.
Description
Technical field
The present invention relates to a kind of solder, be specifically related to a kind of multi-element Cu-base solder.
Background technology
White cast-iron is cheap, have higher wearability, but toughness is low, it is generally acknowledged that soldering is nonsensical, and conventional overlaying method or complex method (white cast-iron and steel water composite ingot or white cast-iron and flexible steel plate and inlay) obtain a wearing layer on steel surface.Form wearing layer on matrix material steel surface by built-up welding white cast-iron, because welding temperature is high, easily make parts produce distortion, and form crackle, even snap, composite is subject to certain restrictions again in planform and the operation such as forging and stamping, machined.
Result of study showed in recent years: soldering is a kind of welding method being hopeful to connect for above-mentioned bimetallic material, can obtain firmly brazed seam.Therefore, solder technology is that manufacture is cheap, the method for optimizing of the white cast-iron parts of high rigidity, high abrasion resistance, CuZn system alloy is conventional a kind of cheap hard solder, fine with the ability of filling up gap to the wetability of steel, be widely used in the soldering cast iron of soldering low temperature carbon, low-alloy steel.CuZn solder due to fusing point high so that brazing temperature is also high, thus to White Cast Iron Containing and performance impact comparatively large, interface corrosion is serious, need solve it.
Summary of the invention
Technical problem to be solved by this invention is to provide that a kind of cost is low, wettability good, high, the low-melting multi-element Cu-base solder of brazed seam shear strength.
Technical problem to be solved by this invention realizes by the following technical solutions:
Multi-element Cu-base solder, is made up of the component of following mass percent:
Mn： 8.5-9.5%
Ni： 1.5-2.5%
Sn： 0.3-0.8%
Si： 0.3-0.8%
Al: 0.5-1%
Surplus is CuZn.
The better quality percentage of each component is:
Mn： 8.6%
Ni： 1.5%
Sn： 0.4%
Si： 0.5%
Al: 0.8%
Surplus is CuZn.
The invention has the beneficial effects as follows: fusing point of the present invention is low, and by adding appropriate Mn and Sn, further increase wettability and the brazed seam shear strength of solder.
Detailed description of the invention
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with specific embodiment, setting forth the present invention further.
Multi-element Cu-base solder, is made up of the component of following mass percent:
Mn： 8.5-9.5%
Ni： 1.5-2.5%
Sn： 0.3-0.8%
Si： 0.3-0.8%
Al: 0.5-1%
Surplus is CuZn.
The better quality percentage of each component is:
Mn： 8.6%
Ni： 1.5%
Sn： 0.4%
Si： 0.5%
Al: 0.8%
Surplus is CuZn.
Multi-element Cu-base solder, its cost is low, and fusing point is low, and by adding appropriate Mn and Sn, further increases wettability and the brazed seam shear strength of solder.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (2)
1. multi-element Cu-base solder, is characterized in that, is made up of the component of following mass percent:
Mn： 8.5-9.5%
Ni： 1.5-2.5%
Sn： 0.3-0.8%
Si： 0.3-0.8%
Al: 0.5-1%
Surplus is CuZn.
2. multi-element Cu-base solder according to claim 1, is characterized in that, is made up of the component of following mass percent:
Mn： 8.6%
Ni： 1.5%
Sn： 0.4%
Si： 0.5%
Al: 0.8%
Surplus is CuZn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510255270.1A CN104889599A (en) | 2015-05-19 | 2015-05-19 | Multi-element copper-base brazing filler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510255270.1A CN104889599A (en) | 2015-05-19 | 2015-05-19 | Multi-element copper-base brazing filler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104889599A true CN104889599A (en) | 2015-09-09 |
Family
ID=54022785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510255270.1A Pending CN104889599A (en) | 2015-05-19 | 2015-05-19 | Multi-element copper-base brazing filler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104889599A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891105A (en) * | 2017-03-06 | 2017-06-27 | 上海斯米克焊材有限公司 | A kind of automobile MIG soldering copper welding wires |
| CN111151917A (en) * | 2019-12-26 | 2020-05-15 | 浙江大学 | Brazing filler metal with nickel-plated layer for brazing sintered neodymium-iron-boron magnet and preparation method |
| CN111761257A (en) * | 2020-06-04 | 2020-10-13 | 陕西斯瑞新材料股份有限公司 | Preparation method and application of Cu-Mn-Ni-Si copper-based brazing filler metal |
| CN112440031A (en) * | 2020-11-23 | 2021-03-05 | 四川大西洋焊接材料股份有限公司 | Copper-manganese-nickel brazing filler metal and preparation method thereof |
| CN113523647A (en) * | 2021-07-30 | 2021-10-22 | 浙江工业职业技术学院 | Preparation method and system of copper alloy welding wire and sealing structure |
| CN114571137A (en) * | 2022-05-09 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing paste, copper-based pre-alloy and preparation method thereof |
| CN114571129A (en) * | 2021-09-30 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing filler metal and preparation method and application thereof |
-
2015
- 2015-05-19 CN CN201510255270.1A patent/CN104889599A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891105A (en) * | 2017-03-06 | 2017-06-27 | 上海斯米克焊材有限公司 | A kind of automobile MIG soldering copper welding wires |
| CN111151917A (en) * | 2019-12-26 | 2020-05-15 | 浙江大学 | Brazing filler metal with nickel-plated layer for brazing sintered neodymium-iron-boron magnet and preparation method |
| CN111151917B (en) * | 2019-12-26 | 2021-01-01 | 浙江大学 | Brazing filler metal with nickel-plated layer for brazing sintered neodymium-iron-boron magnet and preparation method |
| CN111761257A (en) * | 2020-06-04 | 2020-10-13 | 陕西斯瑞新材料股份有限公司 | Preparation method and application of Cu-Mn-Ni-Si copper-based brazing filler metal |
| CN111761257B (en) * | 2020-06-04 | 2022-06-03 | 陕西斯瑞新材料股份有限公司 | Preparation method and application of Cu-Mn-Ni-Si copper-based brazing filler metal |
| CN112440031A (en) * | 2020-11-23 | 2021-03-05 | 四川大西洋焊接材料股份有限公司 | Copper-manganese-nickel brazing filler metal and preparation method thereof |
| CN113523647A (en) * | 2021-07-30 | 2021-10-22 | 浙江工业职业技术学院 | Preparation method and system of copper alloy welding wire and sealing structure |
| CN114571129A (en) * | 2021-09-30 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing filler metal and preparation method and application thereof |
| CN114571137A (en) * | 2022-05-09 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing paste, copper-based pre-alloy and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150909 |