CN104875226A - Slicing method - Google Patents

Abstract

The invention discloses a slicing method. The slicing method adopts a wafer plate, a signal pen, a mobile module, a data processing terminal, a cutting device, an air clearing pipeline and a cleaning brush. The signal pen is used for acquiring point data; the mobile module is used for driving the signal pen and the cutting device to move; the data processing terminal is used for analyzing an initial data searching point; the cutting device is used for cutting. Compared with the prior art, the slicing method has the advantages that after each-time slicing, a 12-inch wafer is quartered and cleaned, and defective products are recognized by software in a machine, and accordingly production cost and equipment cost can be saved greatly, labor efficiency is improved, and economic benefits are increased.

Description

A kind of dicing method

Technical field

The present invention relates to electronics manufacture field, particularly relate to a kind of dicing method.

Background technology

Along with reaching its maturity of electron trade, the application of slice process is also further extensive, and traditional dicing method finds the center of circle on wafer body, directly wafer body is sliced into 4 pieces, in view of above-mentioned defect, is necessary to design a kind of dicing method in fact.

Summary of the invention:

Technical problem to be solved by this invention is: in a glue assembling process, increase the problem that rubber technique solves the blocking of traditional handicraft syringe needle and pollutes.

For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of dicing method, comprise wafer board, comprise sign pen, mobile module, data processing terminal, cutter sweep, the clean pipeline of wind, cleaning brush, described sign pen is used for collection point bit data, described mobile module for driving sign pen and cutter sweep to move, described data processing terminal for analyze data find initial point, described cutter sweep is used for cutting.

Its dicing method is as follows:

A. linear module drives cutter sweep to move to wafer board upper end;

B. cutting module is leg-of-mutton breach at optional position, wafer body upper end cutting profile;

C. linear module drive singal pen carries out to breach end points the location parameter that parameter acquisition draws three some positions;

D. data collection station is according to the location parameter determination wafer board center of circle.

E. moving module drives cutter sweep to move to upper end, the center of circle.

F. moving module drives cutter sweep to be that initial point carries out quartering cutting to wafer board by the center of circle.

G. moving module drives cutter sweep to be back to wafer board circle centre position upper end.

Further, described mobile module is arranged in X, Y, Z-direction respectively, and can move in X, Y, Z-direction respectively, described linear module is also provided with manipulator.

Further, also following steps are provided with after described f step:

A: the clean pipeline of wind carries out wind removal to the powder detritus that cutting remains;

B: cleaning brush cleans the wafer board after cutting.

Compared with prior art, 12 cun of wafers, after each section, are divided into four parts by the method, and then ready-portioned wafer is cleaned, finally identify defective products by the software of machine intimate, this device will save production cost and equipment cost greatly, raise labour efficiency, increase economic benefit.

Accompanying drawing explanation

Fig. 1 illustrates the present embodiment 1 flow chart

Fig. 2 illustrates the present embodiment 2 flow chart

Detailed description of the invention

Embodiment one

As shown in Figure 1 comprise wafer board, comprise sign pen, mobile module, data processing terminal, cutter sweep, the clean pipeline of wind, cleaning brush, described sign pen is used for collection point bit data, described mobile module for driving sign pen and cutter sweep to move, described data processing terminal for analyze data find initial point, described cutter sweep is used for cutting.

Its dicing method is as follows:

A. linear module drives cutter sweep to move to wafer board upper end;

B. cutting module is leg-of-mutton breach at optional position, wafer body upper end cutting profile;

C. linear module drive singal pen carries out to breach end points the location parameter that parameter acquisition draws three some positions;

D. data collection station is according to the location parameter determination wafer board center of circle.

E. moving module drives cutter sweep to move to upper end, the center of circle.

F. moving module drives cutter sweep to be that initial point carries out quartering cutting to wafer board by the center of circle.

G. moving module drives cutter sweep to be back to wafer board circle centre position upper end.

Described mobile module is arranged in X, Y, Z-direction respectively, can move in X, Y, Z-direction respectively,

Described linear module is also provided with manipulator.

Compared with prior art, 12 cun of wafers, after each section, are divided into four parts by the method, and then ready-portioned wafer is cleaned, finally identify defective products by the software of machine intimate, this device will save production cost and equipment cost greatly, raise labour efficiency, increase economic benefit.

Embodiment two

As shown in Figure 2 comprise wafer board, comprise sign pen, mobile module, data processing terminal, cutter sweep, the clean pipeline of wind, cleaning brush, described sign pen is used for collection point bit data, described mobile module for driving sign pen and cutter sweep to move, described data processing terminal for analyze data find initial point, described cutter sweep is used for cutting.

Its dicing method is as follows:

A. linear module drives cutter sweep to move to wafer board upper end;

B. cutting module is leg-of-mutton breach at optional position, wafer body upper end cutting profile;

C. linear module drive singal pen carries out to breach end points the location parameter that parameter acquisition draws three some positions;

D. data collection station is according to the location parameter determination wafer board center of circle.

E. moving module drives cutter sweep to move to upper end, the center of circle.

F. moving module drives cutter sweep to be that initial point carries out quartering cutting to wafer board by the center of circle.

G. the powder detritus that the clean pipeline of wind is residual to cutting carries out wind removal.

H. cleaning brush cleans the wafer board after cutting.

I. moving module drives cutter sweep to be back to wafer board circle centre position upper end.

Compared with prior art, 12 cun of wafers, after each section, are divided into four parts by the method, and then ready-portioned wafer is cleaned, finally identify defective products by the software of machine intimate, this device will save production cost and equipment cost greatly, raise labour efficiency, increase economic benefit.

The present invention is not limited to above-mentioned concrete embodiment, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, done all conversion, all drop within protection domain of the present utility model.

Claims (3)

1. a dicing method, comprise wafer board, it is characterized in that comprising sign pen, mobile module, data processing terminal, cutter sweep, the clean pipeline of wind, cleaning brush, described sign pen is used for collection point bit data, described mobile module for driving sign pen and cutter sweep to move, described data processing terminal for analyze data find initial point, described cutter sweep is used for cutting.

Its load method is as follows:

A, linear module drive cutter sweep to move to wafer board upper end;

B, cutting module are leg-of-mutton breach at optional position, wafer body upper end cutting profile;

C, linear module drive singal pen carry out to breach end points the location parameter that parameter acquisition draws three some positions;

D, data collection station are according to the location parameter determination wafer board center of circle.

E, mobile module drive cutter sweep to move to upper end, the center of circle.

F, mobile module drive cutter sweep to be that initial point carries out quartering cutting to wafer board by the center of circle.

G, mobile module drive cutter sweep to be back to wafer board circle centre position upper end.

2. dicing method as claimed in claim 1, is characterized in that, described mobile module is arranged in X, Y, Z-direction respectively, and can move in X, Y, Z-direction respectively, described linear module is also provided with manipulator.

3. dicing method as claimed in claim 2, is characterized in that, be also provided with following steps after described f step:

A: the clean pipeline of wind carries out wind removal to the powder detritus that cutting remains;

B: cleaning brush cleans the wafer board after cutting.