CN104868214B - Balanced type transition circuit based on the micro-strip of probe feed to substrate integration wave-guide - Google Patents
Balanced type transition circuit based on the micro-strip of probe feed to substrate integration wave-guide Download PDFInfo
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- CN104868214B CN104868214B CN201510205034.9A CN201510205034A CN104868214B CN 104868214 B CN104868214 B CN 104868214B CN 201510205034 A CN201510205034 A CN 201510205034A CN 104868214 B CN104868214 B CN 104868214B
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Abstract
The invention discloses a kind of balanced type transition circuit based on the micro-strip of probe feed to substrate integration wave-guide, including the first to the 3rd medium substrate, the first and second metal patches, four articles of input and output transmission lines and four resonators；Second and the 3rd is equipped with the first plated-through hole on medium substrate to form substrate integration wave-guide, and the first metal patch forms the ground of input and output transmission line；Resonator is arranged at the 3rd medium substrate upper surface；Second metal patch forms the ground of substrate integration wave-guide；Four the second plated-through holes run through first medium substrate, the first metal patch and second medium substrate.Input/output transmission line is fed into substrate integration wave-guide by the second plated-through hole resonator at a distance of half-wavelength, pass through differential signal, common-mode signal is suppressed, the bottom surface of resonator and underlying substrate integrated waveguide forms equivalent capacity, reduce the requirement to probe length, so as to reduce the requirement to substrate integration wave-guide thickness, reduce circuit thickness.
Description
Technical field
The present invention relates to the communications field, more says, is related to a kind of based on the micro-strip of probe feed to substrate integration wave-guide
Balanced type transition circuit.
Background technology
In the business and military channels of microwave and millimeter wave, micro-strip and substrate integration wave-guide is can be effectively each
Two kinds of common transmission lines of high-frequency signal are transmitted between kind module.Microstrip is commonly used in the multiple active circuits of connection
Module include transistor, monolithic integrated microwave circuit (MMIC) and various surfaces installation component.And substrate integration wave-guide
Due to having the characteristics of metal waveguide Q values are high, the low and power capacity of loss is big, while again easy to process and Planar integration concurrently, become
The first choice of the low loss line of antenna feeding network, high q filter system etc..
The use of different types of transmission line is favourable, such as microstrip line and substrate in the architecture Design of a system
The module that integrated waveguide coexists.In this respect, a micro-strip is just needed when substrate integration wave-guide module is connected to micro-strip module
To the transition device of substrate integration wave-guide.In numerous applications, these transition devices are installed in the surface of Multilayer panel.It is based on
Planar substrates, easily fabricated and compact dimensions wideband microband-substrate integration wave-guide Transition Design are extremely important.
Neutrodyne circuit is more and more studied due to the symmetry of its circuit form and the reversed nature of signal
And concern.Compared with traditional single-ended microwave circuit, the advantages of neutrodyne circuit, includes：It is harmonics restraint, high linearity, anti-interference
Ability strong (usual outside noise is all common-mode signal), high reliability and high-output power (power combing of two difference channels)
Deng.Therefore, in current microwave monolithic integrated circuit (MMIC) and RF IC (RFIC), balance/difference modes quilt
It is widely used.Therefore the balanced type Transition Design of exploitation micro-strip-substrate integration wave-guide is highly desirable, for neutrodyne circuit
In.
The balanced type Transition Design of traditional micro-strip to substrate integration wave-guide be mostly by various forms of probe feeds Lai
Form, wherein preferable design is to stretch into substrate integration wave-guide by probe, coupled with substrate integration wave-guide, but due to visiting
Pin feed needs certain length, this make it that substrate thickness is thicker, and the selection of substrate is relatively difficult.Come for bandwidth of operation
Say, such to be designed as 17%, the performance of common mode inhibition this respect is not assessed in addition such design.
The content of the invention
The present invention realizes transition of the micro-strip to substrate integration wave-guide for traditional probe feed, causes substrate thickness
Greatly, and it is stringent to the thickness requirement of substrate and caused by substrate selection it is inconvenient the defects of, there is provided one kind is based on probe feed
Micro-strip to the balanced type transition circuit of substrate integration wave-guide, realize differential signal from microstrip transmission line to substrate integration wave-guide
The multilayer antarafacial transition of transmission, simplifies circuit structure, reduces thickness, and easily fabricated, adds differential mode bandwidth, common mode inhibition
Effect is good, and strong antijamming capability and reliability are high.
The present invention solves the technical solution that its technical problem uses：There is provided a kind of based on the micro-strip of probe feed to substrate
The balanced type transition circuit of integrated waveguide, including first medium substrate, second medium substrate, the 3rd medium substrate, the first metal
Patch, the second metal patch, two input and output transmission line groups and four resonators；Two input and output transmission line groups
The first medium upper surface of base plate both ends are symmetrically disposed on, each input/output transmission line group includes what mirror image was set
Two input/output transmission lines；The lower surface of the first medium substrate is connected with the upper surface of the second medium substrate；Institute
State and be respectively arranged with multiple first plated-through holes on second medium substrate and the 3rd medium substrate and integrated with forming substrate
Waveguide, first metal patch are arranged at the upper surface of the second medium substrate to form the input and output transmission line group
Ground；The lower surface of the second medium substrate is connected with the upper surface of the 3rd medium substrate；Four resonators two
Two 1 groups of both ends for being symmetrically disposed on the 3rd medium substrate upper surface；Second metal patch is arranged at the described 3rd and is situated between
The lower surface of matter substrate is to form the ground of substrate integration wave-guide；Four the second plated-through holes are symmetrically disposed on described in pairs
The first medium substrate, first metal patch and the second medium substrate are simultaneously run through in first medium substrate both ends；
Two second plated-through holes in one group input/output terminal with two input/output transmission lines of the same side respectively
Position and the same side two resonators center it is corresponding；Two the second plated-through hole phases in one group
Away from half wavelength.
Preferably, multiple first plated-through holes surround rectangle.
Preferably, further included on the second medium substrate and the 3rd medium substrate logical by multiple three metallization
The perceptual window that hole is formed.
Preferably, the perceptual window is located at the center that multiple first plated-through holes surround rectangle.
Preferably, the perceptual window is rectangle, by four group of the 3rd plated-through hole group for being located at four vertex of rectangle respectively
Into every group includes two the 3rd plated-through holes.
Preferably, the resonator is the metal patch of rectangle.
The balanced type transition circuit based on the micro-strip of probe feed to substrate integration wave-guide of the present invention has beneficial below
Effect:The input/output transmission line of balanced type transition is harmonious by the probe formed at a distance of the second plated-through hole of half-wavelength
The device that shakes is fed into substrate integration wave-guide, makes differential signal by the way that common-mode signal is suppressed, the substrate collection of patch resonator and lower section
The equivalent capacity formed into the bottom surface of waveguide (being made of the 3rd medium substrate and the first plated-through hole), which can reduce, grows probe
The requirement of degree, so as to reduce the requirement to substrate integration wave-guide thickness, reduces circuit thickness.
In addition, the perceptual window formed by increasing plated-through hole in substrate integration wave-guide, increases the band of differential-mode response
It is wide.It has evaluated the rejection ability of common-mode signal at the same time, there is preferable common mode inhibition effect.
Brief description of the drawings
The balanced type transition circuit first based on the micro-strip of probe feed to substrate integration wave-guide that Fig. 1 is the present invention is implemented
The three dimensional structure diagram of example；
The balanced type transition circuit first based on the micro-strip of probe feed to substrate integration wave-guide that Fig. 2 is the present invention is implemented
The side view of example；
The balanced type transition circuit first based on the micro-strip of probe feed to substrate integration wave-guide that Fig. 3 is the present invention is implemented
In example on first medium upper surface of base plate circuit topology diagram；
The balanced type transition circuit first based on the micro-strip of probe feed to substrate integration wave-guide that Fig. 4 is the present invention is implemented
The topology diagram of first metal patch in example；
The balanced type transition circuit first based on the micro-strip of probe feed to substrate integration wave-guide that Fig. 5 is the present invention is implemented
The topology diagram of second medium substrate in example；
The balanced type transition circuit first based on the micro-strip of probe feed to substrate integration wave-guide that Fig. 6 is the present invention is implemented
The topology diagram of 3rd medium substrate upper surface in example；
Fig. 7 is the first example of balanced type transition circuit based on the micro-strip of probe feed to substrate integration wave-guide of the present invention
Simulation result figure.
Embodiment
Below in conjunction with drawings and examples the present invention will be further explained explanation.
Fig. 1 is the balanced type transition circuit 100 first based on the micro-strip of probe feed to substrate integration wave-guide of the present invention
The three dimensional structure diagram of embodiment, as shown in Figure 1, in the present embodiment, the micro-strip based on probe feed integrates ripple to substrate
The balanced type transition circuit 100 led includes first medium substrate 1, second medium substrate 2, the 3rd medium substrate 3, the first metal patch
Piece 4,5, two input and output transmission line groups 6 of the second metal patch and four resonators 7.
Wherein, two input and output transmission line groups 6 are symmetrically disposed on 1 upper surface both ends of first medium substrate, and each input/
Output transmission line group 6 includes two input/output transmission lines that mirror image is set, such as in 1 left end of first medium substrate is mirror
As two input transmission lines set, two output transmission lines set for mirror image of right end.If 1 left end of first medium substrate
For two output transmission lines, right end is then two input transmission lines.The lower surface of first medium substrate 1 and second medium substrate
2 upper surface connection.
It is respectively arranged with multiple first plated-through holes 8 on 2 and the 3rd medium substrate 3 of second medium substrate, multiple first
Plated-through hole 8 is uniformly distributed, and surrounds a rectangle, forms substrate integration wave-guide.First metal patch 4 is arranged at second medium
The upper surface of substrate 2 is to form the ground of input and output transmission line group 6.The lower surface of second medium substrate 2 and the 3rd medium substrate 3
Upper surface connection.Four resonators 7 are symmetrically disposed on the both ends of 3 upper surface of the 3rd medium substrate in pairs, in this implementation
In example, resonator 7 is the metal patch of rectangle.Second metal patch 5 is arranged at the lower surface of the 3rd medium substrate 3 to form base
The ground of piece integrated waveguide.
Four the second plated-through holes 9 are symmetrically disposed on 1 both ends of first medium substrate, and four the second gold medals in pairs
Categoryization through hole 9 runs through first medium substrate 1, the first metal patch 4 and second medium substrate 2.Second plated-through hole 9 is
For probe.Two 9 half wavelengths, and two input/output with the same side respectively apart of the second plated-through holes in every group
The position of the input/output terminal of transmission line and the center of the two of the same side resonators 7 are corresponding.For example, first is situated between
Transmitted for two input transmission lines, the then position of two the second plated-through holes 9 in left side and this two inputs in the left side of matter substrate 1
The position of the input terminal of line corresponds, and also the center with two resonators 7 of the same side corresponds.That is,
The input/output terminal of two input/output transmission lines of the same side is in half wavelength, two resonators 7 of the same side
The heart is at a distance of half wavelength.
In addition, the rectangle that multiple first plated-through holes 8 surround on 2 and the 3rd medium substrate 3 of second medium substrate
Center be also respectively provided with the perceptual window being made of multiple 3rd plated-through holes 10, it is preferable that perceptual window is rectangle,
And four group of the 3rd plated-through hole 10 by being arranged on its four vertex forms, every group includes two the 3rd plated-through holes
10。
In the present embodiment, first medium substrate 1, the dielectric constant phase of 2 and the 3rd medium substrate 3 of second medium substrate
Together, can be realized for example, by Ro4003C frequency PCBs plate.In other embodiments, first medium substrate 1, second medium base
The dielectric constant of 2 and the 3rd medium substrate 3 of plate can not also be identical.
(it is only used for illustrating and tests measurement, be not used in the limitation present invention) referring to Fig. 2 to Fig. 6, in one example, the
The thickness h 1=0.913mm of one medium substrate 1,2 thickness h 2=0.913mm of second medium substrate, 3 thickness h 3 of the 3rd medium substrate
=0.254mm, dielectric constant=3.38 of first medium substrate 1, second medium substrate 2 and second medium substrate 3, long L1
=77mm, wide L2=30mm (length and width of the first to the 3rd medium substrate are identical in example).Input/output transmission line is divided into four
Section, first segment is perpendicular to the long side of first medium substrate 1, its length l1=6.9mm, its width W1=2.1mm, its distance first
The distance l4=8.4mm of 1 short side of medium substrate；Second section is perpendicular to first segment, its length l2=6.6mm；Section three, perpendicular to
Second section, its length l3=5mm, the distance between Section three g=0.5mm of two articles of input/output transmission lines that mirror image is set；
Section four, one end is connected with Section three, and the other end is input/output terminal and spacing ld=10.5mm, Section four of length l5=
8.65mm, Section four of width W3=1mm, Section of four end are connected to semicircle arc dia d1=1.2mm.First metal patch 4
Length and width it is identical with medium substrate, it is interior through the outer annular diameter D=2mm of the second plated-through hole 9 of the first metallized patches 4
Ring diameter d2=1mm, the distance between the short side of the first metallized patches 4 and second plated-through hole 9 nearest with it
Fv1=12.7mm, the spacing of two the second plated-through holes 9 is fv2=10.5mm in one group, 9 distance of the second plated-through hole
The beeline fv3=7mm of the long side of first metallized patches 4.
On 2 and the 3rd medium substrate 3 of second medium substrate, shorter flat of rectangle two that the first plated-through hole 8 surrounds
Row side is equal with the distance of 2 and the 3rd 3 liang of shorter parallel edges of medium substrate of second medium substrate, distance V1=7.9mm.The
Longer flat of the longer parallel edges of rectangle two that one plated-through hole 8 surrounds and 2 and the 3rd 3 liang of medium substrate of second medium substrate
The distance on row side can be waited and also differed, be illustrated in figure 5 one of the rectangle unequal, the first plated-through hole 8 surrounds compared with
Long parallel edges and the longer parallel edges of 2 and the 3rd medium substrate 3 of second medium substrate are very close to another longer parallel
While with 2 and the 3rd medium substrate 3 of second medium substrate it is parallel with it while the distance between V2=14.4mm.Such as Figures 5 and 6 institute
Show, the induction window of rectangle is located at the center for the rectangle that the first plated-through hole 8 surrounds, the first gold medal of induction window distance of rectangle
The distance for two vertical edges of rectangle that categoryization through hole 8 surrounds is respectively lg=1.5mm and lv1=23.75mm, and with the first metal
The distance for changing the rectangle that through hole 8 surrounds is respectively that the parallel edge lengths of lg=1.5mm are lv2=12.5mm.First metallization is logical
The diameter Vd=0.5mm in hole 8, the second plated-through hole 9 and the 3rd plated-through hole 10.Through the second of second medium substrate 2
The beeline lt1=5.05mm of the short side for the rectangle that 9 the first plated-through hole of distance 8 of plated-through hole surrounds, distance first
The distance lt2=6.3mm of the long side for the rectangle that plated-through hole 8 surrounds, the spacing of two the second plated-through holes 9 in one group
Ltd=10.5mm.
It is arranged on the long lp1=10mm of the resonator 7 of 3 upper surface of the 3rd medium substrate, wide lp2=7.5mm, resonator 7
The beeline v1=1.55mm of the short side for the rectangle that the first plated-through hole of distance 8 surrounds, 7 distance of resonator first metallize
The beeline v2=1.55mm of the long side for the rectangle that through hole 8 surrounds.The distance gp on two resonators, the 7 adjacent both sides in one group
=3mm.
By simulation software CST (Computer Simulation Technology) to the transition electricity with above-mentioned parameter
Road 100 is emulated, and the results are shown in Figure 7, and the transition as can be seen from Figure 7 meets that return loss is less than the frequency model of 15dB
Enclose for 8.52~11.26GHz, i.e., relative bandwidth is 27.4%, and common-mode signal suppresses in more than 19dB in passband.
Implement in the balanced type transition circuit 100 first based on the micro-strip of probe feed to substrate integration wave-guide of the present invention
In example, probe and rectangular metal patch that input/output transmission line 6 passes through the second plated-through hole 9 composition at a distance of half-wavelength
The resonator 7 of composition is fed into substrate integration wave-guide, make differential signal by, common-mode signal is suppressed, rectangular metal patch with
The equivalent capacity that the bottom surface of the substrate integration wave-guide (being made of the 3rd medium substrate 3 and the first plated-through hole 8) of lower section is formed
The requirement to probe length can be reduced, so as to reduce the requirement to substrate integration wave-guide thickness, reduces circuit thickness.Lead at the same time
The perceptual window of addition is crossed to increase bandwidth.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention, for the skill of this area
For art personnel, the invention may be variously modified and varied.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included within scope of the presently claimed invention.
Claims (4)
1. a kind of balanced type transition circuit based on the micro-strip of probe feed to substrate integration wave-guide, it is characterised in that including
One medium substrate (1), second medium substrate (2), the 3rd medium substrate (3), the first metal patch (4), the second metal patch
(5), two input and output transmission line groups (6) and four resonators (7), the resonator (7) are the metal patch of rectangle；Two
A input and output transmission line group (6) is symmetrically disposed on first medium substrate (1) the upper surface both ends, each input
Output transmission line group (6) includes two input/output transmission lines that mirror image is set；The lower surface of the first medium substrate (1)
It is connected with the upper surface of the second medium substrate (2)；On the second medium substrate (2) and the 3rd medium substrate (3)
Multiple first plated-through holes (8) are respectively arranged with to form substrate integration wave-guide, multiple first plated-through holes (8) are uniformly divided
Cloth and rectangle is surrounded, the upper surface that first metal patch (4) is arranged at the second medium substrate (2) is described defeated to form
Enter the ground of output transmission line group (6)；The lower surface of the second medium substrate (2) and the upper table of the 3rd medium substrate (3)
Face connects；Four resonators (7) are symmetrically disposed on the both ends of the 3rd medium substrate (3) upper surface in pairs；Institute
State the second metal patch (5) and be arranged at the lower surface of the 3rd medium substrate (3) to form the ground of substrate integration wave-guide；Four
Second plated-through hole (9) is symmetrically disposed on first medium substrate (1) both ends and runs through the first medium in pairs
Substrate (1), first metal patch (4) and the second medium substrate (2)；Two second metallization in one group
Through hole (9) is humorous with two of the position of the input/output terminal of two input/output transmission lines of the same side and the same side respectively
Shake device (7) center it is corresponding；Two second plated-through holes (9) in one group are at a distance of half wavelength.
2. the balanced type transition circuit according to claim 1 based on the micro-strip of probe feed to substrate integration wave-guide, its
It is characterized in that, is further included on the second medium substrate (2) and the 3rd medium substrate (3) logical by multiple three metallization
The perceptual window that hole (10) is formed.
3. the balanced type transition circuit according to claim 2 based on the micro-strip of probe feed to substrate integration wave-guide, its
It is characterized in that, the perception window is located at the center that multiple first plated-through holes (8) surround rectangle.
4. the balanced type transition circuit according to claim 3 based on the micro-strip of probe feed to substrate integration wave-guide, its
It is characterized in that, the perception window is rectangle, is made of four group of the 3rd plated-through hole (10) for being located at four vertex of rectangle respectively,
Every group includes two the 3rd plated-through holes (10).
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| CN201510205034.9A CN104868214B (en) | 2015-04-27 | 2015-04-27 | Balanced type transition circuit based on the micro-strip of probe feed to substrate integration wave-guide |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106067590B (en) * | 2016-07-29 | 2018-11-13 | 南京信息职业技术学院 | Double-frequency omnidirectional substrate integrated waveguide spiral slot antenna |
| CN107919516B (en) * | 2017-11-02 | 2019-05-31 | 东南大学 | A kind of voltage-controlled resonator of miniaturization substrate integrated coaxial line |
| CN109301472B (en) * | 2018-10-31 | 2024-07-12 | 至晟(临海)微电子技术有限公司 | Dual-band millimeter wave antenna |
| CN109494436A (en) * | 2018-11-15 | 2019-03-19 | 西安电子科技大学昆山创新研究院 | A kind of filter and preparation method thereof |
| CN110165351B (en) * | 2019-03-19 | 2020-11-10 | 西安电子科技大学 | Transition structure from coupling type broadband microstrip to dielectric integrated waveguide |
| CN110233319B (en) * | 2019-05-24 | 2021-01-26 | 南通大学 | Balanced filter based on substrate integrated waveguide |
| CN112864559B (en) * | 2021-01-11 | 2022-07-08 | 博微太赫兹信息科技有限公司 | Multilayer dielectric plate transition conversion structure based on SIW |
| CN114024136B (en) * | 2021-11-04 | 2022-05-31 | 北京航空航天大学 | High common mode rejection ratio differential antenna based on half-mode substrate integrated waveguide |
| CN114899564B (en) * | 2022-05-24 | 2023-06-06 | 南通先进通信技术研究院有限公司 | Band-controllable low-profile double-band balanced dielectric resonator filter |
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Effective date of registration: 20191213 Address after: 226100, No. 100, Dongting Lake Road, Linjiang Town, Haimen, Jiangsu, Nantong Patentee after: Jiangsu Jiazhao Electronic Co., Ltd Address before: 518110 Longhua Street, Longhua Street, Longhua Street, Longhua Community, Shenzhen City, Guangdong Province, 428 Garden Street, B24 Garden Street, B23B Patentee before: Shenzhen Morning Intellectual Property Operations Co., Ltd. |
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