CN209766614U - Single-body double-path balanced filter and radio frequency front-end circuit - Google Patents
Single-body double-path balanced filter and radio frequency front-end circuit Download PDFInfo
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- CN209766614U CN209766614U CN201920554568.6U CN201920554568U CN209766614U CN 209766614 U CN209766614 U CN 209766614U CN 201920554568 U CN201920554568 U CN 201920554568U CN 209766614 U CN209766614 U CN 209766614U
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Abstract
The utility model discloses a monomer double-circuit balanced type filter and radio frequency front end circuit, the filter includes at least two layers of printed circuit board that pile up from bottom to top, and every layer of printed circuit board includes metal level, dielectric plate, lower metal level and a plurality of via hole, and metal level and lower metal level set up respectively in the top surface and the bottom surface of dielectric plate, and a substrate integrated waveguide resonant cavity is enclosed into to a plurality of via holes; substrate integrated waveguide resonant cavities in two adjacent layers of printed circuit boards are coupled together; the upper metal layer of the printed circuit board on the uppermost layer and the lower metal layer of the printed circuit board on the lowermost layer are respectively provided with four micro-strip feed lines inserted into the substrate integrated waveguide resonant cavity, the tail end of each micro-strip feed line is provided with a port, and the ports of every two micro-strip feed lines which are centrosymmetric form a pair of balanced ports. The utility model discloses realize two way balanced type wave filters in a wave filter, reduced the circuit size to can realize the good isolation between the two way balanced type wave filters.
Description
Technical Field
the utility model relates to a wave filter, especially a monomer double-circuit balance formula wave filter and radio frequency front end circuit belong to wireless communication technical field.
Background
With the rapid development of wireless communication technology, high-performance microwave devices have a great demand, filters are important components of radio frequency front-end circuits of wireless systems, and balanced circuits have high immunity to interference. Therefore, a balanced filter in which a filter and a balanced circuit are integrated has been studied in large quantities.
Due to low price and relatively simple structure, printed circuit board microstrip structures are largely used for balanced filter design; in addition, Low Temperature Co-fired Ceramic (LTCC) technology is also widely used, and the size of the circuit can be greatly reduced due to the multi-layer structure of the LTCC. However, the microstrip structure of the Printed Circuit Board (PCB) and the low temperature co-fired ceramic have the disadvantages of low Q value and power tolerance, and cannot be used for narrowband applications, otherwise the loss of the designed balanced filter is too large. The dielectric resonator is used for designing a narrow-band balanced filter due to the advantage of high Q value, but has the disadvantages of large size, heavy weight and high cost. In addition to printed circuit board, low temperature co-fired ceramic and Dielectric Resonator (DR) technologies, Substrate Integrated Waveguide (SIW) is also widely used in microwave device design due to its low cost, high integration and relatively high Q factor, including filters, power splitters, crossovers and couplers.
At present, the size of the balanced filter based on the substrate integrated waveguide is mainly reduced by carrying out miniaturization design on a single balanced filter, and no relevant record exists on a single two-way balanced filter based on the substrate integrated waveguide.
SUMMERY OF THE UTILITY MODEL
the utility model aims at solving the above-mentioned prior art's defect, provide a monomer double-circuit balanced type wave filter, this wave filter can realize two way balanced type wave filters, has reduced the circuit size to can realize the good isolation between the two way balanced type wave filters.
another object of the present invention is to provide a rf front-end circuit including the above filter.
The purpose of the utility model can be achieved by adopting the following technical scheme:
a single two-way balanced filter comprises at least two layers of printed circuit boards stacked from bottom to top, wherein each layer of printed circuit board comprises an upper metal layer, a dielectric plate, a lower metal layer and a plurality of through holes, the upper metal layer and the lower metal layer are respectively arranged on the top surface and the bottom surface of the dielectric plate, and a substrate integrated waveguide resonant cavity is defined by the through holes; substrate integrated waveguide resonant cavities in two adjacent layers of printed circuit boards are coupled together;
The upper metal layer of the printed circuit board on the uppermost layer and the lower metal layer of the printed circuit board on the lowermost layer are respectively provided with four micro-strip feed lines inserted into the substrate integrated waveguide resonant cavity, the tail end of each micro-strip feed line is provided with a port, and the ports of every two micro-strip feed lines which are centrosymmetric form a pair of balanced ports.
Furthermore, in the two adjacent printed circuit boards, the lower metal layer of the upper printed circuit board is in contact with the upper metal layer of the lower printed circuit board, and the lower metal layer of the upper printed circuit board and the upper metal layer of the lower printed circuit board are both provided with coupling slots.
Furthermore, in the two adjacent layers of printed circuit boards, the number of the coupling slots of the upper layer printed circuit board and the number of the coupling slots of the lower layer printed circuit board are four, and the shapes and the sizes of the coupling slots are the same; four coupling slots of the upper printed circuit board are symmetrical about the center point of the lower metal layer; the four coupling slots of the lower printed circuit board are symmetrical about the center point of the metal layer thereon.
Furthermore, in the printed circuit board on the uppermost layer, any two adjacent microstrip feed lines form an included angle of 90 degrees with a connecting line of the central points of the upper metal layers;
in the lowest printed circuit board, any two adjacent microstrip feed lines form an included angle of 90 degrees with a connecting line of the central points of the lower metal layers;
the four microstrip feed lines of the printed circuit board on the uppermost layer are in one-to-one correspondence with the four microstrip feed lines of the printed circuit board on the lowermost layer, and each microstrip feed line of the printed circuit board on the uppermost layer is positioned right above the corresponding microstrip feed line of the printed circuit board on the lowermost layer.
Furthermore, the projection of each microstrip feed line of the uppermost printed circuit board on the lower metal layer of the lowermost printed circuit board is intersected with and perpendicular to the microstrip feed line corresponding to the lowermost printed circuit board.
furthermore, each microstrip feed line is a bent microstrip feed line.
Further, each microstrip feed line comprises a vertical section and an inclined section which are connected;
In the printed circuit board on the uppermost layer, the vertical section of each microstrip feed line is vertical to one edge of the upper metal layer, and the inclined section of each microstrip feed line is inserted into the substrate integrated waveguide resonant cavity;
In the lowest printed circuit board, the vertical section of each microstrip feed line is vertical to one edge of the lower metal layer, and the inclined section of each microstrip feed line is inserted into the substrate integrated waveguide resonant cavity.
Furthermore, the cross section of the substrate integrated waveguide resonant cavity is circular.
Furthermore, the cross section of the substrate integrated waveguide resonant cavity is in the shape of a regular polygon with even number sides.
The utility model discloses a further purpose can reach through taking following technical scheme:
A radio frequency front-end circuit comprises the single two-way balanced filter.
The utility model discloses for prior art have following beneficial effect:
1. The utility model is provided with at least two layers of printed circuit boards, the substrate integrated waveguide resonant cavities of each layer of printed circuit boards are coupled together, the upper metal layer of the uppermost printed circuit board and the lower metal layer of the lowest printed circuit board are respectively provided with four micro-strip feeder lines inserted into the substrate integrated waveguide resonant cavities, the ports of every two micro-strip feeder lines with central symmetry form a pair of balanced ports, the transmission of differential signals in two pairs of balanced ports is realized, and the two balanced ports are not mutually influenced by the other two pairs of balanced ports in orthogonal positions, thereby obtaining two paths of balanced filters, namely, the two paths of balanced filters are fused into a single two-path balanced filter with four pairs of balanced ports, the size can be greatly reduced, the substrate integrated waveguide resonant cavity has higher Q value compared with the traditional micro-strip design, lower losses can be achieved.
2. The utility model discloses the inherent reverse electric field distribution characteristic of TE 102 and TE 201 quadrature degeneration mode of required difference input/output effect through the integrated waveguide resonant cavity of substrate obtains, can realize good common mode rejection effect, because do not need extra reverse circuit, simplified circuit structure, because the quadrature characteristic of the TE 102 of the integrated waveguide resonant cavity of substrate and TE 201 degeneration mode, the signal can't be mutual transmission between two way balanced type wave filters, has realized good isolation.
Drawings
Fig. 1 is a schematic structural diagram of a single two-way balanced filter according to embodiment 1 of the present invention.
fig. 2 is a graph showing the common mode and differential mode response curves of the two-path balanced filter according to embodiment 1 of the present invention.
Fig. 3 is a differential mode isolation curve diagram between two paths of balanced filters according to embodiment 1 of the present invention.
Wherein, 1-upper printed circuit board, 101-first upper metal layer, 1011-first microstrip feed line, 1012-second microstrip feed line, 1013-third microstrip feed line, 1014-fourth microstrip feed line, 102-first dielectric board, 103-first lower metal layer, 1031-first coupling slot, 1032-second coupling slot, 1033-third coupling slot, 1034-fourth coupling slot, 104-first via, 2-lower printed circuit board, 201-second upper metal layer, 2011-fifth coupling slot, 2012-sixth coupling slot, 2013-seventh coupling slot, 2014-eighth coupling slot, 202-second dielectric board, 203-second lower metal layer, 2031-fifth microstrip feed line, 2032-sixth microstrip feed line, 2033-a seventh microstrip feed line, 2034-an eighth microstrip feed line, 204-a second via, P1-a first port, P2-a second port, P3-a third port, P4-a fourth port, P5-a fifth port, P6-a sixth port, P7-a seventh port, P8-an eighth port.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
Example 1:
As shown in fig. 1 to fig. 3, the present embodiment provides a single two-way balanced filter, which can be applied to a radio frequency front end circuit of an antenna system, and includes two layers of printed circuit boards, i.e., an upper layer printed circuit board 1 and a lower layer printed circuit board 2.
The upper printed circuit board 1 comprises a first upper metal layer 101, a first dielectric plate 102, a first lower metal layer 103 and a plurality of first via holes 104, wherein the first upper metal layer 101 and the first lower metal layer 103 are respectively arranged on the top surface and the bottom surface of the first dielectric plate 102, and the plurality of first via holes 104 enclose a first substrate integrated waveguide resonant cavity; the lower printed circuit board 2 comprises a second upper metal layer 201, a second dielectric plate 202, a second lower metal layer 203 and a plurality of second via holes 204, the second upper metal layer 201 and the second lower metal layer 203 are respectively arranged on the top surface and the bottom surface of the second dielectric plate 202, and the plurality of second via holes 204 enclose a second substrate integrated waveguide resonant cavity; the first substrate integrated waveguide resonant cavity is coupled to the second substrate integrated waveguide resonant cavity.
In order to realize the coupling between the first substrate integrated waveguide resonant cavity and the second substrate integrated waveguide resonant cavity, the first lower metal layer 103 of the upper printed circuit board 1 is in contact with the second upper metal layer 201 of the lower printed circuit board 2, the first lower metal layer 103 and the second upper metal layer 201 are both provided with coupling slots, the coupling between the first substrate integrated waveguide resonant cavity and the second substrate integrated waveguide resonant cavity is realized through the coupling slots, and the coupling coefficient required by the filter is realized through controlling the size of the coupling slots.
Further, the coupling slots provided in the first lower metal layer 103 and the second upper metal layer 201 are four and have the same shape and size, where the four coupling slots of the first lower metal layer 103 are the first coupling slot 1031, the second coupling slot 1032, the third coupling slot 1033, and the fourth coupling slot 1034, and the first coupling slot 1031, the second coupling slot 1032, the third coupling slot 1033, and the fourth coupling slot 1034 are point-symmetric with respect to the center of the first lower metal layer 103; the four coupling slots of the second upper metal layer 201 are a fifth coupling slot 2011, a sixth coupling slot 2012, a seventh coupling slot 2013 and an eighth coupling slot 2014, respectively, and the fifth coupling slot 2011, the sixth coupling slot 2012, the seventh coupling slot 2013 and the eighth coupling slot 2014 are symmetrical about the center point of the second upper metal layer 201.
because the printed circuit board of the present embodiment has only two layers, the upper printed circuit board 1 is the uppermost printed circuit board, the lower printed circuit board 2 is the lowermost printed circuit board, the first upper metal layer 101 of the upper printed circuit board 1 and the second lower metal layer 203 of the lower printed circuit board 2 are both provided with four microstrip feed lines, wherein the four microstrip feed lines of the first upper metal layer 101 are inserted into the first substrate integrated waveguide resonant cavity, which are respectively the first microstrip feed line 1011, the second microstrip feed line 1012, the third microstrip feed line 1013 and the fourth microstrip feed line 1014, and the four microstrip feed lines of the second lower metal layer 203 are inserted into the second substrate integrated waveguide resonant cavity, which are respectively the fifth microstrip feed line 2031, the sixth microstrip feed line 2032, the seventh microstrip feed line 2033 and the eighth microstrip feed line 2034.
Furthermore, in the upper printed circuit board 1, any two adjacent microstrip feed lines form an angle of 90 degrees with a connecting line of the central point of the first upper metal layer 101, a connecting line of the first microstrip feed line 1011 and the central point of the first upper metal layer 101 is set as a first connecting line, a connecting line of the second microstrip feed line 102 and the central point of the first upper metal layer 101 is set as a second connecting line, a connecting line of the third microstrip feed line 1013 and the central point of the first upper metal layer 101 is set as a third connecting line, a connecting line of the fourth microstrip feed line 1014 and the central point of the first upper metal layer 101 is set as a fourth connecting line, the first connecting line and the third connecting line form an angle of 90 degrees, the first connecting line and the fourth connecting line form an angle of 90 degrees, the second connecting line and the third connecting line form an angle of 90 degrees, and the second connecting line and the fourth connecting line form an angle of 90 degrees; in the lower printed circuit board 2, any two adjacent microstrip feed lines form a 90-degree angle with a connecting line of the central points of the second lower metal layer 203, a connecting line of a fifth microstrip feed line 2031 and the central point of the second lower metal layer 203 is set as a fifth connecting line, a connecting line of a sixth microstrip feed line 2032 and the central point of the second lower metal layer 203 is set as a sixth connecting line, a connecting line of a seventh microstrip feed line 2033 and the central point of the second lower metal layer 203 is set as a seventh connecting line, a connecting line of an eighth microstrip feed line 2034 and the central point of the second lower metal layer 203 is set as an eighth connecting line, the fifth connecting line and the seventh connecting line form a 90-degree angle, the sixth connecting line and the seventh connecting line form a 90-degree angle, and the sixth connecting line and the eighth connecting line form a 90-degree angle; the first microstrip feed line 1011 corresponds to the fifth microstrip feed line 2031, the first microstrip feed line 1011 is located directly above the fifth microstrip feed line 2031, the second microstrip feed line 1012 corresponds to the sixth microstrip feed line 2032, the second microstrip feed line 1012 is located directly above the sixth microstrip feed line 2032, the third microstrip feed line 1013 corresponds to the seventh microstrip feed line 2033, the third microstrip feed line 1013 is located directly above the seventh microstrip feed line 2033, the fourth microstrip feed line 1014 corresponds to the eighth microstrip feed line 2034, and the fourth microstrip feed line 1014 is located directly above the eighth microstrip feed line 2034.
In the present embodiment, the projection of the first microstrip power feed line 1011 on the second lower metal layer 203 intersects and is perpendicular to the fifth microstrip power feed line 2031, the projection of the second microstrip power feed line 1012 on the second lower metal layer 203 intersects and is perpendicular to the sixth microstrip power feed line 2032, the projection of the third microstrip power feed line 1013 on the second lower metal layer 203 intersects and is perpendicular to the seventh microstrip power feed line 2033, and the projection of the fourth microstrip power feed line 1014 on the second lower metal layer 203 intersects and is perpendicular to the eighth microstrip power feed line 2034.
preferably, each microstrip feed line is a meander-shaped microstrip feed line including a vertical section and an inclined section connected, the vertical section of the first microstrip feed line 1011 is perpendicular to a position further to the rear at the left edge of the first upper metal layer 101, the vertical section of the second microstrip feed line 1012 is perpendicular to a position further to the front at the right edge of the first upper metal layer 101, the vertical section of the third microstrip feed line 1013 is perpendicular to a position further to the left at the front edge of the first upper metal layer 101, the vertical section of the fourth microstrip feed line 1014 is perpendicular to a position further to the right at the rear edge of the first upper metal layer 101, the vertical section of the fifth microstrip feed line 2031 is perpendicular to a position further to the left at the rear edge of the second lower metal layer 203, the vertical section of the sixth microstrip feed line 2032 is perpendicular to a position further to the right at the front edge of the second lower metal layer 203, the vertical section of the seventh microstrip feed line 2033 is perpendicular to a position further to the front at the left edge of, a vertical section of the eighth microstrip feed line 2034 is perpendicular to a position further back at the right edge of the second lower metal layer 203; the inclined sections of the first, second, third, and fourth microstrip feed lines 1011, 1012, 1013, and 1014 are inserted into the first substrate-integrated waveguide resonant cavity, and the fifth, sixth, seventh, and eighth microstrip feed lines 2031, 2032, 2033, and 2034 are inserted into the second substrate-integrated waveguide resonant cavity.
Further, a first port P1 is provided at the end of the first microstrip feed line 1011, a second port P2 is provided at the end of the second microstrip feed line 1012, a third port P3 is provided at the end of the fifth microstrip feed line 2031, a fourth port P4 is provided at the end of the sixth microstrip feed line 2032, a fifth port P5 is provided at the end of the third microstrip feed line 1013, a sixth port P6 is provided at the end of the fourth microstrip feed line 1014, a seventh port P7 is provided at the end of the seventh microstrip feed line 2033, an eighth port P8 is provided at the end of the eighth microstrip feed line 2034, and the eight ports are used as both an input port and an output port; the first microstrip feed line 1011 is centrosymmetric to the second microstrip feed line 1012, so that the first port P1 and the second port P2 form a first pair of balanced ports, the fifth microstrip feed line 2031 is centrosymmetric to the sixth microstrip feed line 2032, so that the third port P3 and the fourth port P4 form a second pair of balanced ports, the third microstrip feed line 1013 is centrosymmetric to the fourth microstrip feed line 1014, so that the fifth port P5 and the sixth port P6 form a third pair of balanced ports, and the seventh microstrip feed line 2033 is centrosymmetric to the eighth microstrip feed line 2034, so that the seventh port P7 and the eighth port P8 form a fourth pair of balanced ports, and it can be seen that four pairs of balanced ports are provided in total; when a differential signal is input from one pair of balanced ports, the differential signal can only be output from the pair of balanced ports parallel to the differential signal, and the other two pairs of balanced ports in the orthogonal position have no signal output, so that the isolation is realized; when a common mode signal is input from the balanced port, the signal cannot be output, and a good common mode rejection effect is realized; therefore, differential signals are transmitted in the two pairs of balanced ports without influencing the other two pairs of balanced ports in the orthogonal position, and the two-path balanced filter is obtained.
In this embodiment, the first substrate-integrated waveguide resonator and the second substrate-integrated waveguide resonator are both circular in cross section, the first substrate-integrated waveguide resonator is sized such that the first substrate-integrated waveguide resonator resonates in the TE 201 and TE 102 orthogonal degenerate modes at the center frequency of the passband of the balanced filter, and the second substrate-integrated waveguide resonator is sized such that the second substrate-integrated waveguide resonator resonates in the TE 201 and TE 102 orthogonal degenerate modes at the center frequency of the passband of the balanced filter.
in the above embodiments, the metal materials used for the first upper metal layer 101, the first lower metal layer 103, the first upper metal layer 201, the second lower metal layer 203, the hole wall of the first via hole 104, and the hole wall of the second via hole 204 may be any one of aluminum, iron, tin, copper, silver, gold, and platinum, or may be an alloy of any one of aluminum, iron, tin, copper, silver, gold, and platinum.
Fig. 2 and fig. 3 are graphs of experimental results of the single two-way balanced filter of this embodiment, and it can be seen from fig. 2 that the center frequency of the pass band of the differential mode filter tested is 6.33GHz, the return loss at the center frequency is greater than 20dB, the bandwidth with the return loss greater than 15dB is 1.58%, the minimum insertion loss tested is 1.335dB, and the minimum insertion loss simulated is 0.91 dB; the common mode rejection within the pass band is greater than 47 dB; it can be seen from fig. 3 that the differential mode isolation between the two-way balanced filters is greater than 45 dB.
Example 2:
The main characteristics of this embodiment are: the cross section shapes of the first substrate integrated waveguide resonant cavity and the second substrate integrated waveguide resonant cavity are regular polygons with even number of sides, such as a square, a regular hexagon and the like. The rest is the same as example 1.
Example 3:
the single two-way balanced filter of the present embodiment is different from embodiments 1 and 2 in that: the printed circuit board assembly may include three or more layers of printed circuit boards, for example, three layers of printed circuit boards, wherein the upper metal layer of the uppermost printed circuit board and the lower metal layer of the lowermost printed circuit board are provided with four microstrip feed lines, the lower metal layer of the uppermost printed circuit board is in contact with the upper metal layer of the intermediate printed circuit board, the lower metal layer of the intermediate printed circuit board is in contact with the upper metal layer of the lowermost printed circuit board, and the lower metal layer of the uppermost printed circuit board, the upper metal layer of the intermediate printed circuit board, the lower metal layer of the intermediate printed circuit board, and the upper metal layer of the lowermost printed circuit board.
To sum up, the utility model discloses a monomer double-circuit balanced type filter is symmetrical structure, utilize the inherent reverse characteristic of quadrature distribution and TE 201 and TE 102 quadrature mode electric field itself between the integrated waveguide quadrature degeneracy mode of substrate, fuse two balanced type filters in a single circuit structure on the integrated waveguide of substrate for the first time, the monomer double-circuit balanced type filter of a dual input dual output has been accomplished, and has light in weight, easy integration, and the insertion loss is little, common mode suppression, differential mode filtering transmission is effectual, keep apart high excellent performance between the two way balanced type filters.
The above, only be the embodiment of the utility model discloses a patent preferred, nevertheless the utility model discloses a protection scope is not limited to this, and any technical personnel who is familiar with this technical field are in the utility model discloses a within range, according to the utility model discloses a technical scheme and utility model design equivalence substitution or change all belong to the protection scope of the utility model patent.
Claims (10)
1. A monomer two-way balanced filter which is characterized in that: the integrated waveguide resonant cavity comprises at least two layers of printed circuit boards stacked from bottom to top, wherein each layer of printed circuit board comprises an upper metal layer, a dielectric plate, a lower metal layer and a plurality of through holes, the upper metal layer and the lower metal layer are respectively arranged on the top surface and the bottom surface of the dielectric plate, and the through holes surround a substrate integrated waveguide resonant cavity; substrate integrated waveguide resonant cavities in two adjacent layers of printed circuit boards are coupled together;
The upper metal layer of the printed circuit board on the uppermost layer and the lower metal layer of the printed circuit board on the lowermost layer are respectively provided with four micro-strip feed lines inserted into the substrate integrated waveguide resonant cavity, the tail end of each micro-strip feed line is provided with a port, and the ports of every two micro-strip feed lines which are centrosymmetric form a pair of balanced ports.
2. The unitary two-way balanced filter of claim 1, wherein: in the two adjacent layers of printed circuit boards, the lower metal layer of the upper layer printed circuit board is contacted with the upper metal layer of the lower layer printed circuit board, and the lower metal layer of the upper layer printed circuit board and the upper metal layer of the lower layer printed circuit board are both provided with coupling slots.
3. the unitary two-way balanced filter of claim 2, wherein: in the two adjacent layers of printed circuit boards, the number of the coupling slots of the upper layer printed circuit board and the number of the coupling slots of the lower layer printed circuit board are four, and the shapes and the sizes of the coupling slots are the same; four coupling slots of the upper printed circuit board are symmetrical about the center point of the lower metal layer; the four coupling slots of the lower printed circuit board are symmetrical about the center point of the metal layer thereon.
4. A unitary two-way balanced filter according to any one of claims 1-3, wherein: in the printed circuit board on the uppermost layer, any two adjacent microstrip feed lines form an included angle of 90 degrees with a connecting line of the central points of the upper metal layer;
In the lowest printed circuit board, any two adjacent microstrip feed lines form an included angle of 90 degrees with a connecting line of the central points of the lower metal layers;
The four microstrip feed lines of the printed circuit board on the uppermost layer are in one-to-one correspondence with the four microstrip feed lines of the printed circuit board on the lowermost layer, and each microstrip feed line of the printed circuit board on the uppermost layer is positioned right above the corresponding microstrip feed line of the printed circuit board on the lowermost layer.
5. The unitary two-way balanced filter of claim 4, wherein: the projection of each microstrip feed line of the uppermost printed circuit board on the lower metal layer of the lowermost printed circuit board is intersected with and vertical to the microstrip feed line corresponding to the lowermost printed circuit board.
6. A unitary two-way balanced filter according to any one of claims 1-3, wherein: each microstrip feed line is a bent microstrip feed line.
7. The unitary two-way balanced filter of claim 6, wherein: each microstrip feed line comprises a vertical section and an inclined section which are connected;
In the printed circuit board on the uppermost layer, the vertical section of each microstrip feed line is vertical to one edge of the upper metal layer, and the inclined section of each microstrip feed line is inserted into the substrate integrated waveguide resonant cavity;
In the lowest printed circuit board, the vertical section of each microstrip feed line is vertical to one edge of the lower metal layer, and the inclined section of each microstrip feed line is inserted into the substrate integrated waveguide resonant cavity.
8. A unitary two-way balanced filter according to any one of claims 1-3, wherein: the cross section of the substrate integrated waveguide resonant cavity is circular.
9. A unitary two-way balanced filter according to any one of claims 1-3, wherein: the cross section of the substrate integrated waveguide resonant cavity is in the shape of a regular polygon with even number sides.
10. a radio frequency front end circuit, comprising: comprising a unitary two-way balanced filter according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920554568.6U CN209766614U (en) | 2019-04-23 | 2019-04-23 | Single-body double-path balanced filter and radio frequency front-end circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920554568.6U CN209766614U (en) | 2019-04-23 | 2019-04-23 | Single-body double-path balanced filter and radio frequency front-end circuit |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098454A (en) * | 2019-04-23 | 2019-08-06 | 华南理工大学 | Monomer two-way balanced type filter and RF front-end circuit |
| CN111478000A (en) * | 2020-04-21 | 2020-07-31 | 南京智能高端装备产业研究院有限公司 | Multi-zero-point band-pass balance filter adopting double-layer circular patches |
| CN113690555A (en) * | 2021-08-31 | 2021-11-23 | 南通大学 | Balanced type strip-shaped dielectric substrate integrated filter |
-
2019
- 2019-04-23 CN CN201920554568.6U patent/CN209766614U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110098454A (en) * | 2019-04-23 | 2019-08-06 | 华南理工大学 | Monomer two-way balanced type filter and RF front-end circuit |
| CN110098454B (en) * | 2019-04-23 | 2024-01-23 | 华南理工大学 | Single-body double-path balanced filter and radio frequency front-end circuit |
| CN111478000A (en) * | 2020-04-21 | 2020-07-31 | 南京智能高端装备产业研究院有限公司 | Multi-zero-point band-pass balance filter adopting double-layer circular patches |
| CN111478000B (en) * | 2020-04-21 | 2021-09-28 | 南京智能高端装备产业研究院有限公司 | Multi-zero-point band-pass balance filter adopting double-layer circular patches |
| CN113690555A (en) * | 2021-08-31 | 2021-11-23 | 南通大学 | Balanced type strip-shaped dielectric substrate integrated filter |
| CN113690555B (en) * | 2021-08-31 | 2022-05-17 | 南通大学 | Balanced type strip-shaped medium substrate integrated filter |
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