CN104851903B - A kind of flexible OLED display and preparation method thereof - Google Patents
A kind of flexible OLED display and preparation method thereof Download PDFInfo
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- 229910010272 inorganic material Inorganic materials 0.000 claims description 39
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- 239000010409 thin film Substances 0.000 claims description 20
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- 238000007641 inkjet printing Methods 0.000 claims description 4
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
A kind of flexible OLED display of the embodiment of the present invention offer and preparation method thereof, is related to display technology field, the light being emitted from sub-pixel interference adjacent subpixels is can avoid, to which excitation purity can be improved and improve color offset phenomenon.The flexible OLED display, including flexible substrate substrate, be arranged on the flexible substrate substrate positioned at the top emitting light emitting diode of each subpixel area, pixel defining layer and encapsulated layer between the adjacent top emitting light emitting diode；The encapsulated layer includes at least the first pattern layer, and first pattern layer includes at least the first pattern corresponding with the pixel defining layer；Wherein, the encapsulated layer except in addition to first pattern corresponding position, it is transparent at other positions.For flexible OLED display and its preparation.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible OLED display and a preparation method thereof.
Background
The flexible display technology has been developed rapidly in recent years, and thus the flexible display has been advanced from the size of the screen to the quality of the display. Both the near-vanishing Cathode Ray Tube (CRT) and the Liquid Crystal Display (LCD) are essentially conventional rigid displays. Compared with the traditional rigid display, the flexible display has many advantages, such as impact resistance, strong shock resistance, light weight, small volume, more convenient carrying and the like.
Currently, flexible displays are mainly flexible OLED displays. As shown in fig. 1, the flexible OLED display includes a flexible substrate 10, an anode 201 disposed at each sub-pixel position of the flexible substrate 10, an organic material functional layer 202, a cathode 203, and a pixel defining layer 30 between two adjacent sub-pixels, and an encapsulation layer 40 located at the uppermost of the flexible OLED display.
Based on the above structure, since the flexible OLED display is frequently bent, light emitted from the organic material functional layer 202 of the sub-pixel is reflected and refracted by the encapsulation layer 40, so that light is emitted from an adjacent sub-pixel, and color purity and color shift phenomena are generated, thereby affecting the display effect.
Disclosure of Invention
Embodiments of the present invention provide a flexible OLED display and a method for manufacturing the same, which can prevent light emitted from a subpixel from interfering with an adjacent subpixel, thereby improving color purity and improving color shift.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
in one aspect, a flexible OLED display is provided, including a flexible substrate, top-emitting light-emitting diodes disposed on the flexible substrate in each sub-pixel region, a pixel defining layer between adjacent top-emitting light-emitting diodes, and an encapsulation layer; the packaging layer at least comprises a first pattern layer, and the first pattern layer at least comprises a first pattern corresponding to the pixel defining layer; and the positions of the packaging layer except the position corresponding to the first pattern are transparent.
Optionally, the first pattern layer further comprises a second pattern of transparent material located between the first patterns.
Optionally, the encapsulation layer includes at least three layers of inorganic material layers and organic material layers alternately arranged; wherein at least one of the organic material layers is the first pattern layer.
Further optionally, the encapsulation layer includes a five-layer structure in which inorganic material layers and organic material layers are alternately arranged; the organic material layer closest to the outer side is the first pattern layer, and the other organic material layer is a transparent organic material layer.
In view of the above, it is preferable that the first pattern layer further corresponds to an edge portion of the organic material functional layer of the top emission light emitting diode.
Preferably, the flexible OLED display further includes a thin film transistor, a drain electrode of the thin film transistor being electrically connected to the first electrode of the top-emission light-emitting diode; the top emission light-emitting diode comprises the first electrode, the organic material functional layer and a second electrode which are arranged above the thin film transistor in sequence; the first electrode includes an opaque metal layer and the second electrode includes a semi-transparent metal layer.
In another aspect, a method for manufacturing a flexible OLED display is provided, including forming a top-emitting light emitting diode located in each sub-pixel region, a pixel defining layer located between adjacent top-emitting light emitting diodes, and an encapsulation layer on a flexible substrate; forming the encapsulation layer includes: forming an encapsulation layer including at least a first pattern corresponding to the pixel defining layer; and the positions of the packaging layer except the position corresponding to the first pattern are transparent.
Optionally, forming the first pattern layer includes: forming the first pattern layer composed of the first patterns and second patterns of transparent material between the first patterns.
Further optionally, forming the encapsulation layer including at least the first pattern layer includes: sequentially forming the packaging layer with at least three-layer structure of alternating inorganic material layers and organic material layers; wherein at least one layer of the organic material layer is a first pattern layer composed of a first pattern of an opaque material and a second pattern of a transparent material.
Further optionally, the encapsulation layer comprises a five-layer structure of alternating inorganic material layers and organic material layers; the organic material layer closest to the outer side is the first pattern layer, and the other organic material layer is a transparent organic material layer.
Optionally, forming a first pattern layer composed of a first pattern of opaque material and a second pattern of transparent material includes: forming the first pattern of an opaque organic material at a position corresponding to the pixel defining layer by an evaporation method; forming the second pattern of a transparent organic material between the first patterns by an evaporation method; or, forming the second pattern of a transparent organic material between the first patterns to be formed by an evaporation method; forming the first pattern of opaque organic material at a position corresponding to the pixel defining layer by an inkjet printing method.
Based on the above, it is preferable that the first pattern further corresponds to an edge portion of the organic material functional layer of the top emission light emitting diode.
Preferably, before forming the top-emission light-emitting diode, the method further comprises forming a thin film transistor, a drain electrode of which is electrically connected to the first electrode of the top-emission light-emitting diode; the top emission light-emitting diode comprises the first electrode, the organic material functional layer and a second electrode which are sequentially formed above the thin film transistor; the first electrode includes an opaque metal layer and the second electrode includes a semi-transparent metal layer.
The embodiment of the invention provides a flexible OLED display and a preparation method thereof, wherein the flexible OLED display comprises a flexible substrate, top-emitting light-emitting diodes, a pixel defining layer and an encapsulating layer, wherein the top-emitting light-emitting diodes are arranged on the flexible substrate and positioned in each sub-pixel area; the packaging layer at least comprises a first pattern layer which is composed of a first pattern of opaque materials and a second pattern of transparent materials; wherein the first patterns correspond to the pixel defining layers, and the second patterns are located between the first patterns. Because the first pattern of the opaque material can absorb the light emitted to the first pattern, when the first pattern of the opaque material is arranged at the position corresponding to the pixel defining layer, the interference of the light emitted by the top-emitting light-emitting diode, which is reflected and/or refracted, incident to the adjacent sub-pixel can be avoided, and thus, the color purity can be improved and the color cast phenomenon can be improved compared with the prior art.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a flexible OLED display provided in the prior art;
fig. 2 is a schematic structural diagram of a flexible OLED display according to an embodiment of the present invention;
fig. 3 is a first schematic structural diagram of an encapsulation layer according to an embodiment of the present invention;
fig. 4 is a second schematic structural diagram of an encapsulation layer according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a package layer according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a flexible OLED display according to an embodiment of the present invention;
fig. 7a is a schematic view of a subpixel arrangement in a flexible OLED display according to an embodiment of the present invention;
fig. 7b is a schematic view illustrating a subpixel arrangement in a flexible OLED display according to an embodiment of the present invention.
Reference numerals:
10-a flexible substrate base plate; 20-top emitting light emitting diodes; 201-anode; 202-a functional layer of organic material; 203 a cathode; 30-a pixel defining layer; 40-an encapsulation layer; 401 — a first pattern layer; 401 a-a first pattern; 401 b-a second pattern; 402-a layer of inorganic material; 403-organic material layer-by-layer; 50-a thin film transistor; 501-grid electrode; 502-a gate insulating layer; 503-a semiconductor active layer; 504-source; 505-drain.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides a flexible OLED display, as shown in fig. 2 to 6, which includes a flexible substrate 10, top-emitting light-emitting diodes 20 disposed on the flexible substrate 10 and located in each sub-pixel region, a pixel defining layer 30 located between adjacent top-emitting light-emitting diodes, and an encapsulation layer 40; the encapsulation layer 40 includes at least a first pattern layer 401, the first pattern layer 401 includes at least a first pattern 401a corresponding to the pixel defining layer 30; wherein, the encapsulation layer 40 is transparent at other positions except the position corresponding to the first pattern 401.
The material of the flexible substrate base 10 may be at least one of polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate.
First, the structure of the top-emission light-emitting diode 20 is not limited, and includes at least an anode 201, an organic material functional layer 202, and a cathode 203.
On this basis, the materials of the anode 201 and the cathode 203 are not limited as long as the light emitted from the top-emission led 20 can be emitted from the side of the encapsulation layer 40.
Second, it will be understood by those skilled in the art that the encapsulation layer 40 serves to encapsulate the top-emitting light-emitting diode 20 to block external moisture from penetrating into the OLED display.
On this basis, the encapsulation layer 40 includes, in addition to the first pattern layer 401, pattern layers of other transparent materials, which is not limited herein.
Third, the opaque material is not limited as long as it absorbs light; in addition, the transparent material is not limited as long as the corresponding light transmittance is secured.
Fourth, the first pattern 401a corresponds to the pixel defining layer 30, the first pattern 401a may completely correspond to the pixel defining layer 30, or the first pattern 401a may also correspond to a part of the top-emission light-emitting diode 20 besides completely corresponding to the pixel defining layer 30, which is not limited herein.
The embodiment of the invention provides a flexible OLED display, which comprises a flexible substrate 10, top emission light-emitting diodes 20 arranged on the flexible substrate 10 and positioned in each sub-pixel region, a pixel defining layer 30 positioned between the adjacent top emission light-emitting diodes 20, and an encapsulating layer 40; the encapsulation layer 40 includes at least a first pattern layer 401, the first pattern layer 401 includes at least a first pattern 401a corresponding to the pixel defining layer 30; wherein, the encapsulation layer 40 is transparent at other positions except the position corresponding to the first pattern 401. Since the first pattern 401a of the opaque material can absorb the light emitted thereto, when it is disposed at a position corresponding to the pixel defining layer 30, the interference of the light emitted from the top-emission led 20, which is reflected and/or refracted, into the adjacent sub-pixel with respect to the adjacent sub-pixel can be avoided, thereby improving the color purity and improving the color shift phenomenon compared to the prior art.
Optionally, as shown in fig. 2 to 6, the first pattern layer 401 further includes second patterns 401b of a transparent material between the first patterns 401 a.
Therefore, the thickness of the first pattern layer 401 can be ensured to be consistent, and on the basis, in order to ensure that the thickness of the packaging layer is uniform, a patterning process is not required to be carried out when a film layer is formed subsequently.
Alternatively, as shown in fig. 3 to 5, the encapsulation layer 40 includes at least three layers of an inorganic material layer 402 and an organic material layer 403 alternately arranged; wherein at least one of the organic material layers 403 is the first pattern layer 401.
Here, the inorganic material layer 402 and the organic material layer alternately mean: a first inorganic material layer 402 is disposed, an organic material layer 403 is disposed on the first inorganic material layer 402, a second inorganic material layer 402 is disposed on the organic material layer 403, and so on.
It should be noted that, since the encapsulation layer 40 is located on the light emitting side of the top-emitting diode 20, the material in the encapsulation layer 40 is transparent, for example, the inorganic material layer 402 is made of transparent inorganic material, and when the organic material layer 403 is not used as the first pattern layer 401, it is made of transparent organic material, unless otherwise specified.
In addition, at least one of the organic material layers 403 is the first pattern layer 401, that is: when the encapsulation layer 40 includes at least one organic material layer 403, the pattern of the layer may be identical to that of the first pattern layer 401, that is, the first pattern 401a and the second pattern 401b of the first pattern layer 401 are both made of organic materials, except that the first pattern 401a is made of an opaque organic material, and the second pattern 401b is made of a transparent organic material.
The opaque organic material may be parylene, organic carbon, organic ceramic material, or the like, for example.
Illustratively, as shown in fig. 3, the encapsulation layer 40 includes a first inorganic material layer 402, a first pattern layer 401 of an organic material disposed on the first inorganic material layer 402, and a second inorganic material layer 402 disposed on the first pattern layer 401.
Alternatively, as shown in fig. 4, the encapsulation layer 40 includes a first inorganic material layer 402, a first pattern layer 401 of an organic material disposed on the first inorganic material layer 402, a second inorganic material layer 402 disposed on the first pattern layer 401, a first pattern layer 401 of an organic material disposed on the second inorganic material layer 402, and a third inorganic material layer 402 disposed on the first pattern layer 401.
Since the organic material layer 403 can be made relatively thick, the material of the first pattern layer 401 is made of an organic material, so that oblique light in a wider angle range can be absorbed, and interference of light reflected and/or refracted by adjacent sub-pixels to the adjacent sub-pixels can be further avoided.
As a further alternative, as shown in fig. 5, the encapsulation layer 40 includes a five-layer structure in which inorganic material layers 402 and organic material layers 403 are alternately arranged; one of the organic material layers 403 closest to the outer side is the first pattern layer 401, and the other organic material layer 403 is a transparent organic material layer.
Namely: a first inorganic material layer 402 is disposed, a transparent organic material layer 403 is disposed on the first inorganic material layer 402, a second inorganic material layer 402 is disposed on the organic material layer 403, a first pattern layer 401 of organic material is disposed on the second inorganic material layer 402, and a third inorganic material layer 402 is disposed on the first pattern layer 401.
On one hand, the interference of the light reflected and/or refracted to the adjacent sub-pixels can be avoided, and on the other hand, the five-layer structure can enable the encapsulation performance of the OLED display to be better, so that the device failure time caused by water vapor permeation is prolonged.
In view of the above, in order to avoid the reflected and/or refracted light from being incident into the adjacent sub-pixels from the edges of the sub-pixels, it is preferable that the first pattern layer 401 further corresponds to the edge portion of the organic material functional layer 202 of the top emission light emitting diode 20, as shown in fig. 2.
On the basis of the above, in view of the disadvantages of the passive matrix applied to the large-sized display, it is preferable that the OLED display provided by the embodiment of the present invention is an active matrix type OLED display, that is, as shown in fig. 6, the flexible OLED display further includes a thin film transistor 50, and a drain electrode 505 of the thin film transistor 50 is electrically connected to the first electrode of the top-emitting light emitting diode 20.
The thin film transistor 50 includes a gate electrode 501, a gate insulating layer 502, a semiconductor active layer 503, a source electrode 504, and a drain electrode 505; the thin film transistor 50 may be a top gate type or a bottom gate type. Of course, the OLED display further includes a gate line, a gate line lead (not shown), and the like electrically connected to the gate electrode 501, and a data line, a data line lead (not shown), and the like electrically connected to the source electrode 504.
On this basis, the top emission light emitting diode 20 includes the first electrode, the organic material functional layer 202 and the second electrode sequentially disposed above the thin film transistor 50; the first electrode includes an opaque metal layer and the second electrode includes a semi-transparent metal layer.
Wherein the first electrode may be an anode 201 and the second electrode may be a cathode 203. Of course, the first electrode may also be the cathode 203 and the second electrode may be the anode 201.
The organic material functional layer 202 may include at least a light emitting layer, and in addition, may further include an electron transport layer and a hole transport layer, and further, in order to improve efficiency of injecting electrons and holes into the light emitting layer, the organic material functional layer 202 may further include an electron injection layer disposed between a cathode and the electron transport layer, and a hole injection layer disposed between the hole transport layer and an anode.
Here, the light emitting layers of the three sub-pixels in one pixel may include light emitting molecules of red, green, and blue light, respectively; of course, the light emitting layer may only include light emitting molecules of white light, and is not limited herein.
Based on the above, the sub-pixels of the OLED display in the embodiment of the present invention may be arranged as shown in fig. 7a, or may be arranged as shown in fig. 7 b. On the basis, when viewed from the light emitting direction of the OLED display, the first pattern 401a in the first pattern layer 401 of the encapsulation layer 40 can be seen to be located between adjacent sub-pixels.
It should be noted that fig. 7a and fig. 7b only illustrate different arrangements of sub-pixels in the OLED display, and only a portion of the first pattern 401a related to the invention point is shown, and nothing is shown.
The embodiment of the invention also provides a preparation method of the flexible OLED display, which comprises the steps of forming top-emitting light-emitting diodes 20 positioned in each sub-pixel region, pixel defining layers 30 positioned between the adjacent top-emitting light-emitting diodes 20 and packaging layers 40 on a flexible substrate 10; wherein forming the encapsulation layer 40 comprises: forming an encapsulation layer 40 including at least a first pattern layer 401, the first pattern layer 401 including at least a first pattern 401a corresponding to the pixel defining layer 30; wherein, the encapsulation layer 40 is transparent at other positions except the position corresponding to the first pattern 401 a.
The material of the flexible substrate base 10 may be at least one of polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate.
It should be noted that, in the first embodiment of the present invention, the flexible substrate base 10 may be formed on a carrier substrate, then the corresponding top-emission light-emitting diode 20, the pixel defining layer 30, the encapsulating layer 40, and the like are formed, and finally the formed OLED display is peeled off from the carrier substrate.
Secondly, the structure of the top-emission light-emitting diode 20 is not limited, and it includes at least an anode 201, an organic material functional layer 202, and a cathode 203.
On this basis, the materials of the anode 201 and the cathode 203 are not limited as long as the light emitted from the top emission light emitting diode 20 can be emitted from the side of the encapsulation layer 40.
Third, it will be understood by those skilled in the art that the encapsulation layer 40 serves to encapsulate the top-emitting light-emitting diode 20 to block external moisture from penetrating into the OLED display.
On this basis, the encapsulation layer 40 includes, in addition to the first pattern layer 401, pattern layers of other transparent materials, which is not limited herein.
Fourth, the opaque material is not limited as long as it absorbs light; in addition, the transparent material is not limited as long as the corresponding light transmittance is secured.
Fifth, the first pattern 401a corresponds to the pixel defining layer 30, the first pattern 401a may completely correspond to the pixel defining layer 30, or the first pattern 401a may also correspond to a part of the top-emission light-emitting diode 20 besides completely corresponding to the pixel defining layer 30, which is not limited herein.
The embodiment of the present invention further provides a method for manufacturing a flexible OLED display, wherein the first pattern 401a of the opaque material can absorb light emitted thereto, so that when the first pattern is disposed at a position corresponding to the pixel defining layer 30, interference of light emitted by the top-emission light-emitting diode 20, which is reflected and/or refracted and then emitted into an adjacent sub-pixel, on the adjacent sub-pixel can be avoided, and thus color purity and color shift can be improved compared to the prior art.
Alternatively, as shown in fig. 2 to 6, forming the first pattern layer 401 includes: the first pattern layer 401 composed of the first patterns 401a and the second patterns 401b of the transparent material between the first patterns 401a is formed.
Alternatively, as shown in fig. 3 to 5, forming the encapsulation layer 40 including at least the first pattern layer 401 composed of the first pattern 401a of the opaque material and the second pattern 401b of the transparent material includes: sequentially forming the encapsulation layer 40 having at least a three-layer structure in which the inorganic material layers 402 and the organic material layers 403 are alternated; at least one of the organic material layers 403 is a first pattern layer 401 composed of a first pattern 401a of an opaque material and a second pattern 401b of a transparent material.
That is, a first inorganic material layer 402, an organic material layer 403, a second inorganic material layer 402, and so on are formed in this order.
It should be noted that, since the encapsulation layer 40 is located on the light emitting side of the top-emitting diode 20, the material in the encapsulation layer 40 is transparent, for example, the inorganic material layer 402 is made of transparent inorganic material, and when the organic material layer 403 is not used as the first pattern layer 401, it is made of transparent organic material, unless otherwise specified.
In addition, at least one of the organic material layers 403 is the first pattern layer 401, that is: when the encapsulation layer 40 includes at least one organic material layer 403, the pattern of the layer may be identical to that of the first pattern layer 401, that is, the first pattern 401a and the second pattern 401b of the first pattern layer 401 are both made of organic materials, except that the first pattern 401a is made of an opaque organic material, and the second pattern 401b is made of a transparent organic material.
The opaque organic material may be parylene, organic carbon, organic ceramic material, or the like, for example.
Since the organic material layer 403 can be made relatively thick, the material of the first pattern layer is made of an organic material, so that oblique light in a wider angle range can be absorbed, and interference of light reflected and/or refracted by the adjacent sub-pixels to the adjacent sub-pixels can be further avoided.
As a further alternative, as shown in fig. 5, the encapsulation layer 40 includes a five-layer structure of alternating inorganic material layers 402 and organic material layers 403; one of the organic material layers 403 closest to the outer side is the first pattern layer 401, and the other organic material layer 403 is a transparent organic material layer.
Namely: a first inorganic material layer 402, a transparent organic material layer 403, a second inorganic material layer 402, a first pattern layer 401 of an organic material, and a third inorganic material layer 402 are sequentially formed.
On one hand, the interference of the light reflected and/or refracted to the adjacent sub-pixels can be avoided, and on the other hand, the five-layer structure can enable the encapsulation performance of the OLED display to be better, so that the device failure time caused by water vapor permeation is prolonged.
Based on the above, the first pattern layer 401 composed of the first pattern 401a of the opaque material and the second pattern 401b of the transparent material is formed, and may be specifically prepared by the following method:
the first patterns 401a of the opaque organic material are formed at positions corresponding to the pixel defining layer 30 by an evaporation method, and the second patterns 401b of the transparent organic material are formed between the first patterns 401a by an evaporation method.
For example, the forming of the first pattern 401a may be: the mask plate is used as a mask, the opening of the mask plate is completely overlapped with the first pattern 401a to be formed, and paraxylene is deposited and accumulated under the condition that the deposition pressure is more than 10P, so that the first pattern 401a with the optical passing rate of less than 20% can be formed. Similarly, the second pattern 401b is formed by using a mask plate as a barrier, so that the opening of the mask plate is completely overlapped with the second pattern 401b to be formed, and depositing a corresponding transparent organic material, thereby forming the second pattern 401 b.
Alternatively, the second patterns 401b of the transparent organic material are formed between the first patterns 401a to be formed by an evaporation method, and then the first patterns 401a of the opaque organic material are formed at positions corresponding to the pixel defining layer 30 by an inkjet printing method.
For example, the forming of the second pattern 401b may be: using a mask plate as a barrier to enable the opening of the mask plate to be completely overlapped with the second pattern 401b to be formed, and depositing a corresponding transparent organic material to form the second pattern 401 b; on this basis, the first pattern 401a may be formed by an inkjet printing method, wherein the inkjet printed material may be an organic-based carbon ink, or an opaque organic material such as an organic-based ceramic material.
On the above basis, in order to avoid the reflected and/or refracted light from being incident into the adjacent sub-pixel from the edge of the sub-pixel, referring to fig. 2, it is preferable that the first pattern layer 401 further corresponds to the edge portion of the organic material functional layer 202 of the top emission light emitting diode 20.
In addition, in view of the disadvantages of the passive matrix in the application of the large-sized display, it is preferable that the OLED display provided by the embodiment of the present invention is an active matrix type OLED display, that is, as shown in fig. 6, before the top-emission light-emitting diode 20 is formed, the method further includes forming a thin film transistor 50, and a drain electrode 505 of the thin film transistor 50 is electrically connected to the first electrode of the top-emission light-emitting diode 20.
The thin film transistor 50 includes a gate electrode 501, a gate insulating layer 502, a semiconductor active layer 503, a source electrode 504, and a drain electrode 505; the thin film transistor 50 may be a top gate type or a bottom gate type. Of course, the OLED display further includes a gate line, a gate line lead (not shown), and the like electrically connected to the gate electrode 501, and a data line, a data line lead (not shown), and the like electrically connected to the source electrode 504.
On this basis, the top emission light emitting diode 20 includes the first electrode, the organic material functional layer 202, and the second electrode sequentially formed above the thin film transistor 50; the first electrode includes an opaque metal layer and the second electrode includes a semi-transparent metal layer.
Wherein the first electrode may be an anode 201 and the second electrode may be a cathode 203. Of course, the first electrode may also be the cathode 203 and the second electrode may be the anode 201.
Based on the above, the sub-pixels of the OLED display in the embodiment of the present invention may be arranged as shown in fig. 7a, or may be arranged as shown in fig. 7 b. On the basis, when viewed from the light emitting direction of the OLED display, the first pattern 401a in the first pattern layer 401 of the encapsulation layer 40 can be seen to be located between adjacent sub-pixels.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (11)
1. A flexible OLED display comprises a flexible substrate, top-emitting light-emitting diodes arranged on the flexible substrate and positioned in each sub-pixel region, a pixel defining layer positioned between adjacent top-emitting light-emitting diodes, and an encapsulating layer; it is characterized in that the preparation method is characterized in that,
the packaging layer at least comprises a first pattern layer, and the first pattern layer at least comprises a first pattern corresponding to the pixel defining layer;
the packaging layer is transparent at other positions except the position corresponding to the first pattern;
the packaging layer is used for packaging the top-emitting light-emitting diode so as to prevent outside water vapor from permeating into the flexible OLED display;
the first patterned layer further includes second patterns of transparent material located between the first patterns.
2. The flexible OLED display of claim 1, wherein the encapsulation layer includes at least a three-layer structure of alternating layers of inorganic material and organic material;
wherein at least one of the organic material layers is the first pattern layer.
3. The flexible OLED display of claim 2, wherein the encapsulation layer includes a five-layer structure of alternating layers of inorganic material and organic material;
the organic material layer closest to the outer side is the first pattern layer, and the other organic material layer is a transparent organic material layer.
4. The flexible OLED display device claimed in any one of claims 1 to 3, wherein the first pattern layer further corresponds to an edge portion of the organic material functional layer of the top emission light emitting diode.
5. The flexible OLED display device claimed in any one of claims 1-3, further comprising a thin film transistor having a drain electrode electrically connected to the first electrode of the top-emitting light-emitting diode;
the top emission light-emitting diode comprises a first electrode, an organic material functional layer and a second electrode which are arranged above the thin film transistor in sequence; the first electrode includes an opaque metal layer and the second electrode includes a semi-transparent metal layer.
6. A preparation method of a flexible OLED display comprises the steps of forming top-emitting light-emitting diodes positioned in each sub-pixel area, pixel defining layers positioned between adjacent top-emitting light-emitting diodes and packaging layers on a flexible substrate; wherein forming the encapsulation layer comprises:
forming an encapsulation layer including at least a first pattern corresponding to the pixel defining layer;
the packaging layer is transparent at other positions except the position corresponding to the first pattern;
forming the packaging layer to package the top-emitting light-emitting diode so as to prevent outside water vapor from permeating into the flexible OLED display;
forming the first pattern layer, including: forming the first pattern layer composed of the first patterns and second patterns of transparent material between the first patterns.
7. The method of claim 6, wherein forming the encapsulation layer including at least the first patterned layer comprises:
sequentially forming the packaging layer with at least three-layer structure of alternating inorganic material layers and organic material layers;
wherein at least one layer of the organic material layer is a first pattern layer composed of a first pattern of an opaque material and a second pattern of a transparent material.
8. The method of claim 7, wherein the encapsulation layer comprises a five-layer structure of alternating layers of inorganic material and organic material;
the organic material layer closest to the outer side is the first pattern layer, and the other organic material layer is a transparent organic material layer.
9. The method of any of claims 6-8, wherein forming a first pattern layer of a first pattern of opaque material and a second pattern of transparent material comprises:
forming the first pattern of an opaque organic material at a position corresponding to the pixel defining layer by an evaporation method; forming the second pattern of a transparent organic material between the first patterns by an evaporation method; or,
forming the second pattern of a transparent organic material between the first patterns to be formed by an evaporation method; forming the first pattern of opaque organic material at a position corresponding to the pixel defining layer by an inkjet printing method.
10. The method according to any of claims 6-8, wherein the first pattern further corresponds to an edge portion of the functional layer of organic material of the top-emitting light-emitting diode.
11. The method of any of claims 6-8, wherein prior to forming the top-emitting light-emitting diode, the method further comprises forming a thin film transistor having a drain electrode electrically connected to the first electrode of the top-emitting light-emitting diode;
the top emission light-emitting diode comprises a first electrode, an organic material functional layer and a second electrode which are sequentially formed above the thin film transistor; the first electrode includes an opaque metal layer and the second electrode includes a semi-transparent metal layer.
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| KR102462423B1 (en) * | 2015-09-15 | 2022-11-03 | 삼성디스플레이 주식회사 | Organic luminescence emitting display device and the method of manufacturing the same |
| CN106654047B (en) * | 2016-12-22 | 2019-02-01 | 武汉华星光电技术有限公司 | OLED display panel and preparation method thereof |
| CN108269825A (en) * | 2016-12-30 | 2018-07-10 | 昆山工研院新型平板显示技术中心有限公司 | Organic luminous fiber and its manufacturing method and organic light emitting display and its manufacturing method |
| CN107221553A (en) * | 2017-06-01 | 2017-09-29 | 深圳市华星光电技术有限公司 | Improve the method and display panel of big visual angle colour cast |
| CN107565045B (en) * | 2017-08-08 | 2019-11-08 | 武汉华星光电半导体显示技术有限公司 | The encapsulating method and structure of flexible OLED panel |
| CN109713007A (en) * | 2017-10-25 | 2019-05-03 | 京东方科技集团股份有限公司 | Array substrate and preparation method thereof, display panel, display device |
| CN107895728B (en) * | 2017-12-05 | 2020-07-28 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof and display device comprising array substrate |
| CN108321176B (en) | 2018-02-02 | 2020-07-03 | 京东方科技集团股份有限公司 | Flexible display panel, manufacturing method thereof and display device |
| CN111384092B (en) * | 2018-12-29 | 2024-01-30 | 北京小米移动软件有限公司 | Terminal and manufacturing method of organic light-emitting diode display panel |
| CN109742112B (en) * | 2019-01-08 | 2021-10-12 | 京东方科技集团股份有限公司 | OLED display panel and electronic equipment |
| CN109904347B (en) | 2019-03-15 | 2020-07-31 | 京东方科技集团股份有限公司 | Light emitting device, method of manufacturing the same, and display apparatus |
| CN109873024A (en) * | 2019-04-09 | 2019-06-11 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display device |
| CN113363282B (en) * | 2020-03-05 | 2023-04-18 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
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